Multi-port multi-beam antenna system on printed circuit board with low correlation for MIMO applications and method therefor
11476591 · 2022-10-18
Assignee
Inventors
Cpc classification
H01Q21/28
ELECTRICITY
H01Q13/18
ELECTRICITY
H01Q21/067
ELECTRICITY
H01Q19/30
ELECTRICITY
International classification
H01Q9/28
ELECTRICITY
H01Q21/06
ELECTRICITY
H01Q19/30
ELECTRICITY
Abstract
An antenna assembly has a dielectric substrate. A plurality of end fire antennas in a Yagi-Uda configuration is positioned around edges of the dielectric substrate.
Claims
1. An antenna assembly comprising: a dielectric substrate; and a plurality of end fire antennas in a Yagi-Uda configuration positioned at edges of the dielectric substrate, wherein each of the end fire antennas comprises: an upper dipole pair; a lower dipole pair; and a metallic wall formed around a back and side areas of the upper dipole pair and the lower dipole pair; wherein the upper dipole pair is formed of a first set of parallel dipoles and the lower dipole pair is formed of a second set of parallel dipoles, the first set of parallel dipoles and the second set of parallel dipoles each being of a different length to support separate λ/2 resonance modes, wherein λ is a wavelength of a 5G frequency band.
2. The antenna assembly of claim 1, wherein each of the end fire antennas comprises two dipoles connected in parallel as a respective radiating element.
3. The antenna assembly of claim 1, wherein the metallic wall has a height to width aspect ratio of 1:1.
4. The antenna assembly of claim 1, comprising: a ground plane coupled to the lower dipole pair; and a transmission line coupled to the upper dipole pair.
5. The antenna assembly of claim 4, wherein the transmission line is a 50-ohm transmission line.
6. The antenna assembly of claim 1, comprising a parasitic element mounted parallel to the lower dipole pair and the upper dipole pair.
7. The antenna assembly of claim 1, wherein the dielectric substrate is a multi-layer Liquid Crystal Polymer (LCP) circuit board.
8. An antenna assembly comprising: a dielectric substrate, wherein the dielectric substrate is a multi-layer Liquid Crystal Polymer (LCP) circuit board; a plurality of end fire antennas in a Yagi-Uda configuration positioned at edges of the dielectric substrate, wherein each of the end fire antennas comprises: an upper dipole pair; a lower dipole pair, wherein the upper dipole pair is formed of a first set of parallel dipoles and the lower dipole pair is formed of a second set of parallel dipoles, the first set of parallel dipoles and the second set of parallel dipoles each being of a different length to support separate λ/2 resonance modes, wherein λ is a wavelength of a 5G frequency band; a metallic wall formed around a back and side areas of the upper dipole pair and the lower dipole pair; a ground plane coupled to the lower dipole pair; a transmission line coupled to the upper dipole pair; and a device for dual polarized broadside radiations formed on a top surface of a center area of the dielectric substrate.
9. The antenna assembly of claim 8, comprising a parasitic element mounted parallel to the lower dipole pair and the upper dipole pair.
10. The antenna assembly of claim 8, comprising a pair of slotted resonant waveguide antennas formed on a top surface of a center area of the dielectric substrate.
11. The antenna assembly of claim 8, comprising a cross-slot antenna formed on a top surface of a center area of the dielectric substrate.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The present application is further detailed with respect to the following drawings. These figures are not intended to limit the scope of the present application but rather illustrate certain attributes thereof. The same reference numbers will be used throughout the drawings to refer to the same or like parts.
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DESCRIPTION OF THE APPLICATION
(14) The description set forth below in connection with the appended drawings is intended as a description of presently preferred embodiments of the disclosure and is not intended to represent the only forms in which the present disclosure can be constructed and/or utilized. The description sets forth the functions and the sequence of steps for constructing and operating the disclosure in connection with the illustrated embodiments. It is to be understood, however, that the same or equivalent functions and sequences can be accomplished by different embodiments that are also intended to be encompassed within the spirit and scope of this disclosure.
