REFRIGERANT PIPING DEVICE
20170074563 ยท 2017-03-16
Inventors
Cpc classification
F25B40/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B39/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B2400/052
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B2400/01
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B2500/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F24H1/102
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B2500/221
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B2500/28
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B47/006
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B39/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B2400/054
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F25B41/37
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F25B47/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F24H1/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D1/047
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A refrigerant piping device includes a refrigerating head, an input unit connected to the refrigerating head to input refrigerant, and an output unit connected to the refrigerating head to output refrigerant. The output unit includes a refrigerant return pipe connected to the refrigerating head, and a heating module configured on the refrigerant return pipe to heat up the refrigerant inside the refrigerant return pipe. The refrigerant return pipe is configured with a heating module to heat up the refrigerant inside the pipe, and the heating can remove the frozen state of the refrigerant return pipe to recover the original flexibility and function of the refrigerant return pipe, thus avoiding the problem wherein the refrigerant return pipe is frozen and gets brittle under the low temperature, and breakage due to the high-speed reciprocating motion of the refrigerating head left and right, back and forth, or up and down.
Claims
1. A refrigerant piping device, capable of high-speed reciprocating motion and working under a low-temperature state, comprising: a refrigerating head; an input unit, connected to the refrigerating head to input refrigerant; and an output unit, connected to the refrigerating head to output refrigerant, said output unit including a refrigerant return pipe connected to the refrigerating head, and a heating module configured on the refrigerant return pipe to heat up the refrigerant inside the refrigerant return pipe.
2. The device defined in claim 1, wherein said input unit includes a refrigerant induction pipe connected to the refrigerating head and extending spirally in the form of a spring, said refrigerant induction pipe being a capillary tube.
3. The device defined in claim 1, wherein said heating module of the output unit has a heating source, and an electric heating wire wound on the refrigerant return pipe and electrically connected to the heating source.
4. The device defined in claim 2, wherein said input unit also includes an outside enclosing pipe covering the refrigerant induction pipe.
5. The device defined in claim 2, wherein said input unit further includes a positioning pipe for the refrigerant induction pipe to wind on.
6. The device defined in claim 1, wherein said heating module of the output unit has a heating source, and an electric heating strip wound on the refrigerant return pipe and electrically connected to the heating source.
7. The device defined in claim 1, wherein said heating module of the output unit has a heating source, and a plurality of electric heating blocks working together to clamp the refrigerant return pipe, each electric heating block inserted with at least one electric heating bar electrically connected to the heating source.
8. The device defined in claim 2, wherein said refrigerating head comprises a main body, a heat exchange structure configured inside the main body to deliver refrigerant, an input connector configured on the main body and connected to the heat exchange structure to input the refrigerant to the heat exchange structure, and an output connector configured on the main body and connected to the heat exchange structure to output the refrigerant to the heat exchange structure, the refrigerant induction pipe of the input unit being connected to the input connector, and the refrigerant return pipe of the output unit being connected to the output connector.
9. The device defined in claim 2, wherein the output unit also includes thermal insulating layer that covers the refrigerant return pipe and the heating module, and the refrigerant induction pipe is wound on the thermal insulating layer and the refrigerant return pipe.
Description
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0016] Other features and advantages of the present invention will be readily apparent from the description of embodiments when taken in conjunction with the accompanying drawings, wherein:
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DETAILED DESCRIPTION OF THE INVENTION
[0025] Before reading detailed description of the present invention, it is to be noted that, in the following description, like components are designated by like reference numerals.
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[0027] The refrigerating head 4 comprises a main body 41, a heat exchange structure 42 configured inside the main body 41, an input connector 43 configured on the main body 41 and connected to the heat exchange structure 42, and an output connector 44 configured on the main body 41 and connected to the heat exchange structure 42. The input connector 43 and the output connector 44 can be integrally formed with the main body 41 a, or separately mounted on the main body 41. The heat exchange structure 42 is a heat exchange refrigerant flow path, with its two ends respectively connected to the input connector 43 and the output connector 44.
[0028] The input unit 5 includes a refrigerant induction pipe 51, with its two ends respectively connected to the condenser 31 and the input connector 43 of the refrigerating head 4. The refrigerant induction pipe 51 is a capillary tube, and extends spirally in the form of a spring, as shown in
[0029] The output unit 6 includes a refrigerant return pipe 61, with its two ends respectively connected to the output connector 44 of the refrigerating head 4 and the compressor 32, and a heating module 62 configured on the refrigerant return pipe 61 to heat up the refrigerant inside the refrigerant return pipe 61. The heating module 62 has an electric heating wire 621 wound on the refrigerant return pipe 61, and a heating source 622 electrically connected to the electric heating wire 621. In the first embodiment, the heating source 622 is preferably made up of a solid-state relay (SSR) and a temperature controller, to control the heat output of the electric heating wire 621 at an appropriate temperature.
[0030] The refrigerant is firstly cooled by the condenser 31, and then delivered to the refrigerant controller 33 for depressurization and converted to the low-temperature state. Then, it is inducted by the refrigerant induction pipe 51 of the input unit 5 to the refrigerating head 4. After passing the input connector 43 of the refrigerating head 4, it enters the heat exchange structure 42 for heat exchange to turn the refrigerating head 4 into a low-temperature state. Next, the refrigerant flows out from the output connector 44, passing the refrigerant return pipe 61 and returns to the compressor 32. At last, the compressor 32 compresses the refrigerant and delivers it to the condenser 31 to start the same cycle.
[0031] During the semiconductor testing operation, the refrigerating head 4 will have high-speed vertical, horizontal or back-and-front motion, to contact and cool the semiconductor (IC). Under excessive low temperature, the refrigerant induction pipe 51 and the refrigerant return pipe 61 will naturally be hardened and get brittle. In comparison, the present invention winds the refrigerant induction pipe 51 in the form of a spring, so that the refrigerant induction pipe 51 can extend when it is pulled. Thus, it will not be directly tightened and can buffer the pulling force to avoid breakage caused by the high-speed reciprocating motion of the refrigerating head 4. Moreover, the refrigerant return pipe 61 is configured with an electric heating wire 621 to heat up the refrigerant return pipe 61 so that it will not be frozen and get brittle under the low temperature. This can also provide an effect to avoid breakage of the pipe during the pull. In addition, the electric heating wire 621 can vaporize the refrigerant flowing inside, avoiding direct backflow of the refrigerant to the compressor 32 to cause a liquid compression phenomenon. Thus it provides a function to protect the compressor 32.
[0032] During the semiconductor (IC) low-temperature testing process, the average motion speed of refrigerating head 4 is: 15 cm vertical motion in 0.3 s and 30 cm horizontal motion in 0.3 s. An ordinary refrigerant pipeline will have metal fatigue and breakage in 5 to 6 days. But the lifecycle of the present invention of a refrigerant piping device 2 can be up to 5 to 6 months. It is apparent that the present invention has an effect to enhance the operational lifecycle.
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[0038] Although the invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.