Mems Film for Semiconductor Device Test Socket Including Mems Bump

Abstract

A microelectromechanical system (MEMS) film for a test socket is arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device and includes a flexible bare film and a plurality of round-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball.

Claims

1. A microelectromechanical system (MEMS) film for a test socket configured to be arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device, the MEMS film comprising: a flexible bare film; and a plurality of round-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball.

2. The MEMS film according to claim 1, further comprising a straight or curved groove at least partially around each of the MEMS bumps.

3. The MEMS film according to claim 1, wherein the MEMS bumps include at least a plurality of first bumps and a plurality of second bumps, the bare film is molded with polyimide that allows a roll-to-roll continuous process and mounted on a supporting member having at least an upper surface and a lower surface in a manner that the bare film wraps the supporting member, the first bumps are arranged in an area corresponding to the upper surface and brought into contact with the conductive ball, and the second bumps are arranged in an area corresponding to the lower surface and brought into contact with the electrode pad.

4. The MEMS film according to claim 1, further comprising: a conductive wire pattern configured to make an electrical connection with each of the MEMS bumps on a bottom of each of the MEMS bumps; and a passivation layer configured to cover the wire pattern while allowing the MEMS bumps to be exposed.

5. A microelectromechanical system (MEMS) film for a semiconductor device test socket, configured to be arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device, the MEMS film comprising: a flexible bare film; and a plurality of step-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface with a height difference.

6. The MEMS film according to claim 5, wherein the step includes an upper step surface and a of lower step surface formed in an alternate manner, and a protruded area at a boundary between the upper step surface and the lower step surface, and the protruded area is configured.

7. The MEMS film according to claim 6, wherein the upper step surface is tapered from an edge side toward a center side leaving only the lower step surface at a center portion of each of the MEMS bumps.

8. A microelectromechanical system (MEMS) film for a semiconductor device test socket, configured to be arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device, the MEMS film comprising: a flexible bare film; and a plurality of MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface with embossing, wherein the embossing forms a protruded area configured to prevent a contact fail even when the conductive ball has a horizontal deviation.

9. The MEMS film according to claim 8, wherein the test socket includes a fixed frame corresponding to the test apparatus, a reciprocating frame on which the semiconductor device is mountable, the reciprocating frame being mounted on the fixed frame in a movable manner in an up and down direction and configured to allow each of the MEMS bumps to be brought into contact with or separated from the electrode pad of the test apparatus, a pair of latch mounted on the fixed frame and configured to prevent floating of the semiconductor device, and a cover mounted on the fixed frame over the reciprocating frame and configured to provide a driving force for the reciprocating frame and the pair of latches.

10. The MEMS film according to claim 9, further comprising: a conductive wire pattern configured to make an electrical connection with each of the MEMS bumps on a bottom of each of the MEMS bumps; a passivation layer on the bare film in an area other than the MEMS bumps; and a groove configured to make each of the MEMS bumps an island, the groove being formed by removing parts of the bare film and the passivation layer with a laser.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG. 1 is a side cross-sectional view of a test socket according to a conventional technology.

[0028] FIG. 2 is a side cross-sectional view of another test socket according to the conventional technology.

[0029] FIG. 3 is a perspective view of a test socket according to some embodiments of the present invention.

[0030] FIGS. 4A, 4B, and 4C are an upper perspective view, a lower perspective view, and a side cross-sectional view of a MEMS film according to some embodiments of the present invention, respectively.

[0031] FIGS. 5A and 5B are pictures of a flat-type MEMS bump and data showing a degree of contact fail of the flat-type MEMS bump according to some embodiments of the present invention.

[0032] FIGS. 6A to 6D are pictures of round-type MEMS bumps and data showing a degree of contact fail of the round-type MEMS bumps according to some embodiments of the present invention.

[0033] FIGS. 7A to 7C are pictures of step-type MEMS bumps and data showing a degree of contact fail of the step-type MEMS bumps according to some embodiments of the present invention.

