COMPOSITE CAVITY AND FORMING METHOD THEREOF

Abstract

There is provided a method for forming a composite cavity and a composite cavity formed using the method. The method comprises the following steps: providing a silicon substrate (101); forming an oxide layer on the front side thereof; patterning the oxide layer to form one or more grooves (103), the position of the groove (103) corresponding to the position of small cavity (109) to be formed; providing a bonding wafer (104), which is bonded to the patterned oxide layer to form one or more closed micro-cavity structures (105) between the silicon substrate (101) and the bonding wafer (104); forming a protective film (106) over the bonding wafer (104) and forming a masking layer (107) on the back side of the silicon substrate (101); patterning the masking layer (107), the pattern of the masking layer (107) corresponding to the position of a large cavity (108) to be formed; using the masking layer (107) as a mask, etching the silicon substrate (101) from the back side until the oxide layer at the front side thereof to form the large cavity (108) in the silicon substrate (101); and using the masking layer (107) and the oxide layer as a mask, etching the bonding wafer (104) from the back side through the silicon substrate (101) until the protective film (106) thereover to form one or more small cavities (109) in the bonding wafer (104). The uniformity of thickness of the semiconductor medium layer where the small cavity (109) in the composite cavity is located is well controlled by the present invention.

Claims

1. A method for forming a composite cavity, comprising: A. providing a silicon substrate; B. forming a silicon dioxide layer on the front side of said silicon substrate; C. patterning said silicon dioxide layer to form one or more grooves, the position of said groove corresponding to the position of small cavity to be formed in step H; D. providing a bonding wafer, and bonding said bonding wafer with said patterned silicon dioxide layer to close said groove, so as to form one or more closed micro-cavity structures between said silicon substrate and said bonding wafer; E. forming a protective film over said bonding wafer, and forming a masking layer on the back side of said silicon substrate; F. patterning said masking layer, the pattern of said masking layer corresponding to the position of a large cavity to be formed in step G; G. using said masking layer as a mask, etching said silicon substrate from the back side until said silicon dioxide layer at the front side, and forming said large cavity in said silicon substrate; H. using said masking layer and said silicon dioxide layer as a mask, etching said bonding wafer from the back side through said silicon substrate until said protective film thereover so as to form one or more said small cavities in said bonding wafer, said large cavity and said small cavity constituting said composite cavity.

2. The method for forming a composite cavity according to claim 1, wherein said silicon dioxide layer is formed by thermal oxidation or chemical vapour deposition.

3. The method for forming a composite cavity according to claim 2, wherein said silicon dioxide layer is patterned by dry etching or wet etching.

4. The method for forming a composite cavity according to claim 3, wherein the material of said bonding wafer is monocrystalline silicon, polycrystalline silicon or glass.

5. The method for forming a composite cavity according to claim 4, wherein the material of said masking layer is a photoresist or a semiconductor medium.

6. A composite cavity formed using the method according to claim 1, comprising a large cavity and a small cavity, both with a downward opening, wherein said large cavity passes through and is formed in the silicon substrate; a patterned silicon dioxide layer as the bottom of said large cavity is formed on the front side of said silicon substrate; the pattern of said silicon dioxide layer corresponds to the position of said small cavity; a bonding wafer is formed over said silicon dioxide layer; said small cavity passes through and is formed in said bonding wafer and is in communication with said large cavity; and a protective film as the bottom of said small cavity is formed over said bonding wafer.

7. The composite cavity according to claim 6, wherein said silicon dioxide layer (102) is formed by thermal oxidation or chemical vapour deposition.

8. The composite cavity according to claim 7, wherein said silicon dioxide layer is patterned by dry etching or wet etching.

9. The composite cavity according to claim 8, wherein the material of said bonding wafer is monocrystalline silicon, polycrystalline silicon or glass.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above-mentioned and other features, properties and advantages of the present invention will become more apparent from the following description of embodiments with reference to the accompany drawings, in which:

[0028] FIGS. 1-8 is a flow chart of a forming process for a composite cavity in one embodiment of the present invention; and

[0029] FIG. 4-A is an enlarged schematic diagram of a micro-cavity structure as shown in FIG. 4.

DETAILED DESCRIPTION

[0030] The present invention will be further described below in conjunction with particular embodiments and the accompanying drawings, and more details are explained in the following description, in order to fully understand the present invention; however, the present invention can obviously be implemented differently from what is described herein; a person skilled in the art can make similar extensions and deductions without departing from the connotation of the invention according to practical applications; and therefore the scope of protection of the present invention should not be limited to the contents of the particular embodiments herein.

An Embodiment of a Method for Forming a Composite Cavity

[0031] FIGS. 1-8 is a flow chart of a forming process for a composite cavity in one embodiment of the present invention. It should be noted that the drawings are merely used as examples, and are not necessarily drawn to scale, and should not be taken as a limitation to the actually claimed scope of protection of the present invention.

[0032] The process flow of the composite cavity mainly comprises the following steps.

[0033] The first step, as shown in FIG. 1, is to provide a silicon substrate 101, which silicon substrate 101 is a substrate of 6 inch, 8 inch, etc.

