Large diameter, high quality SiC single crystals, method and apparatus

Abstract

A method and system of forming large-diameter SiC single crystals suitable for fabricating high crystal quality SiC substrates of 100, 125, 150 and 200 mm in diameter are described. The SiC single crystals are grown by a seeded sublimation technique in the presence of a shallow radial temperature gradient. During SiC sublimation growth, a flux of SiC bearing vapors filtered from carbon particulates is substantially restricted to a central area of the surface of the seed crystal by a separation plate disposed between the seed crystal and a source of the SiC bearing vapors. The separation plate includes a first, substantially vapor-permeable part surrounded by a second, substantially non vapor-permeable part. The grown crystals have a flat or slightly convex growth interface. Large-diameter SiC wafers fabricated from the grown crystals exhibit low lattice curvature and low densities of crystal defects, such as stacking faults, inclusions, micropipes and dislocations.

Claims

1. A method of fabricating a SiC single crystal comprising: (a) sublimation growing a SiC single crystal on a surface of .Iadd.a .Iaddend.seed crystal in the presence of a temperature gradient; and (b) during step (a), controlling said temperature gradient such that a radial temperature gradient in the .Iadd.SiC single .Iaddend.crystal is positive and .[.substantially.]. shallow, and controlling a flux of SiC bearing vapors by .[.substantially.]. restricting said flux to a central area of the surface of the seed crystal .Iadd.via a separation plate disposed between the seed crystal and a source of the SiC bearing vapors, wherein the separation plate includes an outer flux permeable part surrounding an inner flux permeable part that is more permeable to the flux of SiC bearing vapors than the outer flux permeable part, wherein the central area of the surface of the seed crystal is between 30% and 60% of a total surface area of the seed crystal around a center of the seed crystal, wherein a ratio of mass transport of the SiC bearing vapors through 1 cm.sup.2 of area of the inner part of the separation plate versus the mass transport of the SiC bearing vapors through 1 cm.sup.2 of area of the outer part of the separation plate is no less than 50/1.Iaddend..

.[.2. The method of claim 1, wherein the central area of the surface of the seed crystal is between 30% and 60% of a total surface area of the seed crystal substantially around a center of the seed crystal..].

.[.3. The method of claim 1, wherein step (b) includes restricting the flux of SiC bearing vapors to the central area of the surface of the seed crystal via a separation plate disposed between the seed crystal and a source of the SiC bearing vapors..].

4. The method of claim .[.3.]. .Iadd.1.Iaddend., wherein: the separation plate is spaced .Iadd.from the seed crystal at a distance .Iaddend.between .[.about.]. 25% and 75% of .[.the seed.]. .Iadd.a .Iaddend.diameter .[.from.]. .Iadd.of .Iaddend.the seed crystal; and the separation plate has a thickness between .[.about.]. 4 mm and 10 mm.

5. The method of claim .[.3.]. .Iadd.1.Iaddend., wherein the separation plate is either not reactive to the SiC bearing vapors or includes a coating to avoid contact between the separation plate and the SiC bearing vapors.

.[.6. The method of claim 3, wherein the separation plate includes a first, outer part surrounding a second, inner part that is substantially more permeable to the SiC bearing vapors than the first, outer part..].

7. The method of claim .[.6.]. .Iadd.1.Iaddend., wherein: .[.the second, inner part of the separation plate comprises between 20% and 50% of a total area of the separation plate; or.]. the separation plate is made of graphite, .Iadd.or .Iaddend.a refractory compound.[., tantalum carbide, or niobium carbide; or a ratio of mass transport of the SiC bearing vapors through 1 cm.sup.2 of area of the inner part of the separation plate versus the mass transport of the SiC bearing vapors through 1 cm.sup.2 of area of the outer part of the separation plate is no less that about 50/1.]..Iadd.; and the inner part of the separation plate that is more permeable to the flux of SiC bearing vapors than the outer part comprises between 20% and 50% of a total area of the separation plate.Iaddend..

8. The method of claim .[.3.]. .Iadd.1.Iaddend., wherein the separation plate is configured to .[.substantially.]. remove particles from the flux of the SiC bearing vapors.

