High-efficiency heat-dissipating paint composition using a carbon material
09624379 ยท 2017-04-18
Assignee
Inventors
- Seung Hoe DO (Daejeon, KR)
- Seong Cheol Hong (Daejeon, KR)
- Jin Seo Lee (Daejeon, KR)
- Joo Hee Han (Daejeon, KR)
Cpc classification
H01L23/373
ELECTRICITY
H01L2924/0002
ELECTRICITY
C08K9/02
CHEMISTRY; METALLURGY
C09K5/00
CHEMISTRY; METALLURGY
C08K3/046
CHEMISTRY; METALLURGY
H01L23/3737
ELECTRICITY
C09D5/00
CHEMISTRY; METALLURGY
H01L2924/00
ELECTRICITY
H01L2924/0002
ELECTRICITY
C09D7/70
CHEMISTRY; METALLURGY
H01L2924/00
ELECTRICITY
H05K7/20427
ELECTRICITY
International classification
C09K13/00
CHEMISTRY; METALLURGY
H05K7/20
ELECTRICITY
H01L23/373
ELECTRICITY
C09K5/00
CHEMISTRY; METALLURGY
Abstract
Provided is a heat-dissipating paint composition using a carbon material, the heat-dissipating paint composition including a dispersion solution containing a surface treated carbon material, a heat resistance additive, and an adhesion improving emulsion, so that the heat-dissipating paint composition can have excellent heat dissipation performance and can be applied to various industrial field requiring temperature control.
Claims
1. A heat-dissipating paint composition, comprising: 8099 wt % of a dispersion solution containing a surface treated carbon material, and 120 wt % of a heat resistant additive; wherein the dispersion solution containing a surface treated carbon material includes a surface treated carbon material, a styrene and acryl based water soluble resin, any one or a mixture selected from the group consisting of an ammonia water, an amine based compound, an inorganic alkali solution and a solvent; wherein the styrene and acryl based water soluble resin is obtained by a reaction of styrene, alphamethyl styrene, and acrylic acid; wherein the heat resistant additive contains an alkali soluble resin emulsion and any one or a mixture of two or more selected from the group consisting of aluminum oxide, magnesium oxide, beryllium oxide, zirconium oxide, calcium oxide, titanium oxide, zinc oxide, silicon oxide, iron oxide, boron nitride, aluminum nitride, silicon nitride, titanium nitride, zirconium nitride, hafnium nitride, and nitride of niobium; and wherein the alkali soluble resin is obtained by a reaction of a styrene and acryl based water soluble resin, styrene, 2-ethylhexyl acrylate and glycidyl methacrylate.
2. The heat-dissipating paint composition of claim 1, further comprising 50150 parts by weight of an insulation additive based on 100 parts by weight of the heat-dissipating paint composition, the insulation additive being any one or a mixture of two or more selected from the group consisting of organometal sol, polyester-polyurethane copolymer, polyurethane-epoxy copolymer, polyester-polyurethane-silicone copolymer, and polyester-epoxy copolymer.
3. The heat-dissipating paint composition of claim 2, wherein the heat-dissipating paint composition is applied to products selected from the group consisting of LED lamps, electronic chips, heat exchangers, semiconductor equipment, condensers, evaporators, heaters, display devices, monitors, boiler piping, communications, engine, motors, batteries, housing materials, electrode materials, and textiles.
4. The heat-dissipating paint composition of claim 1, wherein the dispersion solution containing a surface treated carbon material includes 0.110 wt % of a surface treated carbon material, 0.0450 wt % of the styrene and acryl based water soluble resin, 0.00515 wt % of the ammonia water, amine based compound, inorganic alkali solution, or mixture thereof; and 2599.855 wt % of the solvent.
5. The heat-dissipating paint composition of claim 1, wherein the heat resistant additive includes 0.120 wt % of the any one or a mixture of two or more selected from the group consisting of aluminum oxide, magnesium oxide, beryllium oxide, zirconium oxide, calcium oxide, titanium oxide, zinc oxide, silicon oxide, iron oxide, boron nitride, aluminum nitride, silicon nitride, titanium nitride, zirconium nitride, hafnium nitride, and nitride of niobium; and 8099.9 wt % of the alkali soluble resin emulsion.
