HIGH PERFORMANCE PEROVSKITE SOLAR CELLS, MODULE DESIGN, AND MANUFACTURING PROCESSES THEREFOR

Abstract

High-performance perovskite solar cell (PSC) devices, arrays thereof, and modules manufactured on flexible and stretchable substrates using roll-to-roll high throughput manufacturing techniques. The flexible cells can be cut into strips and are connected via flexible and/or stretchable interconnects. The interconnect can be a layer deposited on a wavy surface of the stretchable substrate, a coiled or hinged wire, or a conductive paste that can be deformed prior to curing. The highly deformable solar modules can conform to complex organic contours and shapes, such as those that are common in vehicle designs. Such shapes typically require at least one axis of flex and at least one axis of stretch.

Claims

1. A flexible and stretchable solar module comprising: a first flexible perovskite solar cell and a second flexible perovskite solar cell disposed on a stretchable substrate; and a deformable interconnect electrically connecting the first flexible perovskite solar cell and second flexible perovskite solar cell.

2. The solar module of claim 1 wherein the stretchable substrate comprises polydimethylsiloxane (PDMS) or vinyl.

3. The solar module of claim 1 capable of conforming to a contoured surface of an object.

4. The solar module of claim 1 wherein each of the solar cells comprises a flexible substrate coated with a transparent conductive oxide (TCO) layer.

5. The solar module of claim 4 wherein the TCO layer is selected from the group consisting of indium tin oxide (ITO), silver nanowires, single-layer graphene, graphene nanoplates, and combinations thereof.

6. The solar module of claim 4 wherein an exposed portion of the TCO layer on each solar cell is not covered by overlaying layers of the solar cell.

7. The solar module of claim 6 wherein each of the solar cells was manufactured using slot-die coating.

8. The solar module of claim 6 wherein said exposed portion of the TCO layer is between approximately 1 μm and approximately 10 mm wide.

9. The solar module of claim 8 wherein said exposed portion of the TCO layer is approximately 1 mm wide.

10. The solar module of claim 6 wherein each solar cell comprises a metal contact disposed on at least a part of said exposed portion of the TCO layer.

11. The solar module of claim 10 wherein the metal contact was disposed on said exposed portion of the TCO layer by metal evaporation using a mask, screen printing, or attaching the metal contact to said exposed portion of the TCO layer with an electrically conductive adhesive tape.

12. The solar module of claim 10 wherein said exposed portion of the TCO layer is formed by removing the overlaying layers over said exposed portion of the TCO layer by mechanical etching or laser scribing.

13. The solar module of claim 12 wherein the overlaying layers comprise an electron transport layer (ETL), a perovskite layer, a hole transport layer (HTL), and a conductive layer.

14. The solar module of claim 13 wherein the deformable interconnect electrically connects said metal contact on the first flexible perovskite solar cell to said metal contact on the second flexible perovskite solar cell.

15. The solar module of claim 13 wherein the deformable interconnect electrically connects said conductive layer on the first flexible perovskite solar cell to said conductive layer on the second flexible perovskite solar cell.

16. The solar module of claim 13 wherein the deformable interconnect electrically connects said metal contact on the first flexible perovskite solar cell to said conductive layer on the second flexible perovskite solar cell.

17. The solar module of claim 6 wherein the deformable interconnect is flexible and/or stretchable.

18. The solar module of claim 17 where a portion of the stretchable substrate extends vertically between the first flexible perovskite solar cell and the second flexible perovskite solar cell.

19. The solar module of claim 17 wherein said portion of the stretchable substrate is between about 1 mm and about 10 mm in width.

20. The solar module of claim 18 wherein said portion of the stretchable substrate comprises a wavy surface.

21. The solar module of claim 20 wherein a first side of said wavy surface is approximately adjacent to a first contact on the first flexible perovskite solar cell and a second side of said wavy surface is approximately adjacent to a second contact on the second flexible perovskite solar cell.

22. The solar module of claim 21 wherein said deformable interconnect comprises a layer of conductive material deposited on the wavy surface, thereby electrically connecting the first contact and the second contact.

23. The solar module of claim 17 wherein the deformable interconnect comprises a coiled metal wire, a hinged metal wire, a flexible and/or stretchable conductive contact, or a hinged metal connector.

