PROCESS FOR PRODUCING CABLE WITH INSULATION LAYER

Abstract

The present disclosure provides a process. In an embodiment, the process includes providing an initial cable core. The initial cable core includes (i) a conductor and (ii) an initial insulation layer. The initial insulation layer includes a crosslinkable polymeric composition composed of (a) an ethylene-based polymer composed of (1) ethylene monomer, (2) an optional -olefin comonomer, and (3) an optional organosiloxane comonomer. The crosslinkable polymeric composition further includes (b) dicumyl peroxide (DCP), (c) an SiH containing (AP) scavenger, (d) optional curing coagent, and (e) optional anti-oxidant. The process includes subjecting the initial cable core to a crosslinking procedure sufficient to crosslink the crosslinkable polymeric composition and form a cable core with a crosslinked insulation layer.

Claims

1. A process comprising: providing an initial cable core comprising (i) a conductor, (ii) an initial insulation layer comprising a crosslinkable polymeric composition comprising (a) an ethylene-based polymer comprising (1) ethylene monomer, (2) an optional -olefin comonomer, (3) an optional organosiloxane comonomer, (b) dicumyl peroxide (DCP), (c) an SiH containing (AP) scavenger, (d) optional curing coagent, and (e) optional anti-oxidant; subjecting the initial cable core to a crosslinking procedure sufficient to crosslink the crosslinkable polymeric composition and form a cable core with a crosslinked insulation layer.

2. The process of claim 1 comprising cooling the cable core with crosslinked insulation layer to ambient temperature to form a cooled cable core with a crosslinked insulation layer.

3. The process of claim 2 wherein the crosslinking procedure forms dicumyl peroxide decomposition byproducts selected from the group consisting of cumyl alcohol (CA), acetophenone (AP), methane, alpha methyl styrene, and combinations thereof, the process comprising cooling the cable core with crosslinked insulation layer to ambient temperature to form a cooled cable core with a crosslinked insulation layer having an R.sub.AP/CA value less than 0.57.

4. The process of claim 3 wherein the crosslinked insulation layer of the cooled cable core has an R.sub.AP/CA value less than 0.57 at a time from 1 minute after the crosslinking procedure and being cooled to ambient temperature to 60 minutes after the crosslinking procedure and being cooled to ambient temperature.

5. The process of claim 2 wherein the cooled cable core with a crosslinked insulation layer is composition (C), and a similar composition (SC) is defined as an identical composition to (C) except (SC) does not contain component (c), the SiH containing (AP) scavenger, wherein composition (C) has an R.sub.AP/CA and composition (SC) has an R.sub.AP/CA(SC), and composition (C) has a Reduction in R.sub.AP/CA that is least 2.0% greater than R.sub.AP/CA (SC) as determined by Formula 5
Reduction in R.sub.AP/CA%=[(R.sub.AP/CA(C)R.sub.AP/CA(SC))/R.sub.AP/CA(SC)]100%.Formula 5

6. The process of claim 2 comprising degassing, after the cooling, the cooled cable core with a crosslinked insulation layer; and reducing the amount of acetophenone in the crosslinked insulation layer to less than 1000 ppm.

7. The process of claim 1 wherein the SiH containing (AP) scavenger is selected from the group consisting of (s1) through (s20) below ##STR00013## ##STR00014## and combinations thereof.

8. A cable comprising: a cable core comprising (i) a conductor; (ii) a crosslinked insulation layer formed from a crosslinkable polymeric composition comprising (a) an ethylene-based polymer comprising (1) ethylene monomer, (2) an optional -olefin comonomer, (3) an optional organosiloxane comonomer, (b) dicumyl peroxide (DCP), (c) an SiH containing (AP) scavenger, (d) optional curing coagent, and (e) optional anti-oxidant.

9. The cable of claim 8 wherein the SiH containing (AP) scavenger is selected from the group consisting of (s1) through (s20) below ##STR00015## ##STR00016## and combinations thereof.

10. The cable of claim 8 wherein the crosslinked insulation layer comprises from 95 wt % to 99.9 wt % of an ethylene homopolymer; and from 0.1 wt % to 1.0 wt % the SiH containing (AP) scavenger.

11. The cable of claim 10 comprising from 0.1 wt % to 1.0 wt % of a curing coagent.

12. The cable of claim 8 wherein the crosslinked insulation layer comprises from 95 wt % to 99.9 wt % of an ethylene/organosiloxane copolymer; and from 0.1 wt % to 1.0 wt % the SiH containing (AP) scavenger.

13. The cable of claim 8 wherein the cable core is a cooled cable core comprising a crosslinked insulation layer comprising decomposition byproducts selected from the group consisting of cumyl alcohol (CA), acetophenone (AP), methane, alpha methyl styrene, and combinations thereof; and the crosslinked insulation layer of the cooled cable core has an R.sub.AP/CA value less than 0.57 at a time from 1 minute after the crosslinking procedure and being cooled to ambient temperature to 60 minutes after the crosslinking procedure and being cooled to ambient temperature and prior to a degassing procedure.

14. The cable of claim 13 wherein the cooled cable core with a crosslinked insulation layer is composition (C); a similar composition (SC) is defined as an identical composition to (C) except (SC) does not contain component (c), the SiH containing (AP) scavenger; composition (C) has an R.sub.AP/CA (C) and composition (SC) has an R.sub.AP/CA (SC); and composition (C) has a Reduction in R.sub.AP/CA that is least 2.0% greater than R.sub.AP/CA (SC) as determined by Formula 5 $\begin{array}{cc}\mathrm{Reduction}\mathrm{in}{R}_{\mathrm{AP}/\mathrm{CA}}\%=\left[\left(R_{\mathrm{AP}/\mathrm{CA}}\left(C\right)-R_{\mathrm{AP}/\mathrm{CA}}\left(SC\right)\right)/R_{\mathrm{AP}/\mathrm{CA}}\left(SC\right)\right]100\%.& \mathrm{Formula}5\end{array}$

15. The cable of claim 7 comprising a first crosslinked polymeric semiconductive layer; and an optional second crosslinked polymeric semiconductive layer.

Description

DETAILED DESCRIPTION

[0034] The present disclosure provides a process. In an embodiment, the process includes providing an initial cable core. The initial cable core includes (i) a conductor, (ii) an initial insulation layer. The initial insulation layer includes a crosslinkable polymeric composition composed of a) an ethylene-based polymer composed of (1) ethylene monomer, (2) an optional -olefin comonomer, and (3) an optional organosiloxane comonomer. The crosslinkable polymer composition further includes (b) dicumyl peroxide (DCP), (c) an SiH containing acetophenone (AP) scavenger, (d) optional curing coagent, and (e) optional anti-oxidant. The process includes subjecting the initial cable core to a crosslinking procedure sufficient to crosslink the crosslinkable polymeric composition and form a cable core with a crosslinked insulation layer.