9. The method of claim 1, wherein step (a) further includes sublimation growing the SiC single crystal in the presence of .[.at least one of the following:.]. an isotherm that is convex in a direction facing .[.a.]. .Iadd.the .Iaddend.source of the SiC bearing vapors.[.; and?.]..Iadd., and .Iaddend.a radial temperature gradient of no more than .[.about.]. 10 K/cm.

10. The method of claim 9, wherein a difference in thickness between a center of the SiC single crystal and a diameter of the SiC single crystal in a growth direction of the SiC single crystal is no more than .[.about.]. 6 mm.

11. The method of claim 1, further including slicing from the grown SiC single crystal a wafer having .[.one or more of.]. the following: a combined area of stacking faults no more than .[.about.]. 5%, 2%, or 1% of a total area of the wafer; .[.or.]. .Iadd.and.Iaddend. a lattice curvature of no more than .[.about.]. 0.2, 0.1, or 0.06, over the total area of the wafer; .[.or.]. .Iadd.and.Iaddend. a full width at half maximum (FWHM) x-ray reflection of no more than .[.about.]. 50, 30, or 20 arc-seconds over the total area of the wafer; .[.or.]. .Iadd.and.Iaddend. a wafer-average micropipe density (MPD) of no more than .[.about 1/cm.sup.2.]. .Iadd.1 cm.sup.2.Iaddend., 0.2.[./cm.sup.2.]. .Iadd.cm.sup.2.Iaddend., or 0.1.[./cm.sup.2.]. .Iadd.cm.sup.2.Iaddend.; .[.or.]. .Iadd.and.Iaddend. a wafer-average dislocation density of no more than .[.about.]. 10,000 cm.sup.2, 5,000 cm.sup.2, or 1,000 cm.sup.2.

12. The method of claim 1, wherein the grown SiC single crystal has a diameter .[.between about 100 mm and 200 mm.]. .Iadd. sufficient for slicing wafers of 100, 125, 150 or 200 mm in diameter.Iaddend..

13. The method of claim 1, further including slicing from the grown SiC single crystal a wafer having .[.one or more of.]. the following: a wafer-average micropipe density no more than .[.about an average of 1/cm.]. .Iadd.1 cm.sup.2.Iaddend.; .[.or.]. .Iadd.and.Iaddend. a percentage of micropipe-free 2 .Iadd.mm.Iaddend.2 mm square dies extracted from the wafer of not less than .[.about.]. 95%; .[.or.]. .Iadd.and.Iaddend. a percentage of micropipe-free 5 .Iadd.mm.Iaddend.5 mm square dies extracted from the wafer of not less than .[.about.]. 90%; .[.or.]. .Iadd.and.Iaddend. a wafer-average density of dislocations not more than .[.about.]. 10.sup.4.[./cm.]. .Iadd.cm.sup.2.Iaddend.; .[.or.]. .Iadd.and.Iaddend. a density of threading screw dislocations of not more than .[.about.]. 1000.[./cm.]. .Iadd.cm.sup.2.Iaddend.; .[.or.]. .Iadd.and.Iaddend. a density of basal plane dislocations of not more than .[.about.]. 300 cm/cm.sup.3; .[.or.]. .Iadd.and.Iaddend. zero density of foreign polytype inclusions; .[.or.]. .Iadd.and.Iaddend. one or more .[.clouds of.]. .Iadd.wafer areas populated by .Iaddend.carbon inclusions of no more than .[.about.]. 5% of the total wafer area; .[.or.]. .Iadd.and.Iaddend. edge-to-edge lattice curvature no more .[.that about.]. .Iadd.than .Iaddend.0.15; .[.or.]. .Iadd.and.Iaddend. a full width at half maximum (FWHM) x-ray reflection of no more than .[.about.]. 25 arc-seconds over the total area of the wafer.

