Method for preparing organic electronic device

Abstract

The present application relates to a method for preparing an organic electronic device, and the organic electronic device prepared by the same, the method for preparing an organic electronic device can improve flatness and adhesion of an organic layer in a process of sealing an organic electronic element to effectively block moisture or oxygen from the outside, thereby securing the lifetime of the organic electronic device.

Claims

1. A method for preparing an organic electronic device in which printed patterns of an encapsulating composition are formed on a substrate on which an organic electronic element is formed, the method comprising: forming two or more primary printed patterns of the encapsulating composition such that they are extended in one direction, spaced apart from each other, and have a predetermined pitch; and forming two or more secondary printed patterns of the encapsulating composition such that they are extended in the one direction, spaced apart from each other, and alternately disposed with the primary printed patterns, wherein the primary printed patterns and the secondary printed patterns of the encapsulating composition are formed on the organic electronic element.

2. The method for preparing an organic electronic device according to claim 1, wherein each of the primary printed patterns or the secondary printed patterns has a width in a range of 2 to 150 mm.

3. The method for preparing an organic electronic device according to claim 1, wherein the step of forming the primary or the step of forming the secondary printed patterns proceeds with inkjet printing, gravure coating, spin coating, screen printing or reverse offset coating.

4. The method for preparing an organic electronic device according to claim 1, wherein the primary or secondary printed patterns are formed by inkjet printing and the inkjet printing has a printing resolution range of 50 dpi to 1000 dpi.

5. The method for preparing an organic electronic device according to claim 1, wherein each of the primary printed patterns or the secondary printed patterns has a thickness of 2 to 25 μm.

6. The method for preparing an organic electronic device according to claim 1, further comprising a step of planarizing the encapsulating composition.

7. The method for preparing an organic electronic device according to claim 1, further comprising a step of irradiating the encapsulating composition with light to form the cured encapsulating composition.

8. The method for preparing an organic electronic device according to claim 1, further comprising a step of forming the organic electronic element by forming a first electrode layer on the substrate, an organic material layer comprising at least a light emitting layer on the first electrode layer, and a second electrode layer on the organic material layer, before forming the printed pattern with the encapsulating composition.

9. The method for preparing an organic electronic device according to claim 8, further comprising a step of forming a protective layer on the second electrode layer.

10. The method for preparing an organic electronic device according to claim 7, further comprising a step of forming an inorganic layer on the cured encapsulating composition.

11. The method for preparing an organic electronic device according to claim 1, wherein the encapsulating composition comprises a curable compound.

12. The method for preparing an organic electronic device according to claim 11, wherein the curable compound comprises at least one or more curable functional groups.

13. The method for preparing an organic electronic device according to claim 11, wherein the curable compound comprises 5 to 50 parts by weight of a curable compound having a cyclic structure in its molecular structure and 25 to 80 parts by weight of a vinyl ether curable compound.

14. The method for preparing an organic electronic device according to claim 13, wherein the curable compound further comprises a curable compound having an oxetane group.

15. The method for preparing an organic electronic device according to claim 14, wherein the curable compound having an oxetane group is comprised in an amount of 5 to 90 parts by weight relative to 100 parts by weight of the vinyl ether curable compound.

16. The method for preparing an organic electronic device according to claim 11, wherein the composition further comprises a surfactant.

17. The method for preparing an organic electronic device according to claim 11, wherein the composition further comprises a photoinitiator.

18. The method for preparing an organic electronic device according to claim 11, wherein the composition further comprises a photosensitizer.

19. An organic electronic device prepared by the method for preparing an organic electronic device according to claim 1.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIGS. 1 and 3 are cross-sectional views showing an organic electronic device according to one example of the present invention.

(2) FIG. 2 is a plan view showing a printed pattern according to one example of the present invention.

EXPLANATION OF REFERENCE NUMERALS

(3) 3: organic electronic device 31: substrate 32: organic electronic element 33: organic layer 34: inorganic layer 35: protective layer 36: sealing structure 37: encapsulation film 38: cover substrate

BEST MODE

(4) Hereinafter, the present disclosure will be described in more detail through Examples according to the present disclosure and Comparative Examples not complying with the present disclosure, but the scope of the present disclosure is not limited by the following examples.

