TEMPERATURE REGULATING DEVICE ASSEMBLY FOR A SEMICONDUCTOR LASER

Abstract

The present invention relates to an assembly of a temperature regulating device for a semiconductor laser.

The essence of the present invention is that a flat thermally conductive surface of said device is used as a thermally conductive base surface, the assembly further contains two fixing plates which are rigidly fastened to said thermally conductive base surface and adjoin the opposite lateral sides of a lower thermally insulated surface of a thermoelectric element, said surface being in contact with the thermally conductive base surface to prevent the longitudinal and transverse displacements of the thermoelectric element along the thermally conductive base surface, and a thermally conductive plate is rigidly fastened to the thermally conductive base surface and is thermally insulated therefrom.

Claims

1. An assembly of a temperature regulating device for a semiconductor laser, which comprises a thermally conductive base surface, which a thermally insulated surface of a thermoelectric element adjoins, the thermoelectric element consisting of two thermally insulated surfaces, between which a semiconducting layer consisting of a set of n-type and p-type semiconductors is disposed; a thermally conductive plate, at the opposite side whereof the semiconducting layer is rigidly fastened, adjoining the opposite thermally insulated surface of the thermoelectric element; said assembly comprising further at least one operating temperature sensor of the semiconductor laser, wherein, as the thermally conducting base surface, a flat thermally conducting surface of said device is used, the assembly further comprising two fixing plates, which are rigidly fastened to said thermally conducting base surface and adjoin opposite lateral sides of the lower thermally conducting surface of the thermoelectric element, which surface contacts to the thermally conducting surface base to prevent both longitudinal and transverse displacements of the thermoelectric element along the thermally conductive base surface, and the thermally conductive plate is rigidly fastened to the thermally conductive base surface and is thermally insulated therefrom.

2. The assembly as claimed in claim 1, wherein at least one of the fixing plates comprises two side projections, which adjoin the lateral sides of the lower thermally insulated surface of the thermoelectric element.

3. The assembly as claimed in claim 1, wherein the assembly further comprises a bearing pad rigidly fastened to the thermally conductive base surface; two projections are disposed at the upper surface of the bearing pad, between which projections a fiber optical output of the semiconductor laser is arranged, said output resting against the upper surface of the bearing pad.

4. The assembly as claimed in claim 3, wherein the assembly comprises a limiting clamp, which is secured at two projections arranged at the upper surface of the bearing pad.

5. The assembly as claimed in claim 1, wherein the thermoelectric element, the thermally conductive plate, and the semiconductor laser are secured with the help of fasteners.

Description

BRIEF DESCRIPTION OF THE APPENDED DRAWINGS

[0042] In the discussion of the embodiments of the present invention, narrow terminology is used. The present invention is not, however, limited by the accepted terms and it should be kept in mind that each and every such term covers all the equivalent solutions, which operate in a similar manner and are used to solve the same tasks.

[0043] The embodiments of the present invention will be now described in more detail with reference to the accompanying drawings, in which:

[0044] FIG. 1 is a perspective view with the temperature regulation assembly partly in section in accordance with the present invention;

[0045] FIG. 2 is an exploded view of the temperature regulating device assembly for a semiconductor laser in accordance with the present invention; and

[0046] FIG. 3 is a side view of the temperature regulating device assembly in accordance with the present invention.

LIST OF THE REFERENCE NUMERALS

[0047] 1 semiconductor laser

[0048] 1.sub.1 fiber optical output of the semiconductor laser 1

[0049] 1.sub.2 fastener of the semiconductor laser 1

[0050] 1.sub.3 wires to feed electric current to the semiconductor laser 1

[0051] 2 base of the temperature regulating assembly

[0052] 3 thermoelectric element

[0053] 3.sub.1 lower thermally insulated surface of the thermoelectric element 3, which contacts a thermally conductive base surface 5.

