Abstract
The present disclosure relates to a laser marking device and a method thereof. The laser marking device comprises a laser system, a wafer leveling system, a first imaging system and a mobile system: the wafer leveling system carries and levels a warped wafer to be processed; the mobile system underneath properly adjusts a position of the wafer; the first imaging system detects the wafer to recognize a product category and positioning status; the laser system underneath labels laser marks on the wafer; all wafers are marked in the cyclic process.
Claims
1. A laser marking device, comprising a laser system (10), a mobile system (40) over the laser system (10), a wafer leveling system (20) over the mobile system (40), a first imaging system (30) over the wafer leveling system (20) and characterized in that: the wafer leveling system (20) carries and levels a warped wafer (50) to be processed; the mobile system (40) underneath properly adjusts a position of the wafer (50); the first imaging system (30) detects the wafer (50) to recognize a product category shown on the wafer (50) and positioning status; the laser system (10) underneath labels laser marks on the wafer (50).
2. A laser marking device as claimed in claim 1 wherein the wafer leveling system (20) comprises a carrier module (21), a fixture module (22), a dynamic module (23) and a vacuum module (24).
3. A laser marking device as claimed in claim 1 wherein the wafer leveling system (20) is opposite to a second imaging system (31) underneath.
4. A laser marking device as claimed in claim 1 wherein the mobile system (40) comprises a rotary mechanism (41) and a translational mechanism (42).
5. A laser marking device as claimed in claim 4 wherein the rotary mechanism (41) comprises a gearwheel ring component (411), a pinion component (412) and a dynamic component (413).
6. A laser marking device as claimed in claim 5 wherein the gearwheel ring component (411) comprises an upper ring (4111), a lower ring (4112) and a plurality of springs (4113).
7. A method for laser marking comprises steps: (a) a wafer leveling system carries and levels a warped wafer; (b) a first imaging system detects the topography on the upper surface of the wafer to measure positions of a plurality of dies and recognize a plurality of locations for laser marking based on the dies; (c) a laser system refers to information for laser marking on the wafer and marks the wafer at the lower surface through an unfilled corner; (d) the wafer leveling system is spin by a mobile system; (e) the wafer leveling system is horizontally shifted by a mobile system; steps (b) to (e) may be conducted repeatedly.
8. A method for laser marking as claimed in claim 7 wherein the wafer is lifted by a dynamic module in the wafer leveling system after step (c).
9. A method for laser marking as claimed in claim 8 wherein the wafer is lowered by the dynamic module in the wafer leveling system after step (d).
10. A method for laser marking as claimed in claim 7 wherein a second imaging system detects the topography on the back of the wafer and records a plurality of laser marks thereon after step (c).
Description
BRIEF DESCRIPTIONS OF THE DRAWINGS
[0031] FIG. 1 is an exploded view of a laser marking device in a preferred embodiment;
[0032] FIG. 2 is a first schematic view of a laser marking device in a preferred embodiment;
[0033] FIG. 3 is a schematic view of a wafer leveling system of a laser marking device in a preferred embodiment;
[0034] FIG. 4 is a schematic view which illustrates a wafer leveling system of a laser marking device is lifted in a preferred embodiment;
[0035] FIG. 5 is an exploded view of a wafer leveling system of a laser marking device in a preferred embodiment;
[0036] FIG. 6 is an exploded view of a rotary mechanism of a laser marking device in a preferred embodiment;
[0037] FIG. 7a is a first schematic view of a rotary mechanism of a laser marking device in a preferred embodiment;
[0038] FIG. 7b is a second schematic view of a rotary mechanism of a laser marking device in a preferred embodiment;
[0039] FIG. 7c is a third schematic view of a rotary mechanism of a laser marking device in a preferred embodiment;
[0040] FIG. 7d is a fourth schematic view of a rotary mechanism of a laser marking device in a preferred embodiment;
[0041] FIG. 8 is a second schematic view of a laser marking device in a preferred embodiment;
[0042] FIG. 9 is a third schematic view of a laser marking device in a preferred embodiment;
[0043] FIG. 10 is a fourth schematic view of a laser marking device in a preferred embodiment;
[0044] FIG. 11 is a first flowchart of a laser marking device in a preferred embodiment; and
[0045] FIG. 12 is a second flowchart of a laser marking device in a preferred embodiment.