(5) Hereinafter, in Examples and Comparative Examples, an alicyclic epoxy compound Celloxide 2021P from Daicel (hereinafter, CEL2021P) and limonene dioxide (LDO) were used as curable compounds having a cyclic structure. As a vinyl ether curable compound, 1,4-cyclohexanedimethanol divinyl ether (CHDVE) was used. As an oxetane group-containing curable compound, OXT-221 from TOAGOSEI was used. Furthermore, TTA UV-694 (hereinafter, UV694) of an iodonium salt photoinitiator from Tetrachem, was used as a photoinitiator, and F430 from DIC of a fluorine-based surfactant was used as a surfactant. In addition, a silane coupling agent (KBM-403) was used as a coupling agent, and 2-isopropylthioxanthone (ITX) was used as a photosensitizer. Also, 2,6-di-tert-butyl-p-cresol (BHT from SIGMA Aldrich) was used as a heat stabilizer.

Examples 1 to 4

(6) The above compositions were each formulated in weight ratios as in Table 1 below, and introduced into a mixing vessel.

(7) In the mixing vessel, uniform encapsulating composition inks were prepared using a planetary mixer (Kurabo, KK-250s).

(8) Two or more primary printed patterns were formed with each of the encapsulating compositions as prepared above under conditions of Table 2 below using Unijet UJ-200 (Inkjet head-Dimatix 10Pl 256), and then the secondary printed patterns were subjected to ink-jetting between the primary patterns and the primary patterns to form an organic layer.

Comparative Examples 1 to 4

(9) The above compositions were each formulated in weight ratios as in Table 1 below, and introduced into a mixing vessel.

(10) In the mixing vessel, uniform encapsulating composition inks were prepared using a planetary mixer (Kurabo, KK-250s).

(11) The printing was performed only primarily to form an organic layer over the entire area of the substrate. The organic layer was formed in the same manner as in Example 1, except that ink-jetting was performed under conditions of Table 2 below.

(12) TABLE-US-00001 TABLE 1 Example Comparative Example 1 2 3 4 1 2 3 4 LDO 10 10 10 10 10 10 10 10 CEL2021P 10 10 10 10 10 10 10 10 CHDVE 55 55 55 55 55 55 55 55 OXT-221 17 17 17 17 17 17 17 17 UV694 1 1 1 1 1 1 1 1 F430 1 1 1 1 1 1 1 1 KBM-403 5 5 5 5 5 5 5 5 ITX 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 BHT 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5

(13) Physical properties in Examples and Comparative Examples were evaluated in the following manner.

(14) 1. Surface Roughness Measurement

(15) The organic layers formed in Examples and Comparative Examples were UV cured with a light quantity of 4000 mJ/cm.sup.2 at an intensity of 1000 mW/cm.sup.2. The Ra values were measured using an Alpha step (KLA-Tencor) instrument, where it can be evaluated to be excellent in the case of 10 nm or less.

(16) TABLE-US-00002 TABLE 2 Number Thickness Roughness of prints DPI Planarization (μm) (Ra, nm) Example 1 2 150/150 60 sec 3.2 7.7 Example 2 2 200/200 60 sec 5.1 4.3 Example 3 2 300/300 60 sec 8.0 3.8 Example 4 2 400/400 60 sec 10.1 3.4 Comparative 1 300 60 sec 3.1 50.3 Example 1 Comparative 1 400 60 sec 5.0 45.3 Example 2 Comparative 1 600 60 sec 8.2 32.3 Example 3 Comparative 1 800 60 sec 10.2 27.6 Example 4

(17) In the case of DPI, Example 1 to 4 showed DPIs of the primary printed pattern and the secondary printed pattern, respectively, and Comparative Examples 1 to 4 showed single DPI values, as only the primary printing was performed. The thickness was measured as an average thickness of the formed organic layers. The planarization means a retention time for planarization after ink-jetting.