Abstract
A component carrier having: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, a component provided in and/or on the stack, said component comprising at least one electrically conductive surface connected to an electrically conductive connecting element, said connecting element extending from said electrically conductive surface away from the stack and configured to be connected to at least one external component to be mounted on the component carrier when at least one connecting surface provided in/on the external component is faced to the electrically conductive surface of the component, wherein the connecting element is made of a heterogeneous conductive structure that is arranged to permanently compensate for a relative movement between said electrically conductive surface of the component and said connecting surface of the external component. Also provided is a package using such component carrier.
Claims
1. A component carrier comprising: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, a component provided in and/or on the stack, said component comprising at least one electrically conductive surface connected to an electrically conductive connecting element, said connecting element extending from said electrically conductive surface away from the stack and configured to be connected to at least one external component to be mounted on the component carrier when at least one connecting surface provided in/on the external component is faced to the electrically conductive surface of the component, wherein the connecting element is made of a heterogeneous conductive structure that is arranged to permanently compensate for a relative movement between said electrically conductive surface of the component and said connecting surface of the external component.
2. The component carrier according to claim 1, wherein the heterogeneous structure of the connecting element comprises a solid electrically conductive material with voids inside.
3. The component carrier according to claim 1, wherein the heterogeneous structure comprises a plurality of electrically conductive nanowires spaced apart from each other, connected to the electrically conductive surface and extending away from the stack.
4. The component carrier according to claim 1, wherein the heterogeneous structure comprises an electrically conductive porous material connected to the electrically conductive surface.
5. The component carrier according to claim 1, wherein the heterogeneous structure comprises a liquid metal structure connected to the electrically conductive surface.
6. The component carrier according to claim 1, wherein the heterogeneous structure comprises a solder bump with rubber particles inside.
7. The component carrier according to claim wherein the stack comprises at least one exposed electrically conductive surface on the main surface where the component is exposed, said at least one exposed electrically conductive surface being connected to an external conductive structure extending from the at least one exposed electrically conductive surface and configured to expose a surface at a higher vertical level than that of the at least one exposed electrically conductive surface.
8. The component carrier according to claim 1, wherein a damping structure is provided between the component and the stack.
9. A package, comprising: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, a component provided in and/or on the stack, said component comprising at least one electrically conductive surface, at least one external component, said external component comprising at least one connecting surface, wherein said component and said at least one external component are electrically connected to each other, with the at least one electrically conductive surface of the component and the at least one connecting surface of the external component facing each other, by at least one connecting element, wherein the at least one connecting element is made of a heterogeneous conductive structure that is arranged to permanently compensate for a relative movement between said electrically conductive surface of the component and said connecting surface of the external component.
10. The package according to claim 9, wherein the connecting element comprises: a first element connected to the at least one electrically conductive surface of the component, and a second element connected to the at least one connecting surface of the external component, wherein the first element and second element are connected to each other providing the electrical connection between the at least one electrically conductive surface of the component with the at least one connecting surface of the external component.
11. The package according to claim 10, wherein the first element and the second element are connected to each other through their mutual frontal contact, preferably, said frontal contact is provided by the extremity of each element opposed to the extremity in contact/associated with the at least one electrically conductive surface of the component or the at least one connecting surface of the external component.
12. The package according to claim 11, wherein the heterogeneous structure comprises a plurality of electrically conductive nanowires distanced spaced apart to each other, one group connected to the electrically conductive surface of the stack and extended extending away from the stack and the other group connected to the electrically conductive surface of the external component, with the opposing groups being connected one to each other by the at least partial intertangle of the nanowires of the opposing groups.
13. The package according to claim 9, wherein the connecting element and/or the first element and/or the second element is deformed at the contact portion with the respective at least one electrically conductive surface or at least one connecting surface or the opposing first or second element.
14. The package according to claim 9, wherein the connecting element and/or the first element and/or the second element are at least partially covered by a protecting material.
15. The package according to claim 9, wherein the component is configured to be connected to at least two external components.
16. The package according to claim 15, wherein the component has a bridge function.
17. The component carrier according to claim 3, wherein each one of said plurality of nanowires is connected to and/or bonded to and/or monolithically merged from the electrically conductive surface.
