ACOUSTIC WAVE RESONATOR AND DEVICE FOR WIRELESS COMMUNICATIONS

Abstract

An acoustic wave resonator for use in a device for wireless communications includes a first electrode, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode. The first electrode has a first region made of a material having a first density, and a second region formed as a loop region surrounding the first region and electrically connected to the first region. The second region is made of a material having a second density that is different from the first density.

Claims

1. An acoustic wave resonator comprising: a first electrode; a second electrode; and a piezoelectric layer made of a piezoelectric material and disposed between the first electrode and the second electrode, wherein the first electrode comprises: a first region made of a first material having a first density; and a second region in a loop shape surrounding the first region and electrically connected to the first region, wherein the second region is made of a second material having a second density different from the first density.

2. The acoustic wave resonator according to claim 1, wherein the first region and the second region have a same height in a first direction perpendicular to a configuration plane of the first electrode.

3. The acoustic wave resonator according to claim 1, wherein the first density is greater than the second density and a height of the first region in a direction perpendicular to a configuration plane of the first electrode is greater than a height of the second region, or the second density is greater than the first density, and the height of the second region is greater than the height of the first region.

4. The acoustic wave resonator according to claim 3, wherein a height difference between the first region and the second region in the first direction is greater than or equal to 5 nanometers and less than or equal to 100 nanometers.

5. The acoustic wave resonator according to claim 1, wherein a width between an outer edge and an inner edge of the second region is greater than or equal to 0.5 micrometers and less than or equal to 10 micrometers.

6. The acoustic wave resonator according to claim 1, wherein the first material of the first region has a first thermal conductivity, the second material of the second region has a second thermal conductivity, and the first thermal conductivity is greater than the second thermal conductivity.

7. The acoustic wave resonator according to claim 1, wherein the second density is less than the first density, and the first electrode further comprises: a third region formed as a loop region surrounding the second region and electrically connected to the second region, wherein the third region is made of a third material has a third density greater than the second density.

8. The acoustic wave resonator according to claim 7, wherein the first region, the second region, and the third region have a same height in a first direction perpendicular to a configuration plane of the first electrode.

9. The acoustic wave resonator according to claim 7, wherein a height of the first region in a first direction perpendicular to the configuration plane of the first electrode is greater than a height of the second region, and a height difference between the first region and the second region is greater than or equal to 5 nanometers and less than or equal to 100 nanometers; and a height of the third region is greater than a height of the second region, a height difference between the second region and the third region is greater than or equal to 5 nanometers and less than or equal to 100 nanometers.

10. The acoustic wave resonator according to claim 7, wherein a width between an outer edge and an inner edge of the third region is greater than or equal to 0.5 micrometers and less than or equal to 10 micrometers.

11. The acoustic wave resonator according to claim 7, wherein the first density is less than the third density.

12. The acoustic wave resonator according to claim 7, wherein the material of the third region has a third thermal conductivity less than a first thermal conductivity of the first region.

13. The acoustic wave resonator according to claim 7, wherein the first electrode further comprises: a fourth region formed as a loop region surrounding the third region and electrically connected to the third region, wherein the fourth region is made of a fourth material having a fourth density greater than the third density.

14. A filter comprising: an acoustic wave resonator comprising: a first electrode; a second electrode; and a piezoelectric layer made of a piezoelectric material and disposed between the first electrode and the second electrode, wherein the first electrode comprises: a first region made of a first material having a first density; and a second region formed as a loop region surrounding the first region and electrically connected to the first region, wherein the second region is made of a second material having a second density different from the first density.

15. The filter according to claim 14, wherein the first region and the second region have a same height in a first direction perpendicular to a configuration plane of the first electrode.

16. The filter according to claim 14, wherein the first density is greater than the second density and a height of the first region in a first direction is greater than a height of the second region, wherein the first direction is perpendicular to a configuration plane of the first electrode, or the second density is greater than the first density, and the height of the second region is greater than the height of the first region.

17. The filter according to claim 16, wherein a height difference between the first region and the second region is greater than or equal to 5 nanometers and less than or equal to 100 nanometers.

18. The filter according to claim 14, wherein a width between an outer edge and an inner edge of the second region is greater than or equal to 0.5 micrometers and less than or equal to 10 micrometers.

19. The filter according to claim 14, wherein the first material of the first region has a first thermal conductivity, the second material of the second region has a second thermal conductivity less than the first thermal conductivity.

