METHOD OF MANUFACTURING FLEXIBLE, LIGHTWEIGHT PHOTOVOLTAIC ARRAY
20170054046 ยท 2017-02-23
Assignee
Inventors
Cpc classification
H10F19/80
ELECTRICITY
H05K3/0058
ELECTRICITY
Y02P70/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y02E10/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H05K1/189
ELECTRICITY
H05K2201/10121
ELECTRICITY
H10F19/902
ELECTRICITY
H10F71/1375
ELECTRICITY
International classification
H01L31/05
ELECTRICITY
H05K3/30
ELECTRICITY
Abstract
A flexible, lightweight photovoltaic cell array includes one or more individual photovoltaic cell strings attached to a polyimide film substrate and covered with a polyvinyl fluoride film. Each photovoltaic cell string includes one or more photovoltaic cells attached to a flexible printed circuit board. The photovoltaic cell array may be manufactured by a method that includes bonding at least one photovoltaic cell to a flexible printed circuit board, mounting the flexible printed circuit board on a polyimide film substrate, and covering the flexible printed circuit board with a substantially transparent polyvinyl fluoride film.
Claims
1-17. (canceled)
18. A method of manufacturing a flexible photovoltaic array, the method comprising: obtaining a plurality of photovoltaic cells and a flexible printed circuit; applying a solder mask to areas of the photovoltaic cells and the flexible printed circuit on which solder is not desired; bonding the photovoltaic cells to the flexible printed circuit using a pick-and-place machine so that each photovoltaic cell is glued to the flexible printed circuit; running the flexible printed circuit and the photovoltaic cells through a wave of molten solder so that the solder wets metal surfaces not covered by the solder mask to form electrical connections between the photovoltaic cells and the flexible printed circuit; coating a first side of a polyimide film substrate with an adhesive; mounting the flexible printed circuit to the first side of a polyimide film substrate with the adhesive; and covering the flexible printed circuit with a substantially transparent film.
19. The method of claim 18, further comprising: coating a second side of the polyimide film substrate with a high-emissivity coating.
20. The method of claim 19, wherein coating the second side of the polyimide film substrate with the high-emissivity coating comprises coating the second side of the polyimide film substrate with high-emissivity paint.
21. The method of claim 18, further comprising: attaching a bladder sleeve to the first side of the polyimide film substrate; and covering the flexible printed circuit and the bladder sleeve with the substantially transparent film.
22. The method of claim 21, wherein attaching the bladder sleeve to the first side of the polyimide film substrate occurs prior to covering the flexible printed circuit and the bladder sleeve with the substantially transparent film.
23. The method of claim 18, wherein the polyimide film substrate is reinforced with aramid fibers
24. The method of claim 18, wherein covering the flexible printed circuit comprises covering the flexible printed circuit with a substantially transparent polyvinyl fluoride film.
25. The method of claim 18, further comprising mounting the film substrate directly to a surface of a spacecraft or an airplane.
26. A flexible photovoltaic array comprising: a flexible printed circuit and a plurality of photovoltaic cells, each photovoltaic cell being glued to the flexible printed circuit board; a solder mask applied to areas of the photovoltaic cells and the flexible printed circuit on which solder is not desired; a plurality of electrical connections between the photovoltaic cells and the flexible printed circuit, the electrical connections comprising solder wet to metal surfaces not covered by the solder mask; a polyimide film substrate having a first side, the first side of the polyimide film substrate being coated with an adhesive, the flexible printed circuit being mounted to the first side of a polyimide film substrate with the adhesive; and a substantially transparent film covering the flexible printed circuit.
27. The flexible photovoltaic array of claim 29, wherein: a second side of the polyimide film substrate is coated with a high-emissivity coating.
28. The flexible photovoltaic array of claim 27, wherein the high-emissivity coating is high-emissivity paint.
29. The flexible photovoltaic array of claim 26, further comprising: a bladder sleeve attached to the polyimide film substrate, wherein the substantially transparent film covers the flexible printed circuit and the bladder sleeve.
30. The flexible photovoltaic array of claim 26, wherein the polyimide film substrate is reinforced with aramid fibers.
31. The flexible photovoltaic array of claim 26, wherein the substantially transparent film is a polyvinyl fluoride film.
32. The flexible photovoltaic array of claim 26, wherein the polyimide film substrate is mounted directly to a surface of a spacecraft or an airplane.
33. A method of manufacturing a flexible photovoltaic array, the method comprising: applying a solder mask to areas of a flexible printed circuit and at least one photovoltaic cell on which solder is not desired; bonding the at least one photovoltaic cell to the flexible printed circuit using a pick-and-place machine so that the at least one photovoltaic cell is glued to the flexible printed circuit; running the flexible printed circuit with the at least one bonded photovoltaic cell through a wave of molten solder so that the solder wets metal surfaces not covered by the solder mask to form electrical connections between the at least one photovoltaic cell and the flexible printed circuit; mounting the flexible printed circuit on a first side of a polyimide film substrate; and covering the flexible printed circuit with a substantially transparent film.
34. The method of claim 33, further comprising: coating the first side of the polyimide film substrate with an adhesive; and coating a second side of the polyimide film substrate with a high-emissivity coating.
