CIRCUIT AND METHOD FOR INTRA-SYMBOL VOLTAGE MODULATION

20230119987 · 2023-04-20

    Inventors

    Cpc classification

    International classification

    Abstract

    Circuit and method for intra-symbol voltage method are disclosed. In an embodiment, a transceiver circuit is configured to divide a voltage modulation interval(s) (e.g., a symbol duration) into multiple voltage modulation subintervals each corresponding to a respective one of multiple voltage targets. Accordingly, a power management integrated circuit (PMIC) can adapt a modulated voltage multiple times within the voltage modulation interval(s) based on multiple voltage targets, respectively. By adapting the modulated voltage within the voltage modulation interval(s), the modulated voltage can be timely adapted to closely track a time-variant power envelope of a radio frequency (RF) signal to thereby avoid potential distortion (e.g., amplitude clipping) during amplification of the RF signal.

    Claims

    1. A power management integrated circuit (PMIC) comprising: a voltage generation circuit configured to: receive a plurality of target voltage indications each corresponding to a respective one of a plurality of voltage modulation intervals and comprising a plurality of voltage targets each corresponding to a respective one of a plurality of voltage modulation subintervals within the respective one of the plurality of voltage modulation intervals; and generate a plurality of modulated voltages in the plurality of voltage modulation subintervals based on the plurality of voltage targets, respectively.

    2. The PMIC of claim 1, further comprising: an inter-chip interface coupled to a transceiver circuit to receive each of the plurality of target voltage indications prior to the respective one of the plurality of voltage modulation intervals; and a memory circuit configured to store the plurality of received target voltage indications.

    3. The PMIC of claim 2, wherein the inter-chip interface receives each of the plurality of target voltage indications for the respective one of the of the plurality of voltage modulation intervals during an immediately preceding one of the plurality of voltage modulation intervals.

    4. The PMIC of claim 1, wherein each of the plurality of voltage modulation intervals corresponds to a duration of an orthogonal frequency division multiplexing (OFDM) symbol.

    5. The PMIC of claim 1, wherein the voltage generation circuit is further configured to generate each of the plurality of modulated voltages based on the respective one of the plurality of voltage targets no later than a respective start of the respective one of the plurality of voltage modulation subintervals.

    6. The PMIC of claim 5, wherein the voltage generation circuit is further configured to: generate a respective one of the plurality of modulated voltages prior to the respective start of the respective one of the plurality of voltage modulation subintervals in response to the respective one of the plurality of voltage targets indicating that the respective one of the plurality of modulated voltages will increase during the respective one of the plurality of voltage modulation subintervals; and generate the respective one of the plurality of modulated voltages at the respective start of the respective one of the plurality of voltage modulation subintervals in response to the respective one of the plurality of voltage targets indicating that the respective one of the plurality of modulated voltages will decrease during the respective one of the plurality of voltage modulation subintervals.

    7. The PMIC of claim 5, wherein each of the plurality of voltage modulation subintervals has an equal duration.

    8. The PMIC of claim 5, wherein each of the plurality of voltage modulation subintervals has an unequal duration.

    9. A transmission circuit comprising: a power management integrated circuit (PMIC) comprising a voltage generation circuit configured to: receive a plurality of target voltage indications each corresponding to a respective one of a plurality of voltage modulation intervals and comprising a plurality of voltage targets each corresponding to a respective one of a plurality of voltage modulation subintervals within the respective one of the plurality of voltage modulation intervals; and generate a plurality of modulated voltages in the plurality of voltage modulation subintervals based on the plurality of voltage targets, respectively; and a transceiver circuit coupled to the PMIC and configured to generate and provide the plurality of target voltage indications to the PMIC.

    10. The transmission circuit of claim 9, wherein the PMIC further comprises: an inter-chip interface coupled to the transceiver circuit to receive each of the plurality of target voltage indications prior to the respective one of the plurality of voltage modulation intervals; and a memory circuit configured to store the plurality of received target voltage indications.

