FILM FORMATION APPARATUS AND FILM FORMATION METHOD FOR FORMING METAL FILM
20230124546 · 2023-04-20
Inventors
- Haruki KONDOH (Okazaki-shi, JP)
- Koji INAGAKI (Toyota-shi, JP)
- Keiji KURODA (Toyota-shi, JP)
- Kazuaki OKAMOTO (Toyota-shi, JP)
Cpc classification
C25D17/00
CHEMISTRY; METALLURGY
C25D17/002
CHEMISTRY; METALLURGY
C25D17/10
CHEMISTRY; METALLURGY
International classification
C25D17/10
CHEMISTRY; METALLURGY
C25D17/00
CHEMISTRY; METALLURGY
Abstract
A film formation apparatus includes an anode, a solid electrolyte membrane between the anode and a substrate, a power supply that applies voltage between the anode and the substrate as a cathode, and a liquid reservoir that holds the anode and the solid electrolyte membrane while separating them apart from each other, the liquid reservoir storing electrolyte solution including metal ions between the anode and the solid electrolyte membrane. The solid electrolyte membrane includes a central portion that comes in contact with the substrate and the electrolyte solution, and an outer edge portion outside the central portion. The apparatus includes a membrane tensioning mechanism to apply a tensile force to the central portion toward the outer edge portion while storing the heated electrolyte solution in the liquid reservoir, to elongate the central portion.
Claims
1. A film formation apparatus for forming a metal film, comprising: an anode; a solid electrolyte membrane disposed between the anode and a substrate; a power supply that applies a voltage between the anode and the substrate serving as a cathode; and a liquid reservoir that holds the anode and the solid electrolyte membrane while separating the anode and the solid electrolyte membrane apart from each other, the liquid reservoir storing an electrolyte solution comprising metal ions between the anode and the solid electrolyte membrane, the film formation apparatus being configured to apply a voltage between the anode and the substrate while allowing the solid electrolyte membrane to be in contact with the substrate to reduce the metal ions in the solid electrolyte membrane, and form the metal film on a surface of the substrate, wherein, the solid electrolyte membrane comprises a central portion, which is a portion that comes into contact with the substrate and the electrolyte solution, and an outer edge portion located outside the central portion, the film formation apparatus further comprises a membrane tensioning mechanism configured to apply a tensile force from the central portion toward the outer edge portion while storing the heated electrolyte solution in the liquid reservoir, to elongate the central portion of the solid electrolyte membrane.
2. The film formation apparatus for forming a metal film according to claim 1, wherein the membrane tensioning mechanism at least comprises: a frame that sandwiches the outer edge portion, which is bent along an outer side face of the liquid reservoir, with the outer side face; and a tensioning device configured to slide the frame along the outer side face so as to apply the tensile force to the central portion.
3. The film formation apparatus for forming a metal film according to claim 1, wherein the membrane tensioning mechanism at least comprises: a winder, around which the outer edge portion of the solid electrolyte membrane is partially wound; and a tensioning device configured to rotate the winder while allowing the outer edge portion to be in contact with the winder so as to apply the tensile force to the central portion.
4. The film formation apparatus for forming a metal film according to claim 1, wherein the membrane tensioning mechanism at least comprises: a membrane support that supports the outer edge portion of the solid electrolyte membrane; a rod member that abuts on the outer edge portion and is movable in the film thickness direction of the solid electrolyte membrane relative to the solid electrolyte membrane; and a tensioning device configured to move the rod member in the film thickness direction while the outer edge portion is supported by the membrane support, thus applying a tensile force to the central portion.
5. The film formation apparatus for forming a metal film according to claim 1, further comprising: a first temperature sensor that detects the first temperature of the solid electrolyte membrane; a second temperature sensor that detects the second temperature of the substrate; a third temperature sensor that detects the third temperature of the electrolyte solution; and a controller programmed to receive the first temperature information from the first temperature sensor, the second temperature information from the second temperature sensor, and the third temperature information from the third temperature sensor when the liquid reservoir stores the electrolyte solution, and control the membrane tensioning mechanism to operate if the first temperature information, the second temperature information, and the third temperature information are within a predetermined range.
