Break-wire conductor manufacturing methods
12246484 · 2025-03-11
Assignee
Inventors
- Maxime LAPALME (St-Lin-Laurentides, CA)
- Nicola PEDNEAULT PLOURDE (Saint-Jérôme, CA)
- Jocelyn LIRETTE (Mirabel, CA)
Cpc classification
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B29C64/106
PERFORMING OPERATIONS; TRANSPORTING
B29C64/118
PERFORMING OPERATIONS; TRANSPORTING
B29L2031/34
PERFORMING OPERATIONS; TRANSPORTING
B29C64/30
PERFORMING OPERATIONS; TRANSPORTING
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
B29C64/40
PERFORMING OPERATIONS; TRANSPORTING
International classification
B29C64/118
PERFORMING OPERATIONS; TRANSPORTING
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A method of producing an article of manufacture includes printing a break-wire conductive-material pattern via an additive-manufacturing process and applying the break-wire conductive-material pattern to a surface of a component. A shape of the break-wire conductive-material pattern fits the surface of the component.
Claims
1. A method of producing an article of manufacture, the method comprising in a sequential order of steps: three dimensional (3D) printing a break-wire conductive-material pattern on a dissolvable support material; dissolving the dissolvable support material on which the break-wire conductive-material pattern has been 3D printed to form the break-wire conductive-material pattern; applying a non-conductive barrier layer to a component; and applying the break-wire conductive-material pattern directly onto the non-conductive barrier layer on a surface of the component, thereby forming the article of manufacture; wherein a shape of the break-wire conductive-material pattern fits the surface of the component.
2. The method of claim 1, wherein the component is composed of a non-conductive material.
3. The method of claim 2, wherein the component comprises non-conductive plastic.
4. The method of claim 1, wherein the component is composed of a conductive material and the surface comprises the non-conductive barrier layer.
5. The method of claim 1, further comprising: 3D printing a second break-wire conductive-material pattern and dissolving a support material on which the second break-wire conductive-material pattern has been printed; applying the second break-wire conductive-material pattern to other surface portions of the component; and wherein the break-wire conductive-material pattern and the second break-wire conductive-material pattern do not overlap one another.
6. The method of claim 1, further comprising, before the applying the break-wire conductive-material pattern to the surface of the component, printing the component via an additive-manufacturing process.
7. A method of producing an article of manufacture, the method comprising in a sequential order of steps: three dimensional (3D) printing a break-wire conductive-material pattern on a dissolvable support material; dissolving the dissolvable support material on which the break-wire conductive-material pattern has been 3D printed to form the break-wire conductive-material pattern; applying the break-wire conductive-material pattern to a surface of a component, thereby forming the article of manufacture; 3D printing a second break-wire conductive-material pattern on a dissolvable support material; dissolving the dissolvable support material on which the second break-wire conductive-material pattern has been printed; and applying the second break-wire conductive-material pattern to other surface portions of the component; wherein the break-wire conductive-material pattern and the second break-wire conductive-material pattern do not overlap one another.
8. The method of claim 7, wherein a shape of the break-wire conductive-material pattern fits the surface of the component.
9. The method of claim 7, wherein a shape of the second break-wire conductive-material pattern fits the other surface portions of the component.
10. The method of claim 7, wherein the component is composed of a non-conductive material.
11. The method of claim 10, wherein the component comprises non-conductive plastic.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The disclosure is best understood from the following detailed description when read with the accompanying figures. It is emphasized that, in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of various features may be arbitrarily increased or reduced for clarity of discussion.
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DETAILED DESCRIPTION
(8) Various embodiments will now be described more fully with reference to the accompanying drawings. The disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Various embodiments discussed herein can be employed in a test environment or in parts and assemblies in use in the field and provide a less labor-intensive and more repeatable break-wire solution than prior approaches.
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(10) The print head 200 is fed with a conductive-material feed 202 that can be used to print break-wire conductive material and a support-material feed 204 that can be used to print a support material, the support material often being a substrate dissolvable, for example, in water. The break-wire conductive material can be used to print a break-wire conductive-material pattern that can be applied to an existing component or assembly.
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(15) The conductive-material feed 202 is used to print the break-wire conductive-material pattern 604 and a base-material feed 606 used to print the component 602, which components together form the assembly 600. As discussed above and although not illustrated in
(16) In a typical embodiment, the component 602 is composed of a non-conductive material such as, for example, a non-conductive plastic. In other embodiments, in the event the component 602 is made of a conductive base material, a third, non-conductive, material can be printed in a fashion to provide a barrier between the component 602 and the break-wire conductive-material pattern 604. It will be apparent that the approach illustrated in
(17) The term substantially is defined as largely but not necessarily wholly what is specified (and includes what is specified; e.g., substantially 90 degrees includes 90 degrees and substantially parallel includes parallel), as understood by a person of ordinary skill in the art. In any disclosed embodiment, the terms substantially, approximately, generally, and about may be substituted with within 10% of what is specified.
(18) Depending on the embodiment, certain acts, events, or functions of any of the algorithms described herein can be performed in a different sequence, can be added, merged, or left out altogether (e.g., not all described acts or events are necessary for the practice of the algorithms). Moreover, in certain embodiments, acts or events can be performed concurrently, e.g., through multi-threaded processing, interrupt processing, or multiple processors or processor cores or on other parallel architectures, rather than sequentially. Although certain computer-implemented tasks are described as being performed by a particular entity, other embodiments are possible in which these tasks are performed by a different entity.
(19) Conditional language used herein, such as, among others, can, might, may, e.g., and the like, unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments include, while other embodiments do not include, certain features, elements and/or states. Thus, such conditional language is not generally intended to imply that features, elements and/or states are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without author input or prompting, whether these features, elements and/or states are included or are to be performed in any particular embodiment.
(20) While the above detailed description has shown, described, and pointed out novel features as applied to various embodiments, it will be understood that various omissions, substitutions, and changes in the form and details of the devices or algorithms illustrated can be made without departing from the spirit of the disclosure. As will be recognized, the processes described herein can be embodied within a form that does not provide all of the features and benefits set forth herein, as some features can be used or practiced separately from others. The scope of protection is defined by the appended claims rather than by the foregoing description. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.