6. The heat-dissipating paint composition of claim 5, wherein the alkali soluble resin emulsion includes: water; ammonia water, amine based compound, inorganic alkali solution, or mixture thereof; and the alkali soluble resin, and has a solid content of 4050 wt %.
7. The heat-dissipating paint composition of claim 6, wherein the alkali soluble resin is obtained by a reaction of 525 wt % of a styrene and acryl based water soluble resin, 0.15 wt % of styrene, 6580 wt % of 2-ethylhexyl acrylate, 0.13 wt % of glycidyl methacrylate, and 0.12 wt % of an initiator; and wherein the styrene and acryl based water soluble resin is obtained by a reaction of 3040 wt % of styrene, 3035 wt % of alphamethyl styrene, and 3035 wt % of acrylic acid in the presence of a mixed solvent of dipropylene glycol methyl ether and water.
8. The heat-dissipating paint composition of claim 1, wherein the surface treated carbon material is any one or a mixture of two or more selected from the group consisting of single-walled carbon nanotube, double walled carbon nanotube, thin multi-walled carbon nanotube, multi-walled carbon nanotube, roped carbon nanotube, graphite, graphite oxide, graphene, graphene oxide, carbon black, carbon fiber, and carbon nanofiber.
9. The heat-dissipating paint composition of claim 1, wherein the surface treated carbon material has a hydrophilic functional group selected from the group consisting of oxygen, nitrogen, sulfur, and a mixture thereof.
10. The heat-dissipating paint composition of claim 1, wherein the styrene and acryl based water soluble resin is obtained by a reaction of 3040 wt % of styrene, 3035 wt % of alphamethyl styrene, and 3035 wt % of acrylic acid in the presence of a mixed solvent of dipropylene glycol methyl ether and water, the styrene and acryl based water soluble resin having a weight average molecular weight of 1,000100,000.
11. The heat-dissipating paint composition of claim 1, wherein the heat-dissipating paint composition is applied to products selected from the group consisting of LED lamps, electronic chips, heat exchangers, semiconductor equipment, condensers, evaporators, heaters, display devices, monitors, boiler piping, communications, engine, motors, batteries, housing materials, electrode materials, and textiles.
12. A heat-dissipating paint composition, comprising: 8095 wt % of a dispersion solution containing a surface treated carbon material, 115 wt % of a heat resistant additive, and 110 wt % of an adhesion improving emulsion; wherein the dispersion solution containing a surface treated carbon material includes a surface treated carbon material, a styrene and acryl based water soluble resin, any one or a mixture selected from the group consisting of an ammonia water, an amine based compound, an inorganic alkali solution and a solvent; wherein the styrene and acryl based water soluble resin is obtained by a reaction of styrene, alphamethyl styrene, and acrylic acid; wherein the heat resistant additive contains an alkali soluble resin emulsion and any one or a mixture of two or more selected from the group consisting of aluminum oxide, magnesium oxide, beryllium oxide, zirconium oxide, calcium oxide, titanium oxide, zinc oxide, silicon oxide, iron oxide, boron nitride, aluminum nitride, silicon nitride, titanium nitride, zirconium nitride, hafnium nitride, and nitride of niobium; and wherein the alkali soluble resin is obtained by a reaction of a styrene and acryl based water soluble resin, styrene, 2-ethylhexyl acrylate and glycidyl methacrylate.
13. The heat-dissipating paint composition of claim 12, further comprising 50150 parts by weight of an insulation additive based on 100 parts by weight of the heat-dissipating paint composition, the insulation additive being any one or a mixture of two or more selected from the group consisting of organometal sol, polyester-polyurethane copolymer, polyurethane-epoxy copolymer, polyester-polyurethane-silicone copolymer, and polyester-epoxy copolymer.
14. The heat-dissipating paint composition of claim 13, wherein the heat-dissipating paint composition is applied to products selected from the group consisting of LED lamps, electronic chips, heat exchangers, semiconductor equipment, condensers, evaporators, heaters, display devices, monitors, boiler piping, communications, engine, motors, batteries, housing materials, electrode materials, and textiles.
15. The heat-dissipating paint composition of claim 12, wherein the adhesion improving emulsion is an acryl based resin emulsion which includes water; ammonia water, an amine based compound, an inorganic alkali solution, or a mixture thereof; and an acryl based resin and which has a solid content of 4050 wt % and an average particle size of 30300 nm.