[0054] 3.sub.2 upper thermally insulated surface of the thermoelectric element 3, which contacts a thermally conductive plate 4

[0055] 3.sub.3 semiconducting layer of the thermoelectric element 3

[0056] 3.sub.4 wires to feed electric current to the semiconducting layer 3.sub.3 of the thermoelectric element 3

[0057] 4 thermally conductive plate

[0058] 4.sub.1 fastener of the thermally conductive plate 4 at the thermally conductive base surface 2

[0059] 5 thermally conductive base surface

[0060] 5.sub.1, 5.sub.2 fixing plates

[0061] 5.sub.3 fastener of the fixing plates 5.sub.1, 5.sub.2

[0062] 5.sub.4 side projections of the fixing plate 5.sub.1

[0063] 6 temperature sensor

[0064] 6.sub.1 fastener of the temperature sensor 6 at the thermally conductive plate 4

[0065] 7 bearing pad

[0066] 7.sub.1 upper surface of the bearing pad 7

[0067] 7.sub.2 projections of the bearing pad 7

[0068] 7.sub.3 limiting clamp

DETAILED DESCRIPTIONS OF PREFERRED EMBODIMENTS OF THE INVENTION

[0069] Referring now to FIG. 1, FIG. 2, FIG. 3 in which an assembly of a temperature regulating device for a semiconductor laser 1 is shown. The assembly of the temperature regulating device comprises a base 2 (in the figures, only a part of the base 2 is shown), at which a flat surface of a part of the device element is used as a thermally conductive base surface 5. The thermally conductive base surface 5 contacts to a lower thermally insulated surface 3.sub.1 of a thermoelectric element 3, which consists of two thermally insulated surfaces 3.sub.1 (lower) and 3.sub.2 (upper) between which a semiconducting layer 3.sub.3 consisting of a set of n-type and p-type semiconductors is disposed. Two wires 3.sub.4 are connected to the semiconducting layer 3.sub.3, to feed electric current. Also, two wires 1.sub.3 are connected to the semiconductor laser 1 to feed electric current.

[0070] Furthermore, fixing plates 5.sub.1, 5.sub.2 are rigidly fastened to the thermally conductive base surface 5 by means of fasteners 54. The fixing plates 5.sub.1, 5.sub.2 prevent the thermoelectric element 3 from being displaced longitudinally and transversely along the thermally conductive base surface 5 of the base 2.

[0071] The fixing plates 5.sub.1, 5.sub.2, adjoin, with their lateral sides, end faces of the lower thermally insulated surface 3.sub.1 which contacts the thermally conductive base surface 5. This makes it possible to insulate thermally the upper thermally insulated surface 3.sub.2 and lower thermally insulated surface 3.sub.1 from each other.

[0072] The fixing plate 5.sub.1 comprises side projections 5.sub.4 which adjoin end faces of the lower thermally insulated surface 3.sub.1 which contacts the thermally conductive base surface 5. The side projections 5.sub.4 of fixing plate 5.sub.1 improve the reliability of the attachment of the thermoelectric element 3 to the thermally conductive base surface 5 of the base 2.

[0073] The fixing plate 5.sub.2 is disposed between the wires 3.sub.4 of the semiconducting layer 3.sub.3 of the thermoelectric element 3. The fixing plate 5.sub.2 restricts also the movement of the wires 3.sub.4 where they are connected to the semiconducting layer 3.sub.3 of the thermoelectric element 3 this improving the reliability of both connection and operation of the thermoelectric element 3 this also constituting an advantage of the present invention.

[0074] The upper thermally insulated surface 3.sub.2 of the thermoelectric element 3 contacts to a thermally conductive plate 4 rigidly fastened by means of fasteners 4.sub.1 to the thermally conductive base surface 5 of the base 2. The thermally conductive plate 4 is thermally insulated from the thermally conductive base surface 5 through fasteners 4.sub.1 to prevent heat transfer from occurring between the thermally conductive base surface 5 the thermally conductive plate 4.

[0075] The fasteners 4.sub.1 restrict also both longitudinal and transverse displacements of the thermoelectric element 3 along the thermally conductive base surface 5.

[0076] The semiconductor laser 1 is rigidly fastened to the opposite surface of the thermally conductive plate 4 by means of fasteners 1.sub.2. Also, a temperature sensor 6 is rigidly fastened to the surface of the thermally conductive plate 4 by means of a fastener 6.sub.1.

