Light-emitting diode module for a vehicle, and productions

Abstract

A light-emitting diode module, for a vehicle, includes a first transparent sheet having a first main face and a second main face and an edge face; the diodes each including an emitting chip able to emit one or more wavelengths in the visible, guided in the first sheet; a bracket supporting the diodes, extending as a border of the glazing and fastened to the glazing; and a seal against fluid(s), able to protect the chips and the light-emission volume of the chips before injection into the first sheet. An embodiment of the invention also relates to the manufacture of this module.

Claims

1. A light-emitting module, comprising: a glazing including two opposite main faces and an edge face, the glazing further including a first transparent sheet and a second transparent sheet that is laminated with the first transparent sheet, wherein at least part of a periphery of the second sheet extends beyond at least part of a periphery of the first transparent sheet so that a first main face of the second transparent sheet facing toward the first transparent sheet has a portion, located between said part of the periphery of the second sheet and said part of the periphery of the first transparent sheet, that is not laminated with the first transparent sheet; a light source mounted to the glazing and configured to emit a radiation beam having a wavelength in the visible spectrum, the light source having an emitting surface, for emitting the radiation beam, positioned in said portion of the glazing that is located between said part of the periphery of the second sheet and said part of the periphery of the first transparent sheet, and an encapsulation structure surrounding the edge face of the glazing and covering the light source.

2. The light-emitting module of claim 1, wherein the light source includes a plurality of light-emitting diodes.

3. The light-emitting module of claim 1, comprising a bracket for mounting the light source to the glazing.

4. The light-emitting module of claim 3, wherein the bracket is attached to said portion of the second transparent sheet.

5. The light-emitting module of claim 3, wherein the bracket is mounted to one or two of the two opposite main faces of the first transparent sheet.

6. The light-emitting module of claim 5, wherein the first transparent sheet includes a first main face that faces the first main face of the second transparent sheet and a second main face that is opposite the first main face, and wherein the bracket is mounted to the second main face of the first transparent sheet.

7. The light-emitting module of claim 1, wherein the emitting surface of the light source is arranged to face an edge face of the first transparent sheet that defines said part of the periphery of the first transparent sheet so that, in use, the radiation beam enters the first transparent sheet via the edge face of the first transparent sheet.

8. The light-emitting module of claim 1, wherein the encapsulation structure includes a polymeric encapsulation that extends from said part of the periphery of the second sheet to said part of the periphery of the first transparent sheet.

9. The light-emitting module of claim 8, wherein the polymeric encapsulation extends beyond the edge face of the glazing and covers at least a portion of one of the two opposite main faces of the glazing.

10. The light-emitting module of claim 9, wherein the rectangular strip is glued to one of the main faces of the first and/or second transparent sheets.

11. The light-emitting module of claim 8, wherein the polymeric encapsulation is flush with an exterior main face of the second transparent sheet that is opposite the first main face of the second transparent sheet.

12. The light-emitting module of claim 8, wherein the polymeric encapsulation covers a portion of a main face of the first transparent sheet.

13. The light-emitting module of claim 8, wherein the first transparent sheet includes a first main face that faces the first main face of the second transparent sheet and a second main face that is opposite the first main face, wherein the polymeric encapsulation covers at least part of the second main face of the first transparent sheet.

14. The light-emitting module of claim 8, comprising a bracket for mounting the light source to the glazing, wherein the polymeric encapsulation covers the bracket.

15. The light-emitting module of. claim 1, wherein the first transparent sheet and the second transparent sheet are glass sheets.

16. The light-emitting module of claim 1, wherein the encapsulation structure forms a seal against one or more fluids for protecting the light source.

17. The light-emitting module of claim 1, comprising a lamination interlayer arranged between the first transparent sheet and the second transparent sheet.

18. The light-emitting module of claim 1, comprising a seal arranged between the light source and the encapsulation structure.

19. The light-emitting module of claim 18, wherein the seal comprises an encapsulation material that is made of polyurethane or of a flexible thermoplastic chosen from a thermoplastic elastomer (TPE), polyvinyl chloride (PVC) and ethylene-propylene-diene-terpolymer (EPDM).

20. The light-emitting module of claim 1, comprising a bracket for mounting the light source to the glazing, wherein the bracket is a rectangular strip that is fastened to one of the main faces of the first and/or second transparent sheets.