6. A film formation method for forming a metal film on a surface of a substrate, wherein a voltage is applied between an anode and the substrate serving as a cathode while pressing the substrate with a solid electrolyte membrane under liquid pressure of an electrolyte solution to reduce metal ions contained in the solid electrolyte membrane, the method comprising: bringing the solid electrolyte membrane into contact with a surface of the substrate; pouring the electrolyte solution that is heated between the anode and the solid electrolyte membrane; keeping the electrolyte solution stored, and stretching the solid electrolyte membrane by applying a tensile force from a central portion, which is a portion of the solid electrolyte membrane that comes into contact with the substrate and the electrolyte solution, toward an outer edge portion located outside of the central portion, to elongate the central portion of the solid electrolyte membrane; and pressing the substrate with the stretched solid electrolyte membrane under liquid pressure of the stored electrolyte solution, and applying a voltage between the anode and the substrate to form the metal film.
7. The film formation method for forming a metal film according to claim 6, wherein the step of stretching the solid electrolyte membrane comprises sandwiching the outer edge portion, which is bent along an outer side face of a liquid reservoir storing the electrolyte solution, between a frame disposed to at least partially surround the outer edge portion and the outer side face of the liquid reservoir, and sliding the frame along the outer side face so as to apply a tensile force to the central portion.
8. The film formation method for forming a metal film according to claim 6, wherein the step of stretching the solid electrolyte membrane comprises bringing the outer edge portion into contact with a winder, around which the outer edge portion is partially wound; and rotating the winder so as to apply the tensile force to the central portion.
9. The film formation method for forming a metal film according to claim 6, wherein the step of stretching the solid electrolyte membrane comprises: while allowing a membrane support to support the outer edge portion of the solid electrolyte membrane, moving a rod member in a film thickness direction of the solid electrolyte membrane, the rod member being movable in the film thickness direction relative to the solid electrolyte membrane, thus applying a tensile force to the central portion.
10. The film formation method for forming a metal film according to claim 6, wherein the step of stretching the solid electrolyte membrane comprises: when the electrolyte solution is stored between the anode and the solid electrolyte membrane, applying a tensile force to the central portion if a temperature of the solid electrolyte membrane, a temperature of the substrate, and a temperature of the electrolyte solution are within a predetermined range.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0021]
[0022]
[0023]
[0024]
[0025]
[0026]
[0027]
DETAILED DESCRIPTION
[0028] The following describes a film formation apparatus capable of implementing a metal-film formation method according to one embodiment of the present disclosure.
First Embodiment
[0029]
[0030] As shown in
[0031] As shown in
[0032] The substrate B is not particularly limited in material as long as it functions as a cathode (that is, a surface having conductivity), and may be made of a metal material such as aluminum or iron or may be made of resins or ceramics coated with a metal layer such as copper, nickel, silver, or iron.
[0033] As shown in
[0034] As shown in
[0035] The anode 11 is attached to the upper casing 15 made of a conductive material (e.g., metal). The positive electrode of the power supply 14 is connected to the upper casing 15 via conducting wire. This means that the anode 11 is electrically connected to the positive electrode of the power supply 14 via the upper casing 15 and the conducting wire. Note here that the upper casing 15 may be made of a non-conductive material. In this case, the anode 11 is directly connected to conducting wire passing through the upper casing 15, and is electrically connected to the positive electrode of the power supply 14 via this conducting wire.
[0036] As stated above, the electrolyte solution L is liquid containing the metal of the metal film F to be formed in an ionic state, and examples of the metal include copper, nickel, silver and iron. The electrolyte solution L is an aqueous solution (ionization) of these metals with an acid, such as nitric acid, phosphoric acid, succinic acid, nickel sulfate, or pyrophosphoric acid. For example, when the metal is nickel, the electrolyte solution L may be an aqueous solution of nickel nitrate, nickel phosphate, nickel succinate, nickel sulfate, or nickel pyrophosphate.
[0037] When being brought into contact with the electrolyte solution L as stated above, the solid electrolyte membrane 13 is impregnated with (contains) metal ions. The solid electrolyte membrane 13 is not limited as long as the metal ions are reduced at the substrate B when a voltage is applied from the power supply 14 and metal derived from the metal ions is deposited. The material of the solid electrolyte membrane 13 may be resins having an ion exchange function, and examples include fluorine-based resin, such as Nafion (registered trademark) manufactured by DuPont, hydrocarbon resin, polyamic acid resin, and Selemion (CMV, CMD, CMF series) manufactured by Asahi Glass Co. As shown in
[0038] As shown in
[0039] The body 15a has a rectangular cross section that surrounds the anode 11. The body 15a is placed around the anode 11, and has an inner side face, to which the anode 11 is attached. The body 15a has a supply channel 16 to supply electrolyte solution L to the storage space S and a discharge channel 17 to discharge electrolyte solution L from the storage space S. These supply channel 16 and discharge channel 17 are holes that penetrate through the body 15a in the left-right direction. The supply channel 16 is fluidly connected to a supply pipe 50 described below, and the discharge channel 17 is fluidly connected to a discharge pipe 52 described below. The film formation apparatus 1 is provided with a heater (not shown) upstream of the supply channel 16 (for example, in a tank T storing the electrolyte solution L), and the electrolyte solution L heated by this heater is supplied to the storage space S via the supply channel 16.
