LIGHT EMITTING DIODE (LED) BACKLIGHTING SOURCE

Abstract

A light emitting diode (LED) backlighting source comprising at least one circuit board electrically connectable to a power source; a plurality of LEDs electrically mounted on the circuit board and able to be powered by a connected power source; wherein the circuit board is formed of a plurality of spaced finger portions and connecting portions wherein the finger portions and the connecting portions are electrically connected.

Claims

1. A light emitting diode (LED) backlighting source comprising: a. at least one circuit board electrically connectable to a power source; b a plurality of LEDs electrically mounted on the circuit board and able to be powered by a connected power source: c. wherein the circuit board is formed of a plurality of spaced finger portions and connecting portions wherein the finger portions and the connecting portions are electrically connected.

2. A light emitting diode (LED) backlighting source according to claim 1 comprising of at least two circuit boards that have a shape and electrical configuration of the finger portions and the connecting portions to engage and to electrically connect the at least two circuit boards.

3. A light emitting diode (LED) backlighting source according to claim 1 wherein the at least two circuit boards have a substantially similar shape to each other.

4. A light emitting diode (LED) backlighting source according to claim 1 wherein the at least two circuit boards are hand portions formed by at least one connecting portions with a plurality of having

5. A light emitting diode (LED) backlighting source according to claim 1 wherein the at least two circuit boards electrically connect the finger portions of one to the finger portions of another.

6. A light emitting diode (LED) backlighting source according to claim 1 wherein the at least two circuit boards electrically connect the end tip of finger portions of one to the end tip of finger portions of another.

7. A light emitting diode (LED) backlighting source according to claim 2 wherein the at least two circuit boards are formed integrally in a first configuration as a single circuit board with a first footprint and can be separated and reconnected to form the at least two circuit boards with a second footprint greater than the first footprint and engage and electrically connect the at least two circuit boards in the second configuration.

8. A light emitting diode (LED) backlighting source according to claim 2 wherein the at least two circuit boards are formed in a first configuration.

9. A light emitting diode (LED) backlighting source according to claim 3 wherein the at least two circuit boards are complementary in shape.

10. A light emitting diode (LED) backlighting source according to claim 3 wherein the at least two circuit boards are formed from a substantially rectangular circuit board.

11. A light emitting diode (LED) backlighting source according to claim 1 wherein the LEDs are electrically mounted on the circuit board in a spaced arrangement to enhance constant illumination over the footprint of the circuit board.

12. A light emitting diode (LED) backlighting source according Co claim 1, wherein a display array is formed of a plurality of circuit boards wherein at least two circuit boards are formed integrally in a first configuration as a single circuit board with a first footprint and can be separated and reconnected to form the at least two circuit boards with a second footprint greater than the first footprint and engage and electrically connect the at least two circuit boards in the second configuration.

13. A light emitting diode (LED) backlighting source according to claim 1, wherein the plurality of LEDs on the circuit board are substantially equally spaced from each other on the circuit board.

14. A light emitting diode (LED) backlighting source according to claim 1, wherein the plurality of LEDs on the circuit board are substantially equally spaced from each other over the plurality of spaced finger portions.

15. A light emitting diode (LED) backlighting source according to any one of the preceding claims wherein the plurality of LEDs are spaced and offset to each other to provide the required density of LEDs over the circuit board.

16. A light emitting diode (LED) backlighting source according to claim 1, wherein the plurality of LEDs on the circuit board are electrically connected by conductive tracks between adjacent

17. A light emitting diode (LED) backlighting source according to claim 1, wherein the plurality of LEDs on the circuit board are electrically connected in series from a connectable power source.

18. A light emitting diode (LED) backlighting source according to claim 1, wherein the plurality of LEDs are in a non-linear arrangement.

9. A light emitting diode (LED) backlighting source according to claim 1, wherein the plurality of LEDs are in a saw-tooth arrangement with the selected angle between adjacent conductive tracks to provide the required density of LEDs over circuit board being selected from the range of 45 to 135.