[0077] Furthermore, a bearing pad 7 is rigidly fastened to the thermally conductive base surface 5. Disposed at an upper surface 7.sub.1 of the bearing pad 7 are two projections 7.sub.2, between which a fiber optical output 1.sub.1 of the semiconductor laser 1 is disposed the fiber optical output 1.sub.1 of the semiconductor laser 1 resting against the upper surface 7.sub.1 of the bearing pad 7. A limiting clamp 7.sub.3 is secured to the projections 72 of the bearing pad 7 and presses the fiber optical output 1.sub.1 to the upper surface 7.sub.1 of the bearing pad 7 this improving the reliability of connection of the fiber optical output 1.sub.1 to semiconductor laser 1 when exposed to external mechanical impacts and improving, as a whole, the efficiency of operation of the present invention.

[0078] The present invention is manufactured and used as follows. The base 2 of the assembly and the flat thermally conducting surface of the device are provided. The flat thermally conducting surface will be used as the thermally conductive base surface 5, at which the thermoelectric element 3 is placed. The thermally conductive plate 4 is installed at the thermoelectric element 3, and the locations for openings for the fasteners 4.sub.1 of the thermoelectric element 4 and for openings for the fastener 5.sub.4 for the fixing plates 5.sub.1, 5.sub.2 are determined.

[0079] In order to ensure a better thermal conductivity, a thermal paste-based thermally conductive layer (not shown in the figures) is formed at the thermally conductive base surface 5, at which layer the lower thermally insulated surface 3.sub.1 of the thermoelectric element 3 which surface contacts to the thermally conductive base surface 5 is disposed. The fixing plates 5.sub.1, 5.sub.2 are then installed, which plates prevent the thermoelectric element 3 from being displaced longitudinally and transversely along the thermally conductive base surface 5.

[0080] Then a thermal paste-based thermally conductive layer (not shown in the figures) is also formed at the opposite upper thermally insulated surface 3.sub.2 of the thermoelectric element 3 and then the thermally conductive plate 4 is installed at the upper thermally insulated surfaces 3.sub.2, which plate is rigidly fastened, by means of the fasteners 4.sub.1, to the thermally conductive base surface 5 and is thermally insulate therefrom. Then a thermal paste-based thermally conductive layer (not shown in the figures) is also formed at the opposite surface of the thermally conductive plate 4, and then the semiconductor laser 1 is installed at the thermally conductive plate 4 is rigidly fastened by means of the fasteners 4.sub.1 to the thermally conductive plate 4 with the temperature sensor 6 being also fastened thereto by means of the fastener 6.sub.1.

[0081] Thermal insulation of the thermally conductive base surface 5 through the fasteners 4.sub.1 may be accomplished either through making the fasteners 4.sub.1 of thermally insulated materials, such as low thermal conductivity plastics, or though using a sleeve made of thermally insulated materials said sleeve being installed onto the fastener 4.sub.1.

[0082] In addition, the bearing pad 7 is installed at the thermally conductive base surface 5, opposite to the fiber optical output 1.sub.1, with the semiconductor laser 1 being disposed at the upper surface 7.sub.1 of the bearing pad 7 between two projections 7.sub.2 thereof with the limiting clamp 7.sub.3 being installed at said projections.

[0083] The thermoelectric element 3, the semiconductor laser 1 are then connected via the wires 1.sub.3 and the temperature sensor 6 is connected via the wires 3.sub.4 to the respective systems of their power supply and operation control (not shown in the figures).