14. A SiC sublimation crystal growth system comprising; a growth crucible configured to be charged with SiC source material and a SiC seed crystal in spaced relation; and a separation plate separating the growth crucible into a source compartment where the SiC source material resides when the growth crucible is charged with the SiC source material and a crystallization compartment where the SiC seed crystal resides when the growth crucible is charged with the SiC seed crystal, wherein: .Iadd.the separation plate is spaced from both the SiC source material and the SiC seed crystal;.Iaddend. the separation plate includes a .[.first,.]. central part surrounded by .[.a second.]. .Iadd.an outer .Iaddend.part.Iadd., wherein the central part and outer part of the separation plate are both permeable to SiC bearing vapors originating from the SiC source material during sublimation growth of a SiC crystal on the SiC seed crystal;.Iaddend. .[.that.]. .Iadd.the central part of the separation plate has a higher permeability to the SiC bearing vapors originating from the SiC source material during sublimation growth of the SiC crystal on the SiC seed crystal than the outer part; the outer part of the separation plate .Iaddend.has a lower permeability to .Iadd.the .Iaddend.SiC bearing vapors originating from the SiC source material during sublimation growth of .[.a.]. .Iadd.the .Iaddend.SiC crystal on the SiC seed crystal than the .[.first,.]. central part; .[.and.]. .Iadd.the central part of the separation plate has an area between 20% and 50% of the total area of the separation plate; the separation plate is configured to restrict a flux of the SiC bearing vapors to a central area of the surface of the SiC seed crystal that is between 30% and 60% of a total surface area of the SiC seed crystal around a center of the SiC seed crystal; and.Iaddend. a ratio of mass transport of the SiC bearing vapors through the .[.inner.]. .Iadd.central .Iaddend.part of the separation plate versus mass transport of the SiC bearing vapors through the outer part of the separation plate is no less .[.that about.]. .Iadd.than .Iaddend.50/1.

15. The system of claim 14, wherein the separation plate is made from at least one of the following: graphite, .Iadd.or .Iaddend.a refractory compound.[., tantalum carbide, or niobium carbide.]..

16. The system of claim 14, wherein the separation plate is spaced from the SiC seed crystal at a distance between .[.about.]. 20 mm and 70 mm.

17. The system of claim 14, wherein the separation plate includes a coating of tantalum carbide, or niobium carbide, and the coating has a thickness between .[.about.]. 20 microns to 40 microns.

18. The system of claim 14, wherein the .[.first,.]. central part of the separation plate includes passages, each of which has a maximum diameter between .[.about.]. 0.1 mm and 1 mm.

19. A method of forming a high-quality SiC single crystal wafer comprising: sublimation growing on a SiC single crystal seed a SiC single crystal boule having a diameter sufficient for slicing wafers between 100 and 200 mm in diameter, wherein said sublimation growth occurs in the presence of controlled axial and radial temperature gradients and .Iadd.a .Iaddend.controlled flux of sublimated source material .Iadd.that is restricted, via a separation plate that is spaced from the source material and the SiC single crystal seed, to a central area of a surface of the SiC single crystal seed that is between 30% and 60% of a total surface area of the SiC single crystal seed around a center of the SiC single crystal seed, wherein the separation plate includes an outer flux permeable part surrounding an inner flux permeable part that is more permeable to the flux of sublimated source material than the outer flux permeable part, wherein a ratio of mass transport of the SiC bearing vapors through 1 cm.sup.2 of area of the inner part of the separation plate versus the mass transport of the SiC bearing vapors through 1 cm.sup.2 of area of the outer part of the separation plate is no less than 50/1.Iaddend.; and slicing from said SiC .Iadd.single crystal .Iaddend.boule a SiC .Iadd.single crystal .Iaddend.wafer having: a diameter between 100 and 200 mm .[.inclusive.].; .Iadd.and.Iaddend. a lattice curvature of no more than .[.about.]. 0.2, 0.1, or 0.06 over the total area of the wafer; and a full width at half maximum (FWHM) of .[.the.]. x-ray reflection of no more than .[.about.]. 50, 30, or 20 arc-seconds over the total area of the wafer.

20. The method of claim 19, wherein the SiC .Iadd.single crystal .Iaddend.wafer further includes a combined area of stacking faults no more than .[.about.]. 5%, 2%, or 1% of a total area of the .Iadd.SiC single crystal .Iaddend.wafer.

21. The method of claim 19, wherein the SiC .Iadd.single crystal .Iaddend.wafer further includes .[.at least one of.]. the following: a wafer-average micropipe density (MPD) of no more than .[.about.]. 1 cm.sup.2, 0.2 cm.sup.2, or 0.1 cm.sup.2; .[.or.]. .Iadd.and .Iaddend. a wafer-average dislocation density of no more than .[.about.]. 10,000 cm.sup.2, 5,000 cm.sup.2, or 1,000 cm.sup.2.