20. A method of forming a light emitting diode (LED) backlighting source including steps of: a. Determining a size of a required array formed of at least two circuit boards having a plurality of light emitting diodes (LEDs); b. Determining the at least two circuit boards formed integrally in a first configuration as a single circuit board with a first footprint and which can be separated and reconnected to form the at least two circuit boards with a second footprint greater than the first footprint and engage and electrically connect the at least two circuit boards in the second configuration; c. Determining a strength of light intensity required from the array; d. Arranging plurality of light emitting diodes (LEDs) on the at least two circuit boards; e. Forming the array from a circuit board in the first configuration f. Frangibly separating the formed circuit board in the first configuration into the determined at least two circuit boards; and Electrically connecting the at least two circuit boards in the second configuration.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Notwithstanding any other forms which may fall within the scope of the present invention, preferred embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:

[0048] FIG. 1 is a diagrammatic plan view of a light emitting diode (LED) backlighting source in accordance with a first array of a preferred embodiment of the present invention;

[0049] FIG. 2 is a diagrammatic cross-sectional view of a light box using a light emitting diode (LED) backlighting source in accordance with a first array of a preferred embodiment of the present invention

[0050] FIG. 3 is a diagrammatic plan view of a light emitting diode (LED) backlighting source having array formed of two circuit boards in accordance with a preferred embodiment of the present invention;

[0051] FIG. 4 is a light emitting diode (LED) backlighting source having array formed of two circuit boards of FIG. 3 intertwined in a first configuration for manufacture with a decreased footprint;

[0052] FIG. 5 is a light emitting diode (LED) backlighting source in accordance with a first array of a preferred embodiment of the present invention showing different possible constituents;

[0053] FIG. 6 is a light emitting diode (LED) backlighting source having array formed of eight circuit boards of C-shape and I-shape that can be reconnected to form the array of FIG. 5 in accordance with a preferred embodiment of the present invention;

[0054] FIG. 7 is a light emitting diode (LED) backlighting source having array formed of thirty two circuit boards in a first configuration for manufacture with a decreased footprint formed of L-shape, I-shapes and T-shapes that can be reconnected to form the array of FIG. 5 in accordance with a preferred embodiment of the present invention; and

[0055] FIGS. 8A, 8B and 8C are details of a light emitting diode (LED) backlighting source having array showing intensity due to different spacings and different arrangements of light emitting diodes (LEDs) on the circuit boards for a method of creating a light emitting diode (LED) backlighting source according to the invention.

DESCRIPTION OF PREFERRED EMBODIMENTS

[0056] It should be noted in the following description that like or the same reference numerals in different embodiments denote the same or similar features.

[0057] Referring to the drawings there is shown in FIG. 1 a light emitting diode (LED) backlighting source comprising at least one circuit board 11 electrically connectable to a power source (not shown) through connectors 23 and a plurality of LEDs 21 electrically mounted on the circuit board 11 and able to be powered by the connected power source.

[0058] Referring to FIG. 2, there is shown an LED light source for backlighting a translucent or semitranslucent substrate 35 by way of spaced LEDs 21 on a circuit board 11 to provide a substantially uniform box light source 10 which can be used in advertising, in general illumination or in decorative light sources. The linear spacing S.sub.L and the limited angle E provides a limiting height H that the translucent or semitranslucent substrate 35 needs to be away from the spaced LEDs 21 to provide the substantially uniform light source for the box light source 10. However the versatility of the present invention breaks the shackles of this limitation as will become evident hereinafter.

[0059] Referring to FIG. 1 in further detail, there is shown that the at least one circuit board 11 of the light emitting diode (LED) backlighting source is formed by two circuit boards 12, 13 which form an array 11 having a footprint A. Each of the two circuit boards 12, 13 forms a multi-fingered E-shape wherein each circuit board is formed of a plurality of spaced finger portions 25 and connecting portions 23. The finger portions and the connecting portions are therefore electrically connected but the finger portions have spacing 26 therebetween of no circuit board 11, 12 or 13. As the circuit boards 12, 13 have circuit board sections of a plurality of spaced finger portions 25 that are spaced from each other and have empty spacings 26, the array 11 does not need to be formed by a single continuous circuit board.

[0060] Therefore the operating array of the LED light source for backlighting a translucent or semitranslucent substrate having an overall footprint of A does not need to be formed of a continuous circuit board having an overall footprint of A.

[0061] Referring in particular to FIGS. 1 and 4, the separate circuit boards 12, 13 forming the array 11 with footprint A and including spacings 26 between finger portions 25 can be created as a single circuit board as shown in first configuration for manufacture 15 in FIG. 4 with footprint B smaller than footprint A. This is achieved by the multi-fingered E-shape design of the separate circuit boards 12, 13 with the finger portions 25 of the circuit boards 12, 13 intertwining to substantially eliminate all spacings 26 in the circuit board boards 12, 13 can be frangibly disconnected from each other to form the separate multi-fingered E-shape separate circuit boards 12, 13 and thereby forming the spacings 26 between finger portions 25. The circuit boards can then be reconnected with the separate multi-fingered E-shape separate circuit boards 12, 13 having respective finger portions 25 linearly aligned.