[0034] The second step, as shown in FIG. 2, is to form a silicon dioxide layer 102 on the front side of the silicon substrate 101, as an etching barrier layer in the subsequent process of forming a small cavity 109 by etching. Here, the silicon dioxide layer 102 may be formed by thermal oxidation or chemical vapour deposition.

[0035] The third step, as shown in FIG. 3, is to pattern the silicon dioxide layer 102 to form one or more grooves 103, the position of the groove 103 corresponding to the position of small cavity 109 to be formed in the eighth step. Here, the silicon dioxide layer 102 may be patterned by dry etching or wet etching.

[0036] The fourth step, as shown in FIG. 4, is to provide a bonding wafer 104, and bond the bonding wafer 104 with the patterned silicon dioxide layer 102 so as to close the grooves 103, thereby forming one or more closed micro-cavity structures 105 between the silicon substrate 101 and the bonding wafer 104. Here, the material of the bonding wafer 104 may be monocrystalline silicon, polycrystalline silicon or glass (a semiconductor medium).

[0037] FIG. 4-A is an enlarged schematic diagram of a micro-cavity structure as shown in FIG. 4. As shown in FIG. 4-A, which is an enlarged view of one micro-cavity structure 105 (shown by the dotted circle) formed in FIG. 4, which facilitates illustrating the construction of the micro-cavity structure 105 more clearly.

[0038] The fifth step, as shown in FIG. 5, is to form a protective film 106 over the bonding wafer 104, and form a masking layer 107 on the back side of the silicon substrate 101. Here, the material of the masking layer 107 may be a photoresist or a semiconductor medium.

[0039] The sixth step, as shown in FIG. 6, is to pattern the masking layer 107, the pattern of the masking layer 107 corresponding to the position of a large cavity 108 to be formed in the seventh step.

[0040] The seventh step, as shown in FIG. 7, is to etch the silicon substrate 101 from the back side until the silicon dioxide layer 102 (etching barrier layer) at the front side, using the patterned masking layer 107 as a mask, so as to form the large cavity 108 in the silicon substrate 101. Then, the one or more micro-cavity structures 105 which are previously closed are opened from below.

[0041] The eighth step, as shown in FIG. 8, is to etch the bonding wafer 104 from the back side through the silicon substrate 101 until the protective film 106 thereover, using the masking layer 107 and the patterned silicon dioxide layer 102 as a mask, so as to form one or more small cavities 109 in the bonding wafer 104, the large cavity 108 and the small cavities 109 constituting the composite cavity.

The Embodiment of Composite Cavity

[0042] This embodiment can be formed using the above-mentioned method embodiment and uses the reference numbers of elements and part of contents of the preceding embodiment, wherein the same reference numbers are used to denote the same or similar elements, and the description of the same technical content is selectively omitted.

[0043] See FIG. 8, the composite cavity may comprise a large cavity 108 and one or more small cavities 109, both with a downward opening. The large cavity 108 passes through and is formed in the silicon substrate 101, and a patterned silicon dioxide layer 102 (as an etching barrier layer when etching to form the large cavity 108) as the bottom of large cavity 108 is formed on the front side of the silicon substrate 101. The pattern of the silicon dioxide layer 102 corresponds to the positions of the small cavities 109. A bonding wafer 104 is formed over the silicon dioxide layer 102, and the material of the bonding wafer 104 may be monocrystalline silicon, polycrystalline silicon or glass (a semiconductor medium); and one or more small cavities 109 pass through and are formed in the bonding wafer 104 and are in communication with the large cavity 108. A protective film 106, as the bottom of the small cavities 109, is formed above the bonding wafer 104.

[0044] In this embodiment, the silicon dioxide layer 102 may be formed by oxidation or chemical vapour deposition; and the silicon dioxide layer 102 may be patterned by dry etching or wet etching.

[0045] The present invention combines the advantages of the pure monocrystalline solution and pure polycrystalline solution for MEMS microphones and provides a method for forming a composite cavity having its own lower capacitor plate (i.e., the semiconductor medium layer where the small cavity is located) on the basis of the two solutions. The present invention is suitable for production, has low costs, and only needs to control the stress of a single layer of lower capacitor plate in technical aspect.

[0046] The present invention can well control the uniformity of the monocrystalline silicon lower capacitor plate, which is proved to be achievable and an economic technical solution as compared with the high-cost substrate preparing method of the solution using pure monocrystalline silicon. Moreover, in the present invention, the complicated problem of stress interaction in thermal process of the double-layer polycrystal in the existing technology is simplified to the stress control of a single-layer polycrystal, and the stability from batch to batch is also well improved.

[0047] The present invention has been disclosed above in terms of the preferred embodiments which are not intended to limit the present invention, and any person skilled in the art could make possible changes and alterations without departing from the spirit and scope of the present invention. Hence, any alteration, equivalent change and modification which are made to the above-mentioned embodiments in accordance with the technical substance of the present invention and without departing from the contents of the present invention, will fall within the scope of protection defined by the claims of the present invention.