    11. The transmission circuit of claim 9, wherein the transceiver circuit is further configured to: divide each of the plurality of voltage modulation intervals into the plurality of voltage modulation subintervals; determine the plurality of voltage targets for the plurality of voltage modulation subintervals, respectively; and provide each of the plurality of target voltage indications to the PMIC prior to the respective one of the plurality of voltage modulation intervals.

    12. The transmission circuit of claim 11, wherein the transceiver circuit is further configured to provide each of the plurality of target voltage indications for the respective one of the of the plurality of voltage modulation intervals to the PMIC during an immediately preceding one of the plurality of voltage modulation intervals.

    13. The transmission circuit of claim 11, wherein the transceiver circuit is further configured to equally divide each of the plurality of voltage modulation intervals into the plurality of voltage modulation subintervals.

    14. The transmission circuit of claim 11, wherein the transceiver circuit is further configured to unequally divide each of the plurality of voltage modulation intervals into the plurality of voltage modulation subintervals.

    15. A method for enabling intra-symbol voltage modulation comprising: receiving a plurality of target voltage indications each corresponding to a respective one of a plurality of voltage modulation intervals and comprising a plurality of voltage targets each corresponding to a respective one of a plurality of voltage modulation subintervals within the respective one of the plurality of voltage modulation intervals; and generating a plurality of modulated voltages in the plurality of voltage modulation subintervals based on the plurality of voltage targets, respectively.

    16. The method of claim 15, further comprising: generating a respective one of the plurality of modulated voltages prior to the respective start of the respective one of the plurality of voltage modulation subintervals in response to the respective one of the plurality of voltage targets indicating that the respective one of the plurality of modulated voltages will increase during the respective one of the plurality of voltage modulation subintervals; and generating the respective one of the plurality of modulated voltages at the respective start of the respective one of the plurality of voltage modulation subintervals in response to the respective one of the plurality of voltage targets indicating that the respective one of the plurality of modulated voltages will decrease during the respective one of the plurality of voltage modulation subintervals.

    17. The method of claim 15, further comprising: dividing each of the plurality of voltage modulation intervals into the plurality of voltage modulation subintervals; determining the plurality of voltage targets for the plurality of voltage modulation subintervals, respectively; and receiving each of the plurality of target voltage indications prior to the respective one of the plurality of voltage modulation intervals.

    18. The method of claim 17, further comprising receiving each of the plurality of target voltage indications for the respective one of the of the plurality of voltage modulation intervals during an immediately preceding one of the plurality of voltage modulation intervals.

    19. The method of claim 17, further comprising equally dividing each of the plurality of voltage modulation intervals into the plurality of voltage modulation subintervals.

    20. The method of claim 17, further comprising unequally dividing each of the plurality of voltage modulation intervals into the plurality of voltage modulation subintervals.

    Description

    BRIEF DESCRIPTION OF THE DRAWING FIGURES

    [0013] The accompanying drawing figures incorporated in and forming a part of this specification illustrate several aspects of the disclosure, and together with the description serve to explain the principles of the disclosure.

    [0014] FIG. 1 illustrates an exemplary time slot(s) and a mini time slot(s) as widely supported in a fifth generation (5G) or a 5G new-radio (5G-NR) system;

    [0015] FIG. 2 is a schematic diagram of an exemplary transmission circuit wherein a power management integrated circuit (PMIC) and a transceiver circuit are configured according to embodiments of the present disclosure to enable intra-symbol voltage modulation during a voltage modulation interval(s);

    [0016] FIGS. 3A and 3B are block diagrams providing exemplary illustrations of the voltage modulation interval(s) in FIG. 2;

    [0017] FIG. 4 is a block diagram providing an exemplary illustration as to how the PMIC in FIG. 2 can perform intra-symbol voltage modulation during the voltage modulation interval(s);

    [0018] FIG. 5 is a schematic diagram of an exemplary voltage modulation circuit, which can be provided in the PMIC in FIG. 2 to perform intra-symbol voltage modulation during the voltage modulation interval(s); and

    [0019] FIG. 6 is a flowchart of an exemplary process for enabling intra-symbol voltage modulation according to embodiments of the present disclosure.