22. A method of forming a high-quality SiC single crystal wafer comprising: sublimation growing on a SiC single crystal seed a SiC single crystal boule having a diameter sufficient for slicing wafers between 100 and 200 mm in diameter, wherein said sublimation growth occurs in the presence of controlled axial and radial temperature gradients and .Iadd.a .Iaddend.controlled flux of sublimated source material .Iadd.that is restricted, via a separation plate that is spaced from the source material, to a central area of the surface of the SiC single crystal seed that is between 30% and 60% of a total surface area of the SiC single crystal seed around a center of the SiC single crystal seed, wherein the separation plate includes an outer flux permeable part surrounding an inner flux permeable part that is more permeable to the flux of sublimated source material than the outer flux permeable part, wherein a ratio of mass transport of the SiC bearing vapors through 1 cm.sup.2 of area of the inner part of the separation plate versus the mass transport of the SiC bearing vapors through 1 cm.sup.2 of area of the outer part of the separation plate is no less than 50/1.Iaddend.; and slicing from said SiC .Iadd.single crystal .Iaddend.boule a SiC .Iadd.single crystal .Iaddend.wafer having a combined area of stacking faults no more than .[.about.]. 5%, 2%, or 1% of a total area of the .Iadd.SiC single crystal .Iaddend.wafer.

23. The method of claim 22, wherein the SiC .Iadd.single crystal .Iaddend.wafer further includes: a lattice curvature of no more than .[.about.]. 0.2, 0.1, or 0.06 over the total area of the .Iadd.SiC single crystal .Iaddend.wafer.

24. The method of claim 22, wherein the SiC .Iadd.single crystal .Iaddend.wafer further includes a full width at half maximum (FWHM) of .[.the.]. x-ray reflection of no more than .[.about.]. 50, 30, or 20 arc-seconds over the total area of the .Iadd.SiC single crystal .Iaddend.wafer.

25. The method of claim 22, wherein the SiC .Iadd.single crystal .Iaddend.wafer further includes .[.at least one of.]. the following: a wafer-average micropipe density (MPD) of no more than .[.about.]. 1 cm.sup.2, 0.2 cm.sup.2, or 0.1 cm.sup.2; .[.or.]. .Iadd.and.Iaddend. a wafer-average dislocation density of no more than .[.about.]. 10,000 cm.sup.2, 5,000 cm.sup.2, or 1,000 cm.sup.2.

.[.26. A high-quality SiC single crystal wafer having a diameter between 100 and 200 mm and comprising at least one of the following: a lattice curvature of no more than about 0.2, 0.1, or 0.06 over the total area of the wafer; or a full width at half maximum (FWHM) of the x-ray reflection of no more than about 50, 30, or 20 arc-seconds over the total area of the wafer; or a combined area of stacking faults no more than about 5%, 2%, or 1% of a total area of the wafer..].

.[.27. The SiC single crystal of claim 26, wherein the crystal comprises either a 4H polytype or a 6H polytype..].

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a cross-sectional schematic view of a prior art SiC sublimation growth cell;

(2) FIGS. 2A-2B are cross-sectional schematic views of prior art SiC sublimation growth cells, each of which includes prior art top and bottom heaters for avoiding radial temperature gradients during SiC sublimation growth;

(3) FIG. 3 is a cross-sectional schematic view of the prior art SiC sublimation growth cell of FIG. 2A showing isotherms and a contour of a 150 mm diameter SiC boule obtained by finite element simulation;

(4) FIGS. 4A-4B are isolated views of grown SiC crystals illustrating the effect of vapor feeding on the growth interface shape obtained by finite element simulation;

(5) FIG. 5 is a SiC sublimation growth cell according to one embodiment of the present invention;

(6) FIG. 6 is a SiC sublimation growth cell according to another embodiment of the present invention; and

(7) FIG. 7 is an isolated view of the separation plate shown in FIG. 6.