[0062] The one design of multi-fingered E-shape design of the light emitting diode (LED) backlighting source can be formed in a number of ways. Referring to FIG. 5 there is shown the multi-fingered E-shape designs broken into a range of component parts. It can be seen that the initial creation of the circuit board and resulting array can be achieved by other designs than only the multi-fingered &shape design of the separate circuit boards 12, 13 with the finger portions 25 being intertwined to substantially eliminate all spacings 26 in the circuit board creation stage as shown in FIGS. 1 and 4.

[0063] FIG. 6 shows how the multi-fingered E-shape design of the separate circuit boards 12, 13 can be formed of long C-shape (C) and I-shapes (I). This might not result in the maximum reduction in footprint from footprint A of the final array in operation from the footprint B when created as a single circuit board but it definitely will create a footprint B smaller than footprint A and allow greater versatility.

[0064] Still further as shown in FIG. 7, the multi-fingered E-shape design of the separate circuit boards 12, 13 can be formed of smaller parts of L-shape (L), T-shape (T) and I-shape parts (I) that can be made in any configuration on a single circuit board and frangibly disconnected after creation and then reformed into the opposing multi-fingered E-shape design of the separate circuit boards 12, 13, The finger portions 25 and the connecting portions 27 can also be created directly into the final array as per FIG. 5,

[0065] However the light emitting diode (LED) backlighting source is not limited to this design but is open to creation of a range of designs.

[0066] As shown in FIG. 1 there are spacing distances S.sub.1 between adjacent LEDs 21. There are spacings 26 of no circuit board with spacing distances S.sub.2 between adjacent finger portions 25 which creates spacing distances S.sub.3 of LEDs 21. A design therefore is determined by a number of elements including pattern of LEDs on a particular finger portion 25, pattern of finger portions 25 themselves and, pattern of LEDs on an adjacent finger portion to the particular finger portion 25.

[0067] The light emitting diode (LED) backlighting source of the present invention has many benefits and any one or more of those benefits can be implemented into an embodiment of the invention. The various benefits comprise: [0068] a. General ease and variability of manufacture [0069] b. The ability to decrease circuit board manufacture size [0070] c. The variability of size of final array [0071] d. The variability of LED intensity of final array [0072] e. The control of sections of LED final array

[0073] The general ease and variability of manufacture can he shown by the method of forming a light emitting diode (LED) backlighting source. Initially the physical structure of the final array with spacings can be determined. Secondly is the intensity structure that is required while maintaining constant illumination intensity across the backlighting source, This is related to the LED radiance and relative spacing. Thirdly is the effective manufacture and then disassembly and assembly into the effective array.

[0074] Therefore the initial step of the physical structure of the final array with spacings can be determined includes: [0075] a. Determining a size of a required array formed of at least two circuit boards having a plurality of light emitting diodes (LEDs); [0076] b. Determining the at least two circuit boards formed integrally in a first configuration as a single circuit board with a first footprint and which can be separated and reconnected to form the at least two circuit boards with a second footprint greater than the first footprint and engage and electrically connect the at least two circuit boards in the second configuration.

[0077] The second step of the intensity structure that is required while maintaining constant illumination intensity across the backlighting source includes: [0078] a. Determining a strength of light intensity required from the array; [0079] b. Arranging plurality of light emitting diodes (LEDs) on the at !east two circuit boards.

[0080] Third step is the effective manufacture and then disassembly and assembly into the effective array by; [0081] a. Forming the array from a circuit board in the first configuration [0082] b. Frangibly separating the formed circuit board in the first configuration into the determined at least two circuit boards: and [0083] c. Electrically connecting the at least two circuit boards in the second configuration.

[0084] The ability to decrease circuit board manufacture size is shown in particular by FIG. 1 in comparison to FIG. 4.

[0085] The variability of size of final array is achieved in that all the component parts can be modular and any one part of a design can be replaced. Still further the final array is not limited to the shape or size of the circuit board on creation but can be reconfigured or expanded to the required size and shape and added to due to its design and method of creation.

[0086] The variability of LED intensity of final array is able to be modified or varied by change of design or parts and this can also allow variability of design of the final light box as the spacing from LEDs on the rear lighting circuit board from the front translucent or semitranslucent substrate 15 can be altered as required in the initial design. No longer are you limited by the fixed circuit board and fixed limitations of LEDs.

