Microelectronic Component Arrangement and Production Method for a Microelectronic Component Arrangement

Abstract

A microelectronic component arrangement includes a sensor and a carrier. The sensor has a detection surface and a region including contact elements situated at a first distance with respect to one another. The carrier includes a mounting surface, and the sensor is fixed on the carrier by the contact elements situated at a first distance with respect to one another at least regionally. The detection surface is opposite the mounting surface in a manner having a second distance with respect to the mounting surface. The contact elements are wetted by a mechanically stabilizing material, the region including the contact elements is enclosed by the mechanically stabilizing material, and the detection surface is free of the mechanically stabilizing material.

Claims

1. A microelectronic component arrangement (100) comprising: a sensor, including: at least one detection surface; and at least one region including contact elements that are situated at a first distance with respect to one another; and a carrier including a mounting surface, wherein the sensor is fixed on the carrier by the contact elements situated at the first distance with respect to one another at least regionally, wherein the at least one detection surface is arranged opposite the mounting surface in a manner having a second distance with respect to the mounting surface, wherein the contact elements are wetted by a mechanically stabilizing material, wherein the at least one region is enclosed by the mechanically stabilizing material, and wherein the detection surface is free of the mechanically stabilizing material.

2. The microelectronic component arrangement as claimed in claim 1, wherein: at least one access to the detection surface is present between the at least one detection surface and the mounting surface, and the at least one access is free of the mechanically stabilizing material.

3. The microelectronic component arrangement as claimed in claim 1, wherein: the first distance between the contact elements is less than or equal to the second distance between the detection surface and the mounting surface.

4. The microelectronic component arrangement as claimed in claim 1, wherein: the first distance is between 10 micrometers and 30 micrometers and the second distance is between 30 micrometers and 100 micrometers.

5. The microelectronic component arrangement as claimed in claim 1, wherein: a third distance spaces apart from one another at least two regions comprising the contact elements, and the third distance is at least 100 micrometers.

6. The microelectronic component arrangement as claimed in claim 5, wherein: a ratio between the second distance and the first distance is greater than two, a ratio between the third distance and the second distance is greater than one, and a ratio between the third distance and the first distance is greater than three.

7. The microelectronic component arrangement as claimed in claim 1, wherein: each of the contact elements comprises at least one of solder balls, solder bumps, and solder pillars.

8. The microelectronic component arrangement as claimed in claim 1, wherein: the mechanically stabilizing material comprises an underfill material.

9. The microelectronic component arrangement as claimed in claim 1, wherein: the sensor comprises a circuit.

10. The microelectronic component arrangement as claimed in claim 1, wherein: further solder balls are formed at least regionally on a side of the carrier facing away from the mounting surface.

11. A method for producing a microelectronic component arrangement, comprising: providing a sensor having a first surface, a second surface opposite the first surface, and at least one side surface, the first surface including at least one detection surface and at least one region including contact elements that are situated at a first distance with respect to one another; providing a carrier comprising a mounting surface; connecting the sensor to the mounting surface by the contact elements of the at least one region, a second distance being set between the at least one detection surface and the mounting surface; and stabilizing the connection by a mechanically stabilizing material, wherein the contact elements are wetted with the mechanically stabilizing material by capillary forces, wherein the at least one region is enclosed by the mechanically stabilizing material, and wherein the detection surface is kept free of the mechanically stabilizing material by the capillary forces.

12. The method as claimed in claim 11, further comprising keeping the mechanically stabilizing material between the contact elements by a surface tension that forms.

13. The method as claimed in claim 11, wherein the first surface comprises an access to the detection surface and the access is kept free of the mechanically stabilizing material by the capillary forces.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Further features and advantages of the present disclosure are explained below on the basis of embodiments with reference to the figures.