24. The solar module of claim 6 wherein the deformable interconnect comprises a conductive paste disposed between the first flexible perovskite solar cell and the second flexible perovskite solar cell.

25. The solar module of claim 24 wherein said conductive paste electrically connects said exposed portion of the TCO on the first flexible perovskite solar cell and said exposed portion of the TCO on the second flexible perovskite solar cell.

26. The solar module of claim 25 wherein said exposed portion of the TCO layer on the first flexible perovskite solar cell and said exposed portion of the TCO layer on the second flexible perovskite solar cell spatially overlap but are not in physical contact.

27. The solar module of claim 25 wherein, for each of the solar cells, perovskite forming a perovskite layer is extended to electrically insulate from the conductive paste those layers of the solar cell which are not adjacent to the TCO layer.

28. The solar module of claim 25 wherein an order of layers in each solar cell is the same but the exposed portion of the TCO layer in the first flexible perovskite solar cell is facing downward from a top portion of the first flexible perovskite solar cell and the exposed portion of the TCO layer in the second flexible perovskite solar cell is facing upward from a bottom portion of the second flexible perovskite solar cell.

29. The solar module of claim 25 wherein the first flexible perovskite solar cell is inverted on the stretchable substrate with respect to the second flexible perovskite solar cell.

30. The solar module of claim 29 wherein positions of an HTL and an ETL in the first flexible perovskite solar cell are exchanged with respect to positions of an HTL and an ETL in the second flexible perovskite solar cell.

31. The solar module of claim 24 wherein the solar module is conformed to a contoured surface prior to curing of the conductive paste.

32. The solar module of claim 24 further comprising a stretchable layer covering the first flexible perovskite solar cell, the second flexible perovskite solar cell, and the conductive paste.

33. The solar module of claim 1 further comprising a stretchable cover layer encapsulating the first flexible perovskite solar cell, the second flexible perovskite solar cell, and the deformable interconnect.

34. A method of manufacturing a flexible and stretchable solar cell, the method comprising: producing first and second flexible perovskite solar cells, each cell comprising an exposed portion of a TCO layer on a bottom of the solar cell and a conductive layer on the top of the solar cell; disposing a metallic contact on at least a part of exposed portion of the TCO layer on each of the solar cells; placing the first flexible perovskite solar cell and the second flexible solar cell on a stretchable substrate; and electrically connecting the first flexible perovskite solar cell and the second flexible solar cell with a deformable interconnect.

35. The method of claim 34 wherein the stretchable substrate comprises PDMS or vinyl.

36. The method of claim 34 wherein the producing step comprises slot-die coating.

37. The method of claim 34 wherein the producing step comprises removing layers overlaying the TCO layer using mechanical etching or laser scribing to produce the exposed portion of the TCO layer on each of the flexible perovskite solar cells.

38. The method of claim 34 wherein the electrically connecting step comprises connecting the metal contact on the first flexible perovskite solar cell to the metal contact on the second flexible perovskite solar cell, connecting the conductive layer on the first flexible perovskite solar cell to the conductive layer on the second flexible perovskite solar cell, or connecting the metal contact on the first flexible perovskite solar cell to the conductive layer on the second flexible perovskite solar cell.

39. The method of claim 34 wherein the placing step comprises indenting the first flexible perovskite solar cell and the second flexible perovskite solar cell into the stretchable substrate prior to curing of the stretchable substrate so that a portion of the stretchable substrate extends vertically between the first flexible perovskite solar cell and the second flexible perovskite solar cell.

40. The method of claim 39 comprising producing a wavy pattern on a surface of the portion of the stretchable substrate.

41. The method of claim 40 wherein producing the wavy pattern is performed by stamping, chemical etching, or molding.

42. The method of claim 40 wherein the electrically connecting step comprises depositing a layer of conductive material on the wavy-patterned surface of the portion of the stretchable substrate, thereby connecting a contact on the first flexible perovskite solar cell with a contact on the second flexible perovskite solar cell.

43. The method of claim 34 further comprising encapsulating the first flexible perovskite solar cell, the second flexible perovskite solar cell, and the deformable interconnect in a stretchable cover layer.

