APPARATUS FOR PRODUCING BAKED PRODUCTS

Abstract

A device for producing baked products, in particular edible crisp wafers or soft waffles, contains at least one baking plate, the baking surface of which can be heated to a baking temperature. The baking plate has a sensor device for detecting the temperature of the baking plate and/or a pressure acting on the baking surface of the baking plate during the baking process.

Claims

1. A baking oven for producing baked products, comprising: baking tongs each having two successively disposed baking plates for baking the baked products; an oven frame defining a baking chamber and having an external thermal insulation; a conveying device having a baking tong chain; said baking tongs circulating in the baking oven and being disposed along an orbit leading through said baking chamber and said baking tongs being conveyed by said conveying device along the orbit through the baking oven; said oven frame on a part of the orbit disposed outside said baking chamber having: a device for opening said baking tongs; a dispensing station for dispensing the baked products; a loading station for loading said baking tongs; a device for closing said baking tongs in a running direction of said baking tongs disposed consecutively; a monitoring device integrated in said oven frame for detecting work activity of the baking oven and a baking process taking place in said baking tongs; said baking tongs each containing a sensor device having at least one sensor disposed on a respective one of said baking tongs, said sensor device detecting the baking process taking place in said respective baking tong, and being a passive sensor to be interrogated by an electromagnetic field; a transmitting and receiving device disposed fixedly in said oven frame and containing at least one reading device disposed on the orbit of said baking tong chain, said transmitting and receiving communicating via the electromagnetic field with said sensor of said sensor device; and an evaluation device processing signals coming from said sensor via said reading device and produces monitoring signals.

2. The baking oven according to claim 1 wherein, said sensor device detects at least one of a temperature of said baking plates or a pressure acting on a baking surface of said baking plates during a baking process.

3. The baking oven according to claim 2, wherein: one baking plate of said two successively disposed baking plates has a sensor receiving opening formed therein; and said sensor device contains at least one sensor having a sensor head, said sensor disposed in said sensor receiving opening so that said sensor with said sensor head lies on said baking surface or comes to rest in close proximity to said baking surface.

4. The baking oven according to claim 3, wherein said one baking plate has a rear side and a measuring section, said sensor receiving opening is configured to extend from said rear side of said one baking plate to said measuring section in close proximity to said baking surface, wherein said baking surface and said measuring section run through continuously.

5. The baking oven according to claim 4, wherein said sensor receiving opening penetrates from said rear side of said one baking plate through said one baking plate and said sensor head has a sensor membrane lying on said baking surface and is profiled to match said baking surface.

6. The baking oven according to claim 5, wherein said measuring section of said one baking plate has a stamp projecting towards said sensor head or said sensor membrane for transmitting measurement values acting on said measuring section.

7. The baking oven according to claim 5, wherein said sensor membrane has a stamp projecting towards said measuring section.

8. The baking oven according to claim 4, wherein said measuring section has a wall thickness between 1 and 3 mm.

9. The baking oven according to claim 3, further comprising an annular clamping element, said sensor receiving opening is configured as a blind hole projecting into said one baking plate and said sensor with said sensor head is cylindrically shaped and is fastened in said one baking plate by said annular clamping element.

10. The baking oven according to claim 3, wherein said sensor is a passive temperature-pressure sensor which is interrogated by an electromagnetic field, said sensor has a rear side with a sensor antenna for transmission of energy and information.

11. The baking oven according to claim 10, wherein said sensor antenna is an H-slot antenna.

12. The baking oven according to claim 11, wherein said sensor has a shaft and a reflector plate disposed below said sensor antenna and is fastened to said sensor head or said shaft.

13. The baking oven according to claim 1, wherein said sensor is configured to deliver information relating to the pressure, the temperature and an identification feature characteristic of said sensor.

14. The baking oven according to claim 1, wherein said sensor device has a plurality of sensors disposed in said baking plates.

15. The baking oven according to claim 1, further comprising a position display for displaying a position of each of said baking tongs.

16. The baking oven according to claim 1, wherein said sensor is a surface acoustic wave sensor based on piezoelectric substrate crystals.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

[0021] The invention is explained in detail hereinafter with reference to the drawings.

[0022] FIG. 1 shows an oblique view of two closed baking plates which are assigned to one another and

[0023] FIG. 2 shows a section along the line II-II in FIG. 1.

[0024] FIG. 3 shows an oblique view of a baking tong according to the invention and

[0025] FIG. 4 shows a section of a cross-section along line IV-IV in FIG. 3.

[0026] FIGS. 5 to 7 show various exemplary embodiments with different arrangements of the sensors in the baking plates.

[0027] FIGS. 8 and 9 show an oblique view and a sectional view of an exemplary embodiment for a baking tong, where the baking plates are not self-supporting but arranged in a supporting frame.

[0028] FIG. 10a, b show the inside view of a baking plate half for poured three-dimensional wafer products and the sections through the central die when the mould is closed.