20. A terminal device comprising: a transceiver configured to receive or send a signal, wherein the transceiver comprises a filter configured to filter the signal; and a processor configured to perform signal processing on the signal, wherein the filter comprises: an acoustic wave resonator comprising: a first electrode; a second electrode; and a piezoelectric layer made of a piezoelectric material and disposed between the first electrode and the second electrode, wherein the first electrode comprises: a first region made of a first material having a first density; and a second region formed as a loop region surrounding the first region and electrically connected to the first region, wherein the second region is made of a second material having a second density different from the first density.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0095] FIG. 1 is a schematic diagram of a structure of an acoustic wave resonator;

[0096] FIG. 2 is a front sectional view of an example of an acoustic wave resonator according to this application;

[0097] FIG. 3 is a top view of an upper electrode of the acoustic wave resonator in FIG. 2;

[0098] FIG. 4 is a front sectional view of another example of an acoustic wave resonator according to this application;

[0099] FIG. 5 is a front sectional view of still another example of an acoustic wave resonator according to this application;

[0100] FIG. 6 is a front sectional view of still another example of an acoustic wave resonator according to this application;

[0101] FIG. 7 is a top view of an upper electrode of the acoustic wave resonator in FIG. 6;

[0102] FIG. 8 is a front sectional view of another example of an acoustic wave resonator according to this application;

[0103] FIG. 9 is a front sectional view of still another example of an acoustic wave resonator according to this application;

[0104] FIG. 10 is a front sectional view of still another example of an acoustic wave resonator according to this application;

[0105] FIG. 11 is a top view of an upper electrode of the acoustic wave resonator in FIG. 10;

[0106] FIG. 12 is a front sectional view of another example of an acoustic wave resonator according to this application;

[0107] FIG. 13 is a front sectional view of still another example of an acoustic wave resonator according to this application;

[0108] FIG. 14 is a schematic diagram of an example of a filter according to this application;

[0109] FIG. 15 is a schematic diagram of another example of a filter according to this application;

[0110] FIG. 16 is a schematic diagram of a radio frequency module of a wireless communications device according to this application;

[0111] FIG. 17 is a schematic diagram of a terminal device according to this application; and

[0112] FIG. 18 is a schematic diagram of a base station according to this application.

DESCRIPTION OF EMBODIMENTS

[0113] The following describes the technical solutions of this application with reference to the accompanying drawings.

[0114] FIG. 2 is a schematic diagram of a structure of an example of an acoustic wave resonator according to this application.

[0115] As shown in FIG. 2, the acoustic wave resonator (or a film bulk acoustic wave resonator) includes:

[0116] a substrate;

[0117] a lower electrode (namely, an example of a second electrode), disposed above the substrate;

[0118] a piezoelectric layer, disposed above a lower electrode; and

[0119] an upper electrode (namely, an example of a first electrode), disposed above the piezoelectric layer.

[0120] It should be understood that the foregoing listed structures of the acoustic wave resonator are merely rational description, and are not specifically limited in this application.

[0121] For example, an acoustic isolation layer (or an acoustic isolator) may be formed between the lower electrode and the substrate.

[0122] The following separately describes the foregoing parts in detail.

[0123] A. Substrate

[0124] As an example but not a limitation, the substrate may be formed as a cuboid or a cube.

[0125] The lower electrode in this application is disposed on an upper surface of the substrate.

[0126] In the following, for ease of understanding and description, a plane formed by an x-axis direction and a y-axis direction of a three-dimensional coordinate system is denoted as a plane #A (namely, an example of a configuration plane). In this case, the upper surface of the substrate is parallel or approximately parallel to the plane #A.

[0127] The substrate may be a semiconductor material, for example, silicon.

[0128] It should be noted that, based on a configuration requirement, the acoustic wave resonator in this application may not include the substrate.

[0129] B. Acoustic Isolation Layer

[0130] The acoustic isolation layer may be located inside the substrate, and is configured to reflect an acoustic wave.

[0131] For example, as shown in FIG. 2, the acoustic isolation layer may be an air cavity formed in the substrate.

[0132] Alternatively, the acoustic isolation layer may be an acoustic reflector.

[0133] It should be noted that, based on a configuration requirement, the acoustic wave resonator in this application may not include the acoustic isolation layer.

[0134] C. Lower Electrode

[0135] As shown in FIG. 2, the lower electrode is located above the acoustic isolation layer (specifically, above a z-axis direction of the three-dimensional coordinate system).

[0136] In other words, the lower electrode is disposed on the upper surface of the substrate.

[0137] As an example but not a limitation, as shown in FIG. 2, a boundary (or an edge) of the lower electrode is located outside a boundary of the acoustic isolation layer. In other words, a projection of the acoustic isolation layer on the plane #A is located inside a projection of the lower electrode on the plane #A.

[0138] In this application, the lower electrode may be made of a conductive material.

[0139] As an example but not a limitation, the lower electrode material may include but is not limited to molybdenum, titanium, platinum, aluminum, copper, gold, and the like.

[0140] In this application, the lower electrode may be in a sheet shape or a plate shape extending in a direction of the plane #A.

[0141] As an example but not a limitation, a shape of the lower electrode (specifically, a shape of a projection of the lower electrode in the direction of the plane #A) may include but is not limited to a polygon such as a square, a rectangle, or an irregular geometric. This is not particularly limited in this application.

[0142] D. Piezoelectric Layer (or a Film Piezoelectric Layer)

[0143] As shown in FIG. 2, the piezoelectric layer is located above the lower electrode (specifically, above the z-axis direction of the three-dimensional coordinate system).