21. A roof for a vehicle comprising the light-emitting module of claim 1.

22. A light-emitting module, comprising: a glazing including two opposite main faces and an edge face, the glazing further including a first transparent glass sheet and a second transparent glass sheet that is laminated with the first transparent sheet via a lamination polymeric sheet arranged between the first transparent glass sheet and the second transparent glass sheet; a light source mounted to the glazing and configured to emit a radiation beam having a wavelength in the visible spectrum, the light source having an emitting surface, for emitting the radiation beam, toward an edge face of the glazing; a bracket for supporting the light source, the bracket mounted to at least one of the main faces of the first transparent glass sheet and the second transparent glass sheet, and a polymeric encapsulation structure surrounding the edge face of the glazing and covering the bracket.

Description

(1) Other details and advantageous features of the invention will become clear on reading about examples of modules according to the invention illustrated in the following figures:

(2) FIGS. 1A, 2A, 2C, 3 to 12, 15 and 16 show partial schematic views in cross section of diode modules in various embodiments of the invention;

(3) FIGS. 1B and 1C show partial schematic side views of a diode module in an embodiment of the invention;

(4) FIGS. 1D and 1E show partial schematic views in cross section of an automobile roof with a diode module according to the invention;

(5) FIG. 2B shows a schematic side view of a bracket for fastening diodes, according to the invention;

(6) FIGS. 13 and 14 show, respectively, a partial schematic top view of diode modules in embodiments of the invention.

(7) For the sake of clarity the various elements of the objects shown are not necessarily drawn to scale.

(8) FIG. 1 shows a partial schematic view in cross section of a diode module 100 in a first embodiment of the invention.

(9) This module 100 comprises laminated glazing comprising: a first, for example rectangular, transparent sheet 1 having a first main face 11 and a second main face 12, and a preferably rounded edge face (so as to avoid flaking), for example a soda-lime-silica glass 2.1 mm in thickness; and a second glass sheet 1, 2.1 mm in thickness, optionally tinted to provide a solar-control function (for example VG10 Venus glass) and/or covered with a solar-control coating.

(10) The second glass sheet 1 being laminated by way of a lamination interlayer 50, for example a PVE interlayer 0.76 mm in thickness.

(11) A bracket 3 supporting light-emitting diodes borders the glazing and is fastened to the first glass sheet. This bracket is monolithic, made of thin metal (stainless steel, aluminum, etc.) 0.2 mm in thickness.

(12) The diode bracket has a variable, substantially U-shaped cross section (as shown in detail by the side view in FIG. 3) and comprises: a side part 30 facing the edge face 10 of the first sheet, and bearing diodes; and is prolonged by a first flange 31 that makes contact with the main face of the glazing (and on the periphery); and is prolonged by a second flange 32 facing another main face of the glazing (and on the periphery).

(13) The gap between the two flanges 31, 32 is substantially equal to the thickness of the first sheet.

(14) The first flange has a variable cross section: it has, preferably V-shaped, projecting regions for anchoring in the interlayer 50, separated by recessed regions, for example rectilinear regions 311.

(15) The bearing length of the first flange in the anchoring regions is small, for example from 2 to 10 mm, in order to take into account the presence of the interlayer 50.

(16) The second flange may also have a variable cross section: it has projecting regions 320, of any possible shape, so as to reinforce the fastening, and recessed regions, for example rectilinear regions 321.

(17) In the recessed regions 321, the second flange makes linear contact with the face 12 so as to create a first level seal against the encapsulation material and/or to contain an internal sealing means during mounting, for example an adhesive.

(18) The bearing length of the second flange in the projecting regions 320 is for example from 2 to 30 mm.

(19) The projecting regions 320 and the anchoring regions 310 may be facing, even offset.

(20) As a variant, the bracket has a first flange on the face 12 of the second glass sheet.

(21) The light-emitting diodes each comprise an emitting chip 2 able to emit one or more wavelengths in the visible, guided in the first sheet. The diodes are small, typically a few mm or less in size, especially about 221 mm in size, without optics (lens) and preferably not pre-encapsulated so as to minimize bulk.

(22) The distance between the part bearing diodes and the edge face is minimized, for example from 5 mm. The distance between the chip and the edge face is from 1 to 2 mm.

(23) The main emission direction is perpendicular to the face of the semiconductor chip, for example with a multiple quantum-well active layer, in AlInGaP or another semiconductor technology.