    DETAILED DESCRIPTION

    [0020] The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.

    [0021] It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

    [0022] It will be understood that when an element such as a layer, region, or substrate is referred to as being “on” or extending “onto” another element, it can be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or extending “directly onto” another element, there are no intervening elements present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being “over” or extending “over” another element, it can be directly over or extend directly over the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly over” or extending “directly over” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.

    [0023] Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.

    [0024] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including” when used herein specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

    [0025] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

    [0026] Embodiments of the disclosure relate to circuit and method for intra-symbol voltage modulation. In an embodiment, a transceiver circuit is configured to divide a voltage modulation interval(s) (e.g., a symbol duration) into multiple voltage modulation subintervals each corresponding to a respective one of multiple voltage targets. Accordingly, a power management integrated circuit (PMIC) can adapt a modulated voltage multiple times within the voltage modulation interval(s) based on multiple voltage targets, respectively. By adapting the modulated voltage within the voltage modulation interval(s), the modulated voltage can be timely adapted to closely track a time-variant power envelope of a radio frequency (RF) signal to thereby avoid potential distortion (e.g., amplitude clipping) during amplification of the RF signal.

    [0027] Before discussing intra-symbol voltage modulation according to the present disclosure, starting at FIG. 2, an overview of orthogonal frequency division multiplexing (OFDM) symbols, which can be used to define durations of voltage modulation intervals, is first provided with reference to FIG. 1.

    [0028] FIG. 1 illustrates an exemplary time slot 10 and a pair of mini time slots 12(1)-12(2) as widely supported in a fifth generation (5G) and 5G new-generation (5G-NR) system. The time slot(s) 10 is configured to include multiple symbols 14(1)-14(14), such as OFDM symbols. The mini time slots 12(1)-12(2) can each include at least two of the symbols 14(1)-14(14). In the example shown in FIG. 1, each of the mini time slots 12(1)-12(2) includes four of the symbols 14(1)-14(14).

    [0029] As previously shown in Table 1, each of the symbols 14(1)-14(14) has a symbol duration that depends on the subcarrier spacing (SCS). In this regard, once the SCS is chosen, the duration and the CP of each of the symbols 14(1)-14(14) are set accordingly. Hereinafter, the duration of the symbols 14(1)-14(14) is used to define the duration of a voltage modulation interval.

    [0030] FIG. 2 is a schematic diagram of an exemplary transmission circuit 16 wherein a PMIC 18 and a transceiver circuit 20 are configured according to embodiments of the present disclosure to enable intra-symbol voltage modulation during each of multiple voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1. Herein, the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1 represent three consecutive voltage modulation intervals among any number of voltage modulation intervals, so chosen for the sole purpose of illustration. Understandably, the voltage modulation interval S.sub.X-1 is an immediately preceding voltage modulation interval of the voltage modulation interval S.sub.X, the voltage modulation interval S.sub.X is an immediately preceding voltage modulation interval of the voltage modulation interval S.sub.X+1, and so on.

    [0031] The transmission circuit 16 further includes a power amplifier circuit 22. The power amplifier circuit 22 is configured to amplify an RF signal 24 based on a modulated voltage Vcc, which can be an envelope tracking (ET) modulated voltage or an average power tracking (APT) modulated voltage. Herein, the transceiver circuit 20 is configured to generate the RF signal 24 and the PMIC 18 is configured to generate the modulated voltage Vcc.