DETAILED DESCRIPTION OF THE INVENTION

(8) The invention is an improved SiC sublimation growth process applicable to the growth of high-quality, large-diameter SiC crystals. The invention is aimed at producing flat or slightly convex growth interface by controlling temperature gradients in the growth cell and the flux of the sublimated source material, wherein the gradients are controlled to produce positive and substantially shallow radial gradients in the crystal and its environs not exceeding 10 K/cm and wherein the flux of the sublimated source material is controlled by restricting the vapor transport from the source to the central area of the boule. In addition, in-situ densification of the SiC source by sublimation and filtration of the vapors supplied to the growing SiC crystal from particulates are disclosed, as well as an optional in-situ synthesis of the SiC source.

First Embodiment

(9) The principle of invention is illustrated in FIG. 5. In similarity to conventional SiC sublimation growth, cylindrical crucible 50 includes SiC seed crystal 53 disposed at the top and SiC source material 51 disposed at the bottom. The vapor flux is controlled by a plate 56 disposed in the crucible 50 in the space between the source 51 and seed crystal 53. The chemically inert separation plate 56 is impervious to the vapors 54 and has a central opening 56a. In operation, source 51 vaporizes and generates vapors 54, that migrate toward the seed 53. The opening 56a in plate 56 restricts the vapor flux by forming a vapor column 57. The vapor in column 57 migrates toward the SiC seed crystals 53 and reaches said seed substantially at the central area of the seed 53. This geometry of vapor flux creates a tendency toward convex growth interface. The remaining elements comprising a SiC sublimation growth cell (e.g., FIG. 1) that includes crucible 50 have been omitted from FIG. 5 for simplicity.

Second Embodiment

(10) With reference to FIG. 6, a cylindrical crucible 60 is prepared of dense, fine-grain graphite, such as grade 2020 available from Mersen USA Bay City-MI Corp. 900 Harrison Street, Bay City, Mich. 48708, grade IG-11 available from Toyo Tanso USA, Inc. 2575 NW Graham Circle, Troutdale, Oreg. 97060, or similar, without limitation. Crucible 60 is loaded at the bottom with SiC source material 61, e.g., as-synthesized polycrystalline SiC grain with a particle size, desirably, between 0.1 and 2 mm. A SiC seed crystal 63 is disposed at the top of crucible 60.

(11) FIG. 6 shows a non-limiting embodiment of the invention, wherein crucible 60 is loaded at the bottom with SiC source material 61. It is envisioned, however, that SiC source material 61 can be disposed alternatively in crucible 60, such as, without limitation, spaced at a distance from the bottom of crucible 60 or at a distance from the walls of crucible 60.

(12) A separation plate 66 is prepared, which is chemically inert to the vapors 64 generated by sublimation of SiC source material 61. The thickness of plate 66 is, desirably, between 4 and 10 mm. Plate 66 includes two concentric parts: ring member 66a and central member 66b. Ring member 66a has a substantially low permeability to the vapors generated upon SiC sublimation and is made, desirably, of high-density, small-grain, low-porosity graphite, such as grade 2020 available from Mersen USA Bay City-MI Corp. 900 Harrison Street, Bay City, Mich. 48708 or similar, without limitation.

(13) Central member 66b is made, desirably, of a lower-density, large-grain, high-porosity graphite, such as PG-25 available from NEC-Morgan Porous Carbon and Graphite Products, 200 North Town Street, Fostoria, Ohio 44830 or similar, without limitation. In other words, ring member 66a has a first, low-porosity while central member 66b has a second, higher-porosity. Due to its porous nature with open, interconnecting pores, the material forming central member 66b is substantially permeable to the vapors generated upon SiC sublimation, such as Si, Si.sub.2C and SiC.sub.2 vapors. Hence, vapors 64 created by the sublimation of SiC source material 61 will preferentially pass through central member 66b versus ring member 66a. In this regard, separation plate 66 controls the flux of sublimated source material (vapors 64) that reaches SiC seed crystal 63 and the growing SiC crystal 62. The area of the central member 66b is, desirably, between 20 and 50% of the total area of plate 66.