(24) The light cone is a Lambertian cone of 60.

(25) The light is preferably extracted (not shown here) via the face inside the vehicle, by any means: a diffusing layer, sand-blasting, screen-printing, etching with an acid, etc.

(26) Therefore, a light-emission volume is defined between each chip and the edge face of the first sheet.

(27) Each chip and the light-emission volume must be protected from any pollution: water, chemicals, etc. both in the long term and during the manufacture of the module 100.

(28) In particular, it is useful to provide the module with a polymer encapsulation 7, about 2.5 mm in thickness, on the border of the glazing. This encapsulation, here covering the diode bracket, ensures a long-term seal (against water, cleaning products, etc.).

(29) The encapsulation also provides a good esthetic finish and allows integration of other elements or functionalities (reinforcing inserts, etc.).

(30) The encapsulation 7 has a lip, and is double sided. The encapsulation 7 is for example made of black polyurethane, especially RIM-PU (reaction injection molding polyurethane). This material is typically injected at temperatures of up to 130 C. and at a few tens of bar.

(31) The black encapsulation material is not transparent at the visible wavelength(s) of the diodes. Therefore, to ensure good injection of the light into the first sheet, sealing means are used to seal against the liquid encapsulation material.

(32) To do this, once the diode bracket 3 has been fastened, and before the injection, an external adhesive 4 is placed on the surface of the diode bracket opposite the surface facing the glazing, adhesive 4 protruding over the periphery of the glazing, and bonded at one end to the edge face of the second glass sheet 1 and at the other end to the face 12.

(33) This may be an acrylic strip coated with an acrylic adhesive 0.4 mm in thickness.

(34) For a flush encapsulation, it is preferable for a top part of the edge face 1 to be left free.

(35) As shown in the partial side views of the module 100 (which do not show the encapsulation): the strip 4 may partially protect the chips and the coupling volume (top and bottom protection), a sealing means 43 such as an adhesive is added as a side protection, sealing the lateral ends of the bracket (cf. FIG. 1B); or the strip 4 may completely protect the chips and the coupling volume by way of side parts 43 that protrude beyond the bracket 3 (cf. FIG. 10).

(36) The connecting medium 9 may protrude from the strip 4.

(37) As a variant, adhesive tapes are used.

(38) The module 100 may for example form a fixed panoramic roof of a land-based vehicle, or as a variant of a boat, etc. The roof is mounted from the outside, as shown in FIG. 1D, onto the body 90 using an adhesive 91.

(39) As a variant, shown in FIG. 1E, the encapsulation of the module 100 has been modified as follows: the lip has been removed; inserts 93 for fastening/opening the module have been added; and/or EPDM tubing 92, in other words a closed-cell sealing band, or else a multi-lipped sealing band, has been added against the encapsulation, the band being compressed after mounting on the vehicle.

(40) The multi-lipped sealing band may also be incorporated into the encapsulation.

(41) The first sheet is on the inside of the vehicle. Light is preferably extracted via the face 12.

(42) Diodes (aligned on the bracket) emitting a white or colored light may be chosen for an ambient lighting, or a light for reading, etc.

(43) The bracket may be on a lateral or longitudinal edge of the sheet 1.

(44) A number of brackets may of course be provided on a given edge or on separate edges, the brackets having identical or separate functions (the power, the light emitted, the position and extent of the light-extraction regions, may be suitably chosen).

(45) The light-extraction may form a luminous design, for example a logo or a trademark, or a light show (for children etc.).

(46) FIG. 2A shows a partial schematic view in cross section of a diode module 200 in a second embodiment of the invention.

(47) This module 200 differs from the module 100 in the means for sealing against the encapsulation material.

(48) This is because the PVB lamination interlayer has a part 51 protruding between the edge face of the first sheet 1 and the side part 30 of the bracket. This part is made to bond to the edge face by softening the PVB and embeds the chips.

(49) More precisely, the edge of the PVB may be pre-cut so as to have protruding parts under the recessed regions 311 of the flange 31, which do not bear on the face 12 (cf. FIG. 3 also), and parts for housing anchoring regions 310.

(50) As a variant, the flange 31 is fastened to the external face of the second sheet. The flange may therefore be full (i.e. have a uniform cross section) and longer.

(51) FIG. 2C shows a partial schematic view in cross section of a diode module 210 in a variant of the second embodiment of the invention.