[0084] The assembly in accordance with the present invention operates as follows: electric current is fed to the semiconductor laser 1 and the thermoelectric element 3 via the wires 1.sub.3 and 3.sub.4, respectively. In the course of operation of the semiconductor laser 1, heat is produced (released) whose part is removed as result of the contact of the case of the semiconductor laser 1 to ambient air while the other part of heat is removed from the semiconductor laser 1 to the thermally conductive plate 4. A part of heat is removed from the thermally conductive plate 4 as a result of contact to ambient air while the other part of heat is removed from the thermally conductive plate 4 to the upper thermally insulated surface 3.sub.2 of the thermoelectric element 3. Heat from the lower thermally insulated surface 3.sub.1, of the thermoelectric element 3 is removed to the thermally conductive base surface 5 for which the flat thermally conducting surface of the base 2 is used. A part of heat is removed from the thermally conductive base surface 5 as a result of its contact to ambient air while the other part of heat is removed to the base 2, which is a component of the assembly and performs the function of a radiator. Due to thermal insulation of the thermally conductive plate 4 from the thermally conductive base surface 5through the fasteners 4.sub.1 heat may not be transferred from the thermally conductive base surface 5 to the thermally conductive plate 4. Temperature readings from the temperature sensor 6 come to the control system, which, based on the readings received, determines the electric current value supplied via the wires 3.sub.4 to the semiconducting layer 3.sub.3 of the thermoelectric element 3. As a result of regulating electric current supply to the semiconducting layer 3.sub.3, the difference of temperatures at the lower thermally insulated surface 3.sub.1 and the upper thermally insulated surface 3.sub.2 of the thermoelectric element 3 is regulated.

[0085] In order to replace the thermoelectric element 3, the thermally conductive plate 4 is disconnected from the thermally conductive base surface 5 by removing the fasteners 4.sub.1. The thermoelectric element 3 is then disconnected from the power supply and is removed from the thermally conductive base surface 2, and the thermoelectric element 3 is thereby replaced.

[0086] In order to replace the semiconductor laser 1, it is turned off and disconnected from the thermally conductive plate 3 by removing the fastener 1.sub.2. In addition, the present invention makes it possible to perform quickly the inspection and functionality test of the assembly parts this also constituting its advantage.

[0087] The present invention has a wide margin for temperature regulation, which ensures the maximum efficient operation of the semiconductor laser to ensure the spectral range required.

[0088] Furthermore, the advantages of the present invention include the possibility of its use for various configurations and powers of semiconductor lasers.

[0089] The present invention is not limited by the above described embodiments.

[0090] The above description contains particulars, which are necessary and sufficient for understanding clearly the essence of the present invention. Particulars, which are apparent to those skilled in the art, and those, which do not promote to a better understanding of the essence of the present invention, are omitted herein.

[0091] It will be also appreciated that templates of hole spacing at the thermally conductive base surface may be made to speed up installation.

[0092] It will be also appreciated that, in order to ensure thermal insulation, the fasteners may comprise additional thermally insulated pads, inserts made of a thermal insulating material.

[0093] It will be also appreciated that the fixing plates may be made of a thermal insulating material.

[0094] It will be also appreciated that adhesive compositions may be used as the fasteners.

[0095] It will be also appreciated that fiberglass, glass laminate, paper-based laminate, acryl, polyvinyl chloride, for example, may be used as thermal insulating materials.

[0096] It will be also appreciated that the fixing plates may rigidly fasten at least two thermoelectric elements to the thermally conductive base surface.

[0097] It will be also appreciated that the temperature sensor may, before turning on the semiconductor laser, determine the temperature of the thermally conductive plate and, if this temperature is beyond the allowable operation range of the semiconductor laser, electric current is fed to the thermoelectric element. In the event of negative temperatures of the thermally conductive plate, the polarity of electric current supply to the semiconducting layer of the thermoelectric element is also reversed and, as a result thereof, heat is released at the upper thermally insulated surface of the thermoelectric element to heat the thermally conductive plate till the achievement of predetermined temperatures for the efficient activation of the semiconductor laser, upon activation whereof the polarity of electric current supply to the thermoelectric element is reversed. Since the upper thermally insulated surface of the thermoelectric element and the thermally conductive plate are thermally insulated from each other, and from the thermally conductive base surface as well, the assembly in accordance with the present invention functions efficiently.

[0098] Technical Result

[0099] The technical result of the present invention is the improvement of the efficiency of temperature regulation for a semiconductor laser operating under exposure to external mechanical impacts along with simplifying the design, installation, and replacement of parts.