Packaging film and preparation method thereof, and filter chip packaging method

Abstract

A packaging film and a preparation method thereof, and a filter chip packaging method are provided. The raw materials of the packaging film include: 20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of curing agent, 2-5 parts by mass of photoinitiator, and 0.4-0.8 parts by mass of accelerant, where the curing agent is compounded by bisphenol F-based benzoxazine curing agent and dicyandiamide curing agent according to the mass ratio of 10:(7-9). The packaging film has excellent flexibility and adhesion, a low moisture absorption rate, and high heat resistance and is especially suitable for the packaging of filter chips.

Claims

1. A packaging film, wherein raw materials of the packaging film comprise: 20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of a curing agent, 2-5 parts by mass of a photoinitiator, and 0.4-0.8 parts by mass of an accelerant; wherein the curing agent is compounded by a bisphenol F-based benzoxazine curing agent and a dicyandiamide curing agent according to a mass ratio of 10: (7-9).

2. The packaging film according to claim 1, wherein the raw materials of the packaging film comprise: 22-24 parts by mass of the silicon dioxide, 26 parts by mass of the aliphatic polyurethane acrylate, 12-15 parts by mass of the phenoxy resin, 5-8 parts by mass of the flexible liquid epoxy resin, 10 parts by mass of the bisphenol F epoxy resin, 18-19 parts by mass of the curing agent, 2-5 parts by mass of the photoinitiator, and 0.4-0.8 parts by mass of the accelerant; wherein the curing agent is compounded by the bisphenol F-based benzoxazine curing agent and the dicyandiamide curing agent according to a mass ratio of 10: (8-9).

3. The packaging film according to claim 1, wherein the raw materials of the packaging film comprise: 22-24 parts by mass of the silicon dioxide, 26 parts by mass of the aliphatic polyurethane acrylate, 15 parts by mass of the phenoxy resin, 5-8 parts by mass of the flexible liquid epoxy resin, 10 parts by mass of the bisphenol F epoxy resin, 19 parts by mass of the curing agent, 2-5 parts by mass of the photoinitiator, and 0.4-0.8 parts by mass of the accelerant; wherein the curing agent is compounded by the bisphenol F-based benzoxazine curing agent and the dicyandiamide curing agent according to a mass ratio of 10:9.

4. The packaging film according to claim 1, wherein the raw materials of the packaging film comprise: 24 parts by mass of the silicon dioxide, 26 parts by mass of the aliphatic polyurethane acrylate, 15 parts by mass of the phenoxy resin, 5-8 parts by mass of the flexible liquid epoxy resin, 10 parts by mass of the bisphenol F epoxy resin, 19 parts by mass of the curing agent, 2-5 parts by mass of the photoinitiator, and 0.4-0.8 parts by mass of the accelerant; wherein the curing agent is compounded by the bisphenol F-based benzoxazine curing agent and the dicyandiamide curing agent according to a mass ratio of 10:9.

5. The packaging film according to claim 1, wherein the silicon dioxide is a spherical silicon dioxide micropowder.

6. A preparation method of the packaging film according to claim 1, comprising: taking and mixing the raw materials according to parts by mass, grinding mixed raw materials into a gelatinous mass, obtaining a glue solution through a vacuum defoaming, and coating the glue solution to obtain the packaging film.

7. A filter packaging method, comprising using the packaging film according to claim 1 in packaging of a filter chip.

8. The filter packaging method according to claim 7, wherein the packaging film covers a front and surrounding sides of the filter chip.

9. The packaging film according to claim 2, wherein the silicon dioxide is a spherical silicon dioxide micropowder.

10. The packaging film according to claim 3, wherein the silicon dioxide is a spherical silicon dioxide micropowder.

11. The packaging film according to claim 4, wherein the silicon dioxide is a spherical silicon dioxide micropowder.

12. The preparation method according to claim 6, wherein in the raw materials of the packaging film, the silicon dioxide is a spherical silicon dioxide micropowder.