(52) This module 210 differs from the module 200 in the positioning of the protruding part 51 which this time covers the diode bracket 3. The bracket 3 may be a flangeless bracket, of rectilinear cross section, rectangular for example, for example a printed circuit board (PCB).

(53) Furthermore, the bracket is premounted on the protruding part before it is turned down and, so as to make its anchoring easier, it may comprise burrs 52 on its external face 31 or side face.

(54) In addition, the protruding part envelopes the bracket and bonds to the edge of the face 12. Also, in this configuration, the sheet 50 serves to fasten chips to the glazing.

(55) FIG. 3 shows a partial schematic view in cross section of a diode module 300 in a third embodiment of the invention.

(56) This module 300 differs from the module 210 in that: the laminated glazing is (optionally) replaced by a single glazing, for example made of a plastic, for example PC, and the lamination interlayer is (optionally) replaced by at least one functional film, for example a light-extraction film 50 made of PU, PP or PE with an adhesive-coated side that makes contact with the glazing; and the protruding part 51 of this film this time covers the U-shaped diode bracket 3.

(57) In addition, the protruding part envelopes the bracket 3 and bonds to the face 12.

(58) Finally, the U-shaped bracket may have a uniform cross section, with (full) flanges of equal dimensions.

(59) FIG. 4 shows a partial schematic view in cross section of a diode module 400 in a fourth embodiment of the invention.

(60) This module 400 differs from the module 100 in the means for sealing against the encapsulation material.

(61) This is because the external adhesive strip has been removed (it may also be kept) and replaced with a double-sided adhesive strip 5 (either discontinuous, per (group of) diode(s), or of a single piece for all the diodes) that envelopes the chips and adheres to the edge face of the glazing 10.

(62) The radiation emitted by the diodes passes through the double-sided strip. The light-emission volume (the region between the chips and the coupling edge face, bounded by the emissions of the furthest diodes) is also protected by this strip.

(63) FIGS. 5 to 7 show partial schematic views in cross section of diode modules 500 to 700 in embodiments of the invention.

(64) The module 500 differs from the module 100 in the means of sealing against the encapsulation material, namely an adhesive 6 in contact regions between the bracket and the glazing.

(65) This adhesive is chosen to be transparent at said wavelength(s) of the diodes if it occupies the light-emission volume.

(66) Naturally, preferably to this adhesive may be added a (similar or separate) adhesive or any other means for sealing the side parts of the bracket (as already described in FIG. 1B).

(67) The module 600 differs from the module 100 in the means for sealing against the encapsulation material, namely an adhesive 6 embedding the chips and filling the entire volume between the edge face and the bracket.

(68) This adhesive is chosen to be transparent at said wavelength(s) of the diodes because it occupies the light-emission volume. It also differs in that the first glass sheet is locally recessed and protruding on the two main faces so as to house the diodes and here the bracket, minimizing the width of the encapsulation, or, in a variant, the premounted seal, so as to maximize the size of the window region.

(69) The module 700 differs from the module 600 in the placement of the chips 2, facing the face 12, and the consequent modification of the flange 32, with a volume for housing the chips and a sole 32 bearing against the face 12.

(70) FIGS. 8 to 10 show partial schematic views in cross section of diode modules 800 to 1000 in embodiments of the invention.

(71) These modules 800 to 1100 differ from the module 100 primarily in the absence of encapsulation and in the presence of a premounted seal.

(72) The seal 80 of the module 800 is a seal 81 made of extruded EPDM having a uniform U-shaped cross section and containing a reinforcing metal core 83. The seal comprises an end 82 for clipping to the face 12. In this configuration, the seal 80 serves to fasten chips 2 to the glazing. The diode bracket 3 is a flangeless rectangular bracket, of rectilinear cross section, for example a PCB. The seal (against water, high-pressure washing, cleaning products, etc.) is ensured by way of an internal transparent adhesive 6.

(73) In the modules 900 to 1100, the laminated glazing is replaced with single glazing, for example made of plastic, for example PC.

(74) The seal 80 of the module 900 is a seal 81 made of extruded EPDM having a uniform U-shaped cross section and containing a reinforcing metal core 83. The seal comprises an end 82 for clipping to a recess in a masking layer 9 made of black polycarbonate bordering the face 12. In this configuration, the seal 80 serves to fasten chips to the laminated glazing. The diode bracket 3 is a flangeless rectangular bracket, of rectilinear cross section, for example a PCB. In the edge face a groove is provided for housing the diodes. The seal (against water, high-pressure washing, cleaning products, etc.) is ensured by way of an internal transparent adhesive 6.