[0029] FIGS. 11 and 12 show two side views of baking ovens in which the baking plates according to the invention can be used with relevant evaluation and reading devices.

[0030] FIGS. 13 and 14 show schematic alternative details.

DETAILED DESCRIPTION OF THE INVENTION

[0031] FIGS. 1 to 3 show baking plates according to the invention whose fundamental structure corresponds to the prior art. The embodiment shown shows an upper baking plate 1 and a lower baking plate 2, where these comprise self-supporting baking plates which do not require a supporting frame. In the closed state shown the two baking plates abut against one another at the baking surfaces to such an extent that only the required gap 4 for the dough to be baked remains between the baking surfaces. The baking surfaces can be provided with a fluting in a manner known per se as is known from flat wafers or soft waffles. This fluting is not shown in FIGS. 1 to 3.

[0032] As shown in FIG. 2 in section, the upper baking plate has a sensor device 5 in the form of an individual sensor 6. The sensor 6 is disposed in a sensor receiving opening 7 in the baking plate, where in this exemplary embodiment the sensor with its sensor head 8 extends close to the baking surface 3 of the baking plate 1.

[0033] As can also be seen in FIG. 2, the sensor receiving opening 7 is substantially orthogonal to the baking surface 3 and the sensor receiving opening extends from the baking plate back 9 into the baking plate.

[0034] As will be explained in further detail subsequently with reference to FIG. 4, the sensor with its sensor head 8 extends close to the baking surface 3, where a thin layer of the material of the baking plate remains between the baking surface 3 and the sensor head or the sensor membrane which terminates the sensor head. The thin region of the baking plate is designated subsequently as measuring section 10. Located at the other end of the sensor 6 is the sensor antenna 11 which according to FIG. 1 is configured as an H-slot antenna. The diagrams in these figures are only purely schematic.

[0035] FIG. 3 shows an example for the specific arrangement of the baking plates 1 and 2 in a baking tong. The baking tong can be opened in a known manner and closed again by pivoting the upper baking tong 1 about the baking tong joint 12. The baking tong forms with the rollers 13 the baking tong carriage and a plurality of such baking tong carriages arranged in a row form the baking tong chain which is guided over an orbit. The control roller 14 is used to control the folding movement of the upper baking plate 1.

[0036] Further details on the operating mode of such baking devices can be deduced, for example, from the prior art mentioned initially and reference is particularly made to this.

[0037] For the arrangement of the sensor 6 with the sensor antenna 11, it should also be said that this antenna and its reflector plate 15 should lie as close as possible to the baking plate without however restricting the functionality of the antenna. The sensor antenna 11 can also lie in a slight recess of the baking plate or the baking plate ribs.

[0038] FIG. 4 shows an exemplary embodiment for the arrangement of the sensor 6 in the baking plate.

[0039] The sensor is inserted in the sensor receiving opening 7 and is held by an annular clamping element 30 where this sensor receiving opening is configured as a stepped blind hole. The sensor comprises the sensor head 8 which is closed with the sensor membrane 16 towards the bottom. The sensor receiving opening 7 extends very close to the baking surface 3 of the baking plate, where a measuring section 10 exists between the baking surface and the sensor membrane 16 which is sufficiently thin to relay temperature and pressure relationships on the baking surface 3 rapidly to the sensor head 8.

[0040] For contact and relaying the parameters between the measuring section 10 and the sensor membrane 16, there is provided a stamp 17 which in the present exemplary embodiment is configured as a small continuation of the measuring section 10 which extends in the direction of the sensor membrane 16.

[0041] It is obviously at the discretion of the person skilled in the art to provide the stamp 17 alternatively as part of the sensor membrane 16 and let the stamp act downwards towards the measuring section 10, as shown in FIG. 13.

[0042] The wall thickness of the measuring section 10 is indicated by the reference number 18 and in practice lies between 0.5 and 5 mm, preferably between 1 and 3 mm. The wall thickness of the measuring section depends on the material of the baking plate and the sensitivity of the sensor. It is essential that temperature and pressure can be determined by the sensor in sufficient time and to sufficient extent.

[0043] The measuring section 10 comprises a surface area which is approximately indicated by the arrow 29.

[0044] A cavity 19 is provided in the sensor head 8 for the actual measuring component of the sensor, in particular the substrate-supported piezocrystal, where the structure of this measurement-sensitive sensor arrangement inside the sensor forms a separate invention and is not shown further here. It is essential that the parameters pressure and temperature transmitted through the measuring section 10 or one of these parameters can be relayed with appropriate accuracy as a signal to the sensor antenna 11.

[0045] Located above the sensor head 8 is an insulation shaft 20 whose longitudinal extension overcomes the thickness of the baking plate. The reflector plate 15 sits on the insulation shaft 20. Not shown is the electrical lead which extends inside the sensor from the sensor head 8 as far as the antenna 11 and naturally must withstand the high temperatures of a baking oven.