    [0032] Herein, the transceiver circuit 20 is configured to generate the RF signal 24 with a time-variant power envelope P(t) that can increase or decrease multiple times during each of the symbols 14(1)-14(14) in FIG. 1. As such, the PMIC 18 is configured to adapt the modulated voltage Vcc multiple times to thereby generate multiple modulated voltages V.sub.CC1-V.sub.CCN during each of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1. As such, the modulated voltages V.sub.CC1-V.sub.CCN can better track (increase or decrease) the time-variant power envelope P(t) on an intra-symbol basis to help avoid potential distortion (e.g., amplitude clipping) to the RF signal 24 when the RF signal 24 is amplified by the power amplifier circuit 22.

    [0033] According to an embodiment of the present disclosure, the PMIC 18 includes an inter-chip interface 26, a memory circuit 28, and a voltage generation circuit 30. In a non-limiting example, the inter-chip interface 26 can be a multiwire interface, such as an RF front-end (RFFE) interface, that is coupled to the transceiver circuit 20. The transceiver circuit 20 is configured to provide a respective target voltage indication V.sub.TGT(i) (i = X-1, X, X+1, and so on) for each of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1. Each target voltage indication V.sub.TGT(i) is divided into multiple voltage modulation subintervals T.sub.1-T.sub.N and each of the modulation subintervals T.sub.1-T.sub.N is associated with a respective one of multiple voltage targets V.sub.TGT-1-V.sub.TGT-N.

    [0034] The transceiver circuit 20 is configured to divide each of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1 into the modulation subintervals T.sub.1-T.sub.N. In this regard, FIGS. 3A and 3B are block diagrams providing exemplary illustrations of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1. Common elements between FIGS. 2 and 3A-3B are shown therein with common element numbers and will not be re-described herein.

    [0035] In one embodiment, as illustrated in FIG. 3A, the transceiver circuit 20 can divide each of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1 equally. As such, each of the modulation subintervals T.sub.1-T.sub.N will have an identical duration.

    [0036] In another embodiment, as illustrated in FIG. 3B, the transceiver circuit 20 can divide each of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1 unequally such that each of the modulation subintervals T.sub.1-T.sub.N will have different durations. For example, the transceiver circuit 20 can make any of the modulation subintervals T.sub.1-T.sub.N longer if a variation of the modulated voltage Vcc exceeds a preset threshold between adjacent ones of the modulation subintervals T.sub.1-T.sub.N, or make any of the modulation subintervals T.sub.1-T.sub.N shorter if the modulated voltage Vcc remains unchanged or the variation of the modulated voltage Vcc is below the preset threshold in between the adjacent ones of the modulation subintervals T.sub.1-T.sub.N.

    [0037] In another embodiment, the transceiver circuit 20 can also divide some of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1 into the modulation subintervals T.sub.1-T.sub.N with an equal duration, while dividing some other voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1 into the modulation subintervals T.sub.1-T.sub.N with unequal durations. For example, the transceiver circuit 20 can equally divide the voltage modulation interval S.sub.X-1 into the modulation subintervals T.sub.1-T.sub.N with an equal duration and divide each of the voltage modulation intervals S.sub.X and S.sub.X+1 into the modulation subintervals T.sub.1-T.sub.N with unequal durations.

    [0038] With reference back to FIG. 2, the transceiver circuit 20 is also configured to set the voltage targets V.sub.TGT-1-V.sub.TGT-N for each of the modulation subintervals T.sub.1-T.sub.N based on the time-variant power envelope P(t) of the RF signal 24. In a non-limiting example, the transceiver circuit 20 can set a respective one of the voltage targets V.sub.TGT-1-V.sub.TGT-N for a respective one of the modulation subintervals T.sub.1-T.sub.N based on a maximum of the time-variant power envelope P(t) during the respective one of the modulation subintervals T.sub.1-T.sub.N.

