MEMS Bio-DSC
20170102346 ยท 2017-04-13
Inventors
- Richard Brown (Norton, MA, US)
- William Buote (Norton, MA, US)
- Ernesto Freire (Norton, MA, US)
- Anthony Maletta (Burlington, MA, US)
- Thomas Denner (Selb, DE)
Cpc classification
B01L2300/0627
PERFORMING OPERATIONS; TRANSPORTING
B01L2300/0861
PERFORMING OPERATIONS; TRANSPORTING
B01L3/502715
PERFORMING OPERATIONS; TRANSPORTING
B01L2300/0609
PERFORMING OPERATIONS; TRANSPORTING
B01L2200/147
PERFORMING OPERATIONS; TRANSPORTING
B01L2300/0816
PERFORMING OPERATIONS; TRANSPORTING
B01L2300/18
PERFORMING OPERATIONS; TRANSPORTING
B01L2300/12
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A MEMS cassette for insertion into a DSC calorimeter and a DSC calorimeter using MEMS cassettes to conduct DSC experiments. The MEMS cassette includes a chip configured to conduct DSC reactions of a sample and reference to derive information regarding the sample.
Claims
1. A MEMS cassette for insertion into a DSC calorimeter comprising: a housing; and a chip mounted within the housing, the chip including: a first channel extending through the chip; a second channel extending through the chip; a first reaction area located within the first channel; a second reaction area located within the second channel; a thermopile configured to convert thermal energy from the first reaction area and the second reaction area into electrical energy, and at least one heating element, the at least one heating element configured to provide localized heat to the first and second reaction areas to generate a reaction of at least one sample located within the first reaction area and the second reaction area.
2. The MEMS cassette of claim 1, wherein the at least one heating element includes four individual heating elements.
3. The MEMS cassette of claim 1, wherein the housing is made of an outer plastic shell.
4. The MEMS cassette of claim 1, wherein the cassette is configured to be electronically plugged into the DSC calorimeter.
5. The MEMs cassette of claim 4, wherein the cassette is in electrical connection with the DSC calorimeter.
6. The MEMs cassette of claim 1, wherein the cassette is scanned by the DSC calorimeter.
7. The MEMS cassette of claim 1, wherein the cassette is disposable.
8. The MEMS cassette of claim 1, wherein the cassette housing comprises four channels.
9. The MEMS cassette of claim 8, wherein the four channels of the cassette are each in separate communication with a first inlet, second inlet, first outlet and second outlet in the MEMS chip, so that the four channels can transfer fluid into the first inlet and the second inlet and out of the first outlet and the second outlet.
10. The MEMS cassette of claim 1, further comprising a thermal interface, the thermal interface connected to the thermopile, so that the thermal interface measures the amount of electrical energy generated by thermopile.
11. The MEMS cassette of claim 1, wherein the first reaction area has a larger surface area than the first channel and the second reaction area has a larger surface than the second channel.
12. The MEMS cassette of claim 1, wherein the cassette housing has tapered edges at its distal end.
13. The MEMS cassette of claim 1, wherein the cassette housing is substantially rectangular.
14. The MEMS cassette of claim 1, wherein a chemical dye is inserted into the first and the second reaction area, such that the fluorescence of the chemical dye is measured.
15. The MEMS cassette of claim 1, wherein the cassette housing is substantially rectangular and having a length of 11.0 mm to 32.0 mm and a width of 20.0 mm to 24.00 mm.
16. A DSC calorimeter comprising: an instrument block; a temperature scanning unit; an electrical interface; and at least one MEMS cassette for insertion into a DSC calorimeter having a housing; and a chip mounted within the housing, the chip including: a first channel extending through the chip; a second channel extending through the chip; a first reaction area located within the first channel; a second reaction area located within the second channel; a thermopile configured to convert thermal energy from the first reaction area and the second reaction area into electrical energy, and at least one heating element, the at least one heating element configured to provide localized heat to the first and second reaction areas to generate a reaction of at least one sample located within the first reaction area and the second reaction area, wherein the at least one MEMS cassette is inserted into the instrument block and is in communication with said temperature scanning unit and said electrical interface.
17. The DSC calorimeter of claim 16, wherein the instrument block includes twelve ports, wherein each of the twelve ports is configured to receive one of the at least two MEMS cassettes.
18. The DSC calorimeter of claim 17, wherein there are twelve MEMS cassettes.
19. The DSC calorimeter of claim 17, further comprising dummy cassettes, the dummy cassettes configured to be inserted into each of the twelve ports.
20. The DSC calorimeter of claim 19, wherein the dummy cassettes are inserted into ports that are unoccupied by said MEMS cassettes.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE INVENTION
[0036] The present invention is directed to one or more MEMS cassettes configured to be inserted into a DSC device as well as a DSC device that incorporates MEMS cassettes to run DSC experiments for life science research and development, specifically for bio-molecular research.
