ALUMINIUM-SILICON CARBIDE COMPOSITE, AND POWER-MODULE BASE PLATE

Abstract

To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 m and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.

Claims

1. An aluminum-silicon carbide composite having, on a periphery of a first phase comprising a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %; a second phase comprising an aluminum-ceramic fiber composite containing, at a proportion of 3 to 20% by volume, ceramic fibers having an average fiber diameter of at most 20 m and an average aspect ratio of at least 100; wherein a proportion of the aluminum-ceramic fiber composite contained in the second phase is at least 50 area % of the peripheral area of the first phase.

2. The aluminum-silicon carbide composite according to claim 1, wherein a thermal expansion coefficient of the aluminum-ceramic fiber composite is less than 2010.sup.6/K, a strength at 25 C. is at least 200 MPa and a strength at 150 C. is at least 150 MPa.

3. The aluminum-silicon carbide composite according to claim 1, wherein both main surfaces are covered by an aluminum alloy layer or an aluminum-ceramic fiber layer.

4. The aluminum-silicon carbide composite according to claim 1, wherein one main surface is covered by an aluminum alloy layer or an aluminum-ceramic fiber layer.

5. The aluminum-silicon carbide composite according to claim 1, wherein a ceramic fiber content in the aluminum-ceramic fiber composite contained in the second phase is 5 to 20 vol % with respect to a entire aluminum-ceramic fiber composite.

6. The aluminum-silicon carbide composite according to claim 1, wherein the ceramic fiber comprises one or more materials chosen from among alumina, silica, boron nitride, silicon carbide and silicon nitride.

7. A power-module base plate formed by plating a surface of the aluminum-silicon carbide composite according to claim 1.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0091] [FIG. 1] An explanatory diagram showing an embodiment of the aluminum-silicon carbide composite used in the present invention.

[0092] [FIG. 2] An explanatory diagram showing an embodiment of the aluminum-silicon carbide composite used in the present invention.

DESCRIPTION OF REFERENCE SYMBOLS

[0093] a) Aluminum-silicon carbide composite [0094] b) Peripheral portion including aluminum-ceramic fiber composite [0095] c) 7 mm through hole [0096] d) 10 to 4 mm countersink [0097] e) Surface aluminum alloy layer