18. The package according to claim 11, wherein said frontal contact is provided by the extremity of each element opposed to the extremity in contact/associated with the at least one electrically conductive surface of the component or the at least one connecting surface of the external component.
Description
[0058] Embodiments of the present invention are now described with reference to the accompanying drawings. The invention is not limited to the illustrated or described embodiments.
[0059] FIG. 1 Shows a prior art arrangement
[0060] FIG. 2 Shows a schematic side view of a first embodiment of a package with a component carrier according to the invention
[0061] FIG. 3 Shows a schematic side view of a second embodiment of a package with a component carrier according to the invention
[0062] FIG. 4 Shows a schematic side view of a third embodiment of a package with a component carrier according to the invention
[0063] FIG. 5 Shows a schematic side view of a fourth embodiment of a package with a component carrier according to the invention
[0064] FIG. 6 Shows a schematic side view of a fifth embodiment of a package with a component carrier according to the invention
[0065] FIG. 7 Shows a schematic side view of a sixth embodiment of a package with a component carrier according to the invention
[0066] FIG. 8 Shows a schematic side view of a seventh embodiment of a package with a component carrier according to the invention
[0067] FIG. 9 Shows a schematic side view of an eighth embodiment of a package with a component carrier according to the invention
[0068] FIG. 10 Shows a schematic side view of a ninth embodiment of a package with a component carrier according to the invention
[0069] FIG. 11 Shows a schematic side view of a tenth embodiment of a package with a component carrier according to the invention
[0070] FIG. 12 Shows a schematic side view of an eleventh embodiment of a package with a component carrier according to the invention
[0071] FIG. 13 Shows a schematic side view of an embodiment similar to FIG. 12, with an external component tilted with respect to the component carrier
[0072] FIG. 14 Shows a schematic view of an embodiment similar to FIG. 3, with an external component misaligned with respect to the component carrier in x- and/or y-direction
[0073] FIG. 15 Shows a schematic view of an embodiment similar to FIG. 4, with an encapsulant not completely filling a recess in the component carrier
[0074] FIG. 16 Shows a microscopic picture of intertangled nanowires
DETAILED DESCRIPTION OF EMBODIMENTS OF THE PRESENT INVENTION
[0075] FIG. 1 shows a package according to the prior art. A circuit board 1 is provided with solder balls 2 on one of its surfaces. A package substrate 3 is mounted on and electrically connected by the solder balls 2 and provides two recesses, in which bridges 4 are counter-sunk and positioned for electrically connecting top mounted components. These bridges 4 are in principle tiny pieces of silicon with ultra-high routing layers that connect for instance the transceiver dies 5 and at least one further chip 6 to another, for instance in the IC package. The electrically conductive connections are achieved by solder bumps 7. Standard package traces 8 are provided in the package substrate 3 and a package lid 9 covers and protects the above-mentioned elements.
[0076] The invention proposes now a newly designed component carrier, a first embodiment of which is shown schematically in FIG. 2. This component carrier comprises a stack 10 comprising a plurality of electrically conductive layer structures 11 and at least one electrically insulating layer structure 12. The plurality of electrically conductive structures may be electrically connected by common means like laser or mechanical vias (not shown). Further, a component 13 is provided in a recess in the stack 10 and/or on the surface of the stack 10, in particular on the surface of the insulating layer structure 12. In this example, the electrically insulating layer structure 12 is located/sandwiched between two electrically conductive layer structures 11, in particular having direct contact with each of the two electrically conductive layer structures 11.
[0077] The component 13 comprises at least one electrically conductive surface 14, e.g. a pad or any other electrically conductive surface portion of the component 13, connected to an electrically conductive connecting element 15, which is extending from said electrically conductive surface 14 away from the stack 10, i.e. away also from the surface of the electrically insulating layer structure 12. Said electrically conductive surface 14 may be a portion of a wider conductive surface or may be a pad, optionally with a metal bump connected to said pad. In this example, the component 13 is located such, that the exposed surface of the component 13, which in the embodiment of FIG. 5 and FIG. 6, is the electrically conductive surface 14, is not on the same level regarding stack thickness direction compared with the exposed surface of the stack 10, which exposed surface is defined by the level of the conductive layer structures 11. In particular, the exposed surface of the component 13 is intended below the level regarding stack thickness direction of the exposed surface stack. Alternatively, the exposed surface of the component 13 is on the same level as the exposed surface of the stack 10 or protruding out of the exposed surface of the stack regarding stack thickness direction.
