TRANSPARENT STATIC-DISSIPATIVE POLYCARBONATE RESIN COMPOSITION AND PREPARATION METHOD THEREOF

Abstract

A transparent static-dissipative polycarbonate (PC) resin composition includes the following components: 70-95 parts by weight of PC resin, 5-30 parts by weight of antistatic agent masterbatch and 0.5-1.5 parts by weight of a transesterification inhibitor. The antistatic agent masterbatch includes the following components by mass percentage: 40-60% of an antistatic agent, 0.5-1.6% of a transesterification accelerator, 1-3% of an assistant cross-linkinger, and the balance of PC resin. A method for preparing the transparent static-dissipative PC resin composition includes the following steps: (I) preparing the components of the transparent static-dissipative PC resin composition according to the formulation, and mixing the components evenly to obtain a premix; and (II) adding the premix into a twin-screw extruder, melting, extruding, cooling and pelletizing, to obtain a target product.

Claims

1. A transparent static-dissipative polycarbonate (PC) resin composition, comprising the following components: 70-95 parts by weight of PC resin; 5-30 parts by weight of antistatic agent masterbatch; and 0.5-1.5 parts by weight of a transesterification inhibitor.

2. The transparent static-dissipative PC resin composition according to claim 1, wherein the antistatic agent masterbatch comprises the following components by mass percentage: 40-60% of an antistatic agent; 0.5-1.6% of a transesterification accelerator; 1-3% of an assistant cross-linkinger; and a balance of PC resin.

3. The transparent static-dissipative PC resin composition according to claim 2, wherein the antistatic agent is an organic macromolecular antistatic agent, and the organic macromolecular antistatic agent is a poly(ether-block-amide) copolymer.

4. The transparent static-dissipative PC resin composition according to claim 2, wherein the transesterification accelerator is at least one selected from the group consisting of tetrabutyl titanate, p-toluene sulfonic acid and stannous octoate.

5. The transparent static-dissipative PC resin composition according to claim 2, wherein the assistant cross-linkinger is at least one selected from the group consisting of styrene-acrylonitrile grafted maleic anhydride resin, acrylonitrile-butadiene-styrene grafted maleic anhydride resin, styrene-acrylonitrile grafted glycidyl methacrylate resin, acrylonitrile-butadiene-styrene grafted glycidyl methacrylate and polystyrene grafted maleic anhydride resin.

6. The transparent static-dissipative PC resin composition according to claim 2, wherein in the transparent static-dissipative PC resin composition, the antistatic agent accounts for 3-12% by mass fraction.

7. The transparent static-dissipative PC resin composition according to claim 2, wherein a method for preparing the antistatic agent masterbatch comprises the following steps: (1) preparing the components of the antistatic agent masterbatch according to a formulation, and mixing the components evenly to obtain a premix; and (2) adding the premix into a twin-screw extruder, melting and extruding the premix to obtain an extruded product, and cooling and pelletizing the extruded product, to obtain the antistatic agent masterbatch, wherein the premix is extruded by the twin-screw extruder at 250-280° C. and at a screw speed of 200-500 rpm.

8. The transparent static-dissipative PC resin composition according to claim 6, wherein the transesterification inhibitor is at least one selected from the group consisting of ethyl orthosilicate, triphenyl phosphite, sodium dihydrogen phosphate and diisooctyl phosphate.

9. A method for preparing the transparent static-dissipative PC resin composition according to claim 1, comprising the following steps: (I) preparing the components of the transparent static-dissipative PC resin composition according to a formulation, and mixing the components evenly to obtain a premix; and (II) adding the premix into a twin-screw extruder, melting and extruding the premix to obtain an extruded product, and cooling and pelletizing the extruded product, to obtain the transparent static-dissipative PC resin composition.

10. The method according to claim 9, wherein the premix is extruded by the twin-screw extruder at 240-260° C. at a screw speed of 200-500 rpm.

11. A method of using the transparent static-dissipative PC resin composition according to claim 1, comprising using the transparent static-dissipative PC resin composition in semiconductor boxes or integrated casing of vacuum cleaners.

Description

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0040] The present disclosure is described in detail below with reference to specific examples. The following examples will help those skilled in the art to further understand the present disclosure, but do not limit the present disclosure in any way. It should be noted that those of ordinary skill in the art can further make several variations and improvements without departing from the concept of the present disclosure. These all fall within the protection scope of the present disclosure.

[0041] The present disclosure provides a transparent static-dissipative polycarbonate (PC) resin composition and a preparation method thereof. The transparent static-dissipative PC resin composition was prepared in two steps:

(1) Preparation of Antistatic Agent Masterbatch

[0042] (1-1) Components of the antistatic agent masterbatch by mass percentage, i.e., 40-60% of an antistatic agent, 0.5-1.6% of a transesterification accelerator, 1-3% of an assistant cross-linkinger and the balance of PC resin, were prepared; and the components were mixed evenly to obtain a premix.