DETAILED DESCRIPTIONS OF THE PREFERRED EMBODIMENTS
[0046] A laser marking device and a method thereof will be further explained in preferred embodiments for clear understanding of purposes, characteristics and effects.
[0047] FIG. 1 to FIG. 12 present a laser marking device and a method thereof in preferred embodiments. Referring to FIG. 1 which illustrates a laser marking device comprises a laser system (10), a wafer leveling system (20), a first imaging system (30) and a mobile system (40).
[0048] Specifically, the laser system (10) is a LASER (Light Amplification by Stimulated Emission of Radiation) generation device to amplify stimulated radiation, which is generated according to three elements such as source stimulation, medium gain and resonant structure, for extensive applications in precision machining and semiconductor industries because of some characteristics like no machining stress and precision and is further supplemented by a dust-arrester installation around for collection of powdered by-products.
[0049] Referring to FIGS. 5 and 6 which illustrate the wafer leveling system (20) comprises a carrier module (21), a fixture module (22), dynamic modules (23) and a vacuum module (24): the carrier module (21) is divided into a six-claw structure on which a wafer (50) is carried and a stationary base underneath the wafer wherein the six-claw structure is driven by kinetic energy from the dynamic modules (23) for up/down movements and the stationary base of the carrier module (21) under the wafer (50) contacts the rim of the lower surface of the wafer (50); the fixture module (22) is a leveling device which contacts the rim of the upper surface of the wafer (50) and keeps a stable position relative to the carrier module (21) through magnetic force; the dynamic modules (23) provide displacement power from electricity-driven motors; the vacuum module (24) is covered with antistatic material at its upper surface adjacent to the wafer (50), links a vacuum pump underneath to absorb the lower surface of the wafer (50) through evenly-distributed pores and level the wafer (50), and develops an unfilled corner at which the wafer (50) is not absorbed for convenient operations.
[0050] Referring to FIGS. 1 and 2 which illustrate the first imaging system (30) is an video installation mounted over the wafer (50) to detect the upper surface of the wafer (50) and electrically connected to a backend terminal device for exchanges of detected images by which a layout (product category/positioning status) of chips on the wafer (50) is recognized and the laser system (10) marks the wafer (50) at the lower surface.
[0051] Referring to FIGS. 1, 2, 6 and 7a which illustrate the mobile system (40) comprises a rotary mechanism (41) and a translational mechanism (42): the rotary mechanism (41) supports the wafer leveling system (20) to spin the wafer (50) and comprises a gearwheel ring component (411), a pinion component (412) and a dynamic component (413) (as shown in FIG. 7a) wherein the dynamic component (413) provides power to drive the pinion component (412), the gearwheel ring component (411) linking the pinion component (412), and the vacuum module (24) securely connected to the gearwheel ring component (411); the translational mechanism (42) is an XY sliding table which drives the wafer leveling system (20) to shift along X and Y axes, as shown in FIG. 10.
[0052] Preferably, as shown in FIGS. 1 and 2, the wafer leveling system (20) is opposite to a second imaging system (31) underneath which records laser marks labeled on the wafer (50) completely for tracing or improving a manufacturing process when the wafer (50) stays in the wafer leveling system (20); moreover, as shown in FIGS. 7a and 8, the gearwheel ring component (411) comprises an upper ring (4111), a lower ring (4112) and a plurality of springs (4113) wherein the upper ring (4111) is stacked on the lower ring (4112) and the springs (4113) stay above the upper ring (4111) and function as fasteners fixing the upper ring (4111) and the lower ring (4112); as shown in FIG. 9, the vacuum module (24) is rotated steadily because the upper ring (4111) and the lower ring (4112) fix and are slightly staggered from each other through the springs (4113) and the pinion component (412) tightly contacts the gearwheel ring component (411).
