WIRE GUIDE MODULE, AND ULTRASONIC WIRE BONDER THEREWITH
20230123439 · 2023-04-20
Assignee
Inventors
- Andreas UNGER (Verl, DE)
- Frank WALTHER (Paderborn, DE)
- Michael BROEKELMANN (Delbrueck, DE)
- Matthias HUNSTIG (Paderborn, DE)
Cpc classification
B23K20/10
PERFORMING OPERATIONS; TRANSPORTING
B23K37/0282
PERFORMING OPERATIONS; TRANSPORTING
H01L2924/00014
ELECTRICITY
B23K20/14
PERFORMING OPERATIONS; TRANSPORTING
H01L2224/781
ELECTRICITY
H01L2924/00014
ELECTRICITY
International classification
B23K20/00
PERFORMING OPERATIONS; TRANSPORTING
B23K20/10
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A wire guide module for an ultrasonic wire bonder, comprising a body made of a thermally stable metallic and/or ceramic material, wherein an elongated wire feed-through channel having a wire inlet opening and having a wire outlet opening is provided on the body, and comprising a guide tube provided in the wire feed-through channel. In addition, the invention relates to a thermosonic wire bonder having a wire guide module.
Claims
1. A wire guide module for an ultrasonic wire bonder, the wire guide module comprising: a body made of a thermally stable metallic and/or ceramic material; an elongated wire feed-through channel having a wire inlet opening and having a wire outlet opening is provided on the body; and a guide tube arranged in the wire feed-through channel.
2. The wire guide module according to claim 1, wherein the body provides a cast aluminum alloy or a cobalt chromium tungsten alloy as thermally stable material, and/or wherein the body is produced from aluminum oxide.
3. The wire guide module according to claim 1, wherein the guide tube is flexible, and/or wherein the guide tube is produced from a plastic with a melting temperature of more than 175° C., or more than 240° C. or more than 280° C., and/or wherein the guide tube is produced from PTFE.
4. The wire guide module according to claim 1, wherein a pocketlike and/or trough-shaped installation recess is provided on the body, and wherein the installation recess is routed to the wire feed-through channel.
5. The wire guide module according to claim 4, wherein a clamping part is provided that is inserted in the installation recess and is fixed in the installation recess, wherein the clamping part is in direct contact with the guide tube in order to secure and/or fix and/or position the guide tube in the wire feed-through channel.
6. The wire guide module according to claim 1, wherein the guide tube is provided such that it has a clearance in the wire feed-through channel.
7. The wire guide module according to claim 1, wherein the wire feed-through channel tapers toward the wire outlet opening.
8. The wire guide module according to claim 1, wherein an inert gas channel having an inert gas inlet opening is provided on the body for feeding an inert gas.
9. The wire guide module according to claim 8, wherein the inert gas channel opens into the wire feed-through channel and/or wherein the inert gas channel is routed to the wire feed-through channel at an acute angle such that the inert gas flows toward the wire outlet opening due to the inclination of the inert gas channel in the region of an opening.
10. The wire guide module according to claim 8, wherein the guide tube provides a through opening on a lateral surface, and wherein the guide tube with the through opening is arranged in the wire feed-through channel and associated with the inert gas channel such that the inert gas fed through the inert gas channel arrives in the guide tube through the through opening.
11. The wire guide module according to claim 8, wherein a mount is provided for interlocking positioning of the wire guide module on an attachment element of a bonding head of the ultrasonic wire bonder and/or wherein a longitudinal guide is provided on the body as the mount for installing the body on a correspondingly shaped attachment element of a bonding head of the wire bonder, the longitudinal guide being formed as a dovetail guide.
12. The wire guide module according to claim 1, wherein the wire inlet opening is provided in a region of the mount and/or is surrounded thereby and/or in wherein the wire outlet opening is opposite a mount.
13. The wire guide module according to claim 1, wherein the body provides a first flat side surface and a second flat side surface opposite the first flat side surface, as well as a circumferential connecting surface that connects the first flat side surface to the second flat side surface, wherein the installation recess is formed on the first flat side surface or in a region of the first flat side surface and the connecting surface, and/or wherein the wire inlet opening and/or the wire outlet opening and/or the inert gas inlet opening are provided in the connecting surface.
14. The wire guide module according to claim 13, wherein a groove-shaped outlet contour, which the wire feed-through channel opens into and/or which adjoins the wire outlet opening, is formed as part of the connecting surface.
15. An ultrasonic wire bonder comprising: a linearly and/or rotationally movable bonding head, wherein a bonding tool that is adapted to be excited into ultrasonic vibrations via an ultrasonic transducer is replaceably held on the bonding head; a thermal generator for heating the bonding tool and/or the bond wire and/or a substrate; and the wire guide module according to claim1, wherein the wire guide module is formed as part of the bonding head for feeding a bond wire to the bonding tool.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus, are not limitive of the present invention, and wherein:
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DETAILED DESCRIPTION
[0045] A first embodiment of a wire guide module according to the invention from
[0046] Provided on the body 1 is a wire feed-through channel 2 for a bond wire 11. The wire feed-through channel 2 provides a wire inlet opening 3 located in the region of the connecting surface 9 as well as a wire outlet opening 4. A groove-shaped outlet contour 6, which the wire feed-through channel 2 opens into and which adjoins the wire outlet opening 4, is additionally provided as part of the connecting surface 9.
[0047] Provided in the wire feed-through channel 2 is a guide tube 5. The guide tube 5 is made of a plastic with a melting temperature of more than 175° C. and preferably more than 240° C. and especially preferably more than 280° C. In the present case, the guide tube 5 is made of PTFE. The guide tube 5 is provided such that it has essentially no clearance in the wire feed-through channel 2.
[0048] In order to guide the bond wire 11 to a bonding tool and position it under a tip of the bonding tool, the bond wire 11, which, in particular, is fed vertically through the wire inlet opening 3, is redirected in the wire feed-through channel 2 toward the bonding tool. The bond wire 11 leaves the wire feed-through channel 2 through the wire outlet opening 4, which is arranged at an incline to the bonding tool and arrives in the groove-shaped outlet contour 6 of the wire guide module, which contour is open toward the bonding tool.
[0049] For the purpose of installing the wire guide module according to the invention on a bonding head of the wire bonder, the wire guide module provides a longitudinal guide, in the present case a dovetailed longitudinal guide, as a mount 10. The longitudinal guide 10 is provided on the body 1 of the wire guide module 1. It extends in the region of the opposing flat side surfaces 7, 8 and, at the same time, surrounds the wire inlet opening 3 of the wire feed-through channel 2.
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[0051] According to a third embodiment of the invention from
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[0053] The preferred exit of the inert gas through the wire outlet opening 4 is accomplished by the means that the inert gas channel 16 is routed to the wire feed-through channel 2 at an acute angle, and the inert gas preferentially flows toward the wire outlet opening 4 due to the inclination of the inert gas channel 16 in the region of the opening.
[0054] In a fifth embodiment of the invention from
[0055] According to a sixth embodiment of the invention from
[0056] The new structural or functional features of the respective wire guide module are discussed in each of the exemplary embodiments two through six of the invention, whereas functional or structural features of a preceding embodiment of the invention that have already been described and incorporated are not discussed again. Identical components and component functions are labeled with identical reference symbols here.
[0057] The invention is not limited to the exemplary embodiments shown. For example, provision can be made that the installation recess is provided solely in the region of the connecting surface and/or extends in a direction in which the wire feed-through channel extends.
[0058] The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are to be included within the scope of the following claims.