POLISHING DEVICE

Abstract

An object of the present invention is to provide the diamond polishing device having a function capable of performing polishing even a surface of a semi-closed space such as an inner circumferential surface of a cylinder member or a ring member. The polishing device of the present invention includes a polishing member having a long shape, means for delivering and winding the polishing member, a polishing member support that holds the polishing member to be capable of being wound and displaced, a base to which the polishing member support is attached, and pressing means for pressing the base toward a machining surface of a member to be polished. The base includes an extending section that extends in a direction different from the pressing direction. The polishing member support is disposed at a distal end portion of the extending section.

Claims

1. A polishing device comprising: a polishing member having a linear shape or a belt shape; means for delivering and winding the polishing member; a polishing member support that holds the polishing member to be capable of being wound and displaced; a base to which the polishing member support is attached; and pressing means for pressing the base toward a machining surface of a member to be polished, wherein the base includes an extending section that extends in a direction different from the pressing direction, and the polishing member support is disposed at a distal end portion of the extending section.

2. The polishing device according to claim 1, wherein the means for delivering and winding the polishing member is attached on the base.

3. The polishing device according to claim 1, wherein the direction in which the polishing member is pressed toward the machining surface of the member to be polished is horizontal.

4. The polishing device according to claim 2, wherein the direction in which the polishing member is pressed toward the machining surface of the member to be polished is horizontal.

5. The polishing device according to claim 1, wherein the polishing device is used for polishing of diamond or a diamond film.

6. The polishing device according to claim 2, wherein the polishing device is used for polishing of diamond or a diamond film.

7. The polishing device according to claim 3, wherein the polishing device is used for polishing of diamond or a diamond film.

8. The polishing device according to claim 5, wherein the polishing member has a surface made of metal easily reactive with carbon, carburizing metal, or metal oxide.

9. The polishing device according to claim 6, wherein the polishing member has a surface made of metal easily reactive with carbon, carburizing metal, or metal oxide.

10. The polishing device according to claim 7, wherein the polishing member has a surface made of metal easily reactive with carbon, carburizing metal, or metal oxide.

11. The polishing device according to claim 8, further comprising heating means for heating the polishing member and/or the member to be polished.

12. The polishing device according to claim 9, further comprising heating means for heating the polishing member and/or the member to be polished.

13. The polishing device according to claim 10, further comprising heating means for heating the polishing member and/or the member to be polished.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0020] [FIG. 1]

[0021] FIG. 1 is a diagram showing a form in which an inner circumferential surface of a ring member is machined by a polishing device according to the present invention.

[0022] [FIG. 2]

[0023] FIG. 2 is a diagram showing two embodiments of the polishing device according to the present invention.

[0024] [FIG. 3]

[0025] FIG. 3 is a diagram for explaining a form in which, when the inner circumferential surface of the ring member is machined by the polishing device according to the present invention, the machining is not affected by the gravity.

[0026] [FIG. 4]

[0027] FIG. 4 is a diagram showing an embodiment of the polishing device according to the present invention added with a heating device.

[0028] [FIG. 5]

[0029] FIG. 5 is a diagram for explaining a conventional polishing device that delivers a polishing member.

[0030] [FIG. 6]

[0031] FIG. 6 is a diagram showing a basic configuration of a conventional polishing device of a chemical polishing system.

REFERENCE SIGNS LIST

[0032] 1 member to be polished (machined) [0033] 1a surface to be machined (diamond surface) [0034] 2 heating means [0035] 2a laser beam [0036] 3 polishing member [0037] 3a fixed polishing member [0038] 3b linear polishing member [0039] 3c belt-like polishing member [0040] 4 polishing member support [0041] 4a pulley [0042] 4b roller [0043] 5 base [0044] 5a extending section [0045] 6 delivering and winding means [0046] 7 pressing means

DESCRIPTION OF EMBODIMENTS

[0047] Embodiments of the present invention are explained below in detail.

[0048] A diamond polishing device having a form for performing polishing while winding a polishing member having a long shape on a polishing member support and pressing a polishing surface against a surface of a member to be polished via the polishing member support while continuously or intermittently displacing the polishing surface has a function capable of performing polishing even a surface of a semi-closed space such as an inner circumferential surface of a cylinder member or a ring member. Therefore, a basic characteristic adopted by the present invention resides in a configuration in which the polishing member support wound with the polishing member is attached to an extending section of a base extending in a direction different from the pressing direction by pressurizing means such that the presence of delivering and winding means for the long polishing member, which is an accessory member of the diamond polishing device of this type, and pressing means for pressing the polishing surface toward a machining surface of the member to be polished does not interfere with the structure of the member to be machined. The configuration is adopted in which the base of the present invention includes the extending section extending in the direction different from the pressing direction on the surface to be machined and the polishing member support is disposed at the distal end portion of the extending section. Therefore, it is possible to shift a machining position where the polishing member support is disposed and positions of a main body section of the base and the pressing means and it is possible to prevent the main body section of the base and the pressing means from interfering with the member to be polished and polish a semi-closed space such as an inner circumferential surface of a cylinder member or a ring member.

