THERMAL-MECHANICAL ADJUSTMENT FOR LASER SYSTEM

Abstract

Provided is a laser system that includes a laser head having a laser holder configured to house a laser beam and a lens for reflecting the laser beam at a predetermined wavelength, and a thermal-mechanical adjustment device disposed on the laser head and configured to adjust a temperature and an alignment of the laser beam, to maintain the predetermined wavelength of the laser beam.

Claims

1. A laser system comprising: a laser head including a laser holder configured to house a laser beam and a lens for reflecting the laser beam at a predetermined wavelength; and a thermal-mechanical adjustment device (i) disposed on the laser head and configured to adjust a temperature and an alignment of the laser beam and (ii) to maintain the predetermined wavelength of the laser beam.

2. The laser system of claim 1, further comprising: a chamfered opening formed at one end of the laser head opposite the emitting end of the laser beam; a pivot bar disposed within the chamfered opening and configured to pivot the laser beam about its circumference at a pivot point and to sway at an angle to the rotation thereof within the chamfered opening.

3. The laser system of claim 2, wherein the angle is approximately 90.

4. The laser system of claim 2, wherein the thermal-mechanical adjustment device comprises: a plurality of first thermally conductive portions disposed at opposite sides of the laser head adjacent to respective ends of the pivot bar and configured to apply a resistive force to the laser head.

5. The laser system of claim 4, wherein the first thermally conductive portions comprise a thermally conductive foam material.

6. The laser system of claim 4, wherein the thermal-mechanical adjustment device further comprises: a spring device disposed at another end of the laser head opposite the end housing the pivot bar and configured to apply a pulling force to the laser head; and a plurality of second thermally conductive portions disposed adjacent to the spring device and configured to apply a resistive force to the laser head near the pulling force of the spring device to align the laser beam therein.

7. The laser system of claim 4, wherein the first thermally conductive portions are further configured to dissipate heat generated by the laser beam away from the laser head.

8. The laser system of claim 6, wherein the first and second thermally conductive portions are further configured to dissipate heat generated by the laser beam away from the laser head.

9. The laser system of claim 8, wherein the first and second thermally conductive portions are configured to maintain a specific temperature of the laser beam ranging between approximately 20 to 40 degrees Celsius.

10. The laser system of claim 8 further comprising: a mounting base configured to mount the laser head thereon; and a plurality of set screws to secure the laser head to the mounting base, wherein the second thermally conductive portions apply a resistive force to the plurality of set screws to maintain alignment of the laser beam within the laser head.

11. A thermal-mechanical adjustment device for a laser head, comprising: a plurality of first thermally conductive foam portions disposed at one end of the laser head and configured to dissipate heat from a laser beam therethrough and adjust an alignment of the laser beam by applying a resistive force to the laser head.

12. The thermal-mechanical adjustment device of claim 11, further comprising: a spring device disposed at an opposite end of the laser head and configured to apply a pulling force to the laser head; and a plurality of second thermally conductive foam portions disposed at the opposite end of the laser head adjacent to the spring device and configured to apply a resistive force to counteract the pulling force of the spring device, to align the laser beam within the laser head.

Description

V. DESCRIPTION OF THE DRAWINGS

[0008] FIG. 1 is a schematic illustrating an example of a laser system that can be implemented within one or more embodiments of the present invention.

[0009] FIG. 2 is a detailed schematic of a thermal-mechanical adjustment device of the laser system of FIG. 1 that can be implemented within one or more embodiments.

[0010] FIG. 3 is a schematic illustrating a mechanical adjustment operation of the thermal-mechanical adjustment device of FIG. 2 that can be implemented within one or more embodiments of the present invention.

[0011] FIG. 4A and 4B are schematics illustrating a heat dissipation operation of the thermal-mechanical adjustment device of FIG. 2 that can be implemented within one or more embodiments of the present invention.

[0012] The drawings are only for purposes of illustrating preferred embodiments and are not to be construed as limiting the disclosure. Given the following enabling description of the drawings, the novel aspects of the present disclosure should become evident to a person of ordinary skill in the art. This detailed description uses numerical and letter designations to refer to features in the drawings. Like or similar designations in the drawings and description have been used to refer to like or similar parts of embodiments of the invention.

VI. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0013] As required, detailed embodiments are disclosed herein. It must be understood that the disclosed embodiments are merely exemplary of various and alternative forms. As used herein, the word exemplary is used expansively to refer to embodiments that serve as illustrations, specimens, models, or patterns. The figures are not necessarily to scale and some features may be exaggerated or minimized to show details of particular components. In other instances, well-known components, systems, materials, or methods that are known to those having ordinary skill in the art have not been described in detail in order to avoid obscuring the present disclosure. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art.

[0014] Embodiments of the present invention provide a laser system housing a laser holder for transmitting a laser beam therethrough, and a thermal-mechanical adjustment device capable of adjusting the temperature of the laser beam and maintaining the alignment of the laser beam. The thermal-mechanical adjustment device effectively maintains accuracy of the wavelength of the light output.

[0015] Details regarding the laser system 100 of the present invention will now be discussed with reference to FIGS. 1 through 3. FIG. 1 illustrates a laser system 100 used to perform various testing operations on target equipment 50 e.g., such as a power transformer. For example, the testing operations can include trace gases detection. The laser system 100 can be a semiconductor laser such as a quantum cascade laser (QCL). Other types of lasers could also be used with this laser system 100, for example telecommunication lasers, lead salt lasers, vertical cavity surface emitting laser (VCSEL), Hybrid silicon laser, InGaAsp laser, semiconductor laser diode, doped insulator lasers, or gas and chemical lasers, etc.