Description

DETAILED DESCRIPTION OF THE EMBODIMENTS

(1) In order to make the purpose, technical scheme, and beneficial effects of this application clearer, the application is further explained in detail in conjunction with examples below.

(2) The example of this application provides a high flexibility packaging film, the raw materials of which include: 20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of curing agent, 2-5 parts by mass of photoinitiator, and 0.4-0.8 parts by mass of accelerant, where the curing agent is compounded by bisphenol F-based benzoxazine curing agent and dicyandiamide curing agent according to the mass ratio of 10: (7-9).

(3) As a preferred solution, the raw materials of the high flexibility packaging film include: 22-24 parts by mass of silicon dioxide, 26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-8 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 18-19 parts by mass of curing agent, 2-5 parts by mass of photoinitiator, and 0.4-0.8 parts by mass of accelerant; where the curing agent is compounded by bisphenol F-based benzoxazine curing agent and dicyandiamide curing agent according to the mass ratio of 10: (8-9); DH-4000B aliphatic polyurethane acrylate is preferred for the aliphatic polyurethane acrylate.

(4) As a further preferred solution, the raw materials of the high flexibility packaging film include: 22-24 parts by mass of silicon dioxide, 26 parts by mass of aliphatic polyurethane acrylate, 15 parts by mass of phenoxy resin, 5-8 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 19 parts by mass of curing agent, 2-5 parts by mass of photoinitiator, and 0.4-0.8 parts by mass of accelerant; where the curing agent is compounded by bisphenol F-based benzoxazine curing agent and dicyandiamide curing agent according to the mass ratio of 10:9; DH-4000B aliphatic polyurethane acrylate is preferred for the aliphatic polyurethane acrylate; YX-7105 resin is preferred for the flexible liquid epoxy resin.

(5) As a further preferred solution, the raw materials of the high flexibility packaging film include: 24 parts by mass of silicon dioxide, 26 parts by mass of aliphatic polyurethane acrylate, 15 parts by mass of phenoxy resin, 5-8 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 19 parts by mass of curing agent, 2-5 parts by mass of photoinitiator, and 0.4-0.8 parts by mass of accelerant; where the curing agent is compounded by bisphenol F-based benzoxazine curing agent and dicyandiamide curing agent according to the mass ratio of 10:9; DH-4000B aliphatic polyurethane acrylate is preferred for the aliphatic polyurethane acrylate; YX-7105 resin is preferred for the flexible liquid epoxy resin.

(6) In this application, silicon dioxide is used as an inorganic filler, mainly used to reduce the internal stress and thermal expansion coefficient of the material system; spherical silicon dioxide micropowder is preferred for the silicon dioxide.

(7) In this application, aliphatic polyurethane acrylate, phenoxy resin, flexible liquid epoxy resin, and bisphenol F epoxy resin are resin matrix, in which aliphatic polyurethane acrylate and flexible liquid epoxy resin are used to enhance flexibility, and flexible liquid epoxy resin can also reduce energy storage modulus; phenoxy resin is used to enhance adhesion. Aliphatic polyurethane acrylate can be selected from DH-3000B, DH-4000B and other aliphatic polyurethane acrylates on the market, preferably DH-4000B aliphatic polyurethane acrylate. JER1256 phenoxy resin can be selected as the phenoxy resin. Flexible liquid epoxy resin can be selected from the EXA-4850 series products (e.g., EXA-4850-150, EXA-4850-1000) and/or YX-7105 product on the market, preferably YX-7105 product, or both EXA-4850 series products and YX-7105 product. When selecting EXA-4850 series products, the preferred parameters are: epoxy equivalent: 350-450 g/eq, molecular weight: 700-900, viscosity: 25 C., 15,000-100,000 mPa.Math.s.