[0078] The connecting element 15 is configured to be connected to an external component 16, 17 to be mounted on the component carrier when at least one connecting surface 18, 19 provided in/on the external component 16, 17 is faced to the electrically conductive surface 14 of the component 13. In this position, electrically conductive structures 20 on the external components 16, 17 will also face the surface of the stack 10, in particular its electrically conductive layer structure 11. Structures 20 and structure 11 can be electrically connected by soldering, sintering, connection via a metal (copper pillar) or in any other suitable manner, symbolized in FIG. 2 by the solder bumps 29. As a (not shown) alternative, a solder material is also provided in the connecting element 15 in order to further strengthen the electrical connection.
[0079] As facing the at least one connecting surface 18, 19 provided in/on the external component 16, 17 to the electrically conductive surface 14 of the component 13 it is meant that the two surfaces are at least partially overlapped from a frontal view perpendicular to one of the main surfaces of the component carrier, meaning that along the stack thickness direction (z-direction) a portion, preferably the majority, of the two surfaces overlaps one to each other; in other words, at least a portion between the at least one connecting surface 18, 19 provided in/on the external component 16, 17 and the electrically conductive surface 14 of the component 13 are aligned along the thickness direction of the stack (z-direction) so that they can be electrically connected by the electrically conductive connecting element, the latter preferably extending along a vertical direction (perpendicular to one of the main surfaces of the component carrier). In addition, the external components 16, 17 may have connection pads or other electrically conducting structures on their sides other than that facing the component 13 or the stack 10, respectively, e.g. on the opposite site of the connecting surface.
[0080] After accomplishing the electrical and also mechanical connection between the stack 10 and the external components 16, 17, a package comprising these elements 10, 16, 17 is at least partially formed. The final package might also have a heat removal structure on top of the external components (not shown). Most preferred, the explanations above and in the following, referring to the electrical connection elements 15 and their specific construction and design also apply to the connection elements 22 of the external components 16, 17.
[0081] It should be mentioned that FIGS. 2 to 10, 14 and 15 showfor the sake of clarity of the graphical representation of all details, in particular for the connection portions of the connection elementsthe package comprising the above-explained structures in partly exploded state, i.e. the connection elements 15, 22 not yet physically and electrically in contact.
[0082] As can also be gathered from FIG. 2, each connecting element 15 is made of a heterogeneous conductive structure that is arranged to permanently compensate for a relative movement of said electrically conductive surface 14 of the component 13 and said connecting surface 18, 19 of the external component 16, 17 with the stack 10 of the component carrier.
[0083] Alternatively, at least one connection element 15 is made of a heterogeneous conductive structure, while the rest can be standard solder balls. Also a mixture of different kinds of heterogeneous structures is possible, e.g. the group of connection elements 15 consisting of nano wires and porous structures, of solder balls with rubber particles and nanowires, and so forth.
[0084] With these features, a reliable connection of the component 13, preferably a bridge, with the external components 16, 17 can be assured even in case of slight planar misalignment (relaxed to x-y and/or to z-tolerances), also compensating for CTE (coefficient of thermal expansion) mismatching. Further, there is a direct connection between the component 13 of the stack 10 and the external component 16, 17, with no need to embed the component anymore. At least, solder material can be avoided and potentially increase of the ICS-to-chip interconnection reliability is possible, as well as redundant connection between component 13 and external components 16, 17.
[0085] The connecting element 15, 22 may be permanently or at least temporarily deformable, where the deformation is at least one of a compression, elongation, shearing or bending. According to a first group of preferred embodiments of the invention, depicted in FIGS. 2 to 6, this can be accomplished by a heterogeneous structure comprising a plurality of electrically conductive nanowires 23, 24 preferably spaced apart one to each other and extending away from the stack 10 or the external component 16, 17, respectively. The nanowires 23 of the component 13 are connected to the electrically conductive surface 14 by end discs 25, and the nanowires 24 of the external components 16, 17 are connected to the conducting surfaces 18, 19 of these external components 16, 17 by end discs 26. Other than in the above-explained manner, each of said plurality of nanowires 23, 24 can be connected to and/or bonded to and/or monolithically merged from the electrically conductive surface 14, 18, 19. Nanowires have the advantage of giving a redundant connection, assuring the electrical connection even if some nanowires are broken. The connection between the external components 16, 17 and the stack 10 itself, in particular to the electrically conductive structures 11, can be provided in known manner by solder balls 29.