[0016] As further shown in FIG. 1, the laser system 100 includes a laser holder 110 for transmitting a laser beam 120 therethrough emitting from a laser source. One or more lens 125 are disposed downstream of the laser holder 110 for reflecting the laser beam 120 in a desired direction. In FIG. 2, the laser system 100 further includes a laser head (i.e., a mounting stand) 130 adjacent to the laser holder 110 holding the laser beam 120 and lens 125. The laser head 130 includes a chamfered opening 132, and a thermal-mechanical adjustment device 140 including a pivot bar 141 for maintaining the alignment of the laser beam 120. The laser head 130 can be formed of a metal material such as copper or any other suitable material.

[0017] Further in FIG. 2, the chamfered opening 132 of the laser head 130 is formed at one end of the laser head 130 opposite the emitting end of the laser beam 120 from the laser source, and is configured to house the pivot bar 141 therein. The pivot bar 141 is configured to allow pivot in conjunction with the chamfered opening and rotation of the laser beam 120 about its circumference at a pivot point (as depicted by dashed line A in FIG. 3). The chamfered opening 132 is configured to allow the pivot bar 141 to sway at an angle of approximately 90 to the rotation of the pivot bar 141 (as depicted by dashed line B in FIG. 3). Thus, the pivot bar 141 allows x and y axis alignment of the laser beam 120. When only 1-axis alignment is needed, the rotation around the pivot bar. Alternatively, when 2-axis alignment is needed, then both rotation and pivoting operations are performed.

[0018] The thermal-mechanical adjustment device 140 of the laser system 100 further includes a plurality of first thermally conductive portions 142a and 142b disposed at opposite sides of the laser head 130 adjacent to respective ends of the pivot bar 141. According to one or more embodiments, the thermally conductive portions 142a and 142b can be formed of thermally conductive foam or any other suitable material for the purposes set forth herein.

[0019] A spring device 143 is also provided and is disposed at along the laser head 130 at another end of the laser head 130 opposite the end housing the pivot bar 141. Additionally, according to one or more embodiments, second thermally conductive portions 144a and 144b are disposed adjacent to the spring device 143. The second thermally conductive portions 144a and 144b can be formed of the same or different materials than that of the first thermally conductive portions 142a and 142b. The thermally conductive foam of the thermally conductive portions 142a, 142b, 144a and 144b provides a resistive force and has elastic restorative properties as well as being thermally conductive. Thus, the material could be used in conjunction with screws to allow precise alignment.

[0020] As shown in FIG. 2, the first thermally conductive portions 142a and 142b are L-shaped and the second thermally conductive portions 144a and 144b are rectangular-shaped. The present invention is not limited to the thermally conductive portions 142a, 142b, 144a and 144b being any particular shape or size, and may vary accordingly. Details regarding the operations of the first and second thermally conductive portions 142a, 142b, 144a and 144b and the spring device 143 will be discussed now with reference to FIGS. 3 through 4B.

[0021] FIG. 3 is a schematic illustrating a mechanical adjustment operation to be performed by the thermal-mechanical adjustment device 140 according to one or more embodiments of the present invention.

[0022] As shown in FIG. 3, as indicated by the arrows, the first and second thermally conductive portions 142a, 142b, 144a and 144b are configured to apply a resistive (i.e., pushing) force to the laser head 130, while the spring device 143 is configured to apply a pulling force to the laser head 130, to assist with adjustment of the laser beam 120 being transmitted therethrough.

[0023] When the laser beam 120 is transmitted through the laser head 130, the first and second thermally conductive portions 142a, 142b, 144a and 144b along with the spring device 143 maintain the alignment of the laser beam, thereby maintaining the accuracy of the wavelength. The first and second thermally conductive portions 142a, 142b, 144a and 144b also dissipate heat from the laser system 100.

[0024] FIG. 4A and 4B are schematics illustrating a heat dissipation operation of the thermal-mechanical adjustment device 140 that can be implemented within one or more embodiments of the present invention.

[0025] As shown in FIG. 4A, as indicated by the arrows, the first and second thermally conductive portions 142a, 142b, 144a and 144b are further configured to transfer heat generated by the laser beam 120 away from the laser head 130. Thus, the first and second thermally conductive portions 142a, 142b, 144a and 144b assist with maintaining the temperature of the laser beam 120 to a specific temperature range of approximately 20 to 40 degrees Celsius.

[0026] In some embodiments, the laser system 100 can be mounted to a mounting base 160 as shown in FIG. 4B. In this embodiment, the laser head 130 is secured to mounting base 160 via one or more set screws 161a, 161b and 161c. The first and second thermally conductive portions 144a and 144b are further configured to apply a pushing force against the force of the set screws 161a, 161b and 161c to maintain accuracy of the alignment of the laser beam 120.

[0027] Further, the heat transferred away from the laser head 130 via the first and second thermally conductive portions 142a, 142b, 144a and 144b is further transferred to the mounting base 160 to be dissipated therefrom (as indicated by the arrows). The heat can be disposed of via a heat pipe, heat sink or other heat dissipating mechanism attached to the mounting base 160. The laser system 100 of the present invention therefore effectively maintains the temperature of the laser beam 120.

[0028] Embodiments of the present invention provides the advantages of dissipating heat and mechanically aligning the laser beam of the laser system using the same components (i.e., the thermally conductive portions) employed therein. Further, the present invention provides a laser system without use of a fan to thereby avoid unwanted noise and vibrations in the laser system.

[0029] This written description uses examples to disclose the invention including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.