    [0039] The transceiver circuit 20 is configured to write the voltage targets V.sub.TGT-.sub.1-V.sub.TGT-.sub.N, in association with the modulation subintervals T.sub.1-T.sub.N, into the memory circuit 28 via the inter-chip interface 26. In one embodiment, the transceiver circuit 20 may write the voltage targets V.sub.TGT-1-V.sub.TGT-N associated with any of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1 prior to a start of the respective voltage modulation interval. For example, the transceiver circuit 20 may write the voltage targets V.sub.TGT-1-V.sub.TGT-N associated with the voltage modulation interval S.sub.X+1 during the voltage modulation interval S.sub.X-1 or the voltage modulation interval S.sub.X. Preferably, the transceiver circuit 20 will write the voltage targets V.sub.TGT-1-V.sub.TGT-N associated with any of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1 during an immediately preceding one of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1. For example, the transceiver circuit 20 will write the voltage targets V.sub.TGT-1-V.sub.TGT-N associated with the voltage modulation interval S.sub.X during the voltage modulation interval S.sub.X-1 and write the voltage targets V.sub.TGT-1-V.sub.TGT-N associated with the voltage modulation interval S.sub.X+1 during the voltage modulation interval S.sub.X.

    [0040] Prior to each of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1, the voltage generation circuit 30 retrieves the voltage targets V.sub.TGT-.sub.1-V.sub.TGT-.sub.N, in association with the modulation subintervals T.sub.1-T.sub.N, from the memory circuit 28. Accordingly, the voltage generation circuit 30 can generate the modulated voltages V.sub.CC-1-V.sub.CC-N during the modulation subintervals T.sub.1-T.sub.N based on the voltage targets V.sub.TGT-.sub.1-V.sub.TGT-.sub.N, respectively.

    [0041] FIG. 4 is a block diagram providing an exemplary illustration as to how the PMIC 18 in FIG. 2 can perform intra-symbol voltage modulation during each of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1. Common elements between FIGS. 2 and 4 are shown therein with common element numbers and will not be re-described herein.

    [0042] The voltage generation circuit 30 is configured to determine multiple starts T.sub.START-1-T.sub.START-N of the modulation subintervals T.sub.1-T.sub.N, respectively. In a non-limiting example, the voltage generation circuit 30 can receive the start T.sub.START-1-T.sub.START-N of the modulation subintervals T.sub.1-T.sub.N from the transceiver circuit 20 together with or separately from the voltage targets V.sub.TGT-1-V.sub.TGT-N. Accordingly, the voltage generation circuit 30 can generate each of the modulated voltages V.sub.CC-1-V.sub.CC-N no later than a respective one of the determined start T.sub.START-1-T.sub.START-N of the voltage modulation subintervals T.sub.1-T.sub.N.

    [0043] According to an embodiment of the present disclosure, the voltage generation circuit 30 is configured to determine whether each of the modulated voltages V.sub.CC-1-V.sub.CC-N is set to increase or decrease during a respective one of the modulation subintervals T.sub.1-T.sub.N. If any of the modulated voltages V.sub.CC-1-V.sub.CC-N is set to increase during the respective one of the modulation subintervals T.sub.1-T.sub.N, the voltage generation circuit 30 may start transitioning to the respective one the modulated voltages V.sub.CC-1-V.sub.CC-N prior to the respective start T.sub.START-1-T.sub.START-N of the respective one of the modulation subintervals T.sub.1-T.sub.N. For example, the voltage generation circuit 30 determines that the modulated voltages V.sub.CC-1 and V.sub.CC-3 are set to increase during the modulation subintervals T.sub.1 and T.sub.3, respectively. Accordingly, the voltage generation circuit 30 will start transitioning to the modulated voltages V.sub.CC-1 and V.sub.CC-3 with a timing advance T.sub.a prior to the respective starts T.sub.START-1 and T.sub.START-3 of the modulation subintervals T.sub.1 and T.sub.3. By starting the transition with the timing advance T.sub.a, the voltage generation circuit 30 can ensure that the modulated voltages V.sub.CC-1 and V.sub.CC-3 can be ramped up to desired levels in time to help avoid amplitude clipping in the RF signal 24.

