BROADBAND ANTIREFLECTION COATINGS UNDER COVERGLASS USING ION GUN ASSISTED EVAPORATION
20170062629 ยท 2017-03-02
Inventors
Cpc classification
H10F77/315
ELECTRICITY
Y02E10/544
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H10F71/00
ELECTRICITY
International classification
Abstract
The present disclosure generally relates to broadband antireflective coatings for reducing reflection of light in the infrared without compromising visible light reflectance in multijunction solar cells bonded to coverglass, and methods of forming the same. The antireflective coatings include a high index, one or more intermediate index, and low index of refraction dielectric layers. The high index dielectric layer utilizes an ion beam assisted deposition to maximize the density and index of refraction. The intermediate index layer(s) increase the bandwidth of the antireflection coating, thereby improving the performance of the antireflective coating in the infrared spectrum.
Claims
1. A method of forming an antireflective coating, comprising: depositing a first layer having a first index of refraction within a range of about 2.3 to about 2.7 using ion beam-assisted deposition; depositing a second layer over the first layer, the second layer having an index of refraction within a range of about 1.8 to about 2.1; and depositing a third layer over the second layer, the third layer having an index of refraction within a range of about 1.6 to about 1.8.
2. The method of claim 1, further comprising disposing an intermediate layer between the first layer and the second layer, the intermediate layer deposited by e-beam evaporation.
3. The method of claim 2, wherein the first layer comprises titanium dioxide, the second layer comprises tantalum oxide, and the third layer comprises aluminum oxide.
4. The method of claim 1, wherein the first layer comprises titanium dioxide.
5. The method of claim 4, wherein the second layer is deposited using e-beam evaporation.
6. The method of claim 5, wherein the third layer comprises aluminum oxide.
7. The method of claim 1, wherein the first layer has a thickness within a range of about 20 nanometers to about 60 nanometers.
8. The method of claim 1, wherein the second layer has a thickness of about 1 nanometer to about 50 nanometers.
9. The method of claim 1, further comprises an intermediate layer positioned between the first layer and the second layer.
10. The method of claim 9, wherein the intermediate layer has a refractive index less than the first layer and greater than the second layer.
11. The method of claim 9, wherein the intermediate layer is comprised of the same material as the first layer.
12. The method of claim 9, wherein the intermediate layer and the first layer comprise titanium dioxide.
13. The method of claim 12, wherein the intermediate layer is formed using e-beam deposition.
14. The method of claim 12, wherein the intermediate layer is formed using a deposition method other than ion beam-assisted deposition.
15. A method of forming an antireflective coating, comprising: depositing a first layer comprising titanium dioxide using ion beam-assisted deposition, the first layer having a first index of refraction within a range of about 2.3 to about 2.7; depositing an intermediate layer comprising titanium dioxide disposed on the first layer, the intermediate layer having an index of refraction and a density less than the first layer; depositing a second layer disposed on the intermediate layer, the second layer having an index of refraction less than the intermediate layer and within a range of about 1.8 to about 2.1; and depositing a third layer disposed on the second layer, the third layer having an index of refraction within a range of about 1.6 to about 1.8.
16. The method of claim 15, wherein the third layer comprises aluminum oxide.
17. The method of claim 16, wherein the first layer has a thickness within a range of about 20 nanometers to about 60 nanometers.
18. The method of claim 17, wherein the second layer has a thickness of about 1 nanometer to about 50 nanometers.
19. The method of claim 18, wherein the intermediate layer is formed using e-beam deposition.
20. A method for forming a solar cell, comprising: depositing a first layer comprising titanium dioxide on the solar cell using ion beam-assisted deposition, the first layer having a first index of refraction within a range of about 2.3 to about 2.7; depositing an intermediate layer using e-beam assisted deposition, the intermediate layer comprising titanium dioxide disposed on the first layer, the intermediate layer having an index of refraction and a density less than the first layer; depositing a second layer disposed on the intermediate layer, the second layer comprising tantalum oxide and having an index of refraction less than the intermediate layer and within a range of about 1.8 to about 2.1; and depositing a third layer disposed on the second layer, the third layer comprising aluminum oxide and having an index of refraction within a range of about 1.6 to about 1.8.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to aspects, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary aspects and are therefore not to be considered limiting of its scope, and the disclosure may admit to other equally effective aspects.
[0013]
[0014]
[0015]
[0016]
[0017] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one aspect may be beneficially incorporated in other aspects without further recitation.