1. Initial Cable Core

[0035] The process includes providing an initial cable core. The initial cable core includes (i) a conductor, (ii) a first polymeric semiconductive layer, and (iii) an initial insulation layer composed of a crosslinkable polymeric composition. A conductor, as used herein, is one or more wire(s) or fiber(s) for conducting heat, light, and/or electricity. The conductor may be a single-wire/fiber or a multi-wire/fiber and may be in strand form or in tubular form. Non-limiting examples of suitable conductors include metals such as silver, gold, copper, carbon, and aluminum. The conductor may also be optical fiber made from either glass or plastic. A cable, as used herein, is at least one wire or optical fiber within a sheath, e.g., an insulation covering or a protective outer jacket. Typically, a cable is two or more wires or two or more optical fibers bound together, typically in a common insulation covering and/or protective jacket. The individual wires or fibers inside the sheath may be bare, covered or insulated. Combination cables may contain both electrical wires and optical fibers. The cable can be designed for low, medium, and/or high voltage applications. Alternating current cables can be prepared according to the present disclosure, which can be low voltage, medium voltage, high voltage, or extra-high voltage cables. Further, direct current cables can be prepared according to the present disclosure, which can include high or extra-high voltage cables. Insulated electrical conductors normally comprise a conductive core covered by an insulation layer. The conductive core can be solid or braided (for example, a bundle of threads). Some insulated electrical conductors may also contain one or more additional elements, such as a semiconductor layer (or layers) and/or a protective cover (for example, coiled wire, tape or sheath). Examples are coated metal wires and electrical cables, including those for use in low voltage (LV,>0 to <5 kilovolts (kV) electricity distribution/transmission applications), medium voltage (MV, 5 to <69 kV), high voltage (HV, 69 to 230 kV) and extra-high voltage (EHV,>230 kV). Power cable assessments can use AEIC/ICEA standards and/or IEC test methods.

[0036] The initial cable core includes a first crosslinkable polymeric semiconductive layer and an optional second crosslinkable polymeric semiconductive layer. In an embodiment, the first crosslinkable polymeric semiconductive layer is interposed between the insulation layer composed of the crosslinkable polymeric composition and the conductor, while the second crosslinkable polymeric semiconductive layer surrounds the insulation layer composed of the crosslinkable polymeric composition. Alternatively, the initial insulation layer directly contacts the conductor. The first crosslinkable semiconductive layer and the second crosslinkable polymeric semiconductive layer can be composed of the same composition or be composed of different compositions. Additionally, each crosslinkable polymeric semiconductive layer may be crosslinked and, as such, may initially include crosslinkable polymeric compositions.

[0037] Polymers suitable for use in the first crosslinkable polymeric semiconductive layer and/or the second crosslinkable polymeric semiconductive layer include, but are not limited to, ethylene-based polymers (such as those described above), ethylene ethylacrylate copolymer (EEA), ethylene butylacrylate copolymer (EBA), ethylene vinyl acetate copolymer (EVA), polyolefin elastomers, and combinations of two or more thereof.

[0038] In an embodiment, a conductive filler is present in the first crosslinkable polymeric semiconductive layer and/or the second crosslinkable polymeric semiconductive layer. The conductive filler is present in an amount ranging from 1 to 50 wt % based on the total weight of the respective crosslinkable semiconductive layer, include conductive carbon blacks, conductive carbons (e.g., carbon fiber, carbon nanotubes, graphene, graphites, and expanded graphite platelets), and metal particles. Optional additives include antioxidants, stabilizers, and processing aids.

2. Insulation Layer

[0039] The initial cable core includes an initial insulation layer composed of a crosslinkable polymeric composition. The crosslinkable polymeric composition includes a) an ethylene-based polymer composed of (1) ethylene monomer, (2) an optional -olefin comonomer and/or (3) an optional organosiloxane comonomer. The crosslinkable polymeric composition further includes (b) dicumyl peroxide (DCP), (c) a SiH containing AP scavenger, (d) optional curing coagent, and (e) optional antioxidant.

[0040] The ethylene-based polymer in the crosslinkable polymeric composition of the initial insulation layer is composed of (1) ethylene monomer, (2) an optional -olefin comonomer (such as an ethylene/C.sub.4-C.sub.8 -olefin copolymer) and/or (3) an optional organosiloxane comonomer.

[0041] In an embodiment, the ethylene-based polymer is an ethylene homopolymer with [0042] (i) a density from 0.90 g/cc to 0.93 g/cc, or from 0.91 g/cc to 0.92 g/cc; and/or [0043] (ii) an MI from 0.1 g/10 min to 10.0 g/10 min, or from 0.5 g/10 min to 5.0 g/10 min or from 1.0 g/10 min to 3.0 g/10 min.

[0044] Nonlimiting examples of suitable ethylene homopolymer include LDPE DXM-446 and LDPE 5051, available from Dow Inc.

[0045] In an embodiment, the ethylene-based polymer is a telechelic ethylene-based polymer or a monochelic ethylene-based polymer. A telechelic ethylene-based polymer is copolymer of ethylene and -olefin comonomer (such as an ethylene/C.sub.4-C.sub.8 -olefin copolymer) of Formula I: A.sup.1L.sup.1L.sup.2A.sup.2, wherein: [0046] L.sup.1 is ethylene/-olefin copolymer, (such as an ethylene/C.sub.4-C.sub.8 -olefin copolymer); note, L.sup.1 (divalent) is bonded to A.sup.1 and L.sup.2; [0047] A.sup.1 is selected from the group consisting of the following: [0048] a) a vinyl group, [0049] b) a vinylidene group of the formula CH.sub.2C(Y.sup.1), [0050] c) a vinylene group of the formula Y.sup.1CHCH, [0051] d) a mixture of a vinyl group and a vinylene group of the formula Y.sup.1CHCH, [0052] e) a mixture of a vinyl group and a vinylidene group of the formula CH.sub.2=C(Y.sup.1), [0053] f) a mixture of a vinylidene group of the formula CH.sub.2=C(Y.sup.1) and a vinylene group of the formula Y.sup.1CHCH, and [0054] g) a mixture of a vinyl group, a vinylidene group of the formula CH.sub.2=C(Y.sup.1), and a vinylene group of the formula Y.sup.1CHCH; [0055] Y.sup.1 at each occurrence, independently, is a C.sub.1 to C.sub.30 hydrocarbyl group; [0056] L.sup.2 is a C.sub.1 to C.sub.32 hydrocarbylene group; and [0057] A.sup.2 is a hydrocarbyl group comprising a hindered double bond.

[0058] A monochelic ethylene-based polymer is copolymer of ethylene and -olefin comonomer (such as an ethylene/C.sub.4-C.sub.8 -olefin copolymer) of Formula II: A.sup.1L.sup.1, wherein: [0059] L.sup.1 is L.sup.1 is ethylene/-olefin copolymer, such as an ethylene/C.sub.4-C.sub.8 -olefin copolymer; note, L.sup.1 (monovalent) is bonded to A.sup.1; [0060] A.sup.1 is selected from the group consisting of the following: [0061] a) a vinyl group, [0062] b) a vinylidene group of the formula CH.sub.2=C(Y.sup.1), [0063] c) a vinylene group of the formula Y.sup.1CHCH, [0064] d) a mixture of a vinyl group and a vinylene group of the formula Y.sup.1CHCH, [0065] e) a mixture of a vinyl group and a vinylidene group of the formula CH.sub.2=C(Y.sup.1), [0066] f) a mixture of a vinylidene group of the formula CH.sub.2=C(Y) and a vinylene group of the formula Y.sup.1CHCH, and [0067] g) a mixture of a vinyl group, a vinylidene group of the formula CH.sub.2=C(Y.sup.1), and a vinylene group of the formula Y.sup.1CHCH; and Y1 at each occurrence, independently, is a C.sub.1 to C.sub.30 hydrocarbyl group.

[0068] Telechelic polymers and monochelic polymers are disclosed in International Publications WO 2020/140058 and WO 2020/140067, each of which is incorporated by reference herein. Telechelic polymers and monochelic polymers are interchangeably referred to as unsaturated POE or UPOE.