(14) Chemical inertness of plate 66 can be achieved by deposition of a protective layer of refractory compound on the plate surface. Desirably, all surfaces of the plate 66 are CVD coated with a 30 to 40 micron thick layer of refractory carbide, such as, without limitation, tantalum carbide (TaC) or niobium carbide (NbC). Desirably, the CVD coating of the porous member 66b of the plate 66 does not reduce substantially its permeability to the vapors generated upon SiC sublimation.

(15) Plate 66 is disposed within the crucible 60 between SiC source material 61 and SiC seed crystal 63, thus essentially dividing the crucible interior into source compartment 61a and growth compartment 62a. Plate 66 is disposed from SiC seed crystal 63 at a distance, desirably, between 25% and 75% of the seed diameter.

(16) Crucible 60, loaded with SiC source material 61, separation plate 66 and SiC seed crystal 63, is placed in a crystal growth chamber (not shown), inside a two-zone resistive heating assembly that includes heaters 48 and 49 similar to heaters 38 and 39 in FIG. 3. The heating assembly of FIG. 6 is capable of controlling temperature gradients in the crucible 60 by providing for substantially shallow and positive temperature gradients in the growing SiC crystal 62 and its environs, said gradients, desirably, below 10 C./cm.

(17) The temperature distribution inside crucible 60 can be assessed using finite element modeling. The configuration of top and bottom heaters 48 and 49 and the current flowing across said heaters are optimized to ensure that the radial temperature gradients in the crystal and its vicinity are positive and substantially shallow, said temperature gradients are desirably below 10K/cm.

(18) In preparation for growth, the chamber in which crucible 60 is disposed, e.g., chamber 10 in FIG. 1, is evacuated and flushed with pure inert gas to eliminate traces of atmospheric gases and moisture. The material forming crucible 60 is essentially transparent to atmospheric air and inert gas, but is not as transparent to the Si- and C-bearing vapor species generated by the sublimation of SiC source material 61.

(19) Next, heaters 48 and 49 are activated to raise the crucible temperature, desirably, between 2000 C. and 2400 C. The pressure of inert gas in the chamber is controlled to reach, desirably, between several and 100 Torr. The power levels in the top and bottom heaters 48 and 49 are controlled such that the temperature at the bottom of crucible 60 is higher than the temperature at the top, resulting in an axial temperature gradient, desirably, between 10 and 30 K/cm.

(20) In response to raising the crucible temperature to between 2000 C. and 2400 C., the as-synthesized SiC source material 61 vaporizes and fills the source compartment 61a with Si- and C-bearing vapor species 64, such as Si, Si.sub.2C and SiC.sub.2, that migrate towards plate 66 and precipitate on said plate 66 to form a dense polycrystalline SiC body 65. Desirably, full re-sublimation of the as-synthesized source 61 into the SiC body 65 is accomplished during initial stages of growth, approximately, the first 24 to 36 hours of growth.

(21) The dense polycrystalline SiC body 65 also vaporizes, with the vapors originating from said SiC body 65 filtering across the central, vapor-permeable member 66b of plate 66 and moving towards the SiC seed crystal 63, as shown by arrows 67. Due to the fact that the vapor-permeable member 66b of plate 66 occupies between 20 and 50% of the total area of plate 66, the vapor flux approaches the SiC seed crystal 63 predominantly at the central area of said SiC seed crystal 63, said area equal approximately to 30 to 60% of the total area of SiC seed crystal 63.

(22) Upon reaching SiC seed crystal 63, the vapors 67 precipitate on said SiC seed crystal 63 causing growth of SiC single crystal 62 on the seed 63. In the conditions of substantially shallow and positive radial gradients, this control of the vapor flux by restricting it to the central area of the growing crystal leads to a flat or slightly convex growth interface. Simultaneously, filtration of the vapors originating from the SiC body 65 across permeable member 66b leads to elimination or dramatic reduction of the number of carbon particles 64a reaching the growing crystal 62.

(23) In-situ synthesis of silicon carbide is an optional step. A mixture of elemental carbon and silicon is prepared and disposed (in place of premixed SiC source material 61) in crucible 60 under separation plate 66. Carbon is, desirably, in the form of powder, while silicon is, desirably, in the form of lumps, desirably, of 2 to 8 mm in size. The atomic composition of the mixture is non-stoichiometric with the carbon content, desirably, between 55 and 70 atomic percent.