44. The method of claim 34 wherein the disposing step comprises metal evaporation using a mask, screen printing, or attaching the metal contact to said portion of the TCO layer with an electrically conductive adhesive tape.

45. The method of claim 34 wherein the electrically connecting step comprises disposing a conductive paste between the first flexible perovskite solar cell and the second flexible perovskite solar cell.

46. The method of claim 45 wherein the conductive paste electrically connects the exposed portion of the TCO on the first flexible perovskite solar cell and the exposed portion of the TCO on the second flexible perovskite solar cell.

47. The method of claim 46 comprising spatially overlapping but not directly contacting the exposed portion of the TCO on the first flexible perovskite solar cell and the exposed portion of the TCO on the second flexible perovskite solar cell.

48. The method of claim 47 wherein the placing step comprises inverting the first flexible perovskite solar cell with respect to the second flexible perovskite solar cell.

49. The method of claim 45 further comprising: covering the solar module with a stretchable cover layer; conforming the solar module to a contoured surface of an object; and curing the conductive paste.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings, which are incorporated into and form a part of the specification, illustrate the practice of embodiments of the present invention and, together with the description, serve to explain the principles of the invention. The drawings are only for the purpose of illustrating certain embodiments of the invention and are not to be construed as limiting the invention. In the drawings:

[0014] FIG. 1 is a schematic showing the PSC device architecture after interconnection using method 1, where the interconnect is preferably a layer of conductive material deposited on the stretchable carrier substrate.

[0015] FIG. 2 shows the manufacturing process of PSCs including the steps required to prepare the substrate for interconnection.

[0016] FIG. 3 shows the interconnection scheme in more detail where the perovskite cell is positioned on a stretchable underlayer that has been molded in the connection region. The conductive material contact is then deposited on the wavy stretchable region interconnecting the individual cells. Finally, an encapsulating layer of stretchable material is coated on top of the conductive contact.

[0017] FIG. 4A shows an interconnection scheme for series connections.

[0018] FIG. 4B shows an interconnection scheme for parallel connections.

[0019] FIG. 5A shows the interconnection before bending and stretching.

[0020] FIG. 5B shows the interconnection after bending and stretching. The perovskite cell on the flexible substrate can bend, and the electrical interconnect can bend and stretch.

[0021] FIG. 6 shows an alternative embodiment of the present invention where the interconnect is preferably formed using a conductive paste to electrically connect adjacent cells serially.

[0022] FIG. 7 shows a module similar to that of FIG. 6 after bending and stretching. The perovskite cell on the flexible substrate can bend, and the stretchable substrate/electrical interconnect can bend and stretch.

[0023] FIG. 8 shows the alternative embodiment of the present invention where the interconnect is preferably formed using a conductive paste to electrically connect adjacent cells in parallel.

[0024] FIGS. 9A-9B show several examples of complex, or ‘organic’, contours that require more than one degree of bend, and at least one degree of stretch to form-fit a coating on the surface. FIG. 9A shows an example of a 2-axis organic contour. FIG. 9B shows an application comprising two dimensional organic contours.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

[0025] Embodiments of the present invention are arrays of interconnected photovoltaic PCSs. The PSCs preferably comprise a narrow strip of flexible PSC that has been cut from a larger PSC that preferably has been manufactured using high throughput roll-to-roll manufacturing processes. The cells are each preferably between about 1 mm and 10 mm wide, and their length is preferably between about 1 cm and 1 m. Each cell is preferably sufficiently narrow to accommodate the design constraints of the contour that it will be applied to. Two embodiments of the present invention are methods of manufacturing stretchable interconnections for PSCs enabling them to cover complex contoured surfaces. The present invention provides several valuable improvements to solar module structures, including the combination of flexible solar cells interconnected into an array of series and/or parallel connected cells using flexible and stretchable mechanical/conductive interconnections, as well as using high throughput manufacturing techniques to fabricate the solar cells and solar modules. The preferable flexible and/or stretchable interconnection of thin strips of PSCs embedded in a flexible carrier substrate both reduces the inherent series resistance in the PSCs and increases the deformability of the module. This design results in the potential to form-fit a solar module to complex organic contoured surfaces.