[0037] The advantages of the MEMS cassettes allow for low volume requirements, lower sample requirements and higher throughput for biological macromolecule analytics for life science research and development. The device is specifically tailored for bio-molecular research.
[0038] In certain embodiments of the invention, a MEMS cassette for insertion into a DSC calorimeter is provided comprising: a housing; and a chip mounted within the housing, the chip including: a first channel extending through the chip; a second channel extending through the chip; a first reaction area located within the first channel; a second reaction area located within the second channel; a thermopile configured to convert thermal energy from the first reaction area and the second reaction area into electrical energy, and at least one heating element, the at least one heating element configured to provide localized heat to the first and second reaction areas to generate a reaction of at least one sample located within the first reaction area and the second reaction area.
[0039] In certain embodiments, the first channel has an inlet and an outlet and the second channel has an inlet and an outlet. In certain embodiments, the first channel has more than one inlet. In certain embodiments the first channel has more than one outlet. In certain embodiments, the second channel has more than one inlet. In certain embodiments the second channel has more than one outlet.
[0040] In certain embodiments, the channels are microfluidic chambers or channels. In certain embodiments, the channels are thermally isolated and/or thermally insulated from one another.
[0041] In certain embodiments, the channels are configured to provide passive chaotic mixing for a solution or a sample solution flowing through the channels.
[0042] In certain embodiments, more than one sample can be provided, each of the samples being provided through each of the inlets into the first and second channels.
[0043] In certain embodiments, a sample or sample solution is inserted into the first reaction area and a reference is inserted into the second reaction area. In certain embodiments, the heat given from the sample is compared against the heat given from the reference.
[0044] In certain embodiments, the thermopile is configured to measure temperature differential between the first reaction chamber and the second reaction chamber. In certain embodiments, the thermopile is a thin, metal film thermopile. In certain embodiments, the thermopile is fabricated on a silicon substrate or a membrane, such as a parylene membrane. In certain embodiments, the thermocouple elements are formed from AuNi microjunctions. In certain embodiments, the thermophile is a thermoelectric sensor. In certain embodiments, the thermopile is made from Antimony-bismuth (SbBi).
[0045] In certain embodiments, the at least one heating element includes four individual heating elements. In certain embodiments, two of the heating elements heat the first reaction area and two of the heating elements heat the second reaction area. In certain embodiments, at least a portion of the at least one heating elements are fabricated above or below the first and second reaction areas.
[0046] In certain embodiments, the at least one heating element includes a heating circuit, such that a fluid circuit is provided to heat the first reaction area and/or the second reaction area. In certain embodiments, the heating circuit involves using hot fluid to dissipate heat to the first reaction area and/or the second reaction area.
[0047] In certain embodiments, the at least one heating element is a heating coil. In certain embodiments, the at least one heating element acts as a heat exchanger. In certain embodiments, the at least one heating element is a microheater.
[0048] In certain embodiments, the first reaction area has a larger surface area than the first channel. In certain embodiments, the second reaction area has a larger surface than the second channel. In certain embodiments, the first reaction area has a larger volume than the first channel. In certain embodiments, the second reaction area has a larger volume than the second channel.
[0049] In certain embodiments, the first and second reactions areas are identical in volume and configuration and are arranged side by side.
[0050] In certain embodiments, the first and second reaction areas are each supported on a thin film substrate.
[0051] In certain embodiments, the thin film substrate includes a thermopile sensor located between the first and second reaction chambers and configured to measure the temperature differential between the first and second reaction chambers.
[0052] In certain embodiments, the first and second reaction areas are defined by a surrounding wall made from polydimethylsiloxane (PDMS). In certain embodiments, the thin film substrate of the chip can include a top layer made from a mixture of PDMS.
[0053] In certain embodiments, the first and second reaction areas are based on a freestanding polyimide diaphragm and surrounded by air cavities for thermal isolation. In certain embodiments, the heating elements are made of a thin-film gold resistive heater.
[0054] In certain embodiments, the first and second reaction areas have their temperatures varied at a constant rate.
[0055] In certain embodiments, a chemical dye is inserted into the first and the second reaction area, such that the fluorescence of the chemical dye is measured.
[0056] In certain embodiments, a chemical reaction occurs in the first reaction area. In certain embodiments, a chemical reaction occurs in the second reaction area.
[0057] In certain embodiments, a physical transformation or phase change occurs in the first reaction area. In certain embodiments, a physical transformation or phase change occurs in the second reaction area.
[0058] In certain embodiments, the chip is made of silicon or is a silicon wafer. In certain embodiments, the chip includes a thermal substrate bonded to a microfluidic structure.