16. The heat-dissipating paint composition of claim 15, wherein the acryl based resin is prepared from alkyl(meth)acryl based monomer, itaconic acid, a silane coupling agent or an acryl based cross-linking monomer, an initiator, and an additive.
17. The heat-dissipating paint composition of claim 12, wherein the dispersion solution containing a surface treated carbon material includes 0.110 wt % of a surface treated carbon material, 0.0450 wt % of the styrene and acryl based water soluble resin, 0.00515 wt % of the ammonia water, based compound, inorganic alkali solution, or mixture thereof; and 2599.855 wt % of the solvent.
18. The heat-dissipating paint composition of claim 12, wherein the heat resistant additive includes 0.120 wt % of the any one or a mixture of two or more selected from the group consisting of aluminum oxide, magnesium oxide, beryllium oxide, zirconium oxide, calcium oxide, titanium oxide, zinc oxide, silicon oxide, iron oxide, boron nitride, aluminum nitride, silicon nitride, titanium nitride, zirconium nitride, hafnium nitride, and nitride of niobium; and 8099.9 wt % of the alkali soluble resin emulsion.
19. The heat-dissipating paint composition of claim 18, wherein the alkali soluble resin emulsion includes: water; ammonia water, an amine based compound, an inorganic alkali solution, or a mixture thereof; and a alkali soluble resin, and has a solid content of 4050 wt %.
20. The heat-dissipating paint composition of claim 19, wherein the alkali soluble resin is obtained by a reaction of 525 wt % of a styrene and acryl based water soluble resin, 0.15 wt % of styrene, 6580 wt % of 2-ethylhexyl acrylate, 0.13 wt % of glycidyl methacrylate, and 0.12 wt % of an initiator; and wherein the styrene and acryl based water soluble resin is obtained by a reaction of 3040 wt % of styrene, 3035 wt % of alphamethyl styrene, and 3035 wt % of acrylic acid in the presence of a mixed solvent of dipropylene glycol methyl ether and water.
21. The heat-dissipating paint composition of claim 12, wherein the surface treated carbon material is any one or a mixture of two or more selected from the group consisting of single-walled carbon nanotube, double walled carbon nanotube, thin multi-walled carbon nanotube, multi-walled carbon nanotube, roped carbon nanotube, graphite, graphite oxide, graphene, graphene oxide, carbon black, carbon fiber, and carbon nanofiber.
22. The heat-dissipating paint composition of claim 12, wherein the surface treated carbon material has a hydrophilic functional group selected from the group consisting of oxygen, nitrogen, sulfur, and a mixture thereof.
23. The heat-dissipating paint composition of claim 12, wherein the heat-dissipating paint composition is applied to products selected from the group consisting of LED lamps, electronic chips, heat exchangers, semiconductor equipment, condensers, evaporators, heaters, display devices, monitors, boiler piping, communications, engine, motors, batteries, housing materials, electrode materials, and textiles.
24. The heat-dissipating paint composition of claim 12, wherein the styrene and acryl based water soluble resin is obtained by a reaction of 3040 wt % of styrene, 3035 wt % of alphamethyl styrene, and 3035 wt % of acrylic acid in the presence of a mixed solvent of dipropylene glycol methyl ether and water, the styrene and acryl based water soluble resin having a weight average molecular weight of 1,000100,000.
Description
DESCRIPTION OF DRAWINGS
(1)
(2)
DETAILED DESCRIPTION OF MAIN ELEMENTS
(3) 10: metal PCB substrate
(4) 20: interlayer heat conduction adhesive layer
(5) 30: aluminum heat-dissipating plate coated with heat-dissipating paint
(6) 40: LED lamp
(7) 50: rubber roll
(8) 60: heating metal roll
(9) 70: heat-dissipating paint coating layer
(10) 80: aluminum substrate
BEST MODE
(11) Hereinafter, the present invention will be in detail described by examples, but the present invention is not limited to the following examples.
(12) Physical properties were evaluated by the following measurement methods.
(13) 1) Evaluation on Adhesive Property
(14) Measurement was performed by a tape test (JIS D0202) method. Checkerboard-shaped eyes with 1 mm in width and length were cut in an aluminum heat-dissipating plate coated with a heat-dissipating paint, to which a cellophane tape was then allowed to adhere, and then while the cellophane tape was peeled, a detachment phenomenon was observed. M6 represent a case where all the square cells are peeled, and M5<M4<M3<M2<M1 represents stronger adhesive property. For example, M3 represents a degree at which peeling is acceptable along a straight line and 50% or higher of square pieces of square cells need not be peeled. M2 represents a degree at which corner breakage is entirely shown, peeling along a straight line does not occur, and 50% or higher of square pieces of square cells need not be peeled.