    [0044] In contrast, if any of the modulated voltages VCC-1-V.sub.CC-N is set to increase, or remain unchanged, during the respective one of the modulation subintervals T.sub.1-T.sub.N, the voltage generation circuit 30 may start transitioning to the respective one the modulated voltages V.sub.CC-1-V.sub.CC-N at the respective start T.sub.START- .sub.1-T.sub.START-N of the respective one of the modulation subintervals T.sub.1-T.sub.N. For example, the voltage generation circuit 30 determines that the modulated voltages V.sub.CC-2 and V.sub.CC-N are set to decrease during the modulation subintervals T.sub.2 and T.sub.N, respectively. Accordingly, the voltage generation circuit 30 will start transitioning to the modulated voltages V.sub.CC-2 and V.sub.CC-N right at the respective starts T.sub.START-2 and T.sub.START-N of the modulation subintervals T.sub.2 and T.sub.N.

    [0045] FIG. 5 is a schematic diagram of the voltage generation circuit 30 configured according to an embodiment of the present disclosure. Common elements between FIGS. 2 and 5 are shown therein with common element numbers and will not be re-described herein.

    [0046] Herein, the voltage generation circuit 30 includes a current modulation circuit 32, a voltage modulation circuit 34, and a control circuit 36. The current modulation circuit 32 includes a multi-level charge pump (MCP) 38 and a power inductor 40. During each of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1, the MCP 38 is configured to generate multiple low-frequency voltages V.sub.DC-1-V.sub.DCN, each as a function of a battery voltage V.sub.BAT, during the modulation subintervals T.sub.1-T.sub.N, respectively. Accordingly, in each of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1, the power inductor 40 is configured to induce multiple low frequency currents |.sub.DC1-|.sub.DCN based on the low-frequency voltages V.sub.DC-1-V.sub.DCN, respectively.

    [0047] The voltage modulation circuit 34 includes a voltage amplifier 42, an offset capacitor C.sub.OFF, and a bypass switch S.sub.BYP. The voltage amplifier 42 is configured to generate multiple modulated initial voltages V.sub.AMP1-V.sub.AMPN based on the voltage targets V.sub.TGT-1-V.sub.TGT-N in the modulation subintervals T.sub.1-T.sub.N, respectively. The offset capacitor C.sub.OFF is modulated by the low frequency currents |.sub.DC1-|.sub.DCN to multiple offset voltages V.sub.OFF1-V.sub.OFFN in the modulation subintervals T.sub.1-T.sub.N, respectively. Each of the offset voltages V.sub.OFF1-V.sub.OFFN will raise a respective one of the modulated initial voltages V.sub.AMP1-V.sub.AMPN to a respective one of the modulated voltages V.sub.CC1-V.sub.CCN. For a specific example as to how the offset voltages V.sub.OFF1-V.sub.OFFN can be modulated by the low frequency currents |.sub.DC1-|.sub.DCN to raise the modulated initial voltages V.sub.AMP1-V.sub.AMPN to the modulated voltages V.sub.CC1-V.sub.CCN, please refer to U.S. Pat. Application No. 17/946,224, entitled “MULTI-VOLTAGE GENERATION CIRCUIT.”

    [0048] The transmission circuit 16 of FIG. 2 can be configured to enable intra-symbol voltage modulation based on a process. In this regard, FIG. 6 is a flowchart of an exemplary process 200 for enabling intra-symbol voltage modulation according to embodiments of the present disclosure.

    [0049] Herein, the PMIC 18 receives the target voltage indications V.sub.TGT(i) each corresponding to a respective one of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1 and comprising the voltage targets V.sub.TGT-1-V.sub.TGT-N each corresponding to a respective one of the voltage modulation subintervals T.sub.1-T.sub.N within the respective one of the voltage modulation intervals S.sub.X-1, S.sub.X, S.sub.X+1 (step 202). Accordingly, the PMIC 18 generates the modulated voltages V.sub.CC1-V.sub.CCN in the voltage modulation subintervals T.sub.1-T.sub.N based on the voltage targets V.sub.TGT-.sub.1-V.sub.TGT-.sub.N, respectively (step 204).

    [0050] Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims that follow.