DETAILED DESCRIPTION
[0018] The present disclosure generally relates to broadband antireflective coatings for reducing reflectance loss for multijunction cells into coverglass, and methods of forming the same. The antireflective coatings include a high index dielectric layer, one or more intermediate index layers, and a low index layer. The high index layer is titanium dioxide deposited by ion beam assisted deposition. The intermediate layers have indices of refraction greater than layers disposed on the intermediate layers. The intermediate layers may include tantalum oxide, hafnium oxide, yttrium oxide, and titanium oxide deposited by ion beam-assisted deposition or other deposition methods. A low index layer is disposed over the one or more intermediate index layers.
[0019]
[0020] An antireflective coating 104 is disposed on the upper surface of the multijunction cell 102. The antireflective coating 104 includes a first layer 104a of titanium oxide (TiO.sub.2) deposited using e-beam evaporation, and a second layer 104b of aluminum oxide (Al.sub.2O.sub.3) disposed on the first layer 104a and deposited using e-beam evaporation. While the antireflective coating has desirable antireflective properties in the visible light spectrum (e.g., reflective losses less than one percent), the reflective loses in the infrared spectrum may exceed 10 percent or even 20 percent, and therefore, is unsatisfactory.
[0021]
[0022] The antireflective coating 204 includes a first layer 210, a second layer 212 disposed on the first layer 210, and a third layer 214 disposed on the second layer 212. The first layer 210, e.g., a high index layer, may be a TiO.sub.2 layer formed using ion beam-assisted deposition (IBAD). IBAD is a deposition technique which combines ion implantation with simultaneous sputtering or other physical vapor deposition technique. IBAD allows for independent control of parameters such as ion energy, process temperature, and arrival rate of atomic species at the substrate interface during deposition. Additionally, IBAD can be used to form a gradual transition between a substrate material and the deposited film, and to form films with less intrinsic strain. Formation of TiO.sub.2 using IBAD results in a TiO.sub.2 layer having a higher index of refraction, such as about 2.3 to about 2.7, for example about 2.4 to about 2.5, compared to TiO.sub.2 formed by other methods, which may have an index of refraction of about 2.2.
[0023] A second layer 212, e.g., a first intermediate layer, is disposed on the upper surface of the first layer 210. The second layer 212 may be a tantalum oxide (Ta.sub.2O.sub.5) layer having an index of refraction of about 1.8 to about 2.1, such as about 2.0. Other materials, including hafnium oxide (HfO.sub.2) and yttrium oxide (YtO.sub.2), also having indices of refraction of about 1.8 to about 2.1, may also be used. The second layer 212 may be deposited using e-beam evaporation chambers; however, other deposition methods are also contemplated. A third layer 214, e.g., a low index layer, for example Al.sub.2O.sub.3 deposited by e-beam deposition, may be disposed on the upper surface of the second layer 212. The third layer 214 has an index of refraction of about 1.6 to about 1.8, such as about 1.7. In one example, the first layer 210 may have a thickness within a range of about 20 nanometers to about 60 nanometers, such as about 30 nanometers to about 50 nanometers; the second layer 212 may have a thickness of about 1 nanometer to about 50 nanometers, such as about 30 nanometers to about 50 nanometers; and the third layer may have a thickness within a range of about 50 nanometers to about 100 nanometers, such as about 70 nanometers to about 90 nanometers. Other thicknesses, however, are also contemplated.
[0024] In comparison to the device of
[0025]
[0026] In another example, the first layer 210 may have a thickness within a range of about 20 nanometers to about 60 nanometers, such as about 30 nanometers to about 40 nanometers; the fourth layer 216 may have a thickness within a range of about 20 nanometers to about 60 nanometers, such as about 20 nanometers to about 40 nanometers; the second layer 212 may have a thickness of about 1 nanometer to about 50 nanometers, such as about 30 nanometers to about 50 nanometers; and the third layer 214 may have a thickness within a range of about 50 nanometers to about 100 nanometers, such as about 70 nanometers to about 90 nanometers.
[0027]
[0028]
[0029]
[0030] In operation 426, a third layer, such as the third layer 214 described above, is deposited over the multijunction cell, for example on the second layer 212. The third layer 214 may be deposited using e-beam evaporation, or other deposition techniques including ALD, plasma-enhanced ALD, CVD, plasma-enhanced CVD, or sputtering. The third layer 214 is formed from, for example, Al.sub.2O.sub.3. The third layer 214 generally has an index of refraction less than the second layer 212. In one aspect, the first layer 210, the second layer 212, and the third layer 214 may be deposited in a single process run at a rate of about 5 angstroms per second.
[0031]
[0032] Benefits of the disclosure include increased suppression of reflection within the infrared spectrum, without sacrificing reflection suppression in the visible light spectrum. While aspects herein are described with respect to three layer and four layer antireflective coatings, it is contemplated that antireflective coatings may include more than four layers to further facilitate incremental reduction of indices of refraction between adjacent antireflective coating layers.
[0033] While the foregoing is directed to aspects of the present disclosure, other and further aspects of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.