[0053] Referring to FIG. 11 which illustrates a method for laser marking: step (a): a wafer leveling system carries and levels a wafer (601); step (b): a first imaging system detects the topography on the upper surface of the wafer to measure positions of a plurality of dies and recognize a plurality of locations for laser marking based on the dies (602); step (c): a laser system refers to information for laser marking on the wafer and marks the wafer at the lower surface through an unfilled corner (603); step (d): the wafer leveling system is spin by a mobile system (604); step (e): the wafer leveling system is horizontally shifted by a mobile system (605). The steps (b) to (e) may be conducted repeatedly.
[0054] Preferably, referring to FIG. 12 which illustrates other steps: step (c2) after step (c): the wafer is lifted by a dynamic module of the wafer leveling system (6032); step (dl) after step (d): the wafer is lowered by the dynamic module of the wafer leveling system (6041); step (c1) after step (c): a second imaging system detects the topography on the back of the wafer to record a plurality of laser marks (6031).
[0055] A laser marking device and a method thereof in the present disclosure are described in preferred embodiments in which a process to use the laser marking device is presented in detail.
[0056] Referring to FIGS. 2 and 3 and FIG. 12 (step (a) (601)) which illustrate the wafer (50) is leveled according to conditions as follows: the rims of upper and lower surfaces of the wafer (50) are contacted by the fixture module (22) and the carrier module (21), respectively; the lower surface of the wafer (50) (as shown in FIG. 6) is partially absorbed by the vacuum module (24) on the basis of air pressure. Moreover, both the wafer leveling system (20) and the wafer (50) on the translational mechanism (42) stay at position A, as shown in FIG. 10.
[0057] Referring to FIGS. 1 and 2 that illustrate the first imaging system (30) detects the topography on the upper surface of the wafer (50) to measure and recognize positions of a plurality of dies for labeling a plurality of laser marks in the next step.
[0058] Referring to FIGS. 2 and 7a which illustrate the laser system (10), which refers to information for laser marks to be printed, labels laser marks at the lower surface of the wafer (50) through the unfilled corner of the vacuum module (24) (FIG. 7a).
[0059] Referring to FIG. 3 to FIG. 4 that illustrate the six-claw structure of the carrier module (21) on which the wafer (50) is carried is lifted by the surrounding dynamic modules (23) (FIG. 4) and the wafer (50) is not riskily contacted or rubbed by the vacuum module (24); moreover, the pinion component (412) is driven by the dynamic component (413) for a counterclockwise spin and followed by the gearwheel ring component (411) for a clockwise spin so that the vacuum module (24) is actuated finally, as shown from FIG. 7a to FIG. 7b.
[0060] Referring to FIG. 4 to FIG. 3 that illustrate the six-claw structure of the carrier module (21) on which the wafer (50) is carried is lowered by the surrounding dynamic modules (23) (FIG. 3) and the vacuum module (24) approaches and contacts the wafer (50); moreover, both the wafer leveling system (20) and the wafer (50) are shifted to position B by the translational mechanism (42) along the negative X-axis, as shown in FIG. 10.
[0061] Referring to FIGS. 1 and 2 which illustrate the first imaging system (30) detects the topography on the upper surface of the wafer (50) to measure and recognize shifted positions of a plurality of dies for labeling a plurality of laser marks in the next step.
[0062] Referring to FIGS. 2 and 7b which illustrate the laser system (10), which refers to information for laser marks to be printed, labels laser marks at the lower surface of the wafer (50) through the unfilled corner of the vacuum module (24) (FIG. 7b).