(24) The chamber in which crucible 60 is disposed, e.g., chamber 10 in FIG. 1, is evacuated and filled with inert gas to a pressure desirably, between 200 and 700 Torr, which is above the normal pressure of SiC sublimation growth. Then, heaters 48 and 49 are activated and the temperature of the crucible 60 is raised to reach a temperature desirably, between 1700 C. and 1800 C. which is below the normal temperature of SiC sublimation growth. The crucible is soaked at this temperature and this pressure, desirably, for 2 to 6 hours. During this soak time, silicon and carbon react to form SiC source material 61 in-situ. The elevated pressure of inert gas minimizes vapor effluence from the reacting mixture, as well as evaporative losses of silicon from the crucible, while separation plate 66 prevents particulates generated during synthesis from reaching and contaminating the surface of seed 63. The excess of carbon in the mixture prevents molten silicon from damaging the walls of graphite crucible 60.

(25) After in-situ synthesis of SiC is accomplished, the temperature and pressure in the system are brought to the normal values of SiC sublimation growth (discussed above), and the growth of SiC single crystal 62 on SiC single crystal seed 63 is carried out as described above.

(26) A non-limiting embodiment of separation plate 66 is shown in FIG. 7. The plate is, desirably, 4 to 10 mm thick and includes two concentric parts: ring member 66a and central member 66b. Ring member 66a is made of dense graphite, such as grade 2020 available from Mersen USA Bay City-MI Corp. 900 Harrison Street, Bay City, Mich. 48708 or similar, without limitation. Central member 66b is made of porous graphite, such as grade PG-25 available from NEC-Morgan Porous Carbon and Graphite Products, 200 North Town Street, Fostoria, Ohio 44830, without limitation. Tight connection between ring member 66a and central member 66b can be achieved using high-temperature carbonaceous glue or by threading, without limitation. The area of vapor-permeable, central member 66b is, desirably between 20 and 50% of the total area of plate 66.

(27) The entire surface of plate 66 is desirably protected against vapor erosion by high-temperature CVD coating with TaC, desirably 30 to 40 micron thick (shown as item 77 in FIG. 7). Investigation of TaC-coated plates made of PG-25 porous graphite showed that TaC infiltrated into the bulk of graphite and coated the inner walls of the pores. This infiltration improved the inertness of plate 66 to vapors 64 generated upon sublimation of SiC source material 61, while not reducing the permeability of plate 66 to vapors 64.

(28) The thus described SiC sublimation growth process yields SiC single crystals 62 having a flat or slightly convex growth interface. The interface curvature is characterized by the difference in the boule thickness measured at the boule center and that at the diameter of the wafer to be sliced from the grown SiC single crystal. Desirably, this difference is less than 6 mm.

(29) Permeability of Graphite to Vapors Generated During SiC Sublimation

(30) The utility of plate 66 relies on the different permeability of dense graphite (66a) versus porous graphite (66b) to vapors 64 generated upon sublimation of SiC source material 61. To this end, permeability experiments were performed using test-membranes made of dense, fine-grain, graphite 2020 available from Mersen USA Bay City-MI Corp. 900 Harrison Street, Bay City, Mich. 48708 (hereinafter 2020 graphite) and porous graphite PG-25 available from NEC-Morgan Porous Carbon and Graphite Products, 200 North Town Street, Fostoria, Ohio 44830 (hereinafter PG-25 graphite). The test-membranes were shaped as discs of 150 mm in diameter and 6 mm thick. Some test-membranes were CVD coated with 30 to 40 microns thick coating of TaC. A graphite crucible, similar to crucible 60 in FIG. 6, was prepared and loaded with SiC source material 61 at the bottom. A 3 mm thick pre-weighed graphite plate (hereafter seed plate) was attached to the top of the crucible instead of the SiC seed crystal. The test-membranes were placed in the crucible at a distance of 50 mm from the seed plate. The permeability tests were carried out at a temperature of 2200 C. and argon pressure of 10 Torr. The test duration was 24 hours.

(31) During testing, vapors from the SiC source condensed on the test-membrane forming a dense body or slug of polycrystalline SiC. The SiC slug vaporized and the vapors originating from said SiC slug filtered across the test-membrane and precipitated on the seed plate to form a dense polycrystalline SiC deposit. After test, the weight of the deposit was calculated as a difference in the weight of the seed plate before and after the experiment. The results are shown in Table 1.