[0069] In an embodiment, the ethylene-based polymer in the crosslinkable polymeric composition of the initial insulation layer is an ethylene/organosiloxane copolymer. The ethylene/organosiloxane copolymer includes (i) units derived from ethylene, (ii) from 0.01 wt % to 0.5 wt % units derived from a comonomer, and (iii) optionally units derived from a termonomer. The comonomer is a monocyclic organosiloxane (MOCOS) of Formula (3)

[R.sup.1,R.sup.2SiO.sub.2/2].sub.n [0070] wherein n is an integer greater than or equal to 3, [0071] each R.sup.1 is independently a (C.sub.2-C.sub.4)alkenyl or a H.sub.2CC(R.sup.1a)C(O)O(CH.sub.2).sub.m [0072] wherein R.sup.1a is H or methyl; [0073] m is an integer from 1 to 4; and [0074] each R.sup.2 is independently H, (C.sub.1-C.sub.4)alkyl, phenyl, or R.sup.1. The ethylene-based polymer with monocyclic organosiloxane (MOCOS) of Formula (3) is interchangeably referred to as ethylene/MOCOS copolymer.

[0075] In an embodiment, In an embodiment, MOCOS of Formula (3) is 2,4,6-trimethyl-2,4,6-trivinyl-cyclotrisiloxane, (D.sup.Vi).sub.3 (CAS No. 3901-77-7) having Structure (B) below:

##STR00001##

[0076] In an embodiment, MOCOS of Formula (3) is 2,4,6,8-tetramethyl-2,4,6,8-tetravinyl-cyclotetrasiloxane, (D.sup.Vi).sub.4 (CAS No. 2554-06-5), having Structure (C) below:

##STR00002##

[0077] In an embodiment, MOCOS of Formula (3) is 2,4,6,8,10-pentamethyl-2,4,6,8,10-pentavinyl-cyclopentasiloxane, (D.sup.Vi).sub.5.

[0078] The MOCOS comonomer of Formula (3) is present in the ethylene-based polymer in an amount from 0.01 wt % to 2 wt %, or from 0.01 wt % to 0.5 wt %, or from 0.05 wt % to 0.45 wt %, or from 0.1 wt % to 0.40 wt %, or from 0.3 wt % to 0.5 wt %, or from 0.15 wt % to 0.30 wt %, or from 0.05 wt % to 0.15 wt %. Weight percent is based on total weight of the ethylene-based polymer composition, namely, the ethylene/MOCOS copolymer.

[0079] The crosslinkable polymeric composition in the initial insulation layer also includes from 0.1 wt % to 2.4 wt %, or from 0.5 wt % to 2.0 wt %, or from 0.7 wt % to 1.5 wt %, or from 0.7 wt % to 1.2 wt % dicumyl peroxide (DCP). Weight percent is based on total weight of the crosslinkable polymeric composition.

[0080] The crosslinkable polymeric composition in the initial insulation layer includes an SiH containing AP scavenger. An SiH containing AP scavenger, as used herein, is an organic silicon compound of Formula 4:

##STR00003## [0081] wherein R.sub.1, R.sub.2 and R.sub.3 are the same or different, each R.sub.1, R.sub.2 and R.sub.3 is individually selected from H, a substituted hydrocarbyl, an unsubstituted hydrocarbyl, a substituted heterohydrocarbyl, an unsubstituted heterohydrocarbyl or siloxane. The SiH containing (AP) scavenger is a separate and distinct component to the ethylene-based polymer. In the crosslinkable polymeric composition, the SiH containing (AP) scavenger is not a comonomer to the ethylene-based polymer. Nonlimiting samples of suitable the SiH containing (AP) scavenger of Formula 4 include s1) through s20) below:

##STR00004## ##STR00005##

and combinations thereof.

[0082] In an embodiment, the the SiH containing (AP) scavenger includes polyhedral oligomeric silsesquioxane containing SiH group, and/or inorganic silica containing SiH group, such as dimethylhydrogensiloxy modified silica, for example.

[0083] The crosslinkable polymeric composition may optionally include a curing coagent. Nonlimiting examples of suitable curing cogent include triallyl isocyanurate (TAIC), triallyl cyanurate (TAC), triallyl trimellitate (TA), N2, N2, N4, N4, N6, N6-hexaallyl-1, 3, 5-triazine-2, 4, 6-triamine (HATATA), triallyl orthoformate, pentaerythritol triallyl ether, triallyl citrate, and triallyl aconitate, -methyl styrene dimer (AMSD), acrylate-based coagents such as trimethylolpropane triacrylate (TMPTA), trimethylolpropane trimethylacrylate (TMPTMA), ethoxylated bisphenol A dimethacrylate, 1, 6-hexanediol diacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, tris (2-hydroxyethyl) isocyanurate triacrylate, and propoxylated glyceryl triacrylate, vinyl-based coagents such as polybutadiene having a high 1, 2-vinyl content, trivinyl cyclohexane (TVCH) 4,6-trimethyl-2,4,6-trivinyl-cyclotrisiloxane(VD3), 2,4,6,8-tetramethyl-2,4,6,8-tetravinyl-cyclotetrasiloxane(VD4). 2,4,6,8,10-pentamethyl-2,4,6,8,10-pentavinyl-cyclopentasiloxane, VD5. When present, the curing coagent is present in an amount from greater than 0 wt % to 5 wt %, or from 0.1 wt % to 2.5 wt %, or from 0.2 wt % to 2 wt %, or from 0.3 wt % to 1.5 wt %, or from 0.4 wt % to 1.0 wt %, based on total weight of the crosslinkable polymeric composition.

[0084] The crosslinkable polymeric composition includes an optional anti-oxidant. When present in the crosslinkable polymeric composition, the antioxidant is an organic molecule that inhibits oxidation or a collection of oxygen molecules. The antioxidant works to provide antioxidant properties to the polyolefin composition and/or cross-linked polyolefin product. Nonlimiting examples of suitable anti-oxidant include 2,6-di-tert-butyl-4-methylphenol; 2-(tert-butyl)-4,6-dimethylphenol; 2-(tert-butyl)-4-ethyl-6-methyl-phenol; 2-(tert-butyl)-4-isopropyl-6-methylphenol; 2,4-di-tert-butyl-6-methylphenol; 2,4,6-tri-tert-butylphenol; 2,6-di-tert-butyl-4-isopropylphenol; 2,6-di-tert-butyl-4-ethylphenol; 2,6-di-tert-butylphenol; 2-(tert-butyl)-6-methylphenol; 2,6-diisopropyl-4-methylphenol; 2-isopropyl-4,6-dimethylphenol; 4-ethyl-2-isopropyl-6-methylphenol; 2,4-diisopropyl-6-methylphenol; 4-(tert-butyl)-2-isopropyl-6-methylphenol; 2-(tert-butyl)-6-isopropyl-4-methylphenol; 2-(tert-butyl)-4-ethyl-6-isopropylphenol; 2-(tert-butyl)-4,6-diisopropylphenol; 2,4-di-tert-butyl-6-isopropylphenol; 2-(tert-butyl)-4-methyl-6-(tert-pentyl)phenol; 4-methyl-2,6-di-tert-pentylphenol; 2,4-dimethyl-6-(tert-pentyl)phenol; 2-ethyl-4-methyl-6-(tert-pentyl)phenol; 2-(tert-butyl)-6-ethyl-4-methylphenol; 2-ethyl-6-isopropyl-4-methylphenol; 2,6-diethyl-4-methylphenol; octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate (IRGANOX 1076); pentaerythritol tetrakis-[3-[3,5-di-tert-butyl-4-hydroxyphenyl]propionate (IRGANOX 1010); 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione (IRGANOX 3114); (1,3,5-trimethyl-2,4,5-tris(3,5-ditert-butyl)-4-hydroxybenzyl)-benzene (IRGANOX 1330); hexamethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate (IRGANOX 259); benzenepropanoic acid, 3,5-bis(1,1-dimethyl-ethyl)-4-hydroxy-C7-C9 branched alkyl esters (IRGANOX 1135); 3,5-bis(1,1-dimethylethyl)-4-hydroxybenzenepropanoic acid thiodi-2,1-ethanediyl ester (IRGANOX 1035); N,N-(hexane-1,6-diyl)bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propanamide](IRGANOX 1098); 1,2-bis(3,5-di-tert-butyl-4-hydroxy-hydrocinnamoyl)hydrazine (IRGANOX 1024); 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazin-2-ylamino) phenol (IRGANOX 565); ethylene bis (oxyethylene) bis-(3-(5-tert-butyl-4-hydroxy-m-tolyl)-propionate) (IRGANOX 245); 4,6-bis(octylthiomethyl)-o-cresol (IRGANOX 1520); 4,6-bis(dodecylthiomethyl)-o-cresol (IRGANOX 1726); 3,5-tris(4-(tert-butyl)-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazinane-2,4,6-trione (CYANOX 1790); phenol, 2-(5-chloro-2H-bentotriazol-2-yl)-6-(1,1-dimethylethyl)-4-methyl (TINUVIN 326); phenol, 2-(2H-benzotriazol-2-yl)-4-methyl (TINUVIN P); 2-(2H-benzotriazol-2-yl)-4,6-ditertpentylphenol (TINUVIN 328); 2-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol (TINUVIN 329); phenol, 2-(2H-benzotriazol-2-yl)-4-methyl-6-dodecyl (TINUVIN 571); 2,2-methylenebis(6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol) (TINUVIN 360); 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[(hexyl)oxy]-phenol (TINUVIN 1577); 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol (TINUVIN 234); 4,4-thiobis(2-tert-butyl-5-methylphenol (TBM-6); 3,4-dihydro-2,5,7,8-tetramethyl-2-(4,8,12-trimethyltridecyl)-2H-1-benzopyran-6-ol (IRGANOX E201), and combinations thereof. When present, the anti-oxidant present in an amount from greater than 0 wt % to 5 wt %, or from 0.01 wt % to 2 wt %, or from 0.05 wt % to 1 wt %, or from 0.1 wt % to 0.5 wt %, or from 0.15 wt % to 0.3 wt %, based on total weight of the crosslinkable polymeric composition.