(8) The curing agent is used to cross-link with the epoxy resin at a certain temperature and under the action of the accelerant, so that the material system changes from a flowing state to a solid state. In this application, the curing agents of bisphenol F-based benzoxazine and dicyandiamide are selected simultaneously. The accelerant is used as a catalyst for the cross-linking reaction, which is mainly used to regulate the curing time and has no effect on the performance of the material system. The conventional accelerant can be chosen and added according to the conventional dosage. In some specific embodiments, imidazole accelerants such as 4,5-dihydroxymethyl-2-phenyl-1H-imidazole can be selected as the accelerant. Since aliphatic polyurethane acrylate is a photosensitive resin, a photoinitiator should also be added. The photoinitiator can be selected as a conventional photoinitiator matching the aliphatic polyurethane acrylate. The photoinitiator is used to trigger the photocuring of the aliphatic polyurethane acrylate under ultraviolet (UV) light. In the example of this application, the dosage of the accelerant is 0.7-0.8 parts by mass, and the dosage of the photoinitiator is 3 parts by mass.

(9) The preparation method of the high flexibility packaging film provided in the example of the application includes: taking and mixing each raw material according to parts by mass, grinding the mixed raw material into a gelatinous mass with a bead mill, obtaining the glue solution through vacuum defoaming, and coating the glue solution with a coating machine to obtain the packaging film of the application.

(10) Several examples and comparison examples are provided below. The raw materials used in the examples and comparison examples are as follows: Silicon dioxide: spherical silicon dioxide, D50 has a particle size of 0.6 microns; Aliphatic polyurethane acrylate: DH-3000B aliphatic polyurethane acrylate, average molecular weight 13,000-18,000, 60 C. viscosity 35,000-50,000 mPa.Math.s (millipascal.Math.second); DH-4000B aliphatic polyurethane acrylate, average molecular weight 13,000-18,000, 60 C. viscosity 120,000-150,000 mPa.Math.s; Phenoxy resin: JER1256, molecular weight 51,000; Flexible liquid epoxy resin: EXA-4850-150, epoxy equivalent: 450 g/eq, molecular weight: 900, viscosity: 25 C., 15,000 mPa.Math.s; YX-7105 (also known as super-tough liquid epoxy resin): epoxy equivalent: 487 g/eq, viscosity: 50 C., 6,200 mPa.Math.s; Bisphenol F epoxy resin: YD-8170, epoxy equivalent: 159 g/eq; Curing agent: bisphenol F-based benzoxazine CB4100; dicyandiamide; Photoinitiator: photoinitiator 184 is selected, main component: 1-hydroxycyclohexyl phenyl ketone; Accelerant: 4,5-dihydroxymethyl-2-phenyl-1H-imidazole.

(11) The formulations and performance parameters of the comparison examples and examples are shown in Tables 1-2 respectively. The testing methods for the various performance parameters of the comparison examples and examples are as follows:

(12) I. Film Tensile Strength and Elongation at Break:

(13) The film material with a size of 10 mm*50 mm was cut, that is, the sample strip; the light release film was torn off; both ends of the sample strip were glued with adhesive tape. The fixtures of the universal material testing machine were used to hold the adhesive tape at both ends, respectively, and the heavy release film was torn off to test the tensile strength and elongation at break of the film.

(14) II. Moisture Absorption Rate:

(15) The film material with a size of 50 mm*50 mm was cut and pasted on the silicon wafer, exposed to a UV lamp for 20 s, cured at 180 C. for 1 h, and then weighed. Then the silicon wafer was completely immersed vertically in a glass container containing 251 C. distilled water without bubbles on the surface or contacting the wall of the container. After 24 h of immersion, it was removed with a tweezer, the water on the surface of the film was absorbed with filter paper, followed by immediate weighing. The moisture absorption rate was calculated according to the weight before and after.

(16) III. Adhesion of Silicon Wafer:

(17) Two pieces of 3 mm*3 mm film material with a thickness of 25 m were pasted on the silicon wafer, first exposed to a UV lamp for 20 s, cured at 180 C. for 1 h, and then the shear bond strength was tested with a universal tensile testing machine.

(18) IV. Tensile Strength and Elongation at Break after Curing:

(19) The packaging film was first exposed to UV lamp for 20 s, and then cured at 180 C. for 1 h; the size of the sample made was 55 mm*10 mm*0.5 mm, and the sample was made into a dumbbell type. The fixtures of the universal material testing machine were respectively clamped at both ends, and the tensile strength and elongation at break were tested in the block stretch mode.

