2D ANISOTROPIC BISMUTH MATERIALS AND METHOD FOR OBTAINING SAME USING COLLOIDAL SYNTHESIS
20250074786 · 2025-03-06
Assignee
Inventors
Cpc classification
B82Y40/00
PERFORMING OPERATIONS; TRANSPORTING
B22F2999/00
PERFORMING OPERATIONS; TRANSPORTING
C01G29/006
CHEMISTRY; METALLURGY
B22F9/24
PERFORMING OPERATIONS; TRANSPORTING
B22F9/24
PERFORMING OPERATIONS; TRANSPORTING
B82Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B22F2999/00
PERFORMING OPERATIONS; TRANSPORTING
C01P2002/72
CHEMISTRY; METALLURGY
International classification
Abstract
A 2D bismuth material, also called bismuthene, has a sandwich-like sheet structure with at least two outer layers formed by organic molecules containing sulphur atoms that form BiS bonds and at least one inner layer formed by a crystalline network of Bi(0) atoms. These materials are useful in electronic, optoelectronic, catalytic applications or in energy storage and transformation. Furthermore, a process produces this material from a bismuth salt that reacts with an amine and subsequently with a thiol by effect of the application of radiation and a subsequent reduction. This process has a colloidal approach to producing Bi(0) crystals based on a photocatalytic reduction of a soluble Bi(III) organometallic complex leading to the generation of the crystals.
Claims
1. A material comprising two-dimensional crystals of Bi(0) is formed by: at least two outer layers comprising organic molecules R.sub.2SH, with R.sub.2 being substituted linear or branched C.sub.1-C.sub.18 alkyl or substituted C.sub.5-C.sub.10 aryl, and at least one inner layer between the outer layers comprising metal Bi(0) atoms forming a crystal structure, wherein S atoms of the organic molecules R.sub.2SH of the outer layers are covalently bonded to the adjacent Bi(0) atoms of the inner layer and wherein said outer layers and said inner layer are arranged forming a sandwich-like sheet structure with anisotropic order on a stacking axis.
2. The material according to claim 1, wherein the outer layers have a thickness of between 0.5 to 3 nm.
3. The material according to claim 2, wherein the outer layers have a thickness of 1.5 nm.
4. The material according to claim 1, wherein the inner layer has a thickness of between 5 to 10 nm.
5. The material according to claim 4, wherein the inner layer has a thickness of 7 nm.
6. The material according to claim 1, wherein the Bi(0) of the inner layer has a rhombohedral crystal structure (PDF 44-1246).
7. The material according to claim 1, wherein said material forms crystals of hexagonal morphology.
8. The material according to claim 7, wherein the crystals have a diameter greater than 1,000 nm.
9. The material according to any claim 1, wherein the crystals have a thickness of less than 20 nm.
10. The material according to claim 1, wherein the crystals have an aspect ratio greater than 500.
11. The material according to claim 1, wherein the outer layers are functionalised with sulphur atoms that form BiS bonds and the inner layer is rhombohedral bismuth.
12. A process for producing the material according to claim 1, which comprises the following stages: a) preparing a solution of a bismuth salt with the following formula:
[R.sub.1COO.sup.]Bi.sup.3+ (I) wherein R.sub.1 is a linear or branched C.sub.1-C.sub.18 alkyl, in an organic solvent with the following formula:
CH.sub.3(CH.sub.2).sub.mCHCH.sub.2 (II) where m is an integer value selected from 1 to 20, and add an amine with the following formula:
NH.sub.2(CH.sub.2).sub.n1CHCH(CH.sub.2).sub.n2CH.sub.3 (III) where n1 and n2 are integer values independently selected from between 1 and 10, b) increasing the temperature of the reaction mixture obtained in (a) to a temperature of between 150-250 C., subjecting to vacuum and applying radiation with a wavelength of between 430 and 530 nm, c) breaking the vacuum of the reaction medium of (b) by the introduction of an inert gas, d) adding to the reaction mixture a reducing agent with the following formula:
R.sub.2SH (IV) wherein R.sub.2 is selected from substituted linear or branched C.sub.1-C.sub.18 alkyl or substituted C.sub.5-C.sub.10 aryl, e) stopping the reaction and separating the product obtained.
13. The process according to claim 12, wherein R.sub.1 in the bismuth salt of formula (I) is a linear or branched C.sub.8 alkyl.
14. The process according to claim 13, wherein the bismuth salt of formula (I) is as follows: ##STR00004##
15. The process according to claim 12, wherein m in the organic solvent of formula (II) is an integer value selected from 10 to 18.
16. The process according to claim 1, wherein the organic solvent of formula (II) is the following:
CH.sub.3(CH.sub.2).sub.15CHCH.sub.2
17. The process according to claim 12, wherein n1 and n2 in the amine of formula (III) are an integer value independently selected from between 5 and 8.