[0063] Referring to FIG. 3 to FIG. 4 that illustrate the six-claw structure of the carrier module (21) on which the wafer (50) is carried is lifted by the surrounding dynamic modules (23) (FIG. 4) and the wafer (50) is not riskily contacted or rubbed by the vacuum module (24); moreover, the pinion component (412) is driven by the dynamic component (413) for a counterclockwise spin and followed by the gearwheel ring component (411) for a clockwise spin so that the vacuum module (24) is actuated finally, as shown from FIG. 7b to FIG. 7c.
[0064] Referring to FIG. 4 to FIG. 3 that illustrate the six-claw structure of the carrier module (21) on which the wafer (50) is carried is lowered by the surrounding dynamic modules (23) (FIG. 3) and the vacuum module (24) approaches and contacts the wafer (50); moreover, both the wafer leveling system (20) and the wafer (50) are shifted to position C by the translational mechanism (42) along the positive Y-axis, as shown in FIG. 10.
[0065] Referring to FIGS. 1 and 2 which illustrate the first imaging system (30) detects the topography on the upper surface of the wafer (50) to measure and recognize shifted positions of a plurality of dies for labeling a plurality of laser marks in the next step.
[0066] Referring to FIGS. 2 and 7c which illustrate the laser system (10), which refers to information for laser marks to be printed, labels laser marks at the lower surface of the wafer (50) through the unfilled corner of the vacuum module (24) (FIG. 7c).
[0067] Referring to FIG. 3 to FIG. 4 that illustrate the six-claw structure of the carrier module (21) on which the wafer (50) is carried is lifted by the surrounding dynamic modules (23) (FIG. 4) and the wafer (50) is not riskily contacted or rubbed by the vacuum module (24); moreover, the pinion component (412) is driven by the dynamic component (413) for a counterclockwise spin and followed by the gearwheel ring component (411) for a clockwise spin so that the vacuum module (24) is actuated finally, as shown from FIG. 7c to FIG. 7d.
[0068] Referring to FIG. 4 to FIG. 3 that illustrate the six-claw structure of the carrier module (21) on which the wafer (50) is carried is lowered by the surrounding dynamic modules (23) (FIG. 3) and the vacuum module (24) approaches and contacts the wafer (50); moreover, both the wafer leveling system (20) and the wafer (50) are shifted to position D by the translational mechanism (42) along the positive X-axis, as shown in FIG. 10.
[0069] Referring to FIGS. 1 and 2 which illustrate the first imaging system (30) detects the topography on the upper surface of the wafer (50) to measure and recognize shifted positions of a plurality of dies for labeling a plurality of laser marks in the next step.
[0070] Referring to FIGS. 2 and 7d which illustrate the laser system (10), which refers to information for laser marks to be printed, labels laser marks at the lower surface of the wafer (50) through the unfilled corner of the vacuum module (24) (FIG. 7d).
[0071] Referring to FIG. 3 to FIG. 4 that illustrate the six-claw structure of the carrier module (21) on which the wafer (50) is carried is lifted by the surrounding dynamic modules (23) (FIG. 4) and the wafer (50) is not riskily contacted or rubbed by the vacuum module (24); moreover, the pinion component (412) is driven by the dynamic component (413) for a clockwise spin and followed by the gearwheel ring component (411) for a counterclockwise spin so that the vacuum module (24) is actuated finally, as shown from FIG. 7c to FIG. 7d.
[0072] Referring to FIG. 4 to FIG. 3 that illustrate the six-claw structure of the carrier module (21) on which the wafer (50) is carried is lowered by the surrounding dynamic modules (23) (FIG. 3) and the vacuum module (24) approaches and contacts the wafer (50); moreover, both the wafer leveling system (20) and the wafer (50) are shifted to position A by the translational mechanism (42) along the negative Y-axis, as shown in FIG. 10.
[0073] Accordingly, a laser marking device in the present disclosure, which differs from other laser marking devices and is referred to as creative work in the semiconductor industry, meets patentability and is applied for the patent.
[0074] It should be reiterated that the above descriptions presents preferred embodiments, and any equivalent change in specifications, claims, or drawings still belongs to the technical field within the present disclosure with reference to claims hereinafter.