[0086] Most preferred, a damping structure 27, for instance an insulating material, preferably comprising a spongy structure, is provided between the component 13 and the stack 10. This allows a damped displacement of the component 13 and the external components 16, 17 connected thereto with respect to the stack 1. There may be provided free space between the sidewalls of the component 13 and the stack 1. This may have the advantage that the damping structure 27 can expand into this free space and/or can compensate the alignment misalignment between the component, the external component(s) and the component carrier as above and/or within the values above described Alternatively no free space provided and the damping structure 27 internally compensates the stresses (pressure or shear).
[0087] FIG. 3 shows a further embodiment of a stack respective a package according to the invention. While in the embodiment of FIG. 2 the component 13 is at least partially embedded in the stack 10, in particular exposing only at least a portion of the connecting element 15, the component 13 of FIG. 3 is at least partially exposed outside the stack 10.
[0088] FIG. 3 additionally shows that all electrical connections between the stack 10 and the external components 16, 17 could be realized by connection elements 15 and 22 comprising heterogenous structures 23, 24, respectively, with the most compensating arrangement possible. The front ends of the heterogenous structures, e.g. the nanowires 23 of the connecting elements 15 of the stack 10, can be at different levels along the stack thickness with respect to the connecting elements 15 of the component 13 of the stack 10, despite the fact that they could even be mounted on copper pillars 34, interposed between pads 38 and the nanowires 23 or any other heterogenous structure, like porous material, solder balls with rubber particles or the like. Other embodiments (not shown) provide ends of all connecting elements 15, 22 of the stack 10 and its component 13 arranged in one and the same plane along the stack thickness with the length of the copper pillars 34 compensating for all kinds of length differences of the heterogenous structures to create the same final level of the exposed extremities of e.g. the nanowires 23. As is understood, all of the above explanations regarding the length, build and positioning of the front ends of the connection elements apply in similar manner to the external components 16, 17.
[0089] Another possible embodiment regarding the arrangement of the component 13 with respect to the stack 10 is also shown in FIG. 3. In this possible arrangement, wherein the stack 10 comprises at least one exposed electrically conductive surface 11, 14 with e.g. a pillar structure like e.g. a copper pillar 34 on the main surface, where the component 13 is exposed, said at least one exposed electrically conductive surface being connected to an external conductive structure 22, 24 is at the same level in direction of the stack thickness than the electrically conducting surface structure of the component 13.
[0090] FIG. 4 shows a further embodiment, where the exposed sides of the component 13 are coated with an encapsulant 28 to protect the component 13. In the shown embodiment, the component 13 is inserted in a recess 39 provided in the stack 10. Accordingly, the encapsulant material 28 is provided in the recess 39 covering the component 13 and preferably also covering at least partially one surface of the connection elements 15. The material of the encapsulant 28 preferably fills the recess in the stack 10 completely, where the component 13 is inserted, with the upper surface of the encapsulant 28 preferably flushing with the one of the surfaces (preferably the external surface) of the surface of the electrically insulating structure 12 of the stack 10. Alternatively, the component may be only partially inserted in the recess or it can be externally provided with respect to the stack 10; depending of the position of the component with respect to the stack and the actual need to protect the (portions of the) component, the encapsulant may be exposed with respect to the stack 10 and/or may partially or fully fill the recess; in the preferred embodiment in which the encapsulant partially fills the recess, a step portion (see FIG. 15) corresponding to the edge of the recess may emerge from the encapsulant; according to this embodiment, the adhesion of an eventual dielectric material, such as an underfiller, is improved. The encapsulant 28 is preferably consisting of an electrically insulating material. Furthermore, it may comprise filler material. In an embodiment, the encapsulant 28 can also surround the contacting element, preferably abutting and/or at least partially penetrating to/into said contacting element; preferably, according to the shown embodiment of FIG. 4 the encapsulant material is in contact with the side walls of one extremity of at least an amount of the nano wires 23, in an extent depending of the nano wires dimensions and their distances as well as the encapsulant material properties, such as the viscosity in the liquid form. Alternatively the side walls of the nano wires may be free from encapsulant 28. Furthermore, the encapsulant 28 is preferably in direct contact with the damping structure 27 and both could be made of the same material, although in consideration of their different objectives different and task-optimized materials will be of advantage.