(32) TABLE-US-00001 TABLE 1 Results of vapor permeability tests for dense and porous graphite Total mass transport Graphite grade of membrane across membrane, g Dense 2020 uncoated 2 Dense 2020 coated with TaC 0.5 Porous PG-25 uncoated 100 Porous PG-25 coated with TaC 110

(33) The data in Table 1 shows that mass transport across the membranes made of dense 2020 graphite was about 50 times less than across membranes made of porous PG-25 graphite. TaC coating on the dense 2020 graphite further reduced its permeability. This was due to the fact that the pore sizes of dense graphite are on the order of several microns, and the 30-40 micron coating of TaC further seals the graphite surface. A similar TaC coating on porous PG-25 graphite did not, however, cause a reduction in its permeability. Rather, the TaC coating increased the permeability of the PG-25 graphite. The pore sizes of this PG-25 graphite grade are large, on the order of 100 microns, whereupon the 30-40 micron TaC coating was unable to seal the surface.

(34) Examples of SiC Crystals Grown Using the Process of Invention

(35) Plate 66 was used to grow large-diameter SiC single crystals 62 capable of yielding 100, 125 and 150 mm wafers. The grown SiC single crystals 62 included vanadium-doped semi-insulating 6H crystals, vanadium-doped semi-insulating 4H Si crystals and nitrogen-doped 4H n-type crystals. Doping with vanadium was used to produce semi-insulating SiC crystals. Prior Art for vanadium doping includes U.S. Pat. Nos. 5,611,955; 7,608,524; 8,216,369; and U.S. 2008/0190355; 2011/0303884, which are all incorporated herein by reference.

(36) The grown SiC crystal boules exhibited a flat or slightly convex growth interface, with the difference in the boule thickness measured at the boule center and at the diameter of the wafer to be sliced from the grown SiC single crystal being below 6 mm.

(37) The grown SiC boules were sliced into wafers of 100, 125 and 150 mm in diameter using a multi-wire diamond saw. The as-sawn wafers were lapped and polished on diamond slurries with the grit size progressively reduced from 9 to 1 micron. As a final step, the wafers were double-side polished using a process of Chemical-Mechanical Polishing (CMP). Depending on the wafer type and diameter, the final thickness of the wafers varied between 350 to 500 microns.

(38) Crystal quality of the wafers was investigated using techniques commonly applied in SiC material characterization. First, polished wafers were viewed under crossed polarizers for overall degree of stress, uniformity and quality. Then, they were inspected by optical microscopy for the presence of carbon inclusions. The x-ray quality, including lattice curvature () and reflection broadening (FWHM), was evaluated using mapping with the x-ray rocking curves (monochromatic Cu-K beam with the angular divergence of 10-12 arc-seconds and the incident beam area of about 1 mm.sup.2). Micropipe density (MPD) and dislocation density (DD) were determined by etching in molten KOH followed by computerized mapping of the etch pits. In addition, the wafers were studied by the x-ray topography for the presence of stacking faults (SF). The results are summarized in Table 2 and testify to the quality of large-diameter SiC wafers produced using the growth process of invention.

(39) TABLE-US-00002 TABLE 2 SiC wafers fabricated from crystals grown using the process of invention Wafer X-Ray Quality Polytype Carbon FWHM MPD DD SiC Wafer Type mm Inclusions Stress Inclusions Arc-seconds cm.sup.2 cm.sup.2 SF HO0010-12 6H SI 100 None Low None 0.04 17 0.29 1 .Math. 10.sup.4 None HN0016-10 6H SI 125 None Low None 0.03 25 0.78 1 .Math. 10.sup.4 None DZ0028-10 4H SI 150 None Low None 0.15 ~17 0.76 6.3 .Math. 10.sup.3 None HG0022-08 4H n-type 150 None Low None 0.06 ~14 0.12 5.8 .Math. 10.sup.3 None

(40) The invention has been described with reference to exemplary embodiments. Obvious modifications and alterations will occur to those skilled in the art upon reading and understating the preceding detailed description. It is intended that the invention be construed as including all such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.