Thermosetting resin composition and prepreg and laminate obtained with the same

Abstract

The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition.

Claims

1. A thermosetting resin composition comprising: (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by reacting (a-1) a maleimide compound having at least two N-substituted maleimide groups in a molecule with (a-2) an amine compound having an acidic substituent represented by the following Formula (1) in an organic solvent, a use amount of the organic solvent being 10 to 1000 parts by mass per 100 parts by mass of the sum of the maleimide compound (a-1) and the amine compound (a-2), (B) a 6-substituted guanamine compound represented by the following Formula (2) and/or dicyandiamide, (C) a copolymer resin comprising (c-1) a monomer unit represented by the following Formula (3) and (c-2) a monomer unit represented by the following Formula (4), and (D) an epoxy resin having at least two epoxy groups in a molecule: ##STR00015## wherein R.sub.1 each represents independently an acidic substituent selected from a hydroxyl group, a carboxy group and a sulfonic acid group; R.sub.2 each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; x is an integer of 1 to 5, and y is an integer of 0 to 4; and a sum of x and y is 5; ##STR00016## wherein R.sub.3 represents phenyl, methyl, allyl, butyl, methoxy or benzyloxy; ##STR00017## wherein R.sub.4 and R.sub.5 each represent independently a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 5 carbon atoms, a phenyl group or a substituted phenyl group; ##STR00018## wherein the curing agent (A) comprises a compound represented by the following Formula (5) or the following Formula (6): ##STR00019## wherein R.sub.1, R.sub.2, x and y represent the same ones as in Formula (1); R.sub.6 each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; ##STR00020## wherein R.sub.1, R.sub.2, x and y represent the same ones as in Formula (1); R.sub.7 and R.sub.8 each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A is an alkylene group, an alkylidene group, an ether group, a sulfonyl group or a group represented by the following Formula (7): ##STR00021## and the organic solvent.

2. The thermosetting resin composition according to claim 1, wherein an equivalent ratio of (a-1) the maleimide compound and of (a-2) the amine compound used in the organic solvent falls within a range of 1.0(equivalent of maleimide group in (a-1) the maleimide compound/equivalent of (a-2) the amine compound in terms of NH.sub.2 group)10.0.

3. The thermosetting resin composition according to claim 1, which includes 1 to 95 parts by mass of component (A) based on 100 parts by mass of the sum of the masses of the component (A) having an acidic substituent and an unsaturated maleimide group in terms of a solid matter and masses of the components (B)-(D).

4. The thermosetting resin composition according to claim 3, which also includes 1 to 95 parts by mass of the component (B), 1 to 50 parts by mass of the component (C), and 1 to 95 parts by mass of the component (D), each based on 100 parts by mass of said sum.

5. The thermosetting resin composition according to claim 1, wherein said maleimide compound is bis(4-maleimidephenyl)methane, and said amine compound is m-aminophenol.

6. The thermosetting resin composition according to claim 1, wherein said maleimide compound is selected from the group consisting of bis(4-maleimidephenyl)methane, m-phenylenebismaleimide and bis(4-maleimidephenyl)sulfone, and said amine compound is selected from the group consisting of m-aminophenol and p-aminophenol.

7. The thermosetting resin composition according to claim 1, wherein the component (B) includes the 6-substituted guanamine compound, the 6-substituted guanamine compound being selected from the group consisting of benzoguanamine and 2,4-diamino-6-vinyl-s-triazine.

8. The thermosetting resin composition according to claim 1, which consists essentially of (A) the curing agent, (B) the 6-substituted guanamine compound and/or dicyandiamide, (C) the copolymer resin and (D) the epoxy resin.

9. The thermosetting resin composition according to claim 1, wherein said organic solvent is selected from the group consisting of cyclohexanone, propylene glycol monomethyl ether, and methyl cellosolve.

10. The thermosetting resin composition according to claim 1, wherein the use amount of the organic solvent is 200 to 500 parts by mass per 100 parts by mass of the sum of the maleimide compound (a-1) and the amine compound (a-2).

11. The thermosetting resin composition according to claim 1, wherein said organic solvent is selected from the group consisting of dimethylacetamide and propylene glycol monomethyl ether.