[0026] FIG. 1 illustrates an exemplary device architecture of two PSCs connected in series constructed in accordance with a first embodiment of the present invention. Each PSC preferably comprises flexible carrier substrate 150, transparent conductive oxide (TCO) layer 140, electron transport layer (ETL) 130, perovskite layer 120, hole transport layer (HTL) 110, conductive layer 100, and electrical contact 160 on TCO layer 140. FIG. 2 shows an example of the fabrication steps for the device shown in FIG. 1. First, ETL 130 is deposited on carrier substrate 150 coated with at least one TCO layer 140. Carrier substrate 150 may comprise any material, including but not limited to polyethylene terephthalate (PET). TCO layers 140 may comprise, for example, indium tin oxide (ITO), silver nanowires, single-layer graphene, graphene nanoplates, and/or combinations thereof, together with carrier substrate 150 preferably forming a transparent, flexible, and conductive composite substrate. ETL 130 may comprise any material, including but not limited to a transition metal oxide such as TiO.sub.2, SnO.sub.2, ZnO, In.sub.2O.sub.3, Ga.sub.2O.sub.3, or CdO, and may be deposited by a method such as spin-coating, slot-die coating, air-blade coating, doctor-blade coating, sputtering, e-beam evaporation, or chemical bath deposition, in which any heat treatment does not exceed the melting temperature of the carrier substrate 150 or TCO layer 140. Perovskite layer 120 is then preferably deposited on ETL 130 by a method such as spin-coating, slot-die coating, air-blading, spray-coating, or blade-coating, which method preferably does not comprise a heat treatment exceeding the melting temperature of any of the underlying layers. Perovskite layer 120 preferably comprises the ABX3 structure, where A is a cation comprising, for example, methylammonium, formamidinium, cesium, or rubidium; B is a cation comprising, for example, lead or tin; and X is an anion comprising, for example, an iodide, bromide or chloride. HTL 110 is then preferably deposited on perovskite layer 120 by a method such as spin-coating, slot-die coating, air-blading, spray-coating, or blade-coating, which method preferably does not comprise a heat treatment exceeding the melting temperature of any of the underlying layers. HTL 110 preferably comprises 2,2′,7,7′-Tetrakis[N,N-di(4-methoxyphenyl)amino]-9,9′-spirobifluorene (spiro-OMeTAD), [6,6]-phenyl C61 butyric acid methyl ester (PCBM), or a graphite slurry that includes additives such as carbon black to increase the conductivity. If HTL 110 is not sufficiently conductive, optional conductive layer 100 may be deposited on HTL 110 for forming the top electrical contact to the PSC.

[0027] The PSCs of the present invention are preferably processed in strips that provide access to both the top contact (conductive layer 100) and bottom contact (TCO layer 140), i.e., leaving strip 170 of TCO layer 140 uncovered by ETL 130, perovskite layer 120, HTL 110, and conductive layer 100. This is preferably accomplished by processing ETL 130, perovskite layer 120, HTL 110, and conductive layer 100 in strips using slot-die coating, which can be configured to leave strip 170 of TCO-coated carrier substrate 150 uncoated. Alternatively, mechanical etching or laser scribing can be used to remove ETL 130, perovskite layer 120, HTL 110, and conductive layer 100 to create strip 170. Strip 170 is preferably approximately between 1 μm and 10 mm wide, and more preferably about 1 mm wide. Electrical contact 160 is then deposited or attached to a portion of uncovered strip 170 of TCO layer 140 to form the bottom electrical contact to the PSC. Electrical contact 160 is preferably disposed on TCO layer 140 using a method including but not limited to metal evaporation using a mask, screen printing, or attaching the contact via an electrically conductive adhesive tape. Stretchable interconnection 180, which is preferably also flexible, is formed between electrical contact 160 and optional conductive layer 100.