[0085] The crosslinkable polymeric composition may also contain other additives including, but not limited to, processing aids, fillers, carbon black, nanoparticles, coupling agents, ultraviolet absorbers or stabilizers, antistatic agents, nucleating agents, slip agents, plasticizers, lubricants, viscosity control agents, tackifiers, anti-blocking agents, surfactants, extender oils, acid scavengers, flame retardants, and metal deactivators. When present the additive(s), other than fillers, are typically used in an amount ranging from 0.001 wt % to 10 wt %, or from 0.01 wt % to 7 wt %, or from 0.05 wt % to 5 wt %, or from 0.1 wt % to 3 wt %, based on total weight of the crosslinkable polymeric composition. When the filler is present, the filler is present in an amount from 1 wt % to 50 wt %, or from 2 wt % to 40 wt %, or from 5 wt % to 30 wt %, or from 10 wt % to 20 wt % based on the total weight of the crosslinkable polymeric composition. Nonlimiting examples of suitable filler include clays, precipitated silica and silicates, fumed silica, calcium carbonate, ground minerals, aluminum trihydroxide, magnesium hydroxide, and carbon blacks with typical arithmetic mean particle sizes larger than 15 nanometers.

3. Crosslinking Procedure

[0086] The process includes subjecting the initial cable core to a crosslinking procedure sufficient to crosslink the crosslinkable polymeric composition and form a cable core with a crosslinked insulation layer. The initial cable core containing inner and outer semiconductive and insulation layers can be prepared with various types of extruders, e.g., single or twin screw types. A description of a conventional extruder can be found in U.S. Pat. No. 4,857,600, incorporated by reference herein. A nonlimiting example of co-extrusion and an extruder can be found in U.S. Pat. No. 5,575,965, incorporated by reference herein. A typical extruder has a hopper at its upstream end and a die at its downstream end. The hopper feeds into a barrel, which contains a screw. At the downstream end, between the end of the screw and the die, there is a screen pack and a breaker plate. The screw portion of the extruder is considered to be divided up into three sections, the feed section, the compression section, and the metering section, and two zones, the back heat zone and the front heat zone, the sections and zones running from upstream to downstream. In the alternative, there can be multiple heating zones (more than two) along the axis running from upstream to downstream. If the extruder has more than one barrel, the barrels are connected in series. The length to diameter ratio of each barrel is in the range of from 15:1 to 30:1.

[0087] In an embodiment, the cable core is prepared from a continued vulcanization line composed of single extruder, vulcanization tube and cooling tube

[0088] Following extrusion, the resulting initial cable core is subjected to, or otherwise undergoes, a crosslinking procedure to crosslink the crosslinkable polymeric composition in the initial insulation layer. The initial cable core passes into a heated cure zone downstream of the extrusion die. The heated cure zone is maintained at a temperature in the range from 150 C. to 400 C., or from 160 C. to 350 C. or from 170 C. to 300 C. The heated cure zone is heated by pressurized steam, or is inductively heated with pressurized nitrogen gas. The crosslinking procedure provides a crosslinked insulation layer from the crosslinkable polymeric composition.

[0089] In an embodiment, one or both of the first (inner) polymeric semiconductive layer and/or second (outer) polymeric semiconductive layer is crosslinked during the crosslinking procedure.

[0090] In an embodiment, following the crosslinking procedure, the process includes cooling the cable core with crosslinked insulation layer to ambient temperature to form a cooled cable core with a crosslinked insulation layer. The term ambient temperature, as used herein, is a temperature from 20 C. to 24 C., or from 21 C. to 23 C.

[0091] The crosslinking procedure forms or otherwise creates dicumyl peroxide decomposition byproducts (or DCP decomposition byproducts) in the crosslinked insulation layer. The term dicumyl peroxide decomposition byproducts denotes decomposition products formed during the crosslinking step and/or during the curing step, and/or during the cooling step, by decomposition and reaction of the dicumyl peroxide. The DCP decomposition byproducts include cumyl alcohol (CA), acetophenone (AP), methane, alpha methyl styrene, and combinations thereof. The SiH containing (AP) scavenger react, suppresses, or otherwise quenches, acetophenone that is generated during the crosslinking procedure and/or any subsequent curing and/or cooling.

[0092] Following the crosslinking procedure, the process includes cooling the cable core with crosslinked insulation layer to ambient temperature to form a cooled cable core with a crosslinked insulation layer having an R.sub.AP/CA value less than 0.57. The amount of acetophenone and cumyl alcohol each is determined by way of headspace gas chromatography/flame ionization detection as set forth in the Examples section below. The term cooled cable core with a crosslinked insulation layer, as used herein, is the cable core with the crosslinked insulation layer at a point in time immediately after the crosslinking procedure, specifically from 1 minute to 60 minutes after the cable core is cooled to, or otherwise reaches, ambient temperature; the cooled cable core with a crosslinked insulation layer, is the post-crosslinked cable core from 1 minute to 60 minutes of arrival at ambient temperature and prior to a degassing procedure. A cooled crosslinked XLPE plaque (and/or a cooled crosslinked POE plaque) as used herein, is a crosslinked ethylene-based polymer plaque used to replicate the cooled cable core with the crosslinked insulation layer in the Examples section (below), the cooled crosslinked XLPE plaque (and/or the cooled crosslinked POE plaque) at a point in time immediately after the crosslinking procedure, specifically from 1 minute to 60 minutes after the plaque is cooled to, or otherwise reaches, ambient temperature; the cooled crosslinked XLPE (and/or the cooled crosslinked POE plaque), is the post-crosslinked plaque from 1 minute to 60 minutes of arrival at ambient temperature and prior to a degassing procedure. The R.sub.AP/CA value demonstrates the AP reduction in the present process. Lowering the ratio of AP to CA (i.e., the smaller the R.sub.AP/CA value) leads to lowering AP concentration given the same DCP loading.