18. The process according to claim 1, wherein the amine of formula (III) is the following: ##STR00005##
19. The process according to claim 12, wherein the temperature in step (b) is 200 C.
20. The process according to claim 12, wherein the radiation of step (b) is applied for a time of between 10 and 30 minutes.
21. The process according to claim 12, wherein the inert gas of step (c) is a non-oxidising gas.
22. The process according to claim 12, wherein R.sub.2 in the reducing agent of formula (IV) is selected from a linear C.sub.8-C.sub.12 alkyl or a phenyl.
23. The process according to claim 1, wherein the reducing agent of formula (IV) is selected from dodecanethiol or thiophenol.
24. The process according to claim 12, wherein the reaction is stopped in step (e) by suddenly reducing the temperature of the mixture obtained in (d).
25. The process according to claim 12, wherein the product is separated in step (e) by centrifugation or filtration.
26. A method of using the material according to claim 1, comprising storing or generating energy.
27. A method of using the material according to claim 1, comprising catalysis.
28. A method of using the material according to claim 1, comprising applying in photonics.
Description
BRIEF DESCRIPTION OF THE FIGURES
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EXAMPLES OF THE INVENTION
Example 1: Synthesis of Bi2D
[0063] In this process, a soluble organic precursor of Bi(III) was reduced under the influence of light and temperature, using dodecanethiol as a reducing agent. The obtained material was separated from the reaction mixture by centrifugation and washed with chloroform.
[0064] As a first step, a stock solution of 100 mM bismuth neodecanate (BiNeo) in 1-octadecene (ODE) was prepared by dissolving 3.614 g BiNeo in 25 mL ODE. In the particular case of colloidal synthesis, 125 mol (1.25 mL) of this solution were pipetted and placed in a 50 mL two-necked flask. Subsequently, 22.22 mL of ODE and 1.235 mL of oleylamine (3.75 mmol, 30 eq.) were added. The system was subjected to vacuum, while being heated in oil bath (200 C.) under constant magnetic stirring (400 RPM) and continuously illuminated using an LED lamp. After 13 minutes of degassing, it was changed to argon atmosphere, while the reaction mixture remained at 200 C. for a further 2 minutes. Through a septum, and using a syringe, 0.3 mL (1.25 mmol, 10 eq.) of dodecanethiol (DDT) was injected. The resulting mixture was allowed to react for 30-40 seconds. Upon addition of DDT, the reaction mixture immediately turned yellow, indicating formation of Bi-DDT. The organometallic complex of Bi(III) was photochemically reduced to Bi(0) while DDT was oxidised to disulfide. The reduction of Bi(III) to Bi(0), and consequently the end of the reaction, was confirmed by the appearance of a black colour (see colour evolution in the scheme of
[0065] After separation of the 2D crystals of Bi(0), the solid was redispersed in chloroform and washed by centrifugation 3 times (10 k RPM, 10 minutes). In this way, we sought to exchange the remaining ODE with chloroform, thus allowing the solid to dry more easily.
[0066] The final product was allowed to dry in the dry box, or stored as a suspension in chloroform, to be used in subsequent characterisations. In the case of microscopies, the suspensions were sonicated before use (TEM, SEM, AFM, Raman), while in other assays the final dry solid was used (PXRD, TGA).
TABLE-US-00001 TABLE 1 Chemical reagents, molecular formulas and codes. Name Formula Code Bismuth neodecanoate Bi(C.sub.10H.sub.19O.sub.2).sub.3 Bi(neo).sub.3 Bismuth Bi(C.sub.12H.sub.25S).sub.3 Bi(C.sub.12S).sub.3 dodecanethiolate Dodecanethiol C.sub.12H.sub.25SH C.sub.12SH Dodecyldisulfide (C.sub.12H.sub.25S).sub.2 (C.sub.12S).sub.2 Oleylamine C.sub.18H.sub.35NH.sub.2 C.sub.18NH.sub.2 Octadecene C.sub.18H.sub.36 C.sub.18 Note: Bismuth dodecanethiolate is the organometallic complex of Bi(III) referred to throughout the text.
Example 2: Characterisation of 2D Bismuth Crystals
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[0068] The organometallic complex Bi-DDT was identified as the active species (precursor) in the reduction reaction from Bi(III) to Bi(0), which can be monitored even at room temperature (see Example 3 below). In
[0069] Taking into account the behaviour at room temperature, the dependence of the reaction rate and the resulting morphology on both the light intensity and the reaction temperature was also evaluated. The results are shown in
[0070] As can be seen in
[0071] After this analysis, the parameters 200 C. and 2000 lm were chosen as the optimised synthetic conditions.
[0072] STEM-EDS mappings reveal the elemental composition of the hexagonal crystals of Bi(0) with a small amount of sulphur (S) on the surface.
[0073] XPS measurements confirm the presence of sulphur on the surface of the Bi crystals.