12. A prepreg obtained by impregnating or coating a base material with the thermosetting resin composition according to claim 1 and then subjecting it to a B stage.

13. A laminated plate obtained by laminating and molding the prepreg according to claim 12.

14. The laminated plate according to claim 13, wherein it is a metal clad laminated plate obtained by superposing a metal foil on one side of the prepreg and then heating, pressing and molding it.

Description

EXAMPLES

(1) Next, the present invention shall be explained with reference to examples shown below, but the present invention shall not be restricted by these examples.

(2) The performances of copper clad laminated plates obtained in the following examples were measured and evaluated by the following methods.

(3) (1) Evaluation of a Copper Foil Adhesive Property (Copper Foil Peeling Strength)

(4) An evaluation base plate was prepared by dipping a copper clad laminated plate in a copper etching liquid to thereby remove the copper foil allowing a band part having a width of cm to remain, and a peeling strength of the band part was measured by means of an autograph (AG-100C manufactured by Shimadzu Corporation).

(5) (2) Measurement of Glass Transition Temperature (Tg)

(6) An evaluation base plate of 5 mm square was prepared by dipping a copper clad laminated plate in a copper etching liquid to thereby remove the copper foil, and a glass transition temperature thereof was evaluated by observing a thermal expansion characteristic of the evaluation base plate by means of a TMA test equipment (TMA2940 manufactured by Du Pont Co., Ltd.).

(7) (3) Evaluation of a Solder Heat Resistance

(8) An evaluation base plate of 5 mm square was prepared by dipping a copper clad laminated plate in a copper etching liquid to thereby remove the copper foil, and it was left standing on the conditions of 121 C. and 0.2 MPa for 4 hours by means of a pressure cooker test equipment (manufactured by Hirayama Manufacturing Corporation). Next, it was dipped in a solder bath having a temperature of 288 C. for 20 seconds, and then an appearance of the evaluation base plate was observed to thereby evaluate a solder heat resistance.

(9) (4) Evaluation of a Copper-Stuck Heat Resistance (T-288)

(10) An evaluation base plate of 5 mm square was prepared from a copper clad laminated plate, and time passing until blister was generated on the evaluation base plate at 288 C. was measured to thereby evaluate a copper-stuck heat resistance by means of a TMA test equipment (TMA2940 manufactured by Du Pont Co., Ltd.).

(11) (5) Evaluation of a Moisture Absorption (Water Absorption Coefficient)

(12) An evaluation base plate was prepared by dipping a copper clad laminated plate in a copper etching liquid to thereby remove the copper foil, and it was left standing on the conditions of 121 C. and 0.2 MPa for 4 hours by means of a pressure cooker test equipment (manufactured by Hirayama Manufacturing Corporation), and then a water absorption coefficient of the evaluation base plate was measured.

(13) (6) Evaluation of a Flame Resistance

(14) An evaluation base plate was prepared by dipping a copper clad laminated plate in a copper etching liquid to thereby remove the copper foil, and an evaluation base plate was prepared by cutting out from the above evaluation base in a length of 127 mm and a width of 12.7 mm and evaluated according to a test method (V method) of UL94.

(15) (7) Measurement of a Relative Dielectric Constant and a Dielectric Loss Tangent

(16) An evaluation base plate was prepared by dipping a copper clad laminated plate in a copper etching liquid to thereby remove the copper foil, and a relative dielectric constant and a dielectric loss tangent thereof were measured at a frequency of 1 GHz by means of a relative dielectric constant measuring device (manufactured by Hewlett-Packard Company).

Production Example 1

Production of a Curing Agent (A-1)

(17) A reactor having a volume of 2 liter which was equipped with a thermometer, a stirring device and a moisture determining device equipped with a reflux condenser and which could be heated and cooled was charged with 358.0 g of bis(4-maleimidephenyl)methane, 54.5 g of m-aminophenol and 412.5 g of propylene glycol monomethyl ether, and they were reacted for 5 hours while refluxing to obtain a solution of a curing agent (A-1).

