Compact multi-band optical measuring unit

Abstract

In an embodiment a measuring unit includes a light emitting LED component including a housing occupying a housing surface G and an LED chip located within the housing, the LED chip including a light emitting light surface L and being configured to emit light; a photodetector configured to detect reflected light reflected from a measured object originating from the LED component and output a measurement signal dependent on a detection of the reflected light; and an integrated circuit configured to evaluate the measurement signal, wherein the LED component, the photodetector, and the integrated circuit are combined into an integrated unit; and a conversion layer disposed in the housing and located above the LED chip, the conversion layer configured to convert the light into multiband light, wherein a ratio L/G of is greater than or equal to 0.8, and wherein the measuring unit is configured to optically measure at least one property of the measured object.

Claims

1. A measuring unit comprising: a light emitting LED component comprising: a housing occupying a housing surface G; and an LED chip located within the housing, the LED chip comprising a light emitting light surface L and being configured to emit light; a photodetector configured to: detect reflected light reflected from a measured object originating from the LED component; and output a measurement signal dependent on a detection of the reflected light; and an integrated circuit configured to evaluate the measurement signal, wherein the LED component, the photodetector, and the integrated circuit are combined into an integrated unit; and a conversion layer disposed in the housing and located above the LED chip, the conversion layer configured to convert the light into multiband light, wherein a ratio L/G of is greater than or equal to 0.8, and wherein the measuring unit is configured to optically measure at least one property of the measured object.

2. The measuring unit according to claim 1, wherein the LED chip is configured to emit blue light.

3. The measuring unit according to claim 1, wherein the LED component and the photodetector are arranged on the integrated circuit.

4. The measuring unit according to claim 3, wherein the LED component and the photodetector are arranged side-by-side on the integrated circuit.

5. The measuring unit according to claim 1, wherein the measuring unit further comprises a substrate, and wherein the LED component, the photodetector, and the integrated circuit are combined into the integrated unit via the substrate.

6. The measuring unit according to claim 5, wherein the LED component, the photodetector, and the integrated circuit are arranged adjacent to each other, and wherein the photodetector is arranged between the LED component and the integrated circuit.

7. The measuring unit according to claim 5, wherein the LED component, the photodetector and the integrated circuit are embedded in the substrate.

8. The measuring unit according to claim 7, wherein the LED component, the photodetector and/or the integrated circuit are flush with the substrate.

9. The measuring unit according to claim 5, wherein the substrate consists essentially of an epoxy resin-based composition.

10. The measuring unit according to claim 1, wherein the conversion layer covers the entire light surface L.

11. The measuring unit according to claim 1, wherein the measuring unit is a spectrometer, wherein the LED component is a light source of the spectrometer, wherein the photodetector is a radiation detector of the spectrometer, wherein the photodetector is configured to output a reflection spectrum of the measured object as the measurement signal, and wherein the integrated circuit is an evaluation unit for the reflection spectrum outputted from the photodetector.

12. A portable device comprising: the measuring unit according to claim 1.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Preferred embodiments of the invention are now described with reference to the drawings.

(2) FIG. 1 shows a first variant of a measuring unit according to embodiments; and

(3) FIG. 2 shows a second variant of a measuring unit according to embodiments.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

(4) In the following description, exemplary embodiments of the present invention are described with reference to the drawings. The drawings are not necessarily to scale, but are merely intended to illustrate the respective features schematically.

(5) It should be noted that the features and components described below may each be combined with one another, regardless of whether they have been described in connection with a single embodiment. The combination of features in the respective embodiments serves only to illustrate the basic structure and functionality of the claimed device.

(6) The measuring units 100, 200 shown in the two figures are used for optical measurement of at least one property of a measuring object M. The measuring object M may be different objects. The measured object M may be, for example, a food or human skin or a metal or another substance. By using the measuring unit 100, 200, a user can obtain information about the properties of the measured object M. For example, if the object is a food, the user can obtain information about its ingredients by means of the measuring unit. If the object is a substance, information about its composition can be obtained by means of the measuring unit 100, 200.

(7) The measuring unit 100, 200 obtains information about the measured object M by emitting light E onto the measured object M, detecting the light Q reflected back from the measured object, and drawing conclusions about the properties of the measured object M based on the composition of the light.

(8) The measuring unit 100, 200 is a microelectronic assembly. It is intended to be installed as part of an electronic device. The measuring unit 100, 200 is usually no larger than a fingernail.

(9) With reference to FIG. 1, a first variant 100 of a measuring unit according to embodiments is now described.

