Method for improving current carrying capacity of second-generation high-temperature superconducting tape

Abstract

A method for improving current carrying capacity of a second-generation high-temperature superconducting tape, which includes: stretching the second-generation high-temperature superconducting tape in a high-temperature environment, and carrying out an oxygenation heat treatment on the stretched second-generation high-temperature superconducting tape The atmosphere of the high-temperature environment is oxygen, or an inert gas, or a mixture thereof, and a temperature of the high-temperature environment is 450-650° C.; and a strain for stretching ranges from 0.1% to 1%, and a time for stretching ranges from 1 minute to 100 hours. The method of the present invention is a post-processing technique for the second-generation high-temperature superconducting tape with a simple treatment process and a controllable result, and by stretching, current carrying capacity of the superconducting tape is improved and anisotropy of superconductivity is reduced.

Claims

1. A method for improving a current carrying capacity of a second-generation high-temperature superconducting tape, the second-generation high-temperature superconducting tape comprising a superconducting layer, the method comprising the following steps in a sequential manner: a) depositing the superconducting layer by pulsed laser deposition, chemical vapor deposition, or chemical solution deposition to prepare the second-generation high-temperature superconducting tape, wherein the second-generation high-temperature superconducting tape is plated with silver, and the superconducting layer of the second-generation high-temperature superconducting tape comprises a rare-earth barium-copper-oxide compound or a rare-earth barium-copper-oxide compound containing a non-superconducting second phase; b) stretching the second-generation high-temperature superconducting tape at 450-650° C. to produce a stretched second-generation high-temperature superconducting tape with a strain of 0.1-1% along a length thereof; and c) carrying out oxygenation heat treatment on the stretched second-generation high-temperature superconducting tape.

2. The method of claim 1, wherein an atmosphere in the high-temperature environment is oxygen, or an inert gas, or a mixture thereof.

3. The method of claim 1, wherein the oxygenation heat treatment comprises: keeping the second-generation high-temperature superconducting tape in a pure oxygen atmosphere at 400-500° C. for 30 minutes to 5 hours.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The features, objects, and advantages of the present invention will become more apparent with reference to the detailed description of non-limiting embodiments and the drawings:

(2) FIG. 1 is a transmission electron micrograph of a cross-section of a superconducting layer in a second-generation high-temperature superconducting tape according to a first embodiment, in which a growth direction of c-axis of a superconducting layer EuBa.sub.2Cu.sub.3O.sub.7 and a position of a stacking fault are marked;

(3) FIG. 2 is a critical current-external field graph of the second-generation high-temperature superconducting tape at a temperature of 4.2 K before and after the high-temperature stretching and heat treatment according to the first embodiment, in which the applied magnetic field is perpendicular to a surface of the superconducting tape;

(4) FIG. 3 is a graph showing a calculated anisotropy of the second-generation high-temperature superconducting tape after the high-temperature stretching and heat treatment according to the first embodiment; and

(5) FIG. 4 is a critical current-external field graph of a second-generation high-temperature superconducting tape at a temperature of 4.2 K before and after the high-temperature stretching and heat treatment according to a second embodiment, in which the applied magnetic field is perpendicular to the surface of the superconducting tape.

DETAILED DESCRIPTION OF EMBODIMENTS

(6) The present invention will now be described in detail with reference to the following embodiments which are illustrative rather than limiting. It should be noted that changes and modifications made by the skilled in the art, without departing from the inventive concept, are within the scope of the present invention.

(7) The embodiments are directed to a method for improving current carrying capacity of second-generation high-temperature superconducting tapes, comprising stretching a second-generation high-temperature superconducting tape plated with or without silver in a high-temperature environment of 450-650° C. such that a strain of 0.1-1% along the length of the superconducting tape is further caused and is maintained for 1 minute to 100 hours; and the atmosphere of the high-temperature atmosphere can be oxygen, a protective inert atmosphere, or a mixture thereof. After stretching, an oxygenation heat treatment is carried out on superconducting tape, that is, the second-generation high-temperature superconducting tape is held in a pure oxygen atmosphere at 400-500° C. for 30 minutes to 5 hours. With the preferred high-temperature stretching process, the current carrying capacity of the second-generation high-temperature superconducting tape can be increased by 30%.