[0028] As shown in FIG. 3, the cells are then placed on a stretchable substrate 230, which preferably comprises polydimethylsiloxane (PDMS). In FIG. 3, to simplify the drawing, layer 190 represents optional conductive layer 100, layer 200 represents ETL 130, perovskite layer 120, and HTL 110, and layer 210 represents carrier substrate 150 coated with TCO layer 140, including uncoated strip 170 and electrical contact 160. The gap between the cells is preferably between about 1 mm and about 10 mm. In this gap, stretchable substrate 230 preferably extends above layer 210 and layer 200, and its surface preferably comprises a wavy pattern such as that shown in FIG. 3. The wavy pattern may be produced by a method such as stamping, chemical etch, pouring the stretchable substrate into a mold, or by any other means. The height of the stretchable substrate in the gap is preferably extended above the cells by laying down the cells on the stretchable substrate when it is soft before curing and pressing the cells down. Stretchable interconnection 180 preferably comprises a thin layer of conductive material, preferably between approximately 1 nm and 1000 nm in thickness, that is preferably deposited on electrical contact 160 on the uncoated TCO strip 170 (shown in FIGS. 1-2) and the wavy surface of that portion of the stretchable substrate in the gap between adjacent cells. Alternatively, stretchable interconnection 180 may comprise a coiled or hinged metal wire, a flexible and/or stretchable conductive contact, or a hinged metal connector. Stretchable interconnection 180 connects the cell to the adjacent solar cell either in series or in parallel, depending on the voltage and current specifications required for the application. Such an interconnect enables the module to stretch and bend between adjacent flexible perovskite solar cells without stressing/breaking the metal interconnect. To encapsulate the contacts, top stretchable layer 240, preferably comprising a material such as PDMS, is deposited using at least one of spin-coating, slot-die coating, drop-casting, or blade-coating.

[0029] FIGS. 4A and 4B show series and parallel interconnections of PSCs respectively. As shown in FIG. 4A, for a series connection the stretchable interconnect is connected between the top contact (conductive layer 100) and the bottom contact (TCO layer 140) of adjacent flexible perovskite solar cells. For parallel connection, the stretchable interconnect is connected between adjacent flexible perovskite solar cells twice, where one connection is used to connect the top contacts of adjacent cells and one is used to connect the bottom contacts of adjacent cells, as shown in FIG. 4B.

[0030] FIGS. 5A-5B illustrate a solar module of the present invention before and after bending and/or stretching, respectively, showing the resultant deformation of stretchable interconnection 180. The perovskite solar module of the present invention is preferably flexible in at least two directions and stretchable in one or more directions. In this interconnection scheme, the flexibility of the PSC itself generates the first degree of bend, and the stretchable substrate and top stretchable layer (not shown), which comprises the encapsulated conductive interconnects, generates the second degree of bend and at least one degree of stretch.

[0031] FIG. 6 illustrates an alternative embodiment of the present invention depicting a series interconnection between two PSCs. Flexible substrate 260 preferably comprises PET. TCO layer 270 is preferably deposited on flexible substrate 260 to form one of the electrical contacts of the PSC. TCO layers 270 may comprise, for example, indium tin oxide (ITO), silver nanowires, single-layer graphene, graphene nanoplates, and/or combinations thereof, together with flexible substrate 260 preferably forming a transparent, flexible, and conductive composite substrate. ETL 280 may comprise any material, including but not limited to a transition metal oxide such as TiO.sub.2, SnO.sub.2, ZnO, In.sub.2O.sub.3, Ga.sub.2O.sub.3, or CdO. Perovskite layer 290 preferably comprises the ABX3 structure, where A is a cation comprising, for example, methylammonium, formamidinium, cesium, or rubidium; B is a cation comprising, for example, lead or tin; and X is an anion comprising, for example, an iodide, bromide or chloride. HTL 300 preferably comprises 2,2′,7,7′-Tetrakis[N,N-di(4-methoxyphenyl)amino]-9,9′-spirobifluorene (spiro-OMeTAD), [6,6]-phenyl C61 butyric acid methyl ester (PCBM), nickel oxide, or a graphite slurry that includes additives such as carbon black to increase the conductivity. IF HTL 300 is not sufficiently conductive, conductive layer 310, preferably comprising TCO similar to TCO layer 270, forms the other electrical contact of the PSC. Conductive layer 310 is preferably covered by flexible layer 320 which preferably comprises a flexible, transparent material such as PET.