[0091] Below the damping structure 27 there could be provided an additional conductive structure (not shown) at the bottom of the recess in the electrically insulating structure 12 of the stack. Component 13 could also be electrically connected to such additional electrically conductive structure, which could be a copper layer.
[0092] Further, FIG. 4 shows that all other electrically conducting connections between the stack 10 and the external components 16, 17 can be provided by known solder connections, comprising solder bumps 29 between the conductive layer structure 11 of the stack 10 and the conductive layer structure 20 of the external components 16, 17. Again, other embodiments may be provided with at least one further connection structure between the components, as already explained above.
[0093] FIG. 5 shows the solution with solder bumps 29 even for an arrangement, where the component 13 is at least partially exposed and overtops the surface of the stack 10. As a further feature there may be a higher density of pads and/or smaller pad-size of the external components 16, 17 in the area of the component 13 forming a bridge for said external components 16, 17.
[0094] While the embodiments of FIGS. 2 to 5 all show the connecting elements each comprising two elements one at least partially frontally provided one to each other so that a mutual frontal contact is realized, FIG. 6 shows an embodiment where the connection elements 15 belonging to the stack 10 having the explained heterogenous structure are provided on one component only (such as the embodiments in FIG. 7); in other words, each connection element comprises one element only, interacting with a conductive surface of the opposed component during or after the connection of the two components; in the shown embodiment the nanowires 23, merging from the electrically conductive surface 14 of the component 13, abut in contact with for example pad-like connecting surfaces 18, 19 of the external components 16, 17.
[0095] Another possible embodiment regarding the arrangement of the component 13 with respect to the stack 10 is shown in FIG. 6. In this possible arrangement, wherein the stack 10 comprises at least one exposed electrically conductive surface 11 on the main surface of the electrically insulating structure 12 where the component 13 is exposed. The component 13 comprises at least one electrically conductive surface 14 facing the external components 16, 17 and connected to an electrically conductive connecting element 15, which is extending from said electrically conductive surface 14 away from the stack 1, i.e. away also from the surface of the electrically insulating layer structure 12. In this example, the component 13 is located such, that the exposed surface of the component 13, which in the embodiment of FIG. 5 and FIG. 6, is the electrically conductive surface 14, is not on the same level regarding stack thickness direction compared with the exposed surface of the stack 10, which exposed surface is defined by the level of the conductive layer structures 11. In particular, the exposed surface of the component 13 is intended below the level regarding stack thickness direction of the exposed surface stack. Alternatively, the exposed surface of the component 13 is on the same level as the exposed surface of the stack or protruding out of the exposed surface of the stack regarding stack thickness direction. Preferably, solder balls 21 might be placed within the heterogenous structure in order to further strengthen the connection between the stack 10 and the external components 16, 17.
[0096] FIG. 7 shows a further embodiment of the invention, with a still further possible version of connection elements 15. These are built with a solid electrically conductive material, for instance solder bumps 29, with voids inside, which are filled preferably with rubber particles 30, which can be of equal size and/or preferably also of same size as the voids. Also, other fillers for the voids in the solid material are possible, comprising or consisting of a resin and/or an elastomeric material and/or a liquid. The voids are preferably at least partially sealed one against each other. Such voids within the metal might limit the conductivity (still compared to pure copper, not to solder). Other embodiments can provide voids containing a gas, in particular air, or can be at least partly evacuated, said voids being preferably at least partially connected one to each other defining air passages. In every case of filler or not, the voids or at least a part of them can be open to the outside of the solid material and thereby affect the external roughness and/or the size of the surface area of the connecting element 15, 22.