[0040] As shown in
[0041] Next, the following describes a mechanism to circulate the electrolyte solution L in the film formation apparatus 1. As shown in
[0042] In this embodiment, the film formation apparatus 1 includes an elevating mechanism, not shown, above the upper casing 15. Examples of the elevating mechanism include a cylinder of a hydraulic type or a pneumatic type, which enables the solid electrolyte membrane 13 to move up and down to bring the solid electrolyte membrane 13 into contact with and separate it from the substrate B. The elevating mechanism to bring the solid electrolyte membrane 13 into contact with and separate it from the substrate B may be placed below the lower casing 21. In this case, the substrate B may be moved up and down to bring the solid electrolyte membrane 13 into contact with and separate it from the substrate B.
[0043] As shown in
[0044] Specifically, as shown in
[0045] As shown in
[0046] As shown in
[0047] As shown in
[0048] The controller 40 operates the above-mentioned elevating mechanism (not shown) so that the solid electrolyte membrane 13 comes into contact with the substrate B, and then controls the operation of the pump P to supply the heated electrolyte solution L in the upper casing 15 (storage space S). The controller 40 controls to fill the storage space S with the heated electrolyte solution L first, and then operate the membrane tensioning unit 18. An operation timing of the membrane tensioning unit 18 is shown below.
[0049] As shown in
[0050] Next, the film formation method using the film formation apparatus 1 according to the present embodiment will be described. The film formation method according to the present embodiment applies a voltage between the anode 11 and the substrate B serving as a cathode while pressing the substrate B with the solid electrolyte membrane 13 under liquid pressure of the electrolyte solution L so as to reduce metal ions contained in the solid electrolyte membrane 13, thus forming a metal film F on the surface of the substrate B.
[0051] As shown in
[0052] Next, as shown in
[0053] Next, as shown in
[0054] Next, as shown in
[0055] Alternatively, if the temperature of the solid electrolyte membrane 13, the temperature of the substrate B, and the temperature of the electrolyte solution L stored between the anode 11 and the solid electrolyte membrane 13 are within a predetermined range, this step of stretching the solid electrolyte membrane may slide the frame 18a upward by the electric motor M in response to a driving signal from the controller 40 to apply a tensile force to the central portion 13a. This allows for more reliable elimination of sagging in the central portion 13a of the solid electrolyte membrane 13.
[0056] Next, as shown in
[0057] The following describes the advantageous effects of the film formation apparatus 1 according to the present embodiment and the film formation method using this film formation apparatus 1.
[0058] As described above, the film formation apparatus 1 according to the present embodiment stores the heated electrolyte solution L in the upper casing 15, and the membrane tensioning unit 18 of the film formation apparatus 1 then applies a tensile force to the central portion 13a of the solid electrolyte membrane 13 from the central portion 13a toward the outer edge portion 13b to elongate the central portion 13a of the solid electrolyte membrane 13. The film formation method according to the present embodiment includes the step of, while storing the electrolyte solution L, stretching the solid electrolyte membrane 13 by applying a tensile force to the central portion 13a of the solid electrolyte membrane 13 in the direction from the central portion 13a to the outer edge portion 13b so as to elongate the central portion 13a. Therefore, even when the solid electrolyte membrane 13 thermally expands due to heated electrolyte solution L poured into the upper casing 15, which causes sagging of the solid electrolyte membrane 13 against the surface of the substrate B, the tensile force applied to the central portion 13a toward the outer edge portion 13b elongates the central portion 13a of the solid electrolyte membrane 13. In this way, the present embodiment applies a voltage between the anode 11 and the substrate B after eliminating the sagging of the solid electrolyte membrane 13, that is, while keeping the solid electrolyte membrane 13 flat. This suppresses unevenness in the metal film F deposited on the surface of the substrate B, and thereby suppresses fluctuations in film thickness of the metal film F.
