3D image capture apparatus with depth of field extension
09591286 ยท 2017-03-07
Assignee
Inventors
- Zhisheng Yun (Woodbury, MN, US)
- David B. Stegall (Saint Paul, MN, US)
- Shannon D. Scott (Hudson, WI)
- James L. Graham, II (Woodbury, MN, US)
- Paul A. Sevcik (White Bear Township, MN, US)
Cpc classification
H04N23/54
ELECTRICITY
G02B17/023
PHYSICS
H04N23/555
ELECTRICITY
G02B17/008
PHYSICS
H04N23/55
ELECTRICITY
A61B1/05
HUMAN NECESSITIES
A61B1/247
HUMAN NECESSITIES
A61C9/0053
HUMAN NECESSITIES
G02B17/0816
PHYSICS
International classification
G02B17/02
PHYSICS
Abstract
A 3D imaging apparatus with enhanced depth of field to obtain electronic images of an object for use in generating a 3D digital model of the object. The apparatus includes a housing having mirrors positioned to receive an image from an object external to the housing and provide the image to an image sensor. The optical path between the object and the image sensor includes an aperture element having apertures for providing the image along multiple optical channels with a lens positioned within each of the optical channels. The depth of field of the apparatus includes the housing, allowing placement of the housing directly on the object when obtaining images of it.
Claims
1. A 3D imaging apparatus, comprising: a housing; an image sensor within the housing; a first mirror and a second mirror each within the housing, the first and second mirrors positioned to receive an image from an object external to the housing and provide the image to the image sensor; an aperture element having a plurality of apertures, located along an optical path between the object and the image sensor, for providing the image along a plurality of optical channels corresponding with the apertures to the image sensor; a lens positioned within each of the optical channels between the aperture element and the image sensor; and a holder within the housing for holding the first mirror, the aperture element, and the lens for each of the optical channels, wherein the holder is located adjacent the image sensor, wherein the image sensor is positioned substantially parallel to an object plane of the object, wherein a depth of field of the apparatus includes the housing, wherein the apparatus is configured to be placed directly on the object to be imaged for intra-oral scanning.
2. The 3D imaging apparatus of claim 1, wherein the housing further comprises a transparent cover positioned within the optical path, and further comprising a light source adjacent the cover for illuminating the object.
3. The 3D imaging apparatus of claim 1, wherein the housing includes an angled tip, and the second mirror is located adjacent an interior surface of the angled tip.
4. The 3D imaging apparatus of claim 1, wherein the image sensor comprises a single image sensor partitioned into multiple regions corresponding with the plurality of optical channels.
5. The 3D imaging apparatus of claim 1, wherein the aperture element is located between the first and second mirrors and the image sensor.
6. The 3D imaging apparatus of claim 1, wherein the first and second mirrors each comprise planar mirrors.
7. The 3D imaging apparatus of claim 1, wherein at least one of the first and second mirrors comprises a concave mirror.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The accompanying drawings are incorporated in and constitute a part of this specification and, together with the description, explain the advantages and principles of the invention. In the drawings,
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DETAILED DESCRIPTION
(16) Embodiments of the present invention increase the depth of field of a 3D camera system. The system has multiple optical channels to capture multiple views of an object from varying viewpoints that can be used to generate a 3D image of it. An electronic digital imager sensor captures a scene of a 3D object through the multiple apertures to obtain different view-angle images. Software algorithms can rebuild the 3D scene into a 3D image or model based on the captured different view-angle images of the scene.
(17) Systems to generate 3D images or models based upon image sets from multiple views are disclosed in U.S. Pat. Nos. 7,956,862 and 7,605,817, both of which are incorporated herein by reference as if fully set forth. These systems can be included in a housing providing for hand-held use, and an example of such a housing is disclosed in U.S. Pat. No. D674,091, which is incorporated herein by reference as if fully set forth.
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(19) For the configuration of imager 10 of
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(23) The components of imager 10 can be implemented with, for example, the following. Mirrors 18 and 20 can be aluminum or silver coated on optical glass or metal. Mirror 18 can alternatively be a prism, and mirror 20 can alternatively be a planar mirror plate. A prism is used for mirror 20 for ease of holding the mirror in place on holder 26. Mirrors 18 and 20 can optionally be one piece of material with mirrors on both ends. Mirrors 18 and 20 are preferably positioned at 50 and 40, respectively, from the image plane. The angles of the mirrors should total 90 for the image sensor to obtain images normal to the target, and each of the angles can thus be adjusted for desired placement in the housing. Lenses 24 can include separate lenses for each channel or be a single molded piece of material. Exemplary lens arrays are provided below. Aperture element 22 can be a multi-layer metal plate, such as BeCu base with Ni plating, with holes etched into it for the apertures 23. Holder 26 can be aluminum or a molded plastic material, and mirror 20, aperture element 22, and lenses 24 can be adhered to holder 26 or mechanically held in place on the holder. Light sources 16 can be light emitting diodes (LEDs). Cover 14 can be optical glass. Housing 12 can be metal or a plastic material. The various components of imager 10 in housing 12 can be positioned at particular distances in the optical path for a desired performance.
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(26) Each of the optical channels in the 3D imagers can have single or multiple optical elements. Multiple elements can achieve superior imaging quality, large depth of field, and athermalized system design.
(27) The images of the object formed on the image sensor are located in two regions as shown in
(28) The image sensors can be implemented with, for example, any digital imager such as a CMOS or CCD sensor. The image sensor can include a single sensor, as shown, partitioned into multiple image data regions. Alternatively, the image sensor can be implemented with multiple sensors with the image data regions distributed among them.