[0043] (1-2) The premix was added into a twin-screw extruder, followed by melting, extruding, cooling and pelletizing to obtain the antistatic agent masterbatch, where the extruding by the twin-screw extruder was conducted at 250-280° C. and at a screw speed of 200-500 rpm.

(2) Preparation of a Transparent Static-Dissipative PC Resin Composition

[0044] (2-1) Components of the transparent static-dissipative PC resin composition, i.e., 70-95 parts by weight of PC resin, 5-30 parts by weight of the antistatic agent masterbatch and 0.5-1.5 parts by weight of a transesterification inhibitor, were prepared; and the components were mixed evenly to obtain a premix.

[0045] (2-2) The premix was added into a twin-screw extruder, followed by melting, extruding, cooling and pelletizing to obtain a target product, where the extruding by the twin-screw extruder was conducted at 240-260° C. and at a screw speed of 200-500 rpm; in the obtained transparent static-dissipative PC resin composition, the organic macromolecular antistatic agent accounts for 3-12% by mass fraction.

[0046] The components used in the examples are described below:

[0047] The antistatic agent is an organic macromolecular antistatic agent which is a poly(ether-block-amide) copolymer. The antistatic agent is readily available on the market, which, used in the examples, includes MH1657 commercially available from Arkema and Ionphase U1 from Ionphase.

[0048] The transesterification accelerator may be tetrabutyl titanate, p-toluene sulfonic acid or stannous octoate.

[0049] The assistant cross-linkinger may be styrene-acrylonitrile grafted maleic anhydride resin, acrylonitrile-butadiene-styrene grafted maleic anhydride resin, styrene-acrylonitrile grafted glycidyl methacrylate resin, acrylonitrile-butadiene-styrene grafted glycidyl methacrylate or polystyrene grafted maleic anhydride resin.

[0050] The transesterification inhibitor may be ethyl orthosilicate, triphenyl phosphite, sodium dihydrogen phosphate or diisooctyl phosphate.

[0051] Under the condition that additives do not adversely affect the transparency and static-dissipative performance of the PC resin composition, the disclosed composition may further optionally include one or more additives that are conventionally used in the manufacture of resin compositions. For example, the disclosed resin composition may include one or more of other resins, stabilizers, flame retardants, impact modifiers, colorants and mold release agents.

[0052] The following is the specific implementation process of the present disclosure, in which the information of the antistatic agent involved in each example and comparative example is as follows:

[0053] Antistatic agent AS-1: Arkema MH1657, surface resistivity 10.sup.9

[0054] Antistatic agent AS-2: Ionphase U1, surface resistivity 10.sup.7

[0055] Transesterification accelerator ZJH-1: tetrabutyl titanate, commercially available

[0056] Transesterification accelerator ZJH-2: p-toluene sulfonic acid, commercially available

[0057] Transesterification accelerator ZJH-3: stannous octoate, commercially available

[0058] Assistant cross-linkinger ZJL-1: styrene-acrylonitrile grafted maleic anhydride resin, commercially available

[0059] Assistant cross-linkinger ZJL-2: Styrene-acrylonitrile grafted glycidyl methacrylate resin, commercially available

[0060] Transesterification inhibitor YZZ-1: ethyl orthosilicate, commercially available

[0061] Transesterification inhibitor YZZ-3: sodium dihydrogen phosphate, commercially available.

[0062] The formulations of the antistatic agent masterbatch in the examples and comparative examples of the present disclosure are shown in Table 1, and the addition amount of each component is expressed in mass fraction.

TABLE-US-00001 TABLE 1 Components of antistatic agent masterbatch Masterbatch Masterbatch Masterbatch Masterbatch Masterbatch Masterbatch Masterbatch Masterbatch Masterbatch 1# 2# 3# 4# 5# 6# 7# 8# PC 58.5 36.6 57 37.2 44.1 39.1 38.8 30 AS-1 40 60 60 AS-2 40 60 52 60 60 ZJH-1 0.5 ZJH-2 0.9 1.6 0.3 0.9 3 ZJH-3 0.5 0.8 ZJL-1 1.0 1.2 0.3 1.2 7 ZJL-2 2.5 2.5 2.5

[0063] The antistatic agent masterbatch 1-8# was prepared as follows:

[0064] (1) The components were weighed according to the amounts in parts by weight as described in Table 1, and mixed evenly to obtain a premix.

[0065] (2) The premix was added into a twin-screw extruder, followed by melting and extruding at 260° C., cooling and pelletizing.

Examples 1 to 8

[0066] Examples 1 to 8 provide transparent static-dissipative PC resin compositions, the formulations of which are shown in Table 2, and the addition amount of each component is expressed in parts by weight.