[0087] The plurality of LEDs 21 of the multi-fingered E-shape design of the separate circuit boards 12, 13 of the FIGS. 1 to 7 are in a saw-tooth arrangement with a fixed angle. However the selected angle between adjacent conductive tracks can be different in different designs to provide the required density of LEDs over circuit board being selected from the range of >0 to <180. This is also an element which alters the spacing distances S.sub.1 between adjacent LEDs 21. There are spacings 26 of no circuit board with spacing distances S.sub.2 between of adjacent finger portions 25 which creates spacing distances S.sub.3 of LEDs 21. A design Therefore is determined by a number of elements including pattern of LEDs on a particular finger portion 25, pattern of finger portions 25 themselves and, pattern of LEDs on an adjacent finger portion to the particular finger portion 25.

[0088] As shown in FIGS. 8A, 8B and 8C the plurality of LEDs 21 do not need to be in a saw-tooth arrangement with the selected angle between adjacent conductive tracks to provide the required density of LEDs over circuit board being selected from the range of 45 to 135. Instead it could be linear, square wave, sinusoidal, or random. The choice of arrangement is another variable of the angle and spacing of LEDs to give different density of LEDs and thereby different intensity of light.

[0089] Also the control of sections of LED final array can be varied as sections can be separately powered and separately fluctuated.

[0090] In a further embodiment not shown), the density of LED's can be varied to achieve a predetermined backlighting effect, and depending on the density of LED's for a given finger portion, the distance between the substrate or diffuser cover 35 can be varied to optimise the predetermined effect required.

Interpretation

Embodiments:

[0091] Reference throughout this specification to one embodiment or an embodiment means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, appearances of the phrases in one embodiment or in an embodiment in various places throughout this specification are not necessarily all referring to the same embodiment, but may. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner, as would be apparent to one of ordinary skill in the art from this disclosure, in one or more embodiments.

[0092] Similarly it should be appreciated that in the above description of example embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. This method of disclosure, however, is not to be interpreted as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the Detailed Description of Specific Embodiments are hereby expressly incorporated into this Detailed Description of Specific Embodiments, with each claim standing on its own as a separate embodiment of this invention.

[0093] Furthermore, while some embodiments described herein include some but not other features included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention, and form different embodiments, as would be understood by those in the art. For example, in the following claims, any of the claimed embodiments can be used in any combination.

[0094] Different Instances of Objects

[0095] As used herein, unless otherwise specified the use of the ordinal adjectives first, second, third, etc., to describe a common object, merely indicate that different instances of like objects are being referred to, and are not intended to imply that the objects so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.

[0096] Specific Details

[0097] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In other instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

[0098] Terminology

[0099] In describing the preferred embodiment of the invention illustrated in the drawings, specific terminology will be resorted to for the sake of clarity. However, the invention is not intended to be limited to the specific terms so selected, and it is to be understood that each specific term includes all technical equivalents which operate in a similar manner to accomplish a similar technical purpose. Terms such as forward, rearward, radially, peripherally, upwardly, downwardly, and the like are used as words of convenience to provide reference points and are not to be construed as limiting terms.

[0100] Comprising and Including

[0101] In the claims which follow and in the preceding description of the invention, except where the context requires otherwise due to express language or necessary implication, the word comprise or variations such as comprises or comprising are used in an inclusive sense, i.e. to specify the presence of the stated features but not to preclude the presence or addition of further features in various embodiments of the invention.

[0102] Any one of the terms: including or which includes or that includes as used herein is also an open term that also means including at least the elements/features that follow the term, but not excluding others. Thus, including is synonymous with and means comprising.

[0103] Scope of Invention

[0104] Thus, while there has been described what are believed to be the preferred embodiments of the invention, those skilled in the art will recognize that other and further modifications may be made thereto without departing from the spirit of the invention, and it is intended to claim all such changes and modifications as fail within the scope of the invention. For example, any formulas given above are merely representative of procedures that may be used. Functionality may be added or deleted from the block diagrams and operations may be interchanged among functional blocks. Steps may be added or deleted to methods described within the scope of the present invention.

[0105] Although the invention has been described with reference to specific examples, it will be appreciated by those skilled in the aft that the invention may be embodied in many other forms.

INDUSTRIAL APPLICABILITY

[0106] It is apparent from the above, that the arrangements described are applicable to the lighting or advertising industries and other light emitting diode (LED) backlighting source industries.