(15) 2) Evaluation on Heat Resistance
(16) Measurement was performed by a heating roll test (see,
(17) 3) Evaluation on Insulating Property
(18) Measurement was performed by a sheet resistance measurement method (JIS K7194, ASTM D257). A sample was divided into 9 parts by being cut to a size of 58 cm, and then the measurement was performed. An inherent sheet resistance of the sample was obtained by applying a voltage of 101000 volt, using the 4 point probe method having 4 probes and then excluding contact resistance as much as possible. It was evaluated that insulating property exhibited a sheet resistance of 10.sup.5 /sq or higher.
Preparative Example 1
Preparation of Dispersion Solution Containing Surface Treated Carbon Material
(19) An aqueous CNT solution was prepared in a pre-treating bath by mixing carbon nanotube (CNT) 15 g with distilled water 985 g using a circulation pump. Before the aqueous CNT solution is inputted to a preheating bath through a high-pressure injection pump at a flow rate of 30 g/min, a gas phase oxygen compressed to 252 atm was mixed with the aqueous CNT solution at a front end of a heat exchanger at a flow rate of 0.8 g/min. The mixture liquid was inputted to the preheating bath that has been preheated to 200 C. through the heat exchanger. The preheated mixture liquid was injected to a surface treatment reactor in a subcritical water state of 210 C. and 250 atm, and then surface treated. The surface treated product was again transferred to the heat exchanger, and firstly cooled to 100 C. and then again cooled to about 25 C. by a cooling apparatus, thereby obtaining a continuously surface treated CNT 14.3 g.
(20) 3 wt % of the surface treated carbon nanotube, 2.4 wt % of a styrene and acryl based water soluble resin (weight average molecular weight:100,000, including 35 wt % of styrene, 32.5 wt % of alphamethyl styrene, and 32.5 wt % of acrylic acid), 94.24 wt % of water, and 0.36 wt % of ammonia water were mixed to prepare a dispersion solution containing a surface treated carbon material.
Preparative Example 2
Preparation of Heat Resistant Additive
(21) A heat resistant additive was prepared by using 90 wt % of the dispersion solution prepared in Preparative Example 1 and 10 wt % of an aqueous alkali resin emulsion containing zinc oxide as heat-resistant metal oxide.
(22) Here, the aqueous alkali resin emulsion was used by mixing 52.1 wt % of water, 1.9 wt % of ammonia water, and 46 wt % of solid. As the solid, a resin obtained by reacting 20.7 wt % of a styrene and acryl based water soluble resin (weight average molecular weight:100,000, including 35 wt % of styrene, 32.5 wt % of alphamethyl styrene, and 32.5 wt % of acrylic acid), 4.2 wt % of styrene, 73.3 wt % of 2-ethylhexyl acrylate, 1.2 wt % of glycidyl methacrylate, and 0.6 wt % of ammonium peroxide as an initiator was used.
Preparative Example 3
Preparation of Adhesion Improving Emulsion
(23) An adhesion improving emulsion was prepared by mixing 54.9 wt % of water, 0.2 wt % of 27% ammonia water, and 44.9 wt % of an acryl based resin (weight average molecular weight: 15,000) as a solid.
(24) Here, as the acryl based resin used as a solid, a resin obtained by reacting 49.0 wt % of butyl acrylate, 49.4 wt % of methyl methacrylate, 0.6 wt % of itaconic acid, 0.6 wt % of a silane coupling agent (aminopropyltrimethoxysilane), and 0.4 wt % of ammonium peroxide as an initiator was used.
Preparative Example 4
Preparation of Insulation Additive
(25) A zirconia sol was prepared by mixing tetrapropyl zirconate (100 ml) and ethylacetoacetate (100 ml) and then adding a nitric acid solution (17 ml) thereto.
(26) An organosilane sol was prepared by mixing 3-glycidyloxypropyltrimethoxysilane (100 ml), isopropylalcohol (110 ml), and a nitric acid solution (16 ml).