(15) Embodiments of the exemplary antenna design disclose a technique for omnidirectional signal propagation for MIMO systems, bypassing the need for beamforming. The antenna design may involve positioning three antenna topologies along the surface and around the edges of a circuit board to maximize signal coverage. End fire antennas in a four-dipole Yagi-Uda configuration may be positioned around the edges of the circuit board, and either slotted waveguide or cross-slot broadside antennas may be positioned in the center of the circuit board. The antenna design may achieve a combined 3 dB scan angle of more than −145° to 145° in both planes with a very low correlation coefficient between ports. Whereas a phased array antenna typically provides a scan range of only −60° to 60°.
(16) Referring to
(17) The dielectric substrate 1003 may be formed of a plurality of layers of LCP 2005. Each layer of LCP 2005 may be connected with another layer of LCP 2005 with an adhesive layer 2004. In accordance with one embodiment, the adhesive layer 2004 may be adhesive layers of FL A3000 paste or similar materials.
(18) The device 1 may have four end fire antennas 1000 in MIMO configuration attached around an edge of the dielectric substrate 1003. An individual end fire antenna 1000 may be attached to each side edge of the dielectric substrate 1003 and around a perimeter of the dielectric substrate 1003. In accordance with one embodiment, the end fire antennas 1000 may exhibit a wide −10 dB return loss band from 22.8 to 44 GHz to support three proposed bands for 5G communication. In accordance with one embodiment, the end fire antennas 1000 may be Yagi-Uda antenna elements.
(19) The device 1 may support additional channels other than those of the four end fire antennas 1000. The device 1 may have two additional channels. The two additional channels may be supported in the broadside direction with a pair of slotted resonant waveguide antennas 1001 and 1002 attached on a top surface in a center area of the dielectric substrate 1003.
(20) The four end fire antennas 1000 may be formed in a four-dipole configuration 4000 as shown in
(21) A dipole may have capacitive reactance for frequencies below the resonance frequency and inductive reactance for frequencies above the resonance frequency. The upper and lower dipole pairs 2002 and 2001 respectively may be sized so that the position of their resonance frequencies may result in cancelled reactance profiles, widening the impedance match to cover the mid-band region. Their separation may be optimized to minimize mutual coupling (nearly zero). A more closely positioned second dipole may overload the primary mode of the longer dipole and does not result in the same wideband impedance match.
(22) A metallic wall 6005 may surround the back and sides of each of the antennas 1000 forming the four-dipole configuration 4000. The metallic wall 6005 may be used to suppresses surface wave propagation. The metallic wall 6005 around the backside of the antennas 1000 may decrease mutual coupling and cross-polarization radiation between the antennas 1000 and other antenna elements of the device 1. It may also reduce circuitry interference.
(23) The metallic wall 6005 may have a height to width aspect ratio of 1:1 to simplify plating fabrication. A transmission line 2006 may connect the upper dipole pair 2006, dipole pair 6002/6004, to the coaxial probe 2000. The coaxial probe 2000 may reduce the influence of the transmission line 2006 on impedance matching and the radiation pattern of the device 1. The correlation between the coaxial probes 2000 is independent of element spacing provided the dielectric substrate 1003 is larger than the antennas 1000. In accordance with one embodiment, the transmission line 2006 may be a 50-ohm transmission line 2006.
(24) The lower dipole pair 2001 may be connected to a finite ground plane 2007. The ground plane 2007 may have an opening hole 2008 for the feed probe 2000. A parasitic element 2003 may be mounted parallel to the drive elements of the lower and upper dipole pairs 2001 and 2002 respectively, with all the elements usually in a line perpendicular to the direction of radiation of the antenna. The effect of the parasitic element 2003 may have on the radiation pattern depends both on its separation from the next element, and on its length. In accordance with one embodiment, the parasitic element 2003 is a director radiator. The parasitic element 2003 may be formed on the same layer as the dipole pair 2001 and ground plane 2007. In accordance with one embodiment, the parasitic element 2003 may be separated by a quarter wavelength from the lower dipolar pair 2001.
(25) Referring to
(26) In
(27) Referring to
(28) The device 1 and 1′ are multiport antenna systems fabricated on LCP technology for applications in wireless communication systems. More specifically, the devices 1 and 1′ may be used for 5G communications. The devices 1 and 1′ may allow for signals on separate ports to be steered without analog or digital beamforming techniques.
(29) As may be seen in
(30) The foregoing description is illustrative of particular embodiments of the application, but is not meant to be a limitation upon the practice thereof. The following claims, including all equivalents thereof, are intended to define the scope of the application.