[0093] In an embodiment, the cooled cable core with a crosslinked insulation layer is composition (C), and a similar composition (SC) is defined as an identical composition to composition (C) except (SC) does not contain component (c), the SiH containing (AP) scavenger. The composition (C) has an R.sub.AP/CA value, R.sub.AP/CA (C), and composition (SC) has an R.sub.AP/CA value (SC), R.sub.AP/CA(SC). The composition (C) has a Reduction in R.sub.AP/CA, or RiR.sub.AP/CA, that is least 2.0% greater than the R.sub.AP/CA (SC) as determined by Formula 5 below:

[00005]$\begin{array}{cc}\mathrm{Reduction}\mathrm{in}{R}_{\mathrm{AP}/\mathrm{CA}}\%=\left[\left(R_{\mathrm{AP}/\mathrm{CA}}\left(C\right)-R_{\mathrm{AP}/\mathrm{CA}}\left(SC\right)\right)/R_{\mathrm{AP}/\mathrm{CA}}\left(SC\right)\right]100\%.& \mathrm{Formula}5\end{array}$

[0094] In an embodiment, the cooled cable core with a crosslinked insulation layer, composition (C), has a Reduction in R.sub.AP/CA that is from greater than or equal to 2.0% to less than or equal to 35%, or from greater than or equal to 5% to less than or equal to 30%, or from greater than or equal to 10% to less than or equal to 25%, or from greater than or equal to 10% to less than or equal to 20%.

[0095] In an embodiment, the process includes degassing the cooled cable core with a crosslinked insulation layer at a temperature from 50 C. to 80 C. from to reduce the amount of acetophenone to less than 1000 ppm in the crosslinked insulation layer with greater than 2%, or greater than 5% or greater than 10% or greater than 15% or greater than 20% or greater than 30% or greater than 35% or greater than 40% or greater than 45% degassing time reduction.

4. Cable

[0096] The present disclosure provides a cable. In an embodiment, the cable includes a cable core. The cable core is composed of (i) a conductor and (ii) a crosslinked insulation layer. The crosslinked insulation layer is formed from a crosslinkable polymeric composition composed of a) an ethylene-based polymer composed of (1) ethylene monomer, (2) an optional organosiloxane comonomer, and/or (3) an optional organosiloxane comonomer. The crosslinkable polymeric composition further includes b) dicumyl peroxide (DCP), and an SiH containing (AP) scavenger, and (c) an SiH containing (AP) scavenger, (d) optional curing coagent, and (e) optional anti-oxidant.

[0097] It is understood that the DCP is consumed during crosslinking to form the crosslinked insulation layer of the cable. In the crosslinked insulation layer of the cable, the SiH containing (AP) scavenger is selected from the group consisting of (s1) through (s20) below

##STR00006## ##STR00007##

and combinations thereof.

[0098] In an embodiment, the cable includes the cable core with the crosslinked insulation layer composed of from 95 wt % to 99.9 wt % of an ethylene homopolymer, and from 0.1 wt % to 2.0 wt %, or from 0.2 wt % to 1.5 wt %, or from 0.3 wt % to 1.0 wt %, or from 0.4 wt % to 0.8 wt % of the SiH containing (AP) scavenger. Weight percent is based on total weight of the crosslinked insulation layer. In a further embodiment, the crosslinked insulation layer includes from 0.1 wt % to 2 wt %, or from 0.2 wt % to 1.5 wt %, or from 0.3 wt % to 1 wt %, or from 0.4% to 0.8 wt % of the curing coagent. It is understood that the ethylene-homopolymer, SiH containing (AP) scavenger and optional curing agent amount to 100 wt % of the crosslinked insulation layer.

[0099] In an embodiment, the cable includes the cable core with the crosslinked insulation layer composed of from 95 wt % to 99.9 wt % of a telechelic ethylene/C.sub.4-C.sub.8 -olefin copolymer, and from 0.1 wt % to 2.0 wt %, or from 0.2 wt % or from 1.5 wt %, or from 0.3 wt % to 1.0 wt %, or from 0.4 wt % to 0.8 wt % of the SiH containing (AP) scavenger. Weight percent is based on total weight of the crosslinked insulation layer. In an further embodiment, the crosslinked insulation layer includes from 0.1 wt % to 2.0 wt %, or from 0.2 wt % to 1.5 wt %, or from 0.3 wt % to 1 wt %, or from 0.4% to 0.8 wt % of the curing coagent. It is understood that the telechelic ethylene/C.sub.4-C.sub.8 -olefin copolymer, SiH containing (AP) scavenger and optional curing agent amount to 100 wt % of the crosslinked insulation layer.

[0100] In an embodiment, the cable includes the cable core with the crosslinked insulation layer composed of from 95 wt % to 99.9 wt % of a monochelic ethylene/C.sub.4-C.sub.8 -olefin copolymer, and from 0.1 wt % to 2.0 wt %, or from 0.2 wt % or from 1.5 wt %, or from 0.3 wt % to 1.0 wt %, or from 0.4 wt % to 0.8 wt % of the SiH containing (AP) scavenger. Weight percent is based on total weight of the crosslinked insulation layer. In an further embodiment, the crosslinked insulation layer includes from 0.1 wt % to 2.0 wt %, or from 0.2 wt % to 1.5 wt %, or from 0.3 wt % to 1.0 wt %, or from 0.4 wt % to 0.8 wt % of the curing coagent. It is understood that the monochelic ethylene/C.sub.4-C.sub.8 -olefin copolymer, SiH containing (AP) scavenger and optional curing agent amount to 100 wt % of the crosslinked insulation layer.

[0101] In an embodiment, the cable includes the cable core with the crosslinked insulation layer composed of from 95 wt % to 99.9 wt % of an ethylene/organosiloxane copolymer, and from 0.1 wt % to 2.0 wt %, or from 0.2 wt % or from 1.5 wt % or from 0.3 wt % to 1.0 wt %, or from 0.4 wt % to 0.8 wt % of the SiH containing (AP) scavenger. The ethylene/organosiloxane copolymer is any ethylene/MOCOS copolymer as previously disclosed herein. Weight percent is based on total weight of the crosslinked insulation layer. In a further embodiment, the crosslinked insulation layer includes from 0.1 wt % to 2.0 wt %, or from 0.2 wt % to 1.5 wt %, or from 0.3 wt % to 1.0 wt %, or from 0.4 wt % to 0.8 wt % of the curing coagent. It is understood that the ethylene/organosiloxane copolymer, SiH containing (AP) scavenger and optional curing agent amount to 100 wt % of the crosslinked insulation layer.

[0102] In an embodiment, the crosslinked insulation layer directly contacts the conductor. The term directly contacts refers to a layer configuration whereby the crosslinked insulation layer is located immediately adjacent to the conductor and no intervening layers or no intervening structures are present between the conductor and the crosslinked insulation layer.

[0103] In an embodiment, the cable includes the cable core with a first crosslinked polymeric semiconductive layer disposed between, or otherwise interposed between, the crosslinked insulation layer and the conductor. The first crosslinked polymeric semiconductive layer surrounds the conductor, and the crosslinked insulation layer surrounds the first crosslinked semiconductive layer. In a further embodiment, a second crosslinked polymeric semiconductive layer surrounds the crosslinked insulation layer. The first crosslinked polymeric semiconductive layer and the second crosslinked polymeric semiconductive layer can be composed of the same composition or can be composed of different compositions as previously disclosed herein.