[0059] In certain embodiments, the MEMS cassette is made of a thin film substrate.
[0060] In certain embodiments, the cassette housing is made of an outer plastic shell. In certain embodiments, the cassette housing is made of certain plastic materials and plastic polymer materials. In certain embodiments the cassette housing is resistant to heat, such that the cassette housing does not melt at high temperatures (over 350 degrees Fahrenheit).
[0061] In certain embodiments, the MEMS cassettes integrate mechanical elements, sensors, actuators, and electronics on a common silicone substrate through microfabrication technology. In certain embodiments, there are resistive temperature sensors and on-chip heaters located within the cassette.
[0062] In certain embodiments, the MEMS cassette and chip include a PDMS structure, polymide-PDMS intermediate layer, SbBi thermopile, polymide diaphragm, micro-heater, and temperature sensor on a silicon substrate.
[0063] In certain embodiments, the cassette is configured to be electronically plugged into the DSC calorimeter. In certain embodiments, the cassette is directly plugged into the calorimeter and into the thermal block.
[0064] In certain embodiments, the cassette is in electrical connection with the DSC calorimeter. In certain embodiments, the cassette is scanned by the DSC calorimeter and DSC reactions occur within the cassette.
[0065] In certain embodiments, the cassette is disposable. In certain embodiments, the cassette is reusable and can be sterilized and cleaned.
[0066] In certain embodiments, the cassette housing comprises four channels. In certain embodiments, the four channels of the cassette are each in separate communication with a first inlet, second inlet, first outlet and second outlet in the MEMS chip, so that the four channels can transfer fluid into the first inlet and the second inlet and out of the first outlet and the second outlet.
[0067] In certain embodiments, the cassette includes a thermal interface, the thermal interface connected to the thermopile, so that the thermal interface measures the amount of electrical energy generated by thermopile. In certain embodiments, the thermal interface includes a sensor or sensing element.
[0068] In certain embodiments, the cassette housing has tapered edges at its distal end. In certain embodiments, the cassette housing is substantially rectangular. In certain embodiments, the cassette housing is cylindrical. In certain embodiments, the cassette housing has the shape of an SD card.
[0069] In certain embodiments, the cassette housing is substantially rectangular and has a length of 11.0 mm to 32.0 mm and a width of 20.0 mm to 24.00 mm.
[0070] Other objects of the invention are achieved by providing a DSC calorimeter comprising: an instrument block; a temperature scanning unit; an electrical interface; and at least one MEMS cassette, wherein the at least one MEMS cassette is inserted into the instrument block and is in communication with said temperature scanning unit and said electrical interface.
[0071] In certain embodiments, the DSC calorimeter includes at least two MEMS cassettes.
[0072] In certain embodiments, the at least two MEMS cassettes have a structure as set forth above.
[0073] In certain embodiments, the instrument block includes six ports, wherein each of the six ports is configured to receive at least one MEMS cassette. In certain embodiments, six MEMS cassettes are provided to correspond to the six ports in the instrument block.
[0074] In certain embodiments, the instrument block includes twelve ports, wherein each of the twelve ports is configured to receive at least one MEMS cassette. In certain embodiments, twelve MEMS cassettes are provided to correspond to the twelve ports in the instrument block.
[0075] In certain embodiments, the DSC calorimeter includes dummy cassettes, the dummy cassettes configured to be inserted into each of the ports in the DSC calorimeter.
[0076] In certain embodiments, the dummy cassettes are inserted into ports that are unoccupied by said MEMS cassettes.
[0077] In certain embodiments, the DSC calorimeter includes thermal control unit hardware. In certain embodiments, the DSC calorimeter includes instrument control communications and data collection electronics and firmware design and software.
[0078] In certain embodiments, the DSC calorimeter includes a user interface and data processing algorithms.
[0079] Referring to
[0080] In certain embodiments, the left chip area 118 and right chip area 115 is a thin film substrate.
[0081] Also shown in
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[0084] Referring to
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[0087] The DSC calorimeter 500 is able to receive MEMS cassettes 100 or 400 and/or dummy cassettes in the ports or slots. The DSC calorimeter 500 is able to conduct experiments on the MEMS cassettes located within the slots.
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[0095] While the invention has been specifically described in connection with certain specific embodiments thereof, it is to be understood that this is by way of illustration and not of limitation and that various changes and modifications in form and details may be made thereto, and the scope of the appended claims should be construed as broadly as the prior art will permit.
[0096] The description of the invention is merely exemplary in nature, and thus, variations that do not depart from the gist of the invention are intended to be within the scope of the invention. Such variations are not to be regarded as a departure from the spirit and scope of the invention.