Production Example 2

Production of a Curing Agent (A-2)

(18) A reactor having a volume of 2 liter which was equipped with a thermometer, a stirring device and a moisture determining device equipped with a reflux condenser and which could be heated and cooled was charged with 358.0 g of bis(4-maleimidephenyl)methane, 54.5 g of p-aminophenol and 412.5 g of propylene glycol monomethyl ether, and they were reacted for 5 hours while refluxing to obtain a solution of a curing agent (A-2).

Production Example 3

Production of a Curing Agent (A-3)

(19) A reactor having a volume of 2 liter which was equipped with a thermometer, a stirring device and a moisture determining device equipped with a reflux condenser and which could be heated and cooled was charged with 358.0 g of bis(4-maleimidephenyl)methane, 68.5 g of p-aminophenol and 426.5 g of N,N-dimethylacetamide, and they were reacted at 140 C. for 5 hours to obtain a solution of a curing agent (A-3).

Production Example 4

Production of a Curing Agent (A-4)

(20) A reactor having a volume of 1 liter which was equipped with a thermometer, a stirring device and a moisture determining device equipped with a reflux condenser and which could be heated and cooled was charged with 268.0 g of m-phenylenebismaleimide, 54.5 g of m-aminophenol and 322.5 g of N,N-dimethylacetamide, and they were reacted at 140 C. for 5 hours to obtain a solution of a curing agent (A-4).

Production Example 5

Production of a Curing Agent (A-5)

(21) A reactor having a volume of 2 liter which was equipped with a thermometer, a stirring device and a moisture determining device equipped with a reflux condenser and which could be heated and cooled was charged with 408.0 g of bis(4-maleimidephenyl)sulfone, 54.5 g of p-aminophenol and 462.5 g of N,N-dimethylacetamide, and they were reacted at 100 C. for 2 hours to obtain a solution of a curing agent (A-5).

Production Example 6

Production of a Curing Agent (A-6)

(22) A reactor having a volume of 2 liter which was equipped with a thermometer, a stirring device and a moisture determining device equipped with a reflux condenser and which could be heated and cooled was charged with 360.0 g of bis(4-maleimidephenyl) ether, 54.5 g of p-aminophenol and 414.5 g of N,N-dimethylacetamide, and they were reacted at 100 C. for 2 hours to obtain a solution of a curing agent (A-6).

Production Example 7

Production of a Curing Agent (A-7)

(23) A reactor having a volume of 2 liter which was equipped with a thermometer, a stirring device and a moisture determining device equipped with a reflux condenser and which could be heated and cooled was charged with 570.0 g of 2,2-bis[4-(4-maleimidephenoxy)phenyl]propane, 54.5 g of p-aminophenol and 624.5 g of propylene glycol monomethyl ether, and they were reacted at 120 C. for 2 hours to obtain a solution of a curing agent (A-7).

Production Example 8

Production of a Curing Agent (A-8)

(24) A reactor having a volume of 2 liter which was equipped with a thermometer, a stirring device and a moisture determining device equipped with a reflux condenser and which could be heated and cooled was charged with 282.0 g of 4-methyl-1,3-phenylenebismaleimide, 54.5 g of p-aminophenol and 336.5 g of propylene glycol monomethyl ether, and they were reacted at 120 C. for 2 hours to obtain a solution of a curing agent (A-8).

Production Example 9

Production of a Copolymer Resin (C-1)

(25) A reactor having a volume of 2 liter which was equipped with a thermometer, a stirring device and a moisture determining device equipped with a reflux condenser and which could be heated and cooled was charged with 514.0 g of a copolymer resin of styrene (m) and maleic anhydride (n) (trade name: EF-40, manufacture by Elf Atochem Co., Ltd., monomer ratio (m/n)=4.0, weight average molecular weight: 10,000), 462.6 g of cyclohexanone and 51.4 g of toluene. The reactor was heated up to 70 C. to homogeneously dissolve them, and then 46.5 g of aniline was dropwise added little by little. Next, the temperature was elevated up to the reflux temperature, and they were reacted for 5 hours while removing condensation water produced to obtain a solution of a copolymer resin (C-1) comprising styrene, maleic anhydride and N-phenylmaleimide. A monomer ratio m/(n+r) of styrene (m) of (C-1), maleic anhydride (n) and N-phenylmaleimide (r) was 4.0, and a weight average molecular weight thereof was 11,000.