[0104] In an embodiment, the cable includes the cooled cable core, i.e., the cable core immediately after crosslinking. The cooled cable core includes the crosslinked insulation layer having decomposition byproducts selected from the group consisting of cumyl alcohol (CA), acetophenone (AP), methane, alpha methyl styrene, and combinations thereof. The crosslinked insulation layer of the cooled cable core has an AP/CA ratio less than 0.57 at a time from 1 minute after the crosslinking procedure and being cooled to ambient temperature to 60 minutes after the crosslinking procedure and being cooled to ambient temperature and prior to a degassing procedure.

[0105] In an embodiment, the cable includes the cooled cable core with a crosslinked insulation layer is identified as composition (C). A similar composition, (SC), (as previously defined herein) is a composition identical composition to (C) except (SC) does not contain component (c), the SiH containing (AP) scavenger. The composition (C) has an R.sub.AP/CA(C) and the composition (SC) has an R.sub.AP/CA(SC). The composition (C) has a Reduction in R.sub.AP/CA, or RiR.sub.AP/CA that is least 2.0% greater than R.sub.AP/CA (SC) as determined by Formula 5 below:

[00006]$\begin{array}{cc}\mathrm{Reduction}\mathrm{in}{R}_{\mathrm{AP}/\mathrm{CA}}\%=\left[\left(R_{\mathrm{AP}/\mathrm{CA}}\left(C\right)-R_{\mathrm{AP}/\mathrm{CA}}\left(SC\right)\right)/R_{\mathrm{AP}/\mathrm{CA}}\left(SC\right)\right]100\%.& \mathrm{Formula}5\end{array}$

[0106] In an embodiment, the cooled cable core with a crosslinked insulation layer, composition (C), has a Reduction in R.sub.AP/CA that is from greater than or equal to 2.0% to less than or equal to 50%, or from greater than or equal to 5% to less than or equal to 40%, or from greater than or equal to 10% to less than or equal to 30%, or from greater than or equal to 10% to less than or equal to 20%.

[0107] By way of example, and not limitation, some embodiments of the present disclosure will now be described in detail in the following examples.

1. Materials

[0108] Materials used in the comparative samples (CS) and inventive examples (IE) are provided in Table 1A-1C below.

TABLE-US-00001 TABLE 1A LDPE MI Vinyl D4 Density, (2.16 kg, comonomer LDPE g/cc 190 C.), content, wt % LDPE-1 (DXM-446) 0.92 2.3 0 LDPE-2 (505i) 0.92 2.2 0 Polyethylene-VD4 0.92 3.5 0.15 copolymer-2 (0.15%) Polyethylene-VD4 0.92 3.5 0.3 copolymer-3 (0.3%) Polyethylene-VD4 0.92 2.9 0.5 copolymer-4 (0.5%) Polyethylene-VD4 0.92 3.5 0.08 copolymer-11 (0.08%)

TABLE-US-00002 TABLE 1B Unsaturated POE (u-POE) Density, MI (2.16 kg, Vinyl per Vinylidene Trissub Vinylene VCH per g/cc 190 C.), 10.sup.6 C. per 10.sup.6 C. per 10.sup.6 C. per 10.sup.6 C. 10.sup.6 C. UPOE1 0.87 9.6 241 125 22 57 282 (Telechelic ethylene/octene copolymer) UPOE2 0.87 10.5 223 121 35 67 0 (Monochelelic ethylene/octene copolymer)

TABLE-US-00003 TABLE 1C Name Structure/properties Source DCP Organic Peroxide Farida Dicumyl peroxide C.sub.18H.sub.22O.sub.2 CAS No. 80-43-3 SiH-1 Tri-ethoxysilane, [00008] TCl Shanghai SiH-2 1,1,1,3,5,5,5- heptamethyltrisiloxane [00009] TCl Shanghai SiH-3 1-(2-(Trimethoxysilyl)ethyl)- 1,1,3,3-tetramethyldisiloxane (CAS 137407-65-9) [00010] Commercially available in Macklin Biochemical Co SiH-4 3-((dimethylsilyl)oxy)-1,1,5,5- tetramethyl-3-phenyltrisiloxane [00011] TCl Shanghai SiH-5 7-Octenyldimethylsilane [00012] Gelest TAIC Curing Coagent Farida Triallyl isocyanurate C.sub.12H.sub.15N.sub.3O.sub.3 CAS No. 1025-15-6 TBM-6 antioxidant Lowinox 4,4-Thiobis(6-tert-butyl-m-cresol) C.sub.22H.sub.30O.sub.2S CAS No. 96-69-5

2. Calibration Curve Set Up for AP and CA Measurement

2.1: Preparation of Crosslinked Blank Sheet without AP and CA (Luperox 101 Will not Generate AP and CA) [0109] a. 1 wt % Luperox 101 was soaked into POE blank sheet at 50 C. for 6 hours (hr). 1 wt % Luperox 101 was soaked into LDPE blank sheet at 70 C. for 6 hr. [0110] b. The POE blank sheet and the LDPE blank sheet each is compression molded at 180 C. to prepare crosslinked two respective plaques, each plaque having a 1 mm thickness. [0111] c. Each plaque is degassed in a vacuum oven at 70 C. for 1 day.

2.2: Crosslinked POE Calibration Sample and XLPE Calibration Sample Preparation

[0112] a. 1 gram (g) sample is cut from a crosslinked POE blank or XLPE blank sheet and placed into a 20 milliliter (mL) headspace vial [0113] b. 0.005 g AP standard chemical was injected into the headspace vial containing the 1 g POE or XLPE sample to prepare the calibration standard. The headspace vial was then sealed with a crimp cap and is hereafter referred as the calibration sample. [0114] c. 0.005 g CA standard chemical was injected into the headspace vial containing the 1 g POE/XLPE sample to prepare the calibration standard. The headspace vial was then sealed with a crimp cap and is hereafter referred as the calibration sample.
2.3: Load the Calibration Sample into HSGC with the Condition in the Table 1 for Analysis to Get the Correlation Between the Peak Area from HSGC and AP or CA Concentration in Calibration Sample.

TABLE-US-00004 TABLE 2A Instrument Agilent 6890N Gas Column Chromatography system DB-WAX column (123-7033UI 30 m 0.32 mm ID 0.5 m film) Carrier flow 2.0 mL/min constant flow Helium carrier gas Oven 50 C., hold 2 min 15 C./min ramp to 220 C., hold 8 min Total run time: 21.3 min Injection Headspace Inlet Injector temp = 250 C. Split ratio: 20:1 Detector FID Temperature: 250 C. H2 flow: 40 mL/min Air flow: 400 mL/min Makeup flow: 25 mL/min Headspace instrument Agilent 7697A headspace system HS oven temperature 150 C. HS loop temperature 160 C. HS transfer line temperature 170 C. HS vial equilibration 30 min HS injection duration 1.0 min Loop equilibration time 0.1 min GC cycle time 33 min

3. Sample Preparation for AP and CA Measurement

3.1 Compression Molding to Prepare Crosslinked Plaques from Example Compounds [0115] a. Put about 30 g of example compounds in pellets form into a 1-mm thickness mold between two PET films. Then put this loaded mold into a hot press machine (LabTech). [0116] b. Preheating at 120C for 10 minutes. [0117] c. Venting for 8 times and 0.2 s for each. [0118] d. Close the platens to apply 15 MPa pressure to mold for 20 minutes. Meanwhile increase the temperature to 182 C. within 6.5 minutes. [0119] e. Keep a continued 15 Mpa on the mold and cooling to 24 C. [0120] f. Take out the mold from machine.