[0049] A form for polishing an inner circumferential surface of a ring member is explained according to a representative embodiment example of the present invention with reference to FIG. 1. In a device of this embodiment, delivering and winding means 6 for delivering and winding a polishing member 3 is attached to a base 5 and pressurizing means 7 for pressing the base 5 toward a surface to be machined la is attached. An extending section 5a extending in a direction orthogonal to a direction of a pressing force for biasing the base 5 in a position on the opposite side of an attached position of the pressurizing means 7 is provided in the base 5. A polishing member support 4 such as a pulley or a roller is attached near a distal end portion of the extending section 5a. Further, in the polishing member support 4, the polishing member 3 having a long shape such as a linear shape or a belt shape is laid over between the polishing member support 4 and the delivering and winding means 6 to be wound on the polishing member support 4. The polishing device of the present invention has a structure in which the polishing member support 4 is attached to the extending section extending in the direction orthogonal to the direction of the pressing force for biasing the base 5 in the position on the opposite side of the attached position of the pressurizing means and the surface of a member to be polished 1 is polished by the polishing member 3 wound on the polishing member support 4. Therefore, it is possible to shift the positions of the delivering and winding means 6 and the pressurizing means 7, which form a large device, from a polishing section. It is possible to avoid interference with the member to be machined 1. Therefore, as shown in FIG. 1, even if the member to be machined 1 has a ring shape, it is possible to bring the polishing member support 4 into contact with an inner circumferential surface of the member to be machined 1. It is possible to perform polishing.

[0050] The polishing device of the present invention is not limited to the embodiment example explained above. Various modifications are possible. In the example shown in FIG. 1, the form is adopted in which the delivering and winding means 6 for delivering and winding the polishing member 3 is attached to the base 5. However, the configuration explained above is not always an essential requirement for the object of the present invention to provide a polishing device having a function capable of polishing even a surface of a semi-closed space such as an inner circumferential surface of a cylinder member or a ring member. As shown in A of FIG. 2, a form may be adopted in which the extending section 5a is provided in the base 5 in a direction different from the pressing direction, the polishing member support 4 is attached near the distal end of the extending section 5a, and the delivering and winding means 6 for delivering and winding the polishing member 3 is not attached to the base 5. However, when the delivering and winding means 6 is attached to the base 5 as shown in FIG. 1, the positions of the polishing member support 4 and the delivering and winding means 6 are in a fixed relation. Therefore, tension applied to the polishing member does not change according to relative displacement of both the members during operation and affect polishing. Therefore, the form shown in FIG. 1 is considered to be a more desirable form. A pressing force of the polishing member applied to the surface of the member to be polished in the polishing greatly affects a polishing state and a heating state. Therefore, the pressing force is an important requirement.

[0051] The extending section 5a of the base does not always need to extend in the direction orthogonal to the direction of the pressing force for biasing the base 5 in the position on the opposite side of the attached position of the pressurizing means 7. The extending section 5a only has to extend in the direction different from the pressing direction by the pressurizing means. In short, the position of the polishing member support wound with the polishing member only has to be capable of being shifted from the positions of the delivering and winding means 6 and the pressurizing means 7, which form the large device. A form shown in B of FIG. 2 may be adopted.

[0052] Another preferred form of the polishing device of the present invention is explained with reference to FIG. 3. In this embodiment, the direction of the pressing force is set in the horizontal direction by the pressurizing means 7 to prevent the sections of the device from being affected by the gravity acting thereon. It is possible to remove the influence of the gravity using a balancing device using a weight, air pressure, or the like. However, this is undesirable because complication of the device is caused, for example, the number of components increases and the device needs to be controlled with respect to a weight change due to wear of the polishing member. The machining surface la of the member to be polished 1 is set in the vertical direction. The pressing force of the polishing member 3 acts in the horizontal direction. Therefore, since it is possible to remove the influence of the gravity acting in the vertical direction with a simple structure and irrespective of a wear amount of the polishing member, the machining surface to be polished is not affected. As explained above, the pressing force of the polishing member applied to the surface of the member to be polished in the polishing greatly affects a polishing state and a heating state. Therefore, the pressing force also has an important meaning.

[0053] Further, still another preferred form of the present invention added with heating means is explained with reference to FIG. 4. A heating means 2 focuses a laser beam 2a on a machining section with a laser oscillator to heat the machining section.

[0054] Since the laser beam is radiated on the machining section, reaction between diamond, which is a material to be polished, and metal easily reactive with carbon, carburizing metal, or metal oxide, which is the material of the polishing member, is facilitated. It is possible to reduce a polishing time. Further, if a heater is also provided as heating means at the distal end portion of the extending section 5a of the base where the polishing member support 4 is disposed, a heating effect is further improved. It is possible to further reduce the polishing time.

INDUSTRIAL APPLICABILITY

[0055] In this specification, the polishing member of the present invention is explained as having, on the surface thereof, metal easily reactive with carbon or carburizing metal and performing the chemical polishing. However, the present invention is not limited to this. The present invention can also be applied to a polishing device of a mechanical polishing system including a diamond polishing paper, a belt polishing material, or a diamond wire as long as a long polishing member is continuously or intermittently delivered and wound.