TABLE-US-00002 TABLE 2 Components of transparent static-dissipative PC resin compositions in Examples 1 to 8 Example Example Example Example Example Example Example Example 1 2 3 4 5 6 7 8 PC 92.5 70 95 80 80 90 80 87 Masterbatch 7.5 30 1# Masterbatch 5 20 2# Masterbatch 20 3# Masterbatch 10 20 4# Masterbatch 13 5# YZZ-1 0.5 1.2 0.7 0.6 0.5 YZZ-2 1.5 0.7 0.7 0.5

Comparative Examples 1 to 8

[0067] Comparative Examples 1 to 8 provide transparent static-dissipative PC resin compositions, the formulations of which are shown in Table 3, and the addition amount of each component is expressed in parts by weight.

TABLE-US-00003 TABLE 3 Components of transparent static-dissipative PC resin compositions in Comparative Examples 1 to 8 Comparative Comparative Comparative Comparative Comparative Comparative Comparative Comparative Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 PC 80 80 60 91.4 95 80 88 Masterbatch 20 20 40 3# Masterbatch 5 6# Masterbatch 20 7# Masterbatch 15 8# YZZ-1 3 0.7 0.7 0.8 0.8 0.3 AS-2 8 12 ZJH-3 0.1 ZJL-2 0.5

[0068] The resin compositions of Examples 1 to 8 and Comparative Examples 1 to 8 were prepared as follows:

[0069] The components of the resin compositions in Examples 1 to 8 and Comparative Examples 1 to 8 were put into a high-speed mixer to be premixed evenly to obtain a premix. The premix was added into a twin-screw extruder, melted and extruded at 250° C. and at a screw speed of 350 rpm, followed by cooling, and pelletizing to obtain a final product.

[0070] In Comparative Example 4, the antistatic masterbatch was not prepared separately, but according to the same components of Example 5, the antistatic agent, the transesterification agent, the assistant cross-linkinger, the transesterification inhibitor and the PC resin were extruded in one step. In Comparative Example 8, the PC and the antistatic agent were directly mixed.

[0071] The mechanical properties of the resin compositions prepared in Examples 1 to 8 and Comparative Examples 1 to 8 were tested:

[0072] Charpy impact strength: Tested in accordance with ISO 179-1:2010 (E) standard, impact energy 4 J.

[0073] Flexural modulus: Tested in accordance with ISO 178:2010 (E) standard, test rate 2 mm/min.

[0074] Resistivity: The surface resistivity of a sample was tested in accordance with ASTM D257.

[0075] Light transmittance: The light transmittance of a 3-mm thick sample plate was tested in accordance with GB/T 2410-2008 at 23° C. and 80° C. respectively.

[0076] The test results of Examples 1 to 8 are shown in Table 4, and the test results of Comparative Examples 1 to 8 are shown in Table 5.

TABLE-US-00004 TABLE 4 Mechanical properties, resistivity and light transmittance test results of the Examples Example Example Example Example Example Example Example Example 1 2 3 4 5 6 7 8 Charpy impact strength 58 43 57 48 59 55 49 53 (KJ/m.sup.2) Flexural modulus (MPa) 2200  1900  2280  2030  2000  2180  1970  2100  Resistivity (ohm) .sup. 10.sup.10 .sup. 10.sup.9 .sup. 10.sup.10 .sup. 10.sup.9 .sup. 10.sup.7 .sup. 10.sup.8 .sup. 10.sup.7 .sup. 10.sup.7 Light transmittance at 89 85 91 88 91 89 86 90 23° C. (%) Light transmittance at 88 85 92 89 90 87 88 89 80° C. (%)

TABLE-US-00005 TABLE 5 Mechanical properties, resistivity and light transmittance test results of the Comparative Examples Comparative Comparative Comparative Comparative Comparative Comparative Comparative Comparative Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Charpy 12 56 25 55 44 22 12 46 impact strength (KJ/m.sup.2) Flexural 1910  2030  1470  .sup. 1980  2070  1900  2300  2000  modulus (MPa) Resistivity .sup. 10.sup.8 .sup. 10.sup.7 .sup. 10.sup.7 .sup. 10.sup.14 .sup. 10.sup.15 .sup. 10.sup.14 .sup. 10.sup.12 .sup. 10.sup.9 (ohm) Light 80 63 35 32 69 44 33 11 transmittance at 23° C. (%) Light 54 61 36 12 68 14 20  9 transmittance at 80° C. (%)

[0077] In the examples, the antistatic agent masterbatch was prepared first, and then the antistatic agent masterbatch was mixed with other components, that is, the transparent static-dissipative PC resin compositions were prepared in two steps. In Comparative Example 4, a one-step method was adopted, which greatly increases the resistivity and greatly reduces the light transmittance. When the PC resin and the antistatic agent are directly mixed, the light transmittance is only about 10%. The light transmittance at 23° C. and 80° C. in the examples is less different, while the light transmittance at different temperatures in the comparative examples is quite different, indicating that the light transmittance of the compositions of the present disclosure is not affected by temperature.

[0078] The specific examples of the present disclosure are described above. It should be understood that the present disclosure is not limited to the above specific implementations, and a person skilled in the art can make various variations or modifications within the scope of the claims without affecting the essence of the present disclosure.