[0027] In the figures:

[0028] FIGS. 1a), b) show a schematic perpendicular view for elucidating a microelectronic component arrangement and a plan view of the microelectronic component arrangement in accordance with a first embodiment of the present disclosure;

[0029] FIGS. 2a)-c) show schematic views of a first surface of the microelectronic component arrangement for elucidating a corresponding production method in accordance with the first embodiment of the present disclosure;

[0030] FIG. 3 shows a schematic view of a first surface of a microelectronic component arrangement in accordance with a second embodiment of the present disclosure;

[0031] FIG. 4 shows a further enlarged schematic view of the first surface of the microelectronic component arrangement in accordance with the first embodiment of the present disclosure;

[0032] FIG. 5 shows a schematic view of a first surface of the microelectronic component arrangement in accordance with a third embodiment of the present disclosure;

[0033] FIG. 6 shows an enlarged schematic view of the first surface of the microelectronic component arrangement in accordance with the third embodiment of the present disclosure;

[0034] FIG. 7 shows a further enlarged schematic view of the first surface of the microelectronic component arrangement in accordance with the third embodiment of the present disclosure; and

[0035] FIG. 8 shows a flow diagram for elucidating a sequence of a production method for a microelectronic component arrangement.

DETAILED DESCRIPTION

[0036] In the figures, identical reference signs designate identical or functionally identical elements.

[0037] FIGS. 1a and 1b show a schematic perpendicular view for elucidating a microelectronic component arrangement and a plan view of the microelectronic component arrangement in accordance with a first embodiment of the present disclosure.

[0038] In FIG. 1a, the reference sign 100 denotes a microelectronic component arrangement comprising a sensor 2, wherein the sensor 2 has a detection surface 6. Furthermore, FIG. 1a shows a carrier 1 comprising a mounting surface 11, wherein the sensor 2 is mounted on the carrier 1 by means of a construction and connection device in such a way that the detection surface 6 is opposite the mounting surface 11 in a manner having a second distance A2 and an access 5 to the detection surface 6 is present between the detection surface 6 and the mounting surface 11, wherein the access 5 is free of a mechanically stabilizing material M1 at least regionally.

[0039] In FIG. 1a, further solder balls K1 are formed on a side facing away from the mounting surface 11. Said further solder balls can be used for example for further connection of the microelectronic component arrangement 100 to an ASIC.

[0040] FIG. 1b shows the plan view of the microelectronic component arrangement in accordance with the first embodiment of the present disclosure.

[0041] FIG. 1b shows a view of a second surface 22 of the microelectronic component arrangement 100 and the mounting surface 11. The mechanically stabilizing material M1 projects at corresponding locations of the sensor 2 via side surfaces 23 and thus enlarges corresponding areas for compensating for the different coefficients of thermal expansion of the sensor 2 and the carrier 1.

[0042] The schematic views shown in the following FIGS. 2 to 7 correspond to a section along the dashed line X-X in FIG. 1a.

[0043] FIGS. 2a to 2c are schematic views of a first surface of the microelectronic component arrangement for elucidating a corresponding production method in accordance with the first embodiment of the present disclosure.

[0044] FIGS. 2a to 2c show the first surface 21 of the sensor 2, wherein the sensor 2 has the detection surface 6, four accesses 5, and regions B1, B2, B3, B4 comprising contact elements K1 situated at a first distance A1 with respect to one another. The regions B1, B2, B3, B4 are illustrated in a manner enclosed by dashed lines in FIG. 2a. In FIG. 2a, reference sign T1 denotes a device that can be used for applying, for example dispensing or jetting, the mechanically stabilizing material M1. The regions B1, B2, B3, B4 are formed in each case in a corner region of the quadrilateral sensor 2. The first distance A1 is present between each of the contact elements K1. The distance A1 is so small that the mechanically stabilizing material M1 flows between the contact elements K1 as a result of capillary forces F1, wherein the contact elements are wetted by the mechanically stabilizing material and the four regions B1, B2, B3, B4 are enclosed by the mechanically stabilizing material M1 (see FIG. 2b). In other words, the detection surface 6 and the four accesses 5 are free of the mechanically stabilizing material M1. The access 5 can be understood as a media access.

[0045] FIG. 2c shows that the mechanically stabilizing material M1 is kept between the contact elements K1 by a surface tension OS1 that forms. The detection surface 6 is thus freely accessible for a medium from outside via the accesses 5 from all four side surfaces 23.

[0046] The value of the first distance A1 may be between 10 micrometers and 30 micrometers, and the value of the second distance A2 may be between 30 micrometers and 100 micrometers.

[0047] FIG. 3 is a schematic view of a first surface of a microelectronic component arrangement in accordance with a second embodiment of the present disclosure. FIG. 3 is based on FIG. 2c with the difference that no accesses are formed in FIG. 3. Consequently, a region B1 enclosing the detection surface 6 is formed in FIG. 3. This may also involve a hermetic sealing which can be applied particularly in pressure sensors.