Production Example 10

Production of a Copolymer Resin (C-2)

(26) A reactor having a volume of 1 liter which was equipped with a thermometer, a stirring device and a moisture determining device equipped with a reflux condenser and which could be heated and cooled was charged with 154.0 g of a copolymer resin of isobutylene (m) and maleic anhydride (n) (trade name: Isobam-600, manufacture by Kuraray Co., Ltd., m/n=1.0, weight average molecular weight: 6,000), 308.0 g of N,N-dimethylacetamide and 30.8 g of toluene. The reactor was heated up to 70 C. to homogeneously dissolve them, and then 54.5 g of p-aminophenol was added little by little. Next, the temperature was elevated up to the reflux temperature, and they were reacted for 5 hours while removing condensation water produced to obtain a solution of a copolymer resin (C-2) comprising isobutylene, maleic anhydride and p-hydroxyphenylmaleimide. A monomer ratio m/(n+r) of isobutylene (m) of (C-2), maleic anhydride (n) and p-hydroxyphenylmaleimide (r) was 1.0, and a weight average molecular weight thereof was 7,000.

Comparative Production Example 1

Production of a Curing Agent (A-9)

(27) Referring to examples in the patent document 1, a kneader having a volume of 1 liter which was equipped with a steam hating device was charged with 358.0 g of bis(4-maleimidephenyl)methane and 54.5 g of m-aminophenol, and the mixture was heated and kneaded at 135 to 140 C. for 15 minutes. Then, it was cooled down and crushed to obtain a powder of a curing agent (A-9).

Comparative Production Example 2

Production of a Curing Agent (A-10)

(28) Referring to examples in the patent document 9, a kneader having a volume of 1 liter which was equipped with a steam hating device was charged with 358.0 g of bis(4-maleimidephenyl)methane and 68.5 g of m-aminobenzoic acid, and the mixture was heated and kneaded at 135 to 140 C. for 15 minutes. Then, it was cooled down and crushed to obtain a powder of a curing agent (A-10).

Examples 1 to 20 and Comparative Examples 1 to 8

(29) Used were the curing agents (A-1 to 8) obtained in Production Examples 1 to 8 described above or the curing agents (A-9 and 10) obtained in Comparative Production Examples as the curing agent of the component (A) having an acidic substituent and an unsaturated maleimide group, benzoguanamine (manufactured by Nippon Shokubai Co., Ltd.) or dicyandiamide (manufactured by Kanto Chemical Co., Inc.) as the 6-substituted guanamine compound of the component (B), the copolymer resins (C-1 and 2) obtained in Production Examples 9 and 10 described above, a copolymer resin of styrene and maleic anhydride (C-3, trade name: EF-40, manufacture by Elf Atochem Co., Ltd., m/n=4.0, weight average molecular weight: 10,000) or a copolymer resin of isobutylene and maleic anhydride (C-4, trade name: Isobam-600, manufacture by Kuraray Co., Ltd., m/n=1.0, weight average molecular weight: 6,000) as the copolymer resin of the component (C), a phenol novolac type epoxy resin (D-1, trade name: Epicron N-770, manufacture by Dainippon Ink & Chemicals Inc.) or a dicyclopentadiene type epoxy resin (D-2, trade name: HP-7200H, manufacture by Dainippon Ink & Chemicals Inc.) as the epoxy resin of the component (D), a cresol novolac type phenol resin (trade name: KA-1165, manufacture by Dainippon Ink & Chemicals Inc.) as the epoxy curing agent, crushed silica (E-1, trade name: F05-30, manufacture by Fukushima Yogyo Co., Ltd., average particle diameter: 10 m) and aluminum hydroxide (E-2, trade name: HD-365, manufacture by Showa Denko K.K., average particle diameter: 3 m) as the inorganic filler of the component (E) and methyl ethyl ketone as the diluent solvent, and they were mixed in blend proportions (parts by mass) shown in Table 1 to Table 3 to obtain homogeneous vanishes having a resin content of 70% by mass.