(10) The measuring unit 100 includes a light emitting LED component 102, a photodetector 104, and an integrated circuit 106.

(11) In the present example, the LED component 102 and the photodetector 104 are arranged side-by-side on the integrated circuit. Thus, both the LED component 102 and the photodetector 104 have their bottom surfaces seated on the integrated circuit 106. More specifically, the LED component 102 and the photodetector 104 are attached to the integrated circuit 106. They may be glued there, for example. The structure according to FIG. 1 may also be referred to as “chip on IC”.

(12) Accordingly, the LED component 102, the photodetector 104, and the integrated circuit 106 are combined into an integrated unit.

(13) The light emitting LED component 102 includes a housing 108 and an LED chip 110 disposed within the housing. The housing 108 occupies a bottom surface G. The LED chip 110 comprises a light-emitting light surface L. According to embodiments, the ratio L/G of the light surface L to the housing surface G is greater than or equal to 0.8. Thus, the LED component 102 is a so-called chip-scale package or CSP component. This means that the housing 108 of the LED component 102 is only slightly larger than the LED chip 110.

(14) Preferably, the LED chip no comprises a blue LED. That is, the LED chip no is adapted to emit blue light.

(15) The LED component 102 also comprises a light conversion layer 112 disposed in the housing and located above the LED chip no. Here, the conversion layer 112 covers the entire light surface L of the LED chip no. As a result, all of the blue light emitted from the LED chip no is converted. The conversion layer 112 is selected such that it converts the blue light emitted from the LED chip no into multiband light. Preferably, the conversion layer 112 converts the blue light into multiband infrared light. For example, the obtained infrared light may have three spectral lines. Preferably, the infrared light then comprises three infrared components: a first component in the near infrared range, a second component in the mid infrared range, and a third component in the far infrared range.

(16) The photodetector 104 is used to detect light Q reflected back from the measured object M. This light Q originates from the LED component 102.

(17) The photodetector 104 may output to the integrated circuit 106 a measurement signal that is dependent on characteristics of the reflected light Q. The photodetector 104 is adapted to perform spectral decomposition of the reflected light Q. The photodetector 104 may be realized as a set of photodiodes, photomultipliers, or phototransistors.

(18) The integrated circuit 106 is used to evaluate the measurement signal supplied by the photodetector. The integrated circuit 106 can operate in analog or digital mode.

(19) With reference to FIG. 2, a second variant 200 of a measuring unit according to embodiments is now described. The measuring unit 200 also has an LED component 202, a photodetector 204 and an integrated circuit 206. It differs from the first variant 100 according to FIG. 1 only in the way in which the three components 202, 204 and 206 are arranged relative to one another. In the second variant 200, the different arrangement results from a provided substrate S. The LED component 202, the photodetector 204 and the integrated circuit 206 are combined via the substrate S to form an integrated unit. In this regard, the LED component 202, the photodetector 204, and the integrated circuit 206 are arranged adjacent to each other. The photodetector 204 sits between the LED component 202 and the integrated circuit 206. The three components 202, 204, and 206 are embedded in the substrate S. In the example shown, the LED component 202, the photodetector 204, and the integrated circuit 206 are flush with the substrate S.

(20) Preferably, the substrate S consists of an epoxy resin-based composition.

(21) The measuring units 100, 200 according to embodiments can be used in particular as spectrometers in a cell phone, in a wristwatch or in any other portable device.

(22) The operation is then as follows:

(23) We assume that the measuring unit 100, 200 is integrated in a cell phone. A user of the cell phone can then activate the measuring unit 100, 200 and point it at an object M to be measured.

(24) The LED chip no then emits blue light, which is converted into multiband light E by the conversion layer 112. This multiband light E then exits the LED component 102, 202 toward the measured object M. From there, it is reflected back toward the photodetector 104, 204. The photodetector 104, 204 detects the reflection spectrum Q. This is then evaluated by the integrated circuit 106, 206. Depending on the type of spectrum, conclusions can be drawn about properties of the measured object M.

(25) Since the LED component 102 emits multiband light, a more informative reflection spectrum is also obtained from the measured object M. Such a reflection spectrum distributed over an entire wavelength range holds significantly more information about the measured object M than a reflection signal obtained via a monochromatic light source.

(26) Although the invention has been illustrated and described in detail by means of the preferred embodiment examples, the present invention is not restricted by the disclosed examples and other variations may be derived by the skilled person without exceeding the scope of protection of the invention.