[0074] Analogous to the case of EDS measurements, the energies of Bi 4f and S 2p overlap, preventing an unequivocal characterisation of the surface chemistry of the crystals (
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Example 3: Surface Chemistry
[0076] In particular, more detailed research was performed using spectroscopic techniques, namely XPS and STEM-EDS in combination with Raman spectroscopy. In
[0077] From the EDS it follows that Bi and S are equally distributed, while the oxygen and carbon signal can be clearly correlated with the underlying support film of the TEM. As shown in the inset of
[0078] Under vacuum conditions in the XPS, a brief sputtering of Ar (30 s) was performed to remove this coating layer with the result shown in
[0079] The combination of surface sensitive XPS and spatially resolved EDS thus allows concluding the equally distributed surface coating with the protective sulphur species which, while separating Bi from environmental degradation, can be easily removed by ion beam sputtering.
[0080] Finally, a cross-sectional inspection of the hexagonal microparticles has been performed to unequivocally demonstrate the sulphur-based protective layer.
[0081] Further analysis of this sandwich structure was performed by electron diffraction (ED).
Example 4: Surface Plasmon Modes
[0082] After clarifying the functionalisation/protection of the surface by spectroscopic techniques, monochromatic and aberration-corrected STEM-EELS spectrum images were used to investigate the plasmonic behaviour of the material in the low energy loss regime. Electronic excitations in unoccupied orbitals are usually probed in the EELS. Here the low-energy region of the material was investigated. The observed low energy modes can give access to phononic modes (<1 eV), localised surface plasmon resonances (1-10 eV), as well as volume plasmon modes (20-50 eV). These optical modes indicative of a metal surface are especially interesting for photonics and catalysis.
[0083] The observation of localised surface plasmons is a proof of the high quality of the surface, usually the quality of the plasmonic emission in bismuth systems is deteriorated by the accumulation of defects and distortions in the crystalline order. As shown in
[0084] This exceptional quality of the material allows viewing different plasmonic modes in an energy range below 10 eV.
[0085] Specifically, four different plasmonic modes could be displayed at the indicated energies. Comparison with the simulated results reveals an excellent match of the localisation near the surfaces. To extract the localised EELS spectra, a logarithmic Fourier deconvolution and a subsequent subtraction of the vacuum-acquired deconvoluted ZLP were performed.
Description of the Methodology in the Measurements:
Electron Microscopy:
[0086] Transmission (scanning) electron microscopy and diffraction have been carried out on Bi(0) crystals placed on TEM sample holders covered with a lacey carbon film of a CHCl.sub.3 solution. A JEOL-ARM200F was used for the AC-HRSTEM, operated at 200 kV. TEM and ED measurements were carried out using a Tecnai F20 (200 kV) or a JEOL JEM1010 (100 kV). EDXS mappings were recorded on a Fei Titan Themis300 (300 kV). Scanning Electron Microscopy data were acquired on a Hitachi S4800 FEG, operated at 10 kV. The samples for the AFM, SEM and Raman measurements were prepared by pouring a Bi(0) solution onto silicon wafers with a standard silicon oxide layer and allowing the CHCl.sub.3 to evaporate.
Atomic Force Microscopy:
[0087] Atomic force microscopy was carried out using a Veeco Nanoscope IVa, operated in Si cantilever strike mode.
Raman Spectroscopy:
[0088] Raman spectroscopic measurements were performed with a Horiba LabRam HR Evolution, using a HeNe laser (632.8 nm) with a final power of 7.6 W and a 100 objective (NA 0.9).
Powder X-Ray Diffraction:
[0089] Powder X-ray diffraction (PXRD) patterns were obtained using a PANalytical Empyrean X-ray platform with a capillary platform (diameter: 0.7 mm) and copper radiation (Cu K=1.541 78 ). Measurements were made in triplicate in the 2-theta 2-70 range using a step size of 0.02/step with an integration time of 1 s.
X-Ray Photoelectron Spectroscopy (XPS):
[0090] XPS measurements were recorded on a Thermo Scientific K-Alpha X-ray Photoelectron Spectrometer. Al K X-ray radiation was used as the X-ray source. For all elements, more than 100 spectra were recorded using a 0.1 eV step with a focused point greater than 400 m. XPS data were analysed with Thermo Avantage v5.9912 software.
FIB Cross Section:
[0091] The FIB was carried out with a FEI Helios G4 dual-beam FIB-SEM. A representative crystallite was chosen for the cross-section and a protective layer of Pt was deposited over the crystallite. Two trenches were then cut into the silicon substrate with 30 kV Ga ions. The sheet was attached to the needle of a micromanipulator and lifted from the silicon wafer and welded to an Omniprobe copper grid using Pt. Then, the sheet was thinned until reaching electronic transparency (thickness of about 80 nm) with Ga ions. The foil sample was then investigated on a Philips CM200 FEG TEM, operated at 200 kV.