3.2 Headspace Gas Chromatography (GC) Sample Preparation

[0121] a. Remove the cured plaque with two PET films adhered on both sides from mold [0122] b. Peel off the PET film quickly. [0123] c. Cut out two sheets of the plaque's center area (around 1 g), and put them into two headspace GC vials, then seal the vials immediately. [0124] d. Weigh the sealed GC headspace vial, and the sample weight could be calculated by the difference between the empty vial and the vial with sample.

4. AP and CA Measurement

[0125] The sealed headspace vial with 1 g plaque sample was transferred into a headspace autosampler to condition at 150 C. for 30 minutes (min). Then, an aliquot of 1 ml gas sample in the headspace vial was injected and directly analyzed with GC/FID (gas chromatography/flame ionization detector). The GC oven was programmed from 50 C. (2 min) to 220 C. (8 min) at 15 C. min-1. The FID temperature was at 250 C. with hydrogen flow rate at 40 mL min-1, air flow rate at 400 mL min-1 and nitrogen flow rate at 25 mL min-1. The inlet was operated at 250 C. in split mode at a ratio of 50:1, and the separation column was a 30 m0.32 mm i.d.0.50 m DB-WAX capillary column with 2 mL min-1 flow rate of helium carrier gas.

5. Calculation

[0126] The concentrations of acetophenone and cumyl alcohol were calculated according to following formula in Table 2B below.

TABLE-US-00005 TABLE 2B 2) AP or CA in crosslinked 1) AP or CA in POE* matrix insulation layer (XLPE**) RF .sub.POE, Std = A .sub.POE, Std/W .sub.POE, Std RF .sub.XLPE, Std = A .sub.XLPE, Std/W .sub.XLPE, Std RF .sub.POE, S = RF .sub.POE, Std* W .sub.POE, blk/W .sub.POE, S RF .sub.XLPE, S = RF .sub.XLPE, Std* W .sub.XLPE, blk/W .sub.POE, S Conc. .sub.POE, S (ppm) = 1000*A .sub.POE, S/ Conc. .sub.XLPE, S (ppm) = 1000*A .sub.XLPE, S/ RF .sub.POE, S/W .sub.POE, S RF .sub.XLPE, S/W .sub.XLPE, S where where RF .sub.POE, Std: Response factor of AP RF .sub.XLPE, Std: Response factor of AP or CA in POE blank or CA in POE blank RF .sub.POE, s: Response factor of AP or RF .sub.XLPE, S: Response factor of AP or CA in POE sample CA in POE sample A .sub.POE, Std: Peak area of AP or CA in POE blank A .sub.XLPE, Std: Peak area of AP or CA in POE blank A .sub.POE, S: Peak area of AP or CA in POE sample A .sub.XLPE, S: Peak area of AP or CA in POE sample W .sub.POE, blk: Weight of POE blank W .sub.XLPE, blk: Weight of POE blank W .sub.POE, Std: Weight of AP or CA in POE blank W .sub.XLPE, Std: Weight of AP or CA in POE blank W .sub.POE, S: Weight of POE sample W .sub.XLPE, S: Weight of POE sample Conc. .sub.POE, S: Concentration of AP or Conc. .sub.XLPE, S: Concentration of AP or CA in POE sample CA in POE sample *POE refers to a cooled crosslinked POE plaque, **XLPE refers to a cooled crosslinked XLPE plaque

[0127] By way of example, Table 2C provides calculations for (i) AP and (ii) CA for CS-2, IE-10, and IE-11. Two specimens are taken for each sample of CS-2, IE-10, and IE-1. The final AP value and the final CA value is the average of number of these two specimens. The R.sub.AP/CA value is the final AP value divided by the final CA value for each sample.

TABLE-US-00006 TABLE 2C Specimen 1 CS-2 IE-10 IE-11 #1 AP CA AP CA AP CA A.sub.XLPE, Std 8222.8 8222.8 8222.8 8222.8 8222.8 8222.8 A.sub.XLPE, S 4850.4 8346.7 3361.7 8919.7 3306.9 9047.1 W.sub.XLPE, blk 0.9917 g 0.9917 g 0.9917 g 0.9917 g 0.9917 g 0.9917 g W.sub.XLPE, Std 5.15 mg 5.15 mg 5.15 mg 5.15 mg 5.15 mg 5.15 mg W.sub.XLPE, S 0.9369 g 0.9369 g 0.8958 g 0.8958 g 0.9037 g 0.9037 g RF.sub.XLPE, Std 8222.8/5.15 = 8222.8/5.15 = 8222.8/5.15 = 8222.8/5.15 = 8222.8/5.15 = 8222.8/5.15 = 1597 1597 1597 1597 1597 1597 RF.sub.XLPE, S 1597*0.9917/ 1597*0.9917/ 1597*0.9917/ 1597*0.9917/ 1597*0.9917/ 1597*0.9917/ 0.9369 = 1690 0.9369 = 1690 0.8958 = 1768 0.8958 = 1768 0.9037 = 1752 0.9037 = 1752 Conc..sub.XLPE, S 1000*4850.4/ 1000*8346.7/ 1000*3361.7/ 1000*8919.7/ 1000*3306.9/ 1000*9047.1/ (ppm) 1690/0.9369 = 1690/0.9369 = 1768/0.8958 = 1768/0.8958 = 1752/0.9037 = 1752/0.9037 = 3063 ppm 5271 ppm 2123 ppm 5633 ppm 2088 ppm 5714 ppm **XLPE refers to a crosslinked plaque

TABLE-US-00007 TABLE 2D Specimen 2 CS-2 IE-10 IE-11 #2 AP CA AP CA AP CA A.sub.XLPE, Std 8222.8 8222.8 8222.8 8222.8 8222.8 8222.8 A.sub.XLPE, S 4927.3 8509.3 3327.6 8796.4 3359.0 9195.2 W.sub.XLPE, blk 0.9917 g 0.9917 g 0.9917 g 0.9917 g 0.9917 g 0.9917 g W.sub.XLPE, Std 5.15 mg 5.15 mg 5.15 mg 5.15 mg 5.15 mg 5.15 mg W.sub.XLPE, S 0.9189 g 0.9189 g 0.9396 g 0.9396 g 0.9236 g 0.9236 g RF.sub.XLPE, Std 8222.8/5.15 = 8222.8/5.15 = 8222.8/5.15 = 8222.8/5.15 = 8222.8/5.15 = 8222.8/5.15 = 1597 1597 1597 1597 1597 1597 RF.sub.XLPE, S 1597*0.9917/ 1597*0.9917/ 1597*0.9917/ 1597*0.9917/ 1597*0.9917/ 1597*0.9917/ 0.9189 = 1723 0.9189 = 1723 0.9369 = 1685 0.9369 = 1685 0.9236 = 1714 0.9236 = 1714 Conc..sub.XLPE, S 1000*4927.3/ 1000*8509.3/ 1000*3327.6/ 1000*8796.4/ 1000*3359.0/ 1000*9195.2/ (ppm) 1723/0.9189 = 1723/0.9189 = 1685/0.9369 = 1685/0.9369 = 1714/0.9236 = 1714/0.9236 = 3112 ppm 5374 ppm 2102 ppm 5555 ppm 2121 ppm 5807 ppm **XLPE refers to a crosslinked plaque

5. Results and Discussion:

[0128] As previously described, DCP will decompose in curing step to generate cumyl oxyl radicals. Part of cumyl oxyl radical will go through beta scission to form AP and methyl radicals. Both cumyl oxyl radical and methyl radicals abstract hydrogen from polyethylene to initiate the crosslinking of polymer and form CA and methane. The concentration of these byproducts in a fresh cured sample is determined by DCP loading. Higher loading of DCP leads to greater byproduct concentration.