[0059] As described above, the membrane tensioning unit 18 at least includes the frame 18a that sandwiches the outer edge portion 13b, which is bent along the outer side face 15b1 of the upper casing 15, between it and the outer side face 15b1, and the electric motor M that slides the frame 18a along the outer side face 15b1 to apply a tensile force to the central portion 13a. The step of stretching the solid electrolyte membrane 13 sandwiches the outer edge portion 13b, which is bent along the outer side face 15b1 of the upper casing 15, between the frame 18a and the outer side face 15b1, and slides the frame 18a along the outer side face 15b1 to apply a tensile force to the central portion 13a. Therefore, when the frame 18a is slid along the outer side face the outer edge portion 13b of the solid electrolyte membrane 13 moves uniformly by the frictional force with the frame 18a. Accordingly, an isotropic tensile force acts on the central portion 13a of the solid electrolyte membrane 13, stretching the central portion 13a outward, which elongates the central portion 13a more uniformly. This forms a smooth metal film F because a voltage can be applied between the anode 11 and the substrate B after correcting the sagging in the solid electrolyte membrane 13 due to thermal expansion.
[0060] The film formation apparatus 1 according to the present embodiment includes the controller 40 that receives the first temperature information from the first temperature sensor 42, the second temperature information from the second temperature sensor 44, and the third temperature information from the third temperature sensor 46 when the upper casing 15 stores the electrolyte solution L, and controls the membrane tensioning unit 18 to operate if the first temperature information, the second temperature information, and the third temperature information are within a predetermined range. The film formation method according to the present embodiment includes the step of stretching the solid electrolyte membrane 13, and if the temperature of the solid electrolyte membrane 13, the temperature of the substrate B, and the temperature of the electrolyte solution L stored between the anode 11 and the solid electrolyte membrane 13 are within a predetermined range, this step applies the tensile force to the central portion. Therefore, even when the solid electrolyte membrane 13 sags due to thermal expansion, if the temperatures of the solid electrolyte membrane 13, the substrate B, and the electrolyte solution L are within a predetermined range, the step applies a tensile force to the central portion 13a of the solid electrolyte membrane 13 toward the outer edge portion 13b to elongate the central portion 13a of the solid electrolyte membrane 13. In this way, when the temperature difference between the solid electrolyte membrane 13, the substrate B, and the electrolyte solution L becomes small or when they have no temperature difference, in other words, when it is determined that additional sagging of the solid electrolyte membrane 13 is unlikely to occur due to such a temperature difference, the step elongates the central portion 13a of the solid electrolyte membrane 13. This allows a smoother metal film F to be formed because a voltage can be applied between the anode 11 and the substrate B after ensuring the correction of the sagging in the solid electrolyte membrane 13 due to thermal expansion.
Second Embodiment
[0061]
[0062] As shown in
[0063] In one example, the rotary drum 19a is a cylindrical member, and is attached to the lower protrusion 15b of the upper casing 15 so that at least a part of the outer peripheral surface is exposed. In the present embodiment, a part of the outer peripheral surface of the rotary drum 19a is exposed from the lower protrusion 15b, and the other part is housed inside the lower protrusion 15b. The rotary drum 19a has the outer peripheral surface exposed from the lower protrusion 15b, around which the outer edge portion 13b of the solid electrolyte membrane 13 is partially wound. The outer edge portion 13b of the solid electrolyte membrane 13 includes a wound portion 13e, which is wound around the rotary drum 19a.
[0064] As shown in
[0065] As shown in
[0066] The film formation method according to the present disclosure includes the step of stretching the solid electrolyte membrane 13, and this step rotates the rotary drum 19a by the driving force of the electric motor M while keeping the outer edge portion 13b into contact with the rotary drum 19a, around which the outer edge portion 13b is partially wound, thus acting a tensile force on the central portion 13a.
[0067] As described above, the membrane tensioning unit 19 according to the present embodiment at least includes the rotary drum 19a, around which the outer edge portion 13b of the solid electrolyte membrane 13 is partially wound, and the electric motor M that rotates the rotary drum 19a while keeping the outer edge portion 13b into contact with the rotary drum 19a, thus applying a tensile force to the central portion 13a. The film formation method according to the present disclosure includes the step of stretching the solid electrolyte membrane 13, and this step rotates the rotary drum 19a by the driving force of the electric motor M while keeping the outer edge portion 13b into contact with the rotary drum 19a, around which the outer edge portion 13b is partially wound, thus applying a tensile force to the central portion 13a. The rotation of the rotary drum 19a therefore winds the outer edge portion 13b of the solid electrolyte membrane 13 partially around the rotary drum 19a due to the frictional force with the rotary drum 19a. This causes the central portion 13a of the solid electrolyte membrane 13 to be stretched outward for elongation. This forms a smooth metal film F because a voltage can be applied between the anode 11 and the substrate B after correcting the sagging in the solid electrolyte membrane 13 due to thermal expansion.