[0097] The solder bumps 29 can have different sizes for the connection elements 15 of the component 13 and for the connection elements 35 of the stack 10 itself, to compensate for possible thickness differences as for instance in the embodiment shown in FIG. 7, where the surface of the component 13 lies above the level of the electrically conducting structures 11 of the stack 10, seen in stack thickness direction. Alternatively, if such differences in height are compensated by e.g. pillar structures (like the copper pillars 34 shown in FIG. 3) all solder bumps 29 of the package of the elements 10, 16, 17 can have the same size. Same size for all solder bumps 29 is also possible for components 13 embedded in recesses of the upper surface of the stack 10, with all electrically conductive structures 11, 25 of stack 10 and component 13 arranged in the same plane seen in stack thickness direction.
[0098] A still further embodiment of the invention is shown in FIG. 8, with the heterogeneous structure of the connection elements 15, 22 comprising an electrically conductive porous material 31 set on top of a copper pillar 34 and connected to the electrically conductive surface 14, e.g. a pad (not shown) or any other electrically conductive surface portion of the component 13. Such porous material 31 is also used in the embodiment of FIG. 9, where the porous material 31 is directly coupled to small pads on the surface of the component 13. In this embodiment, an extended version for a protection of the component 13 by an encapsulant material is shown. Not only the component 13 itself is covered and the recess in the stack 10 is filled by encapsulant material 28, but also at least part of the surface of stack 10, preferably the non-electrically conductive area of stack 10 is covered by a layer 32 of encapsulant material.
[0099] It must also be mentioned that the copper pillars 34 or every other pillar structure in every arrangement and on every component or layer structure may be embedded in the component 13 or any other component or layer structure.
[0100] This heterogeneous structure can comprise a liquid metal structure connected to the electrically conductive surface. As shown in the exemplary embodiment of FIG. 10, liquid metal portions 33 are set on top of copper pillars 34.
[0101] The present invention as explained in the preceding paragraphs can overcome the disadvantages of the prior art by a connection where the damping effect is obtained by the dimensions (nanowires) and/or the materials (other alternatives) of the contacting protruding elements.
[0102] As already resulting from the above description, the connecting element arrangement of a complete package 10, 16, 17 of a stack 10 of a component carrier and at least two external components 16, 17 comprises two further elements, a first element 15 connected to the at least one electrically conductive surface 14 of the component 13 and a second element 22 connected to the at least one connecting surface of the external components 16, 17, respectively. Said two elements 15, 22 being connected one to each other providing the electrical connection between the at least one electrically conductive surface 14 of the component 13 with the at least one connecting surface of the external component 16, 17. Preferred, the two elements 15, 22 are connected one to each other at their respective front-end sections, as can be best seen in FIG. 2.
[0103] Another embodiment according to the invention comprises two elements 15, 22 that are connected one to each other by the at least partial intertangle of the nanowires 23 of the first element 15 with the nanowires 24 of the second element 22, as shown in the microscopic picture of FIG. 16.
[0104] A still further embodiment comprises a connecting element 15 and/or a first element and/or a second element that is deformed at the contact portion with the respective at least one electrically conductive surface 14, 18, 19 or at least one connecting surface or the opposing first or second element. Preferred, the at least one electrically conductive surface 14 of the component 13 and the at least one connecting surface 18, 19 of the external components 16, 17 are solely connected one to each other by the connecting element, 15, 22.
[0105] According to a further embodiment of the invention, the connecting element 15, 22 and/or the first element and/or the second element advantageously may at least be partially covered by a protecting material, and/or an underfill structure 36 can be provided between the component 13 and at least one of the external components 16, 17, preferably between the complete stack 10 and all external components 16, 17.
[0106] FIG. 11 shows in exemplary manner an embodiment with a package 10, 16, 17 comprising a complete underfill between the components.
[0107] Another embodiment according to the invention is characterized in that the stack comprises at least one exposed electrically conductive surface on the main surface where the component is exposed, said at least one exposed electrical conductive surface being connected to an external conductive structure extending from the at least one exposed electrical conductive surface and configured to expose a surface at an higher vertical level than that of the at least one exposed electrical conductive surface.
