METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES

Abstract

A method for surface treatment of an at least primarily crystalline substrate surface of a substrate such that by amorphization of the substrate surface, an amorphous layer is formed at the substrate surface with a thickness d>0 nm of the amorphous layer. This invention also relates to a corresponding device for surface treatment of substrates.

Claims

1-10 (canceled)

11. A method for surface treatment of an at least primarily crystalline substrate surface of a substrate, the method comprising: amorphization of the substrate surface without deposition of a material to form an amorphous layer for bonding at the substrate surface of the substrate, the amorphous layer having a thickness d>0 nm, wherein the amorphorization includes ionizing a gas and/or a gas mixture, the amorphous layerresulting from a phase conversion of a material of the substrate.

12. The method according to claim 11, wherein the amorphization is carried out up to a thickness d<100 nm of the amorphous layer.

13. The method according to claim 11, wherein the amorphization is performed such that the mean roughness of the substrate surface decreases.

14. The method according to claim 13, wherein the mean roughness of the substrate surface decreases to a mean roughness of less than 10 nm.

15. The method according to claim 11, wherein the amorphization is produced by collision of particles with the substrate surface.

16. The method according to claim 15, wherein said particles are ions.

17. The method according to claim 15, wherein said particles are accelerated.

18. The method according to claim 15, wherein kinetic energy of the particles is between 1 eV and 1,000 keV.

19. The method according to claim 15, wherein the current density of the particles is between 0.1 mA/cm.sup.2 and 1,000 mA/cm.sup.2.

20. The method according to claim 11, wherein the amorphization is performed in a process chamber, which is evacuated before the amorphization.

21. The method according to claim 20, wherein the process chamber is evacuated before amorphization to a pressure of less than 1 bar.

22. A method for bonding a first substrate, treated according to the method of claim 11, to a second substrate, treated according to the method of claim 11.

23. A method according to claim 22, wherein a heat treatment is performed during and/or after the bonding.

24. A device for surface treatment of a substrate surface of a substrate, the device comprising: a process chamber for receiving the substrate; and means for amorphization of the substrate surfacewithout deposition of a material to form an amorphous layer at the substrate surface, the amorphous layer having a thickness d>0 nm, wherein a gas and/or a gas mixture is ionized for the amorphization, and the amorphous layer results from a phase conversion of a material of the substrate.

Description

[0103] Additional advantages, features, and details of the invention follow from the description below of embodiments that are preferred and based on the drawings. The latter show in:

[0104] FIG. 1 a diagrammatic cross-sectional depiction, not to scale, of an embodiment of a substrate, treated according to the invention, in a first process step (a.morphization) of an embodiment of a method according to the invention,

[0105] FIG. 2 a diagrammatic cross-sectional depiction, not to scale, of a second. process step (making contact/prebonding) of an embodiment of a method according to the invention,

[0106] FIG. 3 a diagrammatic cross-sectional depiction, not to scale, of a third process step (bonding),

[0107] FIG. 4 a diagrammatic cross-sectional depiction, not to scale, of a fourth process step (heat treatment), and

[0108] FIG. 5 a diagrammatic cross-sectional depiction, not to scale, of a unit/device for producing an amorphous layer.

[0109] In the figures, features that are the same or that have the same effect are identified with the same reference numbers.

[0110] FIG. 1 shows a diagrammatic cross-sectional depiction, not to scale, of a first substrate 1 with an amorphous layer 2 that is produced according to the invention at a substrate surface 1o. The amorphous layer 2 in general also has a rough surface 2o. The roughness is preferably reduced to a minimum during the removal of an oxide or other products. The amorphous layer 2 extends from the substrate surface to over a depth (thickness d) into the substrate 1.

[0111] FIG. 2 shows a diagrammatic cross-sectional depiction, not to scale, of a prebonding of two substrates 1, 1 that are treated according to FIG. 1. The prebonding process is distinguished by substrate surfaces 1o, 1o (contact surfaces) being brought into contact along surfaces 2o, 2o of the amorphous layers 2, 2. The contact is made in this case in particular at maximum points 2e of the surfaces 2o, 2o. Because of a roughness that is different from zero but in particular even greatly reduced by the amorphization according to FIG. 1, the result in this case is a formation of cavities 3. In quite especially preferred cases, as many maximum points 2e as possible partially, in particular completely, extend into the minimum points 2 m in order to minimize the number of cavities 3 produced or their volumes as early as during the prebonding process.

[0112] Bringing the surfaces 2o, 2o into contact is completed by a bonding process according to the invention, in particular by force loading crosswise to the substrate surfaces 1o, 1o on the reverse sides 1r, 1r of the substrates 1, 1, and the (totaled) thicknesses d of the common amorphous layer 2 formed from the amorphous layers 2, 2 are reduced to a (common) layer thickness d. At this time, a distinction can preferably no longer be made between the bonded surfaces 1o, 1o of the substrates 1, 1 that are bonded to one another. This property is also mentioned as a specific feature of the embodiment according to the invention and is used for differentiation from other technologies. According to modern technical knowledge, it is not possible to produce an amorphous layer within a substrate without an alteration of the (crystalline) structure in the transfer path of the ions. By studying the structure before or after the amorphous (residual) layer, a definitive identification of the process according to the invention is conceivable. If the structures before or after the amorphous residual layer have not been definitively altered by ion bombardment, the production of the buried amorphous layer must be done by the bonding process according to the invention.

[0113] The force loading results in particular in an approach of the atoms present in the amorphous phase and arranged at the surfaces 1o, 1o. Because of the comparatively already small dimensions (in particular reduced by the amorphization) of the cavities 3, a deformation of the maximum points 2e by a pure shifting of the atoms, in particular supported by diffusion processes, is enough to virtually completely close the cavities 3. Plasticization of the structure is therefore not carried out by plasticization processes known from plasticity theory, such as dislocation mobility or twinning, but rather at least primarily, and preferably exclusively, by movement of the individual atoms caused or supported by approach and/or shifting and/or diffusion.

[0114] In another process step of the invention according to FIG. 4, conversion of the amorphous layer 2, produced in particular at least primarily by recrystallization, is carried out. The conversion, in particular recrystallization, leads to a continuous reduction of the layer thickness d up to a final layer thickness d according to the invention, which according to a quite preferred embodiment according to the invention is equal to 0 (zero). The ratio between d/d and/or d/d is less than or equal to 1, preferably less than 0.5, even more preferably less than 0.25, most preferably less than 0.1, and all the more preferably equal to 0. From this is produced in particular a complete, almost defect-free crystalline transition between the two substrates 1, 1. This can come about even during and/or shortly after the bonding, in particular even in the bonding chamber, in this case, the heating device of a bonder is used during bonding for heating the substrate stack (heat treatment).

[0115] FIG. 5 shows an ion source 4, which accelerates the ions of an ion beam 5 at an angle of incidence to the substrate surface 1o, on the substrate surface 2o.

LIST OF REFERENCE SYMBOLS

[0116] 1, 1 Substrates [0117] 1o, 1o Substrate surfaces [0118] 1r, 1r Reverse sides [0119] 2, 2, 2 Amorphous layers [0120] 2o, 2o Surface [0121] 2e Maximum points [0122] 2m Minimum points [0123] 3 Cavities [0124] 4 Ion source [0125] 5 Ion beam [0126] d, d, d Thicknesses [0127] Angle of incidence