[0034] FIG. 8 is a side view of an embossing-type MEMS bump according to some embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0035] Various embodiments will be described below in more detail with reference to the accompanying drawings. The present invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. Throughout the disclosure, like reference numerals refer to like parts throughout the various figures and embodiments of the present invention.

[0036] A MEMS film for a semiconductor device test socket according to some embodiments of the present invention is described below with reference to the accompanying drawings.

[0037] Referring to FIG. 3, a test socket 100 according to some embodiments of the present invention is arranged between a semiconductor device such as a semiconductor package and a test apparatus such as a device under test (DUT) board, and performs an electrical test of the semiconductor device.

[0038] To this end, the test socket 100 includes a fixed frame 110 that corresponds to a test board of a test apparatus (not shown), a reciprocating frame 120 mounted on the fixed frame 110 in a movable manner in the up and down direction, on which a semiconductor device 102 is mounted, and allowing a MEMS bump 148 (see FIG. 4C) to be brought into contact with or separated from a electrode pad of the test apparatus, a pair of latches 130 mounted on the fixed frame 110 and configured to prevent floating of the semiconductor device 102 (see FIG. 4C), a cover 140 mounted on the fixed frame 110 over the reciprocating frame 120 and configured to provide driving force of the reciprocating frame 120 and the pair of latches 130, and a contact assembly P that electrically connects the test apparatus and the semiconductor device 102 by using a MEMS film 144 fixed on a supporting member of a predetermined shape (not shown).

[0039] The MEMS film 144 is mounted on the supporting member having at least an upper surface and a lower surface in a manner that the bare film wraps the supporting member, and in some embodiments, includes a first bump, which is brought into contact with a conductive ball 104 of the semiconductor device 102 in an area corresponding to the upper surface and a second bump, which is brought into contact with an electrode pad of the test apparatus in an area corresponding to the lower surface.

[0040] Referring FIGS. 4A, 4B, and 4C, the MEMS film 144 includes a flexible bare film 146 and a plurality of MEMS bumps 148 each being formed on the bare film 146 by way of a MEMS process, having an electrical contact with the electrode pad of the test apparatus or the conductive ball 104 of the semiconductor device 102, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball 104.

[0041] In the drawings, a configuration of a wire pattern that electrically connects the bumps and a passivation layer for insulating the wire pattern is omitted.

[0042] The bare film 146 is formed with polyimide (PI) or polyethylene terephthalate (PET) material. The MEMS film 144 is obtained by processing the bare film 146 on a wafer by way of the MEMS technique and the performing a singulation process in which the MEMS film 144 is diced into an individual unit.

[0043] The reason why the MEMS film 144 obtained by forming an MEMS element on the polyimide (PI) bare film 146 is used as the contact assembly P in the present disclosure is because the continuity of a process for mass production can be ensured by a roll-to-roll process. Further, it is the most suitable way to achieve a fine pitch by way of the MEMS process. The polyimide (PI) bare film 146 has excellent elastic force and restoring force with excellent property in restoring its original state after a test without causing physical impact or damage on the semiconductor device 102 and the test apparatus. In addition, the polyimide (PI) bare film 146 offers an easy assembly with the test socket 100.

[0044] Moreover, when using an elastic member for providing elasticity on the back side of the film, the MEMS film 144 is capable of transferring the elasticity of the elastic member owing to the flexibility thereof. As the MEMS film 144 is mounted on the supporting member (not shown) in a manner that the film wraps the supporting member, the flexibility is a fundamental property. If necessary, a wrapping means can be provided in a wrapping area.

[0045] The MEMS bump 148 performs a contact function of making contact with the conductive ball 104 of the semiconductor device 102 or the electrode pad of the test apparatus.

[0046] The MEMS bump 148 is formed with electrically conductive material such as gold (Au), silver (Ag), copper (Cu), tungsten (W), titanium (Ti), molybdenum (Mo), nickel (Ni), beryllium (Be), aluminum (Al), or alloy thereof. Such a bump has a natural oxide layer on its surface, which is generated during a process of forming the bump. The natural oxide layer is formed on the contact surface of the bump and affects the conduction with the conductive ball 104 of the semiconductor device 102, and hence it works as a factor for degrading the electrical performance.