(27) The zirconia sol and the organosilane sol were mixed at a volume ratio of 1:2 to prepare a zirconia-organosilane sol-gel coating development liquid as an insulation additive.
Example 1
Preparation of First Heat-Dissipating Paint Composition (1)
(28) 80 wt % of the first heat-dissipating paint composition prepared in Preparative Example 1 and 20 wt % of the heat resistant additive prepared in Preparative Example 2 were mixed to prepare a first heat-dissipating paint composition (1).
(29) In order to measure heat resistance and adhesive property the prepared heat-dissipating paint composition, the prepared heat-dissipating paint composition was coated on one surface of an aluminum heat-dissipating plate (AI 6061) to a thickness of 10 m by dip coating, and then measurement was performed. The results were tabulated in Table 2 below.
Example 2
Preparation of First Heat-Dissipating Paint Composition (2)
(30) 90 wt % of the first heat-dissipating paint composition prepared in Preparative Example 1 and 10 wt % of the heat resistant additive prepared in Preparative Example 2 were mixed to prepare a first heat-dissipating paint composition (2).
(31) In order to measure heat resistance and sticking property of the prepared heat-dissipating paint composition, the prepared heat-dissipating paint composition was coated on one surface of an aluminum heat-dissipating plate (AI 6061) to a thickness of 10 m by dip coating, and then measurement was performed. The results were tabulated in Table 2 below.
Example 3
Preparation of First Heat-Dissipating Paint Composition (3)
(32) 99 wt % of the first heat-dissipating paint composition prepared in Preparative Example 1 and 1 wt % of the heat resistant additive prepared in Preparative Example 2 were mixed to prepare a first heat-dissipating paint composition (3).
(33) In order to measure heat resistance and sticking property of the prepared heat-dissipating paint composition, the prepared heat-dissipating paint composition was coated on one surface of an aluminum heat-dissipating plate (AI 6061) to a thickness of 10 m by dip coating, and then a measurement was performed. The results were tabulated in Table 2 below.
Example 4
Preparation of Second Heat-Dissipating Paint Composition (1)
(34) 80 wt % of the first heat-dissipating paint composition prepared in Preparative Example 1, 10 wt % of the heat resistant additive prepared in Preparative Example 2, and 10 wt % of the adhesion improving emulsion prepared in Preparative Example 3 were mixed to prepare a second heat-dissipating paint composition (1).
(35) In order to measure heat resistance and sticking property of the prepared heat-dissipating paint composition, the prepared heat-dissipating paint composition was coated on one surface of an aluminum heat-dissipating plate (AI 6061) to a thickness of 10 m by dip coating, and then measurement was performed. The results were tabulated in Table 2 below.
Example 5
Preparation of Second Heat-Dissipating Paint Composition (2)
(36) 85 wt % of the first heat-dissipating paint composition prepared in Preparative Example 1, 10 wt % of the heat resistant additive prepared in Preparative Example 2, and 5 wt % of the adhesion improving emulsion prepared in Preparative Example 3 were mixed to prepare a second heat-dissipating paint composition (2).
(37) In order to measure heat resistance and sticking property of the prepared heat-dissipating paint composition, the prepared heat-dissipating paint composition was coated on one surface of an aluminum heat-dissipating plate (AI 6061) to a thickness of 10 m by dip coating, and then measurement was performed. The results were tabulated in Table 2 below.
Example 6
Preparation of Second Heat-Dissipating Paint Composition (3)
(38) 84 wt % of the first heat-dissipating paint composition prepared in Preparative Example 1, 15 wt % of the heat resistant additive prepared in Preparative Example 2, and 1 wt % of the adhesion improving emulsion prepared in Preparative Example 3 were mixed to prepare a second heat-dissipating paint composition (3).
(39) In order to measure heat resistance and sticking property of the prepared heat-dissipating paint composition, the prepared heat-dissipating paint composition was coated on one surface of an aluminum heat-dissipating plate (AI 6061) to a thickness of 10 m by dip coating, and then measurement was performed. The results were tabulated in Table 2 below.
(40) TABLE-US-00001 TABLE 1 (Unit: wt %) Preparative Preparative Preparative Example 1 Example 2 Example 3 Example 1 80 20 Example 2 90 10 Example 3 99 1 Example 4 80 10 10 Example 5 85 10 5 Example 6 84 15 1
Examples 7 to 9
Preparation of Third Heat-Dissipating Paint Composition
(41) 80 parts by weight of the insulation additive prepared in Preparative Example 4 was added based on 100 parts by weight of the heat-dissipating paint composition prepared in each of Examples 1 to 3, to thereby prepare a third heat-dissipating paint composition.