[0108] The package 10, 16, 17 may also be further protected by a top mounted rigid lid (not shown) at the side of the stack 10 with the external components 16, 17, or alternatively, by an overmould structure 37 as shown in FIG. 12. Said overmould structure 37 may be made from the same material as the underfill structure 36 and could be made as a unitary structure combining underfill structure 36 and overmould structure 37. A further embodiment could comprise a surface finish with a material like tin or gold or a solder resist, either as an alternative to the overmould structure 37 or a lid, respectively, or in combination therewith.
[0109] FIG. 13 shows an embodiment that even if similar to that of FIG. 12, according to the present invention it can represent an example of a package having a misalignment between the component 13 and the connected external component 16; in particular, the component 13 and the external component 16 may be misaligned one to each other along the vertical direction (z-direction) of the component carrier, preferably resulting in one component inclined with respect to the other, for example having the upper surface of the component 13 inclined (not parallel) with respect to the bottom surface of the external component 16 and/or having their overall planar extension inclined one to each other; in the shown embodiment in which the component 13 is connected with two external components 16, 17 (i.e. having a bridge function), the lateral extensions of the external components and/or of the their respective electrically conductive surface 14 and connecting surfaces 18, 19 can be inclined one to each other; for all of these kinds of misalignment, the connection between the component and the external component(s) can be affected during their assembly and/or in the assembly state (where for example this misalignment can occur or can increase due to example to different CTEs of the used material for the layers/components). The compensation of this misalignment is provided by the respective connecting elements 15 that due to the own heterogeneous structure allow the connection with the respective frontal portion and/or conductive surface even if misaligned one to each other and/or to compensate eventual movement among the components in the assembled (working) condition for example due to the temperature variations along the time.
[0110] FIG. 14 shows a further kind of misalignment that in alternative or in addition to that shown in FIG. 13 can affect the connection between the component 13 with the external component(s) 16, 17 and/or can affect the respective integrity: the misalignment is preferably along the planar direction (x-y plane of the component carrier). Said misalignment can occur due to the wrong placement of one component with respect to the other and/or due to the tolerances between the electrically conductive surfaces 14 of the component and those of the connecting surfaces 18, 19 of the external component(s); this misalignment can occur during the assembly between the component 13 and the further component(s) 16, 17 or in the assembled (working) condition for example due to the temperature variations Such misalignment can very effectively be compensated with connecting elements 15, 22, 35 having at least one of the disclosed heterogeneous structure, for example the shown nanowires 23, 24 allowing the connection of a least one portion of said connecting element (i.e. a portion of said nanowires).
[0111] FIG. 15 shows an embodiment of a package with a stack 10 with a recess 39 to receive the component 13, a damping structure 27 and an encapsulant 28, similar to the embodiment depicted in FIG. 4. In the embodiment of FIG. 15, this encapsulant 28 does not fill completely the recess 39, resulting in a step between the upper surface of the encapsulant 28 and the upper surface of the stack 10as shown in detail 40 of FIG. 15corresponding to the recess edge; this edge can be used as an additional grasping element for an eventual underfill/insulating material provided between the component 13 and the external component(s) 16, 17, improving the contact surface of the underfill/insulating material with the stack 10.
LIST OF REFERENCE NUMERALS
[0112] 1 Circuit board [0113] 2 Package balls [0114] 3 Package substrate [0115] 4 Bridge [0116] 5 Die [0117] 6 Chip [0118] 7 Solder bumps [0119] 8 Traces [0120] 9 Package lid [0121] 10 Stack [0122] 11 Electrically conductive structure [0123] 12 Electrically insulating structure [0124] 13 Component [0125] 14 Conductive surface [0126] 15 Connecting element [0127] 16 External component [0128] 17 External component [0129] 18 Conductive surface [0130] 19 Conductive surface [0131] 20 Electrically conductive structure [0132] 21 Solder bump [0133] 22 Connecting element [0134] 23 Nanowires [0135] 24 Nanowires [0136] 25 Pad [0137] 26 Pad [0138] 27 Damping structure [0139] 28 Encapsulant [0140] 29 Solder bump [0141] 30 Rubber particles [0142] 31 Porous material [0143] 32 Encapsulant layer [0144] 33 Liquid metal [0145] 34 Copper pillar [0146] 35 Connecting element [0147] 36 Underfill structure [0148] 37 Overmould structure [0149] 38 Pad [0150] 39 Recess