[0047] Therefore, as the contact surface of the MEMS bump 148 becomes sharp, the contact property can be enhanced in which the contact is achieved by breaking the natural oxide layer. When the MEMS bump 148 is formed in a flat type as shown in FIG. 5A, when making contact with the conductive ball 104, it may be hard to achieve the electrical contact due to the natural oxide layer. In this case, as shown in FIG. 5B, a number of contact fails are generated.

[0048] In some embodiments, the MEMS bump 148 is formed in a round type as shown in FIGS. 6A to 6C. With the round-type MEMS bump 148, as shown in FIG. 6D, the contact fails are decreased, compared to the flat type. However, as the round type bump has a protruded area only at the center portion of the bump, the contact fail may still exist.

[0049] In some embodiments, the MEMS bump 148 is formed in a step type having a height difference as shown in FIGS. 7A and 7B. The step includes an upper step surface and a lower step surface formed in an alternate manner and a protruded area at a boundary of the upper step surface and the lower step surface. The conductive ball 104 is settled on the upper step surface, and the contact with the conductive ball 104 is achieved at the boundary by breaking the natural oxide layer, and hence the overall contact property is improved.

[0050] For example, the upper step surface is tapered from the edge side toward the center side, leaving only the lower step surface at the center portion, and hence a plurality of protruded areas is generated at the center portion. With this structure, as shown in FIG. 7C, virtually no contact fails are generated.

[0051] In some embodiments, the MEMS bump 148 is formed in an embossing type including a plurality of embossings as shown in FIG. 8. When the MEMS bump 148 is formed in the embossing type, each embossing forms the protruded area, such that a plurality of protruded areas exists uniformly in the entire area, and hence, even when there is a horizontal deviation in the conductive ball 104, the contact fail can be minimized.

[0052] A conductive wire pattern 148a for electrically connecting the bumps is formed on the bare film 146, as well as the MEMS bump 148, and a passivation layer 148b for allowing the wire pattern 148a to be covered and the MEMS bump 148 to be exposed is further formed. Specifically, the embossing-type MEMS bump 148 is formed on the wire pattern 148a.

[0053] In some embodiments, the MEMS film 144 further includes a groove 148c of a straight or curved shape around each MEMS bump 148 as shown in FIGS. 6C and 7B. The groove 148c is formed by removing a part of the MEMS film 144.

[0054] Even when the bare film 146 is formed with polyimide (PI) material, the flexibility shows a certain limit. Further, the height of the MEMS bump 148 has a certain deviation (fluctuation). Therefore, the vertical deviation affects the contact between the conductive ball 104 and the MEMS bump 148. To cope with this problem, in some embodiments of the present invention, the groove 148c having various shapes such as a straight line, a curved line, or the like is formed around the MEMS bump 148 on the MEMS film 144.

[0055] In order to allow the MEMS bump 148 to exhibit the contact property independently from other surrounding bumps and to be freed from rigidity of the film without being restricted by the MEMS film 144, the groove 148c can be formed around the MEMS bump 148 of the bare film 146 that is MEMS processed, such that the MEMS bump 148 is brought into contact with the conductive ball 104 of the semiconductor device in a flexible manner.

[0056] In some embodiments, the groove 148c is formed by a laser cutting process or an etching process.

[0057] As described above, it is found that the present disclosure describes a technical idea with a configuration in which a test socket is manufactured by using a micromachining technique that is used for machining a microelectromechanical structure in units of micrometers, particularly, each bump is provided with flexibility in a manner that the bump is free from an influence of the film and has a capability of actively reacting to the vertical deviation, and each bump is provided with round, step, and embossing to improve the contact property.

[0058] Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the disclosure in its broader aspects is not limited to the specific details and representative embodiments shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.