[0032] The PSCs in this embodiment preferably provide access to the top contact (anode) and bottom contact (cathode) of cells that are adjacent by leaving strips 360 and 370 of TCO layer 270 and conductive layer 310 exposed. This is preferably accomplished by processing ETL 280, perovskite layer 290, HTL 300, conductive layer 310, and transparent flexible layer 320 in strips using, for example, slot-die coating, which can be configured to leave strips 360, 370 uncoated by the subsequent layers. Alternatively, mechanical etching or laser scribing can be used to remove ETL 280, perovskite layer 290, HTL 300, conductive layer 310, and transparent flexible layer 320 to create strips 360 and 370. Strips 360 and 370 are each preferably approximately between 1 μm and 10 mm wide, and more preferably about 1 mm wide. The longer top contact (conductive layer 310) of the left cell is then preferably electrically connected to the longer bottom contact (TCO layer 270) of the adjacent right cell via conductive paste 350, which preferably comprises silver, carbon, or any other material that can form a conductive paste, forming a series interconnection. Electrical isolation is preferably achieved between the bottom contact (TCO layer 270) of the left cell and top contact (conductive layer 310) of the adjacent right cell by configuring the deposition of perovskite layer 290 on each cell, which is electrically insulating, to electrically isolate the aforesaid layers from conductive paste 350. The interconnection so formed thus produces a series connection between adjacent cells.

[0033] The cells are laid on stretchable substrate 250, which preferably comprises a stretchable polymer such as vinyl, PDMS, or the like, preferably in an alternating manner. The gap between the cells is preferably between about 1 mm and about 10 mm. After conductive paste 350 is disposed between the cells, to encapsulate the cells and contacts, a final stretchable layer 330, also preferably comprising an insulating material such as vinyl, PDMS, or the like, is preferably laid on top. The entire structure can now be used to cover a curved or otherwise contoured surface while closely conforming to its contours. A final heat treatment not exceeding the melting point of the constituent components of the module may be required for curing the conductive paste after laying the structure down on the target curved surface.

[0034] FIG. 7 illustrates a solar module similar to that shown in FIG. 6 (showing that flexible layer 320 may comprise a different material than that of flexible substrate 260) after bending and/or stretching, showing the resultant deformation of both stretchable substrate 250, stretchable layer 330, and deformable conductive paste 350. The perovskite solar module is preferably flexible in at least two directions, and stretchable in one or more directions. In this interconnection scheme, the flexibility of the PSC itself preferably generates the first degree of bend, and stretchable substrate 250 together with the conductive paste generates the second degree of bend and at least one degree of stretch. The versatility of the roll-to-roll perovskite manufacturing process to fabricate flexible perovskite solar cells also results in the opportunity to custom design the length of the solar cell to reduce the number of manufacturing steps required to form-fit complex contoured surfaces. It also increases design flexibility by enabling the length of the solar cell to be determined by the current-matching criteria of the solar module.

[0035] FIG. 8 shows two adjacent cells connected in parallel in a manner similar to the serial connection shown in FIG. 6. For parallel interconnection, every alternate cell is produced by changing the order of deposition to alternate the ETL 280 with HTL 300 as shown.

[0036] FIGS. 9A and 9B illustrate some different contour shapes that require different degrees of flex and stretch. Complex ‘organic’ contours have more than one degree of orthogonal flex. For a film or fabric to flex in more than one direction simultaneously, a degree of stretch is required to reduce the inevitable occurrence of crumpling or tearing of the film or fabric. The surface application of substrates that are flexible are limited in this regard, as they are unable to form to complex contours that flex along more than one axis, known as ‘compound contours’. These complex contours are very common among modern design, as they form what are known as ‘organic’ shapes. The amount of stretch that is required to form to a complex contour is defined by the severity of the surface curvature. If the surface curvature is more dramatic, the amount of stretch required to form-fit the substrate to the surface is increased. The perovskite-based modules of the present invention can be form-fit to a substantially higher degree on complex curved surfaces.

[0037] Note that in the specification and claims, “about” or “approximately” means within twenty percent (20%) of the numerical amount cited. As used herein, the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a functional group” refers to one or more functional groups, and reference to “the method” includes reference to equivalent steps and methods that would be understood and appreciated by those skilled in the art, and so forth.

[0038] Although the invention has been described in detail with particular reference to the disclosed embodiments, other embodiments can achieve the same results. Variations and modifications of the present invention will be obvious to those skilled in the art and it is intended to cover all such modifications and equivalents. The entire disclosures of all patents and publications cited above are hereby incorporated by reference.