[0046] FIG. 5 is merely intended to illustrate that instead of in the upper baking plate 1, the sensor 6 can also be disposed in the lower baking plate 2. Similarly FIG. 6 shows the multiple arrangement of sensors either in the lower and/or upper baking plate, in the present example the arrangement of three sensors in the upper baking plate as sensor device. FIG. 7 shows the arrangement of respectively one sensor in the lower and upper baking plate.

[0047] FIGS. 8 and 9 illustrate the arrangement of a sensor 6 in another embodiment of baking tongs, where the baking plates are not configured to be self-supporting but are mounted in a supporting frame 21, 22. This fundamental design of a baking plate can also be deduced from the prior art and requires no further explanation since the type of assembly of the baking plates alone is not essential to the invention in the present case. The person skilled in the art also identifies that the tong carriage shown comprises a baking plate without locking such as is used, for example, for the production of soft waffles or for the production of baked flatbreads for the subsequent formation of wafer cones. In the same way however, a sensor can also be provided for tong carriages with locking.

[0048] The supporting frame is indicated as upper supporting frame 21 and lower supporting frame 22. The sensor 6 sits in its sensor receiving opening 7 in the upper baking plate 1. The sensor extends here so far upwards that it is protected by the supporting frame 21 but the effect of the sensor antenna 11 is not diminished.

[0049] FIG. 10a shows schematically the inner view of a die half to produce poured wafer cones, where the sensor 6 is inserted in one of the die recesses 23, where its own baking surface 32 is provided for the sensor 6, on which pressure and/or temperature can be measured in similar manner. FIG. 10b shows the cross-section through the central die in the closed state.

[0050] FIG. 11 shows schematically an overview of the entire baking device. After the dispensing-input station 24, the baking plates provided with the sensor or sensors travel into the baking chamber 25 of the oven. Located in the initial section of the baking chamber is the reader of a radio antenna which emits its electromagnetic field in the direction of the sensors of the passing baking tongs. As a result of the measurement parameters of the sensors, the electromagnetic field varies in characteristic manner, which can be evaluated by the reading device 26. The reading device delivers its signals via the antenna cabling 27 to the evaluation device 28, which for example comprises a display for the operator of the baking device, where the display can output appropriate warnings in the event of variations of the baking parameters. The evaluation device can however also provide independent regulation of the baking parameters.

[0051] The precise arrangement of the reading devices or a multiplicity of reading devices along the process section for the baking process can be arbitrary and selected according to the circumstances. FIG. 12 shows, for example, in the initial part of the baking chamber the arrangement of six reading devices 26 and in addition, a further six reading devices in the returning part of the baking tong chain. This is only to explain that there are numerous possible arrangements. It is therefore possible to track the entire process behaviour of each baking plate and to bring about an optimisation of the baking process.

[0052] FIG. 12 also shows schematically the position display 31 which displays the arrangement in which the baking tong chain is located. The precise assignment of the measurement data delivered by the reading devices 26 to the baking plates and their position in the baking oven is thereby possible.

[0053] FIG. 13 shows schematically an alternative to the arrangement of the sensor in the sensor receiving opening 7. The stamp 17 which is responsible for transmitting the measured quantities to the sensor head 8 is a fixed component of the sensor membrane 16 and projects downwards to the measuring section 10 of the baking plate. The fluting 33 of the baking surface 3 is not interrupted since the measuring section 10 is continuously one-piece with the baking plate 1.

[0054] FIG. 14 shows another alternative to the configuration of the measurement arrangement. The sensor receiving opening 7 extends over a section 32 with reduced diameter into the baking surface 3 so that a continuous opening is present. The stamp 17 extends from the sensor membrane 16 through the section 32 as far as the baking surface 13. If the measurement point of the stamp 17 should not be visually identifiable on the finished wafer product, the stamp 17 can also be provided continuously with the fluting.

[0055] The following is a summary list of reference numerals and the corresponding structure used in the above description of the invention: [0056] 1 Upper baking plate [0057] 2 Lower baking plate [0058] 3 Baking surface [0059] 4 Gap [0060] 5 Sensor device [0061] 6 Sensor [0062] 7 Sensor receiving opening [0063] 8 Sensor head [0064] 9 Baking plate back [0065] 10 Measuring section [0066] 11 Sensor antenna [0067] 12 Baking tong joint [0068] 13 Rollers [0069] 14 Control roller [0070] 15 Reflector plate [0071] 16 Sensor membrane [0072] 17 Stamp [0073] 18 Arrow [0074] 19 Cavity [0075] 20 Insulation shaft [0076] 21 Upper supporting frame [0077] 22 Lower supporting frame [0078] 23 Die recess [0079] 24 Dispensing-input station [0080] 25 Baking chamber [0081] 26 Radio antenna, reading device [0082] 27 Antenna cabling [0083] 28 Evaluation device [0084] 29 Arrow [0085] 30 Annular clamping element [0086] 31 Position display [0087] 32 Section [0088] 33 Fluting