(20) TABLE-US-00001 TABLE 1 Raw material formulations in comparison examples comparison comparison comparison comparison comparison comparison comparison example example example example example example example 1 2 3 4 5 6 7 Silicon 10 10 15 15 20 20 20 dioxide DH-3000B 15 18 18 20 20 20 22 1256 / / 8 8 10 10 10 EXA-4850 10 10 10 9 9 8 8 8170 10 10 10 10 10 10 10 CB4100 10 8 10 10 10 10 10 DICY 5 6 6 6.5 6.5 6.5 6.5 184 2 2 2 2 2 2 3 4,5-Dihydroxy- 0.5 0.6 0.6 0.6 0.65 0.65 0.7 methyl-2- phenyl-1H- imidazole

(21) TABLE-US-00002 TABLE 2 Test values of performance parameters corresponding to comparison examples comparison comparison comparison comparison comparison comparison comparison example example example example example example example 1 2 3 4 5 6 7 Film tensile 1.8 MPa 1.8 MPa 2.1 MPa 2.1 MPa 2.4 MPa 2.3 MPa 2.4 MPa strength Film elongation 180% 185% 200% 220% 215% 215% 230% at break Tensile strength 18.5 MPa 19.0 MPa 23.0 MPa 23.2 MPa 25.0 MPa 25.5 MPa 25 MPa after curing Elongation at 18% 20% 20% 24% 24.5% 23% 26% break after curing Glass transition 105 C. 107 C. 112 C. 113 C. 119 C. 120 C. 123 C. temperature Tg Moisture 0.65% 0.60% 0.61% 0.56% 0.51% 0.45% 0.44% absorption rate Adhesion of 7.2 MPa 7.2 MPa 7.6 MPa 7.5 MPa 8.0 MPa 8.0 MPa 8.7 MPa silicon wafer

(22) TABLE-US-00003 TABLE 3 Raw material formulations and test values of performance parameters in examples example example example example example example example example example 1 2 3 4 5 6 7 8 9 Silicon 20 20 20 20 22 22 22 24 24 dioxide DH-3000B 24 26 26 / / / / / / DH-4000B / / / 24 26 26 26 26 26 1256 12 12 15 12 12 15 15 15 15 EXA-4850 8 8 6 6 6 6 / / / YX-7105 / 5 5 / / / 5 5 8 8170 10 10 10 10 10 10 10 10 10 CB4100 10 10 10 10 10 10 10 10 10 DICY 7 7 7 7 8 8 9 9 9 184 3 3 3 3 3 3 3 3 3 4,5-Dihydroxy- 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.8 methyl-2- phenyl-1H- imidazole

(23) TABLE-US-00004 TABLE 4 Test values of performance parameters in examples example example example example example example example example example 1 2 3 4 5 6 7 8 9 Film tensile 2.8 2.8 3.0 3.2 3.6 3.8 4.2 4.6 4.5 strength (MPa) Film elongation 260 290 300 330 350 360 385 385 400 at break (%) Tensile strength 28.2 28.0 29.5 30.0 31.2 32.0 31.0 32.5 33.0 after curing (MPa) Elongation at 28 32 34 34 38 38 42 45 48 break after curing (%) Glass transition 121 122 122 135 136 136 137 140 142 temperature (Tg/ C.) Moisture 0.42 0.41 0.35 0.32 0.30 0.30 0.23 0.21 0.21 absorption rate (%) Adhesion of 11.5 12.3 13.0 14.6 15.8 18.2 16.8 17.0 16.5 silicon wafer (MPa)

(24) The above examples are intended only to clearly illustrate the examples made and are not intended to limit the implementations. For ordinary technical personnel in the field, other alterations or changes in different forms can be made on the basis of the above description, and it is not necessary and impossible to give an exhaustive list of all implementations, so the obvious changes or alterations that are extended are still within the scope of protection of the invention.