(30) Next, an E glass cloth having a thickness of 0.2 mm was impregnated and coated with the vanish obtained and heated and dried at 160 C. for 10 minutes to obtain a prepreg having a resin content of 55% by mass. Four sheets of the above prepregs were superposed, and electrolytic copper foils of 18 m were disposed at the upper and lower sides and pressed at a pressure of 2.45 MPa and a temperature of 185 C. for 90 minutes to obtain a copper clad laminated plate.

(31) The copper clad laminated plate thus obtained was used to measure and evaluate a copper foil adhesive property (copper foil peeling strength), a glass transition temperature (Tg), a solder heat resistance (T-288), a moisture absorption (water absorption coefficient), a flame retardation, a relative dielectric constant (1 GHz) and a dielectric loss tangent (1 GHz) by the methods described above. The evaluation results thereof are shown in Table 1 to Table 5.

(32) TABLE-US-00001 TABLE 1 Example 1 2 3 4 5 6 Thermosetting resin composition (parts by mass) Component (A) Curing agent (A-1) 40 40 Curing agent (A-2) 40 40 Curing agent (A-3) 40 Curing agent (A-4) 40 Component (B) Benzoguanamine 10 10 10 10 10 10 Component (C) Copolymer resin (C-1) 10 10 10 Copolymer resin (C-2) 10 Copolymer resin (C-3) 10 Copolymer resin (C-4) 10 Component (D) Phenol novolac type epoxy 40 40 40 40 resin (D-1) Cyclopentadiene type epoxy 30 30 resin (D-2) (Epoxy curing agent) Cresol novolac type phenol 10 10 resin Component (E) Crushed silica (E-1) 10 10 10 10 10 10 Aluminum hydroxide (E-2) 80 80 80 80 80 80 Measurement and evaluation results (1) Copper foil adhesive 1.60 1.65 1.69 1.62 1.61 1.60 property (copper foil peeling strength: kN/m) (2) Glass transition 230 225 228 230 230 235 temperature (Tg, C.) (3) Solder heat resistance Good Good Good Good Good Good (4) Copper-stuck heat >60 >60 >60 >60 >60 >60 resistance (T-288, minute) (5) Moisture absorption (water 0.5 0.5 0.5 0.5 0.6 0.5 absorption coefficient: %) (6) Flame retardation V-0 V-0 V-0 V-0 V-0 V-0 (7) Relative dielectric 4.0 3.9 4.0 4.0 4.1 4.0 constant (1 GHz) (8) Dielectric loss tangent 0.004 0.004 0.004 0.005 0.005 0.005 (1 GHz)

(33) TABLE-US-00002 TABLE 2 Example 7 8 9 10 Thermosetting resin composition (parts by mass) Component (A) Curing agent (A-5) 40 Curing agent (A-6) 40 Curing agent (A-7) 40 Curing agent (A-8) 40 Component (B) Benzoguanamine 10 10 10 10 Component (C) Copolymer resin (C-1) 10 Copolymer resin (C-2) 10 Copolymer resin (C-3) 10 Copolymer resin (C-4) 10 Component (D) Phenol novolac type epoxy 40 40 40 40 resin (D-1) Cyclopentadiene type epoxy resin (D-2) (Epoxy curing agent) Cresol novolac type phenol resin Component (E) Crushed silica (E-1) 10 10 10 10 Aluminum hydroxide (E-2) 80 80 80 80 Measurement and evaluation results (1) Copper foil adhesive 1.60 1.65 1.65 1.65 property (copper foil peeling strength: kN/m) (2) Glass transition 240 235 225 245 temperature (Tg, C.) (3) Solder heat resistance Good Good Good Good (4) Copper-stuck heat >60 >60 >60 >60 resistance (T-288, minute) (5) Moisture absorption (water 0.5 0.5 0.5 0.5 absorption coefficient: %) (6) Flame retardation V-0 V-0 V-0 V-0 (7) Relative dielectric 4.0 3.8 3.7 4.1 constant (1 GHz) (8) Dielectric loss tangent 0.004 0.003 0.002 0.003 (1 GHz)