[0048] FIG. 4 is a further enlarged schematic view of the first surface of the microelectronic component arrangement in accordance with the first embodiment of the present disclosure.

[0049] FIG. 4 is based on FIG. 2c and illustrates once again, by means of the double-headed arrow F1 illustrated in the regions B1, B2, B3, B4 that the capillary forces firstly draw the mechanically stabilizing material M1 between the contact elements K1 from outside and also keep the mechanically stabilizing material M1 in the regions B1, B2, B3, B4 as a result of the surface tension OE1 between the contact elements K1, such that the accesses 5 and also the detection surface 6 are free of the mechanically stabilizing material M1.

[0050] FIG. 5 is a schematic view of a first surface of the microelectronic component arrangement in accordance with a third embodiment of the present disclosure.

[0051] FIG. 5 is based on FIG. 3 with the difference that an access 5 to the detection surface 6 is formed in FIG. 5. In this case, the access 5 is formed on a side opposite an intake region of the mechanically stabilizing material M1. This can be realized by corresponding arrangement of the contact elements K1 on the first surface 21 of the sensor 2. The intake region has an uninterrupted arrangement of the contact elements K1, whereas on the side with the access 5 the contact elements K1 correspondingly have a gap or an interruption in their arrangement.

[0052] The dashed box in FIG. 5 represents a region shown in an enlarged view in FIG. 6.

[0053] FIG. 6 is an enlarged schematic view of the first surface of the microelectronic component arrangement in accordance with the third embodiment of the present disclosure.

[0054] FIG. 6 shows the enlarged region on the basis of FIG. 5 for clarifying the size ratios between the first distance A1 and the third distance A3. A ratio between the third distance A3 and the first distance A1 which is greater than 3 is preferred in this case.

[0055] FIG. 7 is a further enlarged schematic view of the first surface of the microelectronic component arrangement in accordance with the third embodiment of the present disclosure.

[0056] FIG. 7 is based on FIG. 6 with the difference that the contact elements K1 have a round cross-sectional shape instead of a quadrilateral cross-sectional shape. FIG. 7 clarifies that the capillary forces F1 and surface tensions OE1 described here depend primarily on the first distance A1 and the geometrical shape of the contact elements K1 is scarcely of importance. Consequently, the disclosure can be used in a multiplicity of construction and connection techniques.

[0057] FIG. 8 is a flow diagram for elucidating a sequence of a production method for a microelectronic component arrangement.

[0058] In this respect, a step A involves providing the sensor 2 having the surface 21 and the second surface 22 opposite the first surface 21, and also the at least one side surface 23, wherein the first surface 21 comprises the at least one detection surface 6 and the at least one region B1, B2, B3, B4 comprising contact elements (K1) having the first distance (A1) with respect to one another (see also FIGS. 2a to 2c). The detection surface 6 may for example have a quadrilateral shape and be arranged centrally on the first surface 21. The detection surface 6 may be provided in particular for detecting pressure, moisture and/or gases and be part of a measuring element of the sensor 2. In other words, the sensor 2 described here may be a media sensor.

[0059] A next step B of the production method involves providing the carrier 1 comprising the mounting surface 11. The carrier 1 may comprise a printed circuit board, in particular.

[0060] A subsequent method step C involves in particular electrically connecting the sensor 2 to the mounting surface 11 by means of the at least one region B1, B2, B3, B4, wherein the second distance A2 is set between the at least one detection surface 6 and the mounting surface 11.

[0061] In method step D, the connection provided in step C is stabilized by the mechanically stabilizing material M1, wherein the contact elements K1 are wetted with the mechanically stabilizing material M1 by capillary forces, and the at least one region B1, B2, B3, B4 comprising the contact elements K1 is enclosed by the mechanically stabilizing material M1, and the detection surface 6 is kept free of the mechanically stabilizing material M1 by the capillary forces F1.

[0062] Furthermore, steps A to D proceed in the order as shown in FIG. 8.

[0063] Although the present disclosure has been described on the basis of preferred exemplary embodiments, it is not restricted thereto. In particular, the materials and constructions mentioned are by way of example and are not restricted to the examples explained.

[0064] The disclosure can be used in particular in the case of MEMS sensors in the automotive or consumer sector which are integrated by flip-chip in the housing. By way of example, the microelectronic component arrangement described here can be used for stress-sensitive pressure sensors.