[0129] As shown in Table 3, 3000 ppm AP and 5200 ppm CA are present in the fresh cured CS-1 sample (cooled crosslinked plaque) containing 1.2% DCP and R.sub.AP/CA value is 0.573. We are surprisingly found that in the presence of SiH-1, SiH-2, SiH-3 and SiH-4, (i.e., in IE-1, IE-2, IE-3, IE-4 and IE-5), the R.sub.AP/CA value decreases, especially for IE-3 with 0.7% SiH-4 which achieves a 35.7% reduction in R.sub.AP/CA compared to CS-1. Bounded by no particular theory, it is believed Si radical initiated by active radicals in the system add to carbonyl group of AP and bonding onto SiH scavenger through SiOC bond.

[0130] At higher DCP loading, IE-6 and 7 in Table 3, SiH-4 effectively reduces the AP. The R.sub.AP/CA value for IE-6 and IE-7 (0.372-0.378) is similar to IE-3 (0.369).

[0131] The additional curing coagents, like TAIC and VD4, do not impact the AP reduction as shown in IE-8 and IE-9.

TABLE-US-00008 TABLE 3 CS-1 IE-1 IE-2 IE-3 IE-4 IE-5 IE-6 IE-7 IE-8 IE-9 LDPE(DXM- 98.8 98.3 98.45 98.1 98.1 97.9 97.8 98.2 97.6 97.6 446) SiH-1 0.5 SiH-2 0.7 SiH-3 0.9 SiH-4 0.35 0.7 0.7 0.7 0.7 0.7 TAIC 0.5 VD4 0.5 DCP 1.2 1.2 1.2 1.2 1.2 1.2 1.5 1.8 1.2 1.2 Total 100 100 100 100 100 100 100 100 100 100 ML, 0.27 0.26 0.23 0.23 0.23 0.22 0.27 0.28 0.23 0.24 dN*m MH, 3.43 2.88 2.95 2.44 2.94 2.46 2.94 3.46 3.29 3.26 dN*m T90, min. 4.23 4.01 4.22 4.13 3.91 3.97 4.68 4.68 4.17 4.17 AP, ppm 2986 2681 2315 1885 2551 2233 2399 2914 1920 1970 CA, ppm 5211 4799 5270 5113 5123 4955 6453 7712 5377 5324 R.sub.AP/CA value 0.573 0.559 0.439 0.369 0.498 0.451 0.372 0.378 0.357 0.370 RiR.sub.AP/CA 2.5% 23.3% 35.7% 13.1% 21.4% 35.1% 34.1% 37.7% 35.4%

[0132] As shown in Table 3, the comparison between IE-1, IE-2, IE-3, IE-4, IE-5, IE-6, IE-7, IE-8 IE-9 each to CS-1 shows that SiH-1, SiH-2, SiH-3, SiH-4 reduces R.sub.AP/CA with IE-1 through IE-9 exhibiting R.sub.AP/CA values less than 0.57, or 0.350 to 0.559 and RiR.sub.AP/CA from 13% to 38% (for cooled crosslinked plaque).

TABLE-US-00009 TABLE 4 CS-2 CS-3 CS-4 CS-5 IE-10 IE-11 IE-12 IE-13 Polyethylene-VD4 copolymer-2 98.8 98.1 (0.15%) Polyethylene-VD4 copolymer-3 (0.3%) 98.8 98.1 Polyethylene-VD4 copolymer-4 (0.5%) 98.8 98.1 Polyethylene-VD4 copolymer-11 98.8 98.1 (0.08%) SiH-4 0.7 0.7 0.7 0.7 DCP 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 Total 100 100 100 100 100 100 100 100 ML, dN*m 0.21 0.2 0.17 0.17 0.17 0.15 0.14 0.15 MH, dN*m 4.06 4.81 5 3.83 2.87 3.41 3.91 2.69 T90, min. 4 3.69 3.57 4.15 3.94 3.70 3.47 4.15 AP, ppm 3088 3061 3444 3244 2113 2105 2171 2005 CA, ppm 5323 5434 5878 5753 5594 5761 5586 5763 R.sub.AP/CA value 0.580 0.573 0.586 0.574 0.378 0.365 0.389 0.348 RiR.sub.AP/CA 34.9% 35.1% 33.7% 38.3%

[0133] As shown in Table 4, SiH-4 achieved a RiR.sub.AP/CA from 34% to 39% with corresponding R.sub.AP/CA values from 0.340 to 0.390 (for a cooled crosslinked plaque composed of copolymer of ethylene and VD4.)

TABLE-US-00010 TABLE 5 IE-14 IE-15 CS-6 CS-7 IE-16 IE-17 LDPE 505i 98.3 97.8 98.8 98.15 97.8 98.05 SiH-4 0.35 0.35 SiH-5 0.5 1 TBM-6 0.15 0.15 0.1 DCP 1.2 1.2 1.2 1.7 1.7 1 TAIC 0.5 Total 100 100 100 100 100 100 ML, dN*m 0.23 0.2 0.23 0.17 0.22 0.18 MH, dN*m 2.93 2.27 3.12 3.83 2.92 3.24 T90, min. 5.06 5.29 5.184 4.851 4.8 4.537 AP, ppm 2673 2354 3474 4625 3880 2452 CA, ppm 5705 5756 6024 8680 8209 5140 R.sub.AP/CA value 0.469 0.409 0.577 0.533 0.473 0.477 RiR.sub.AP/CA 18.8% 29.1% 11.3% 10.5%

[0134] As shown in Table 5, the comparison between IE-14, IE-15 each to CS-6 shows that SiH-5 (which contains vinyl groups) also reduces R.sub.AP/CA with IE-14 and IE-15 exhibiting R.sub.AP/CA values from 0.400 to 0.470 and RiR.sub.AP/CA from 15% to 30% (for cooled crosslinked plaque).

[0135] The comparison between IE16, IE-17 each to CS-7 shows SiH-4 reduces R.sub.AP/CA with IE-16 and IE-17 exhibiting R.sub.AP/CA values from 0.470 to 0.480 and RiR.sub.AP/CA from 10% to 12% in the presence of antioxidant (for cooled crosslinked plaque).

TABLE-US-00011 TABLE 6 CS-8 CS-9 IE-18 IE-19 UPOE-1 98.8 98.1 UPOE-2 98.8 98.1 SiH-4 0.7 0.7 DCP 1.2 1.2 1.2 1.2 Total 100 100 100 100 ML, dN*m 0.08 0.04 0.08 0.03 MH, dN*m 11 6.73 8.02 4.57 T90, min. 3.889 3.693 4.061 3.964 AP, ppm 3418 3613 2491 2156 CA, ppm 5756.5 5794.5 5948 5764 R.sub.AP/CA value 0.594 0.624 0.419 0.374 RiR.sub.AP/CA 29.5% 40.0%

[0136] As shown in Table 6, SiH-4 achieves AP reduction in POE (UPOE). The comparison between IE18 and IE-19 each to CS-8 and CS-9 shows SiH-4 reduces R.sub.AP/CA with IE-18 and IE-19 exhibiting R.sub.AP/CA values from 0.370 to 0.420 and RiR.sub.AP/CA from 28% to 40%.

[0137] The data in Tables 3 to 6 show that SiH containing (AP) scavenger is effective to reduce acetophenone in different polymer matrix platforms and in combination with different components, such like curing coagent, and antioxidant.

[0138] It is specifically intended that the present disclosure not be limited to the embodiments and illustrations contained herein, but include modified forms of those embodiments including portions of the embodiments and combination of elements of different embodiments as come within the scope of the following claims.