(34) TABLE-US-00003 TABLE 3 Example 11 12 13 14 15 16 Thermosetting resin composition (parts by mass) Component (A) Curing agent (A-1) 40 40 Curing agent (A-2) 40 40 Curing agent (A-3) 40 Curing agent (A-4) 40 Component (B) Dicyandiamide 10 10 10 10 10 10 Component (C) Copolymer resin (C-1) 10 10 10 Copolymer resin (C-2) 10 Copolymer resin (C-3) 10 Copolymer resin (C-4) 10 Component (D) Phenol novolac type epoxy 40 40 40 40 resin (D-1) Dicyclopentadiene type epoxy 30 30 resin (D-2) Component (E) Crushed silica (E-1) 10 10 10 10 10 10 Aluminum hydroxide (E-2) 80 80 80 80 80 80 (Epoxy curing agent) Cresol novolac type phenol 10 10 resin Measurement and evaluation results (1) Copper foil adhesive 1.61 1.64 1.68 1.62 1.62 1.60 property (copper foil peeling strength: kN/m) (2) Glass transition 231 226 229 230 231 236 temperature (Tg, C.) (3) Solder heat resistance Good Good Good Good Good Good (4) Copper-stuck heat >60 >60 >60 >60 >60 >60 resistance (T-288, minute) (5) Moisture absorption (water 0.6 0.5 0.5 0.5 0.6 0.5 absorption coefficient: %) (6) Flame retardation V-0 V-0 V-0 V-0 V-0 V-0 (7) Relative dielectric 4.1 3.9 4.0 4.0 4.2 4.1 constant (1 GHz) (8) Dielectric loss tangent 0.004 0.004 0.004 0.005 0.005 0.005 (1 GHz)

(35) TABLE-US-00004 TABLE 5 Comparative Example 1 2 3 4 5 6 Thermosetting resin composition (parts by mass) Component (A) Curing agent (A-1) 40 40 Curing agent (A-9) 40 40 40 Curing agent (A-10) 40 Component (B) Benzoguanamine 10 10 10 10 Component (C) Copolymer resin (C-3) 10 Copolymer resin (C-4) 10 Component (D) Phenol novolac type epoxy 40 40 resin (D-1) Cyclopentadiene type epoxy resin (D-2) 50 50 40 40 (Epoxy curing agent) Cresol novolac type phenol resin 10 10 10 10 Component (E) Crushed silica (E-1) 10 10 10 10 10 10 Aluminum hydroxide (E-2) 80 80 80 80 80 80 Measurement and evaluation results (1) Copper foil adhesive 0.90 0.90 0.70 0.45 property (copper foil peeling strength: kN/m) (2) Glass transition 140 150 130 120 temperature (Tg, C.) (3) Solder heat resistance Blister Blister Blister Blister (4) Copper-stuck heat 1 1 1 0 resistance (T-288, minute) (5) Moisture absorption (water 1.1 1.1 0.8 1.1 absorption coefficient: %) (6) Flame retardation V-0 V-1 V-1 Burned (7) Relative dielectric 4.9 4.9 5.1 5.1 constant (1 GHz) (8) Dielectric loss tangent 0.014 0.014 0.017 0.023 (1 GHz)

(36) In Comparative Examples 5 and 6, the vanishes in which the thermosetting resin composition was homogeneously dissolved were not obtained, and the prepregs could not be produced.

(37) As apparent from the results shown in Table 1 to Table 4, a balance is kept in all of a copper foil adhesive property (copper foil peeling strength), a glass transition temperature (Tg), a solder heat resistance (T-288), a moisture absorption (water absorption coefficient), a flame resistance, a relative dielectric constant (1 GHz) and a dielectric loss tangent (1 GHz) in the examples of the present invention.

(38) On the other hand, as apparent from the results shown in Table 5, the prepregs cannot be produced in the comparative examples or the laminated plates which are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent are not found, and they are inferior in any of the characteristics.

(39) The prepregs obtained by impregnating or coating the base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.