Third Embodiment
[0068]
[0069] As shown in
[0070] As shown in
[0071] As shown in
[0072] As shown in
[0073] The film formation method according to the present embodiment includes the step of stretching the solid electrolyte membrane 13, and this step moves the pin 20b, which is movable above the outer edge portion 13b in the vertical direction relative to the solid electrolyte membrane 13, downward by the driving force of the electric motor M while supporting the outer edge portion 13b with the membrane support 20a that supports the outer edge portion 13b from below, thus applying a tensile force to the central portion 13a.
[0074] As described above, the membrane tensioning unit 20 according to the present embodiment at least includes the membrane support 20a that supports the outer edge portion 13b of the solid electrolyte membrane 13 from below, the pin 20b that abuts on the solid electrolyte membrane 13 above the outer edge portion 13b and is movable in the vertical direction relative to the solid electrolyte membrane 13, and the electric motor M that moves the pin 20b downward while the outer edge portion 13b is supported by the membrane support 20a, thus applying a tensile force to the central portion 13a. The film formation method according to the present embodiment moves the pin 20b, which is movable above the outer edge portion 13b in the vertical direction relative to the solid electrolyte membrane 13, downward while supporting the outer edge portion 13b with the membrane support 20a that supports the outer edge portion 13b from below, thus applying a tensile force to the central portion 13a. This means that, when the pin 20b moves downward, the outer edge portion 13b of the solid electrolyte membrane 13 is pushed downward by the pin 20b while being supported by the membrane support 20a. This causes the central portion 13a of the solid electrolyte membrane 13 to be stretched outward for elongation. This forms a smooth metal film F because a voltage can be applied between the anode 11 and the substrate B after correcting the sagging in the solid electrolyte membrane 13 due to thermal expansion.
EXAMPLES
[0075] The following describes the present disclosure by way of examples.
Example 1
[0076] A glass epoxy substrate (ABF) including the layers of glass fiber cloth impregnated with epoxy resin was prepared for the substrate, on which a film is to be formed. Copper foil was formed on the surface of this glass epoxy substrate.
[0077] Next, a copper film was formed using the film formation apparatus according to the present embodiment shown in
Comparative Example 1
[0078] The film was formed similarly to Example 1. The difference from Example 1 is that a copper film was formed using a film formation apparatus that did not have a membrane tensioning unit 18 as a membrane tensioning mechanism.
Confirmation Of Film Formed
[0079] The substrates with the film formed as described above were observed with a scanning microscope, about the presence or not of unevenness of the metal film.
TABLE-US-00001 Sample No. Sag occurred Evaluation 1 No Good 2 No Good 3 No Good 4 No Good
TABLE-US-00002 Sample No. Sag occurred Evaluation 1 Yes Bad 2 Yes Bad 3 Yes Bad 4 Yes Bad
Results and Consideration
[0080] As is clear from Table 1, no unevenness was observed in all the points inspected of Example 1. Therefore, it is considered that, even when the electrolyte solution heated to 42° C. was poured into the upper casing, the film was formed while eliminating the sagging of the solid electrolyte membrane 13 due to thermal expansion. Presumably, the film was formed while keeping the solid electrolyte membrane flatter, because a tensile force was applied to the central portion of the solid electrolyte membrane toward the outer edge portion to elongate the central portion of the solid electrolyte membrane. Presumably, this suppressed the unevenness of the metal film formed on the surface of the substrate, and formed the metal film with less fluctuation in film thickness.
[0081] In contrast, Table 2 clearly shows that unevenness was observed in all inspected points in Comparative Example 1. Presumably, after the electrolyte solution heated to 42° C. was poured into the upper casing, the film was formed without eliminating the sagging of the solid electrolyte membrane due to the heated electrolyte solution.
[0082] That is descriptions on some embodiments of the present disclosure. The present disclosure is not limited to the film formation apparatuses 1, 1A, and 1B according to the above embodiments but includes all configurations included in the concept and claims of the disclosure. The configurations may be selectively combined as appropriate so as to cope with the above-mentioned problems and achieve advantageous effects. For example, the shape, material, arrangement, size, etc. of each component in the above embodiments can be appropriately changed depending on the specific embodiment of the present disclosure.