Example 1

(8) In this embodiment, illustrated is a method for improving the current carrying capacity of a second-generation high-temperature superconducting tape, which comprises the following steps.

(9) 1) Selection of a material and a preparation technique for the superconducting layer.

(10) The superconducting layer of the second-generation high-temperature superconducting tape is EuBa.sub.2Cu.sub.3O.sub.7 deposited by pulsed laser deposition, and the superconducting tape is plated without silver.

(11) 2) Stretching under high-temperature environment

(12) The material selected in step 1) is stretched in an oxygen atmosphere under a high-temperature environment of 650° C. such that a strain of 1% along the length of the second-generation high-temperature superconducting tape is caused and maintained for 1 minute.

(13) 3) Silver plating and oxygenation heat treatment After stretching under the high-temperature, the second-generation high-temperature superconducting tape is plated with silver, and then the silver-plated superconducting tape is held in a pure oxygen atmosphere at 500° C. for 30 minutes.

(14) The transmission electron micrograph of the cross-section of the superconducting layer of the second-generation high-temperature superconducting tape of the embodiment is shown in FIG. 1, in which the growth direction of c-axis of the superconducting layer EuBa.sub.2Cu.sub.3O.sub.7 and the position of the stacking fault are marked. After the heat treatment, a critical current of the superconducting tape of the embodiment is reached to 1400 A/cm-width under conditions of 4.2 K and 10 T, which is increased by 30%, and the anisotropy is reduced to 4 (shown in FIGS. 2, 3).

Example 2

(15) In this embodiment, illustrated is a method for improving the current carrying capacity of the second-generation high-temperature superconducting tape which comprises the following steps.

(16) 1) Selection of a material and preparation technique for the superconducting layer

(17) The superconducting layer of the second-generation high-temperature superconducting tape is YBa.sub.2Cu.sub.3O.sub.7+BaZrO.sub.3 deposited by pulsed laser deposition, and the superconducting tape is plated with silver.

(18) 2) Stretching under high-temperature environment

(19) The material selected in step 1) is stretched in a nitrogen atmosphere under a high-temperature environment of 550° C. such that a strain of 0.5% along the length of the second-generation high-temperature superconducting tape is caused and maintained for 5 hours.

(20) 3) Silver plating and oxygenation heat treatment

(21) The second-generation high-temperature superconducting tape obtained in step 2) is held in a pure oxygen atmosphere at 400° C. for 30 minutes to carry out the oxygenation heat treatment. As shown in FIG. 4, after the heat treatment, the critical current of the second-generation high-temperature superconducting tape is reached to 1000 A/cm-width under conditions of 4.2 K and 10 T, which is increased by 20%, and the anisotropy is reduced to 3.

Example 3

(22) In this embodiment, illustrated is a method for improving the current carrying capacity of the second-generation high-temperature superconducting tape which comprises the following steps.

(23) 1) Selection of a material and a preparation technique for the super-conducting layer

(24) The superconducting layer of the second-generation high-temperature superconducting tape is Y.sub.0.6Gd.sub.0.6Ba.sub.2Cu.sub.3O.sub.7 deposited by chemical vapor deposition, and the superconducting tape is plated with silver.

(25) 2) Stretching under high-temperature environment high-temperature

(26) The material selected in step 1) is stretched in a high-temperature environment of 450° C. such that a strain of 0.1% along the length of the second-generation high-temperature superconducting tape is caused and maintained for 10 hours, and a mixture of oxygen and nitrogen with the volume ratio of 1:1 is the atmosphere of the high-temperature environment.