(42) In order to measure heat resistance and sticking property of the prepared heat-dissipating paint composition, the prepared heat-dissipating paint composition was coated on one surface of an aluminum heat-dissipating plate (AI 6061) to a thickness of 10 m by dip coating, and then measurement was performed. The results were tabulated in Table 2 below.
Examples 10 to 12
Preparation of Forth Heat-Dissipating Paint Composition
(43) 80 parts by weight of the insulation additive prepared in Preparative Example 4 was added based on 100 parts by weight of the heat-dissipating paint composition prepared in each of Examples 4 to 6, to thereby prepare a fourth heat-dissipating paint composition.
(44) In order to measure heat resistance and sticking property of the prepared heat-dissipating paint composition, the prepared heat-dissipating paint composition was coated on one surface of an aluminum heat-dissipating plate (AI 6061) to a thickness of 10 m by dip coating, and then measurement was performed. The results were tabulated in Table 2 below.
Comparative Example 1
(45) 70 wt % of the heat resistant additive prepared in Preparative Example 2 and 30 wt % of an adhesion improving emulsion were mixed. Physical properties of the prepared heat-dissipating paint composition were measured, and the measured results were tabulated in Table 2.
Comparative Example 2
(46) 90 wt % of the dispersion solution prepared in Preparative Example 1 and 10 wt % of the adhesion improving emulsion prepared in Preparative Example 3 were mixed. Physical properties of the prepared heat-dissipating paint composition were measured, and the measured results were tabulated in Table 2.
Experimental Example 1
Heat Dissipation Test Application to LED Lamp
(47) The physical properties of the heat-dissipating paint composition prepared in each of Examples 1 to 12 and Comparative Examples 1 to 3 were measured, and the results were tabulated in Table 2.
(48) Heat-dissipating performance was measured by a surface temperature measurement method of a metal PCB based LED lamp. An apparatus shown in
(49) TABLE-US-00002 TABLE 2 Heat-Dissipating Property: Metal Adhesive PCB Surface Heat Insulating Property Temperature ( C.) Resistance Property Example 1 M6 69 C. >300 C. <10.sup.5 /sq Example 2 M6 67 C. >300 C. <10.sup.5 /sq Example 3 M6 71 C. >300 C. <10.sup.5 /sq Example 4 <M2.5 59 C. >300 C. <10.sup.5 /sq Example 5 <M2.5 57 C. >300 C. <10.sup.5 /sq Example 6 M3.5 60 C. >300 C. <10.sup.5 /sq Example 7 <M2.5 108 C. >300 C. >10.sup.11 /sq.sup. Example 8 <M2.5 105 C. >300 C. >10.sup.9 /sq Example 9 <M2.5 118 C. >300 C. >10.sup.8 /sq Example 10 <M2.5 85 C. >300 C. >10.sup.10 /sq.sup. Example 11 <M2.5 84 C. >300 C. >10.sup.10 /sq.sup. Example 12 <M2.5 91 C. >300 C. >10.sup.10 /sq.sup. Comparative <M2.5 125 C. >300 C. <10.sup.5 /sq Example 1 Comparative <M2.5 120 C. 70 C. <10.sup.5 /sq Example 2 Comparative 128 C. 100 C. <10.sup.5 /sq Example 3
(50) It may be seen from Table 2 above, that the heat dissipation effect was remarkable due to a bigger superficial area in the case where the heat-dissipating paint of the present invention is use than in the case where the heat-dissipating paint is not coated.
(51) It may be seen that, in the case where an aluminum heat-dissipating plate itself is used without being coated with the heat-dissipating paint (Comparative Example 3), the temperature of the surface of the heating element was continuously increased to 128 C., and in the case where the second heat-dissipating paint composition is used (Examples 1 to 3), the temperatures of the surface of the heating element are 6771 C., which is very decreased to 71 C. or lower. In addition, it may be seen that, in the case where the adhesion improving emulsion is added thereto (the third heat-dissipating paint composition, Examples 4 to 6), the temperature was decreased to 57 C., thereby exhibiting an excellent heat dissipation effect.