(75) As a variant, shown in FIG. 9a, the seal 80 is provided with sealing lips 80. The internal adhesive is then not required thereby allowing the seal to be more easily demounted. However, the joining region at the ends of the seal may be sealed against water, high-pressure washing, cleaning products, etc. by any of the means described above.

(76) The seal 70 of the module 1000 is a seal made of extruded TPE or EPDM 70 having a uniform U-shaped cross section.

(77) The diode bracket 3 is an L-shaped bracket premounted on the seal 70 using an adhesive or any other means. The seal (against water, high-pressure washing, cleaning products, etc.) is ensured by way of an internal transparent adhesive 6.

(78) FIG. 11 shows a partial schematic view in cross section of a diode module 1100 in an embodiment of the invention.

(79) This module 1100 differs from the module 100 in the following: the laminated glazing has been replaced with single PC glazing having a black PC masking layer on the periphery of the face 12; it has a substantially U-shaped external adhesive strip 4; and its chips 6 are pre-encapsulated in a groove in the coupling edge of the glazing, which groove may or may not open onto another edge of the glazing.

(80) If the strip 4 does not completely cover the sides, for a complete protection of the material 7 a sealing means such as an adhesive is added, sealing the groove so as to prevent penetration of fluid from the sides.

(81) FIG. 12 shows a partial schematic view in cross section of a diode module 1200 according to another embodiment of the invention.

(82) This module 1200 differs from the module 100 in the following: the laminated glazing has been replaced with single PC glazing having a black PC masking layer on the periphery of the face 12; it has a substantially U-shaped external adhesive strip 4; and it has a three-faced encapsulation.

(83) The extraction area 12a is covered with a black masking region 12d,

(84) For example, this module is shown mounted on a side window (shown in FIG. 13) with a window region 12d or on a rear window for a land-based vehicle (a variant is shown in FIG. 14).

(85) The light is seen from the exterior (means of locating the vehicle, for the side or rear window, brake light etc.).

(86) FIG. 15 shows a partial schematic view in cross section of a diode module 610 in an embodiment of the invention.

(87) This module differs from the module 600 described in FIG. 6: in the type of bracket, which is a simple rectangular strip 3, typically a PCB, made of plastic or even metal; in the optional fastening of the bracket on the periphery of the lamination face 13 of the second glass sheet by way of an adhesive or a double-sided adhesive 60 which allows the bracket to be pre-positioned with the addition of adhesive sealing means in the coupling volume; and in the choice of diodes, here edge-emitting diodes, therefore with an emitting front side face 21 facing the edge face 10.

(88) In this configuration, the rear face (and sides) of the diodes make contact with the encapsulation material 7. It has surprisingly been observed that the diodes can make contact with the material (beyond their emitting faces) because they withstand the conditions (especially the temperature) of encapsulation in polyurethane or in flexible thermoplastics, preferably injected at less than 250 C., even at 200 C.

(89) Thus, generally, it is possible to use a bracket having a simple shape that does not form a screen between the encapsulation and the diodes (rather than a U-, J- or L-shaped bracket).

(90) Furthermore, the bracket 3 is sufficiently wide to prevent stray light propagating through the border of the second sheet (and therefore being seen from the exterior) for example in the case of a flush encapsulation.

(91) Naturally, it is still possible to provide a more extensive, especially L- or U-shaped, bracket.

(92) As a variant (not shown), the internal sealing adhesive 6 is removed and an adhesive 60 is used for the bonding, and the coupling space is protected by surrounding the diodes and the bracket with an enveloping adhesive strip, for example analogous to that shown in FIG. 1a, and fastened to the edge face 10 and to the periphery of the face 12, beneath the encapsulation.

(93) FIG. 16 shows a partial schematic view in cross section of a diode module 620 in an embodiment of the invention.

(94) This module differs from the module 610 shown in FIG. 15 in the position of the bracket 3, here bonded to the periphery of the first main face 12 using an adhesive 60.

(95) Naturally, a more extensive L-, U- or J-shaped bracket could be used (with a shorter flange on the face 13 especially to stop stray light).

(96) As a variant it could be single glazing.