(27) 3) Silver plating and oxygenation heat treatment

(28) The superconducting tape obtained in step 2) is held in a pure oxygen atmosphere at 500° C. for 30 minutes to 5 hours to carry out the oxygenation heat treatment. As shown in FIG. 4, after the heat treatment, the critical current of the second-generation high-temperature superconducting tape is reached to 1200 A/cm-width under conditions of 4.2 K and 10 T, which is increased by 10%, and the anisotropy is reduced to 3.

Example 4

(29) In this embodiment, illustrated is a method for improving the current carrying capacity of the second-generation high-temperature superconducting tape which comprises the following steps:

(30) 1) Selection of a material and a preparation technique for the super-conducting layer

(31) The superconducting layer of the second-generation high-temperature superconducting tape is GdBa.sub.2Cu.sub.3O.sub.7+BaSnO.sub.3 deposited by chemical solution deposition, and the superconducting tape is plated with silver;

(32) 2) Stretching under high-temperature environment high-temperature

(33) The material selected in step 1) is stretched in an Ar atmosphere under a high-temperature environment of 450° C. such that a strain of 0.1% along the length of the second-generation high-temperature superconducting tape is caused and maintained for 10 hours.

(34) 3) Silver plating and oxygenation heat treatment

(35) The second-generation high-temperature superconducting tape obtained in step 2) is held in a pure oxygen atmosphere at 500° C. for 30 minutes to 5 hours to carry out the oxygenation heat treatment. As shown in FIG. 4, after the heat treatment, the critical current of the superconducting tape is reached to 1000 A/cm-width under conditions of 4.2 K and 10 T, which is increased by 30%, and the anisotropy is reduced to 3.

Comparative Example 1

(36) The embodiment relates to a method for improving the current carrying capacity of the second-generation high-temperature superconducting tape, and the method of the embodiment is similar to that of the first embodiment, except that the superconducting tape is plated with silver and copper in step 1).

(37) After the treatments, the critical current of the obtained second-generation high-temperature superconducting tape is reduced to 500 A/cm-width under conditions of 4.2 K and 10 T.

Comparative Example 2

(38) The embodiment relates to a method for improving the current carrying capacity of the second-generation high-temperature superconducting tape, and the method of the embodiment is similar to that of the first embodiment, except that in step 1) of the embodiment, the second-generation high-temperature superconducting tape is plated with silver and copper, and is laminated with stainless steel.

(39) After the treatments, the critical current of the obtained second-generation high-temperature superconducting tape is reduced to 200 A/cm-width under conditions of 4.2 K and 10 T.

Comparative Example 3

(40) The embodiment relates to a method for improving the current carrying capacity of the second-generation high-temperature superconducting tape, and the method of the embodiment is similar to that of the first embodiment, except that in step 2), the strain caused along the length of the second-generation high-temperature superconducting tape is of 0.01%.

(41) After the treatments, no change is brought to the current carrying current of the second-generation high-temperature superconducting tape.

Comparative Example 4

(42) The embodiment relates to a method for improving the current carrying capacity of the second-generation high-temperature superconducting tape, and the method of the embodiment is similar to that of the first embodiment, except that in step 2), the strain caused along the length of the second-generation high-temperature superconducting tape is of 5%.

(43) After treatment, the critical current of the obtained second-generation high-temperature superconducting tape is reduced to 0 A/cm-width under conditions of 4.2 K and 10 T.

(44) In conclusion, the high-temperature stretching process used in the present invention can significantly improve the current carrying capacity of the superconducting tape and reduce the anisotropy of superconductivity. The present invention is not sensitive to the composition and preparation process of the superconducting layer of the second-generation high-temperature superconducting tape. The present invention is a post-processing technology for the second-generation high-temperature superconducting tape with a simple treatment process and a controllable result that can meet the needs of mass industrial production.

(45) Although the above illustrates some embodiments of the present invention, it should be understood that the present invention is not limited to the embodiments described above, and various changes or modifications may be made by those skilled in the art without departing from the scope of the invention. Any embodiments and features thereof may be combined with each other in a reasonable fashion.