(52) In addition, it may be seen from Examples 7 to 12 that, in the case where the fourth heat dissipation paint composition as an insulation additive was used, the sheet resistances were very high, 10.sup.8 /sq or higher, which exhibits insulating property, and the surface temperature was increased as compared with the samples of Examples 1 to 6.
Experimental Example 2
Heat Dissipation Test: Application to Heat Sink
(53) A lid (plate type heat sink for heat dissipation, made of aluminum and an alloy thereof) of a CPU used in a semiconductor device and a display was coated with the heat-dissipating paint composition prepared in each of Examples 4 to 7, and the heat dissipation performance thereof was confirmed.
(54) The heat-dissipating paint composition of each of Example 4 and Example 7 was coated on the heat-dissipating plate (lid) to a thickness of 10 m by dip coating, and then measurement was performed. A TIM tape was place thereabove, and a CPU was placed thereabove. Then, the same level of power of 16.5 watts was inputted, and the temperature change was observed for 2 hours.
(55) In Comparative Example 4, the heat-dissipating paint composition of the present invention was not coated and the same power of 16.5 watts was applied, and then the temperature change was observed for 2 hours or longer.
(56) The results were tabulated in Table 3 below.
(57) TABLE-US-00003 TABLE 3 Example 4 Example 7 Comparative ( C.) ( C.) Example 4 ( C.) 20 min 48.6 50.2 53.9 60 min 78.2 81.7 84.5 120 min 81.5 92.2 101.4 2 hours or 83.7 95.6 103.5 longer
(58) It was confirmed from Table 3 above that in the case where the heat-dissipating paint composition of the present invention was coated, the temperature decrease effect of about 15% occurred.
Experimental Example 3
Heat Dissipation Test: Application to Heating Element
(59) The heat-dissipating paint composition prepared in each of Example 4 and Example 7 was coated on the entire portion of a heating device, and then the heat dissipation performance was confirmed.
(60) An aluminum heater was used as a heating element, and the heat-dissipating paint composition prepared in each of Example 4 and Example 7 was coated on the entire surface of the heater to a thickness of 10 m by dip coating. The same power of 31.5 watts was applied thereto, and then the temperature change was observed. Here, the temperature was measured by installing temperature sensors at an inside and an outside of the heater.
(61) In Comparative Example 5, the heat-dissipating paint composition of the present invention was not coated and the same power of 31.5 watts was applied, and then the temperature change was observed.
(62) The results were tabulated in Table 4 below.
(63) TABLE-US-00004 TABLE 4 Example 7 Example 10 Comparative ( C.) ( C.) Example 5 ( C.) Inside 139.3 171.3 184.6 Outside 133.1 168.1 172.2
(64) It was confirmed from Table 4 above that in the case where the heat-dissipating paint composition of the present invention was coated, the temperature decrease effect of about 25% occurred.
Experimental Example 4
Heat Dissipation Test: Application to Condenser
(65) The heat-dissipating paint composition prepared in each of Example 4 and Example 7 was coated on the outside of a refrigerator condenser, and then the heat dissipation performance was confirmed. As test conditions, the measurement was performed without installing a fan.
(66) The heat-dissipating paint composition prepared in each of Example 4 and Example 7 was coated on the condenser by dip coating or spray coating, and then the condenser was allowed to operate and the entrance temperature and the exit temperature were measured, respectively.
(67) In Comparative Example 6, the heat-dissipating paint composition of the present invention was not coated and the temperature change was observed.
(68) The results were tabulated in Table 5 below.
(69) TABLE-US-00005 TABLE 5 Example 7 Example 10 Comparative ( C.) ( C.) Example 6 ( C.) Dip Entrance 60 60 60 Coating Temperature Exit 56.1 58.1 59.7 Temperature Spray Entrance 60 60 60 Coating Temperature Exit 55.2 57.6 59.7 Temperature Spray Entrance 60 60 60 Coating Temperature Exit 53.7 55.8 59.7 Temperature
(70) It was confirmed from Table 5 above that in the case where the heat-dissipating paint composition of the present invention was coated, the difference between the entrance temperature and the exit temperature was 46 C.
INDUSTRIAL APPLICABILITY
(71) The heat-dissipating paint composition according to the present invention has excellent heat dissipation performance and can be applied to various industrious fields requiring temperature control.