35. The method of claim 34, wherein coating the second side of the polyimide film substrate with the high-emissivity coating comprises coating the second side of the polyimide film substrate with high-emissivity paint.
36. The method of claim 33, further comprising: attaching a bladder sleeve to the first side of the polyimide film substrate; and covering the flexible printed circuit and the bladder sleeve with the substantially transparent film.
37. The method of claim 36, wherein attaching the bladder sleeve to the first side of the polyimide film substrate occurs before covering the flexible printed circuit and the bladder sleeve with the substantially transparent film.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The above and other features of the present invention, its nature and various advantages will be more apparent upon consideration of the following detailed description, taken in conjunction with the accompanying drawings, in which like reference characters represent like parts throughout and in which:
[0012]
[0013]
[0014]
[0015]
DETAILED DESCRIPTION
[0016] To provide an overall understanding of the invention, certain illustrative embodiments will now be described, including a flexible lightweight photovoltaic array and a method for manufacturing the photovoltaic array. However, it will be understood by one of ordinary skill in the art that the systems and methods described herein may be adapted and modified as is appropriate for the application being addressed and that the systems and methods described herein may be employed in other suitable applications, and that such other additions and modifications will not depart from the scope hereof.
[0017] Individual photovoltaic cells are connected in series so as to obtain a desired voltage, according to characteristics of the photovoltaic cells, to create photovoltaic cell strings. The photovoltaic cell strings are then connected in parallel so as to obtain a desired output capacity, thus creating a photovoltaic cell array.
[0018] Photovoltaic cells 100 may soldered to PCB 102 using, for example, wave soldering. A solder mask is applied to areas of the photovoltaic cells 100 and the PCB 102 on which solder is not desired. Photovoltaic cells 100 are then glued to PCB 102 using pick-and-place machines, and PCB 102 is then run through a wave of molten solder. The solder wets metal surfaces not coated with the solder mask to form electrical connections between the photovoltaic cells 100 and the PCB 102. The use of automated assembly equipment reduces labor costs and improves the rate at which photovoltaic cell strings are assembled.
[0019] The photovoltaic cells 100, within a photovoltaic cell string 104 are wired in series to generate a fixed voltage for each photovoltaic cell string 104. The number of photovoltaic cells 100 in a particular photovoltaic cell string 104 is determined by the voltage requirement of the specific application. Preferably, the return trace is routed on the mounting surface of the PCB 102. In at least one embodiment, PCB 102 is a multi-layer PCB, and the return trace is routed underneath the photovoltaic cell string to reduce the magnetic moment and the associated loop area. A multi-layer PCB also allows for proper separation, thus reducing breakdown potential between layers which would result in string loss.
[0020] In at least one embodiment, string blocking diodes (not shown) are also installed onto PCB 102 using automated assembly equipment. Blocking diodes are used to prevent current from flowing back into one or more photovoltaic cell strings 104 which are not exposed to sunlight (e.g., in shaded areas or at nighttime). Additionally, blocking diodes may be installed between photovoltaic array 200 and the battery (not shown). Once a photovoltaic cell string 104 is assembled, individual photovoltaic cell strings 104 are wired together in parallel to generate the necessary capacity, thus creating a photovoltaic array 200.
[0021]
[0022] Once the appropriate number of photovoltaic cell strings 104 are mounted to polyimide film substrate 106, the entire assembly including photovoltaic cell strings 104, film substrate 106 and bladder sleeve 110, may be covered with a substantially transparent film 108. Film 108 may be, for example, a polyvinyl fluoride film to provide abrasion resistance for photovoltaic cells 102 (
[0023]
[0024]
[0025] Photovoltaic cells (and blocking diodes) are soldered to the PCB using, for example, wave soldering. A solder mask is applied to areas of the photovoltaic cells 100 and the PCB 102 on which solder is not desired. Photovoltaic cells 100 (and blocking diodes) are then glued to PCB 102 using pick-and-place machines, and PCB 102 is then run through a wave of molten solder. The solder wets metal surfaces not coated with the solder mask to form electrical connections between the photovoltaic cells 100 and the PCB 102.
[0026] The flexible PCB including photovoltaic cells (and blocking diodes) may then be mounted on a polyimide film substrate (step 304). The polyimide film substrate may be, for example, a 1 mil sheet of polyimide film reinforced with aramid fibers.
[0027] The flexible PCB preferably is attached to the polyimide film substrate preferably using a silicone-based adhesive. In at least one embodiment, one or more wire harnesses and/or one or more inflatable bladder sleeves are also mounted on the polyimide film substrate using a silicone-based adhesive. The adhesive is applied to the front face of the polyimide film substrate, on which the flexible PCB, one or more wire harnesses, and/or one or more bladder sleeves are mounted. The back side of the polyimide film substrate may be coated with a high-emissivity coating (e.g., high-emissivity paint) to facilitate dissipation of waste heat. In step 306, the entire assembly including photovoltaic cells bonded to the flexible PCB, which is attached to the film substrate is encapsulated by a substantially transparent film. The substantially transparent film may be, for example, a polyvinyl fluoride film. The assembled photovoltaic array is suitable for mounting directly on a surface of, or being deployed from, a spacecraft or an airplane.
[0028] The invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The foregoing embodiments are therefore to be considered in all respects illustrative, rather than limiting of the invention. The present invention is limited only by the claims which follow.