[0144] In this application, the top electrode may be formed as a film extending in the direction of the plane #A.

[0145] In this application, the piezoelectric layer can generate a piezoelectric effect or an inverse piezoelectric effect.

[0146] The piezoelectric effect means that when some dielectrics are deformed by an external force in a specific direction, polarization occurs inside the dielectrics, and positive and negative charges appear on two opposite surfaces of the dielectrics. When the external force is removed, the dielectrics will return to an uncharged state. This phenomenon is called a positive piezoelectric effect. When a direction of the force changes, a polarity of a charge also changes. On the contrary, when an electric field is applied to a polarization direction of the dielectrics, the dielectrics also deform. After the electric field is removed, deformation of the dielectrics disappears. This phenomenon is called the inverse piezoelectric effect.

[0147] A principle of the piezoelectric effect is as follows. If pressure is applied to a piezoelectric material, a potential difference (referred to as the positive piezoelectric effect) is generated. If a voltage is applied to a piezoelectric material, mechanical stress (referred to as the inverse piezoelectric effect) is generated. If the pressure is a high-frequency vibration, a high-frequency current is generated. When high-frequency electrical signals are added to piezoelectric ceramics, high-frequency acoustic signals (mechanical vibration) are generated.

[0148] As an example but not a limitation, a material of the piezoelectric layer may include but is not limited to aluminum nitride (AlN), aluminum scandium nitride (AlScN), lead zirconate titanate (PZT), lithium niobate (LiNbO.sub.3), or the like.

[0149] E. Upper Electrode

[0150] As shown in FIG. 2, the upper electrode is located above the piezoelectric layer (specifically, above the z-axis direction of the three-dimensional coordinate system).

[0151] As an example but not a limitation, as shown in FIG. 2, a boundary (or an edge) of the upper electrode is located inside the boundary of the acoustic isolation layer. In other words, a projection of the upper electrode on the plane #A is located inside the projection of the acoustic isolation layer on the plane #A.

[0152] In this application, the top electrode may be made of a conductive material.

[0153] In this application, the upper electrode may be in a sheet shape or a plate shape extending in the direction of the plane #A.

[0154] As an example but not a limitation, a shape of the upper electrode (specifically, a shape of a projection of the lower electrode in the direction of the plane #A) may include but is not limited to a polygon (for example, an irregular polygon) or an irregular geometric shape. This is not particularly limited in this application. For example, as shown in FIG. 3, the upper electrode may be a trapezoid.

[0155] As shown in FIG. 2 or FIG. 3, in this application, the top electrode may include a region #1 (namely, an example of a first region) and a region #2 (namely, an example of a second region).

[0156] The region #2 is formed as a loop region surrounding the region #1.

[0157] In addition, the region #2 is electrically connected to the region #1. For example, the region #2 that is electrically connected to the region #1 may be generated around the region #1 in a manner such as vapor deposition.

[0158] As an example but not a limitation, a boundary (or an edge) of the region #1 is located inside the boundary of the acoustic isolation layer. In other words, a projection of the region #1 on the plane #A is located inside the projection of the acoustic isolation layer on the plane #A.

[0159] In addition, a height (specifically, a height in the z-axis direction) of the region #1 is greater than or equal to 0.05 micrometers (μm) and less than or equal to 0.6 μm.

[0160] The region #1 is made of a conductive material. For example, a material of the region #1 is molybdenum, titanium, platinum, aluminum, copper, gold, or the like.

[0161] It should be understood that the foregoing listed materials of the region #1 are merely examples for description, and this application is not limited thereto.

[0162] The following describes parameters in the region #2 in detail.

[0163] 1. Size of Region #2

[0164] A boundary of the region #2 may be located on an inner side of the boundary of the acoustic isolation layer. In other words, a projection of the region #2 on the plane #A is located inside the projection of the acoustic isolation layer on the plane #A.

[0165] 2. Width of Region #2

[0166] As an example but not a limitation, a width d2 of an edge of an outer ring and an edge of an inner ring of the region #2 (or a loop width of a projection of the region #2 on the plane #A, or a thickness of the region #2) is greater than or equal to 0.5 μm and less than or equal to 10 μm.

[0167] It should be understood that the foregoing enumerated values of the width d2 of the region #2 are merely examples for description. This is not particularly limited in this application. A value of the width d2 of the region #2 may be randomly adjusted based on parameters such as a range of the region #1 and a range of the acoustic isolation layer.

[0168] 3. Height of Region #2

[0169] A height of the region #2 (specifically, a height in the z-axis direction) may be greater than or equal to 0.05 micrometers (μm), and may be less than or equal to 0.6 μm.

[0170] For example, as shown in FIG. 2, the height of the region #2 may be the same as the height of the region #1.

[0171] Alternatively, a height h2 of the region #2 may be different from a height h1 of the region #1. For example, in the region #1 and the region #2, a height of a region with a higher density is greater than a height of a region with a lower density. For example, as shown in FIG. 4, if a density ρ1 of the region #1 is greater than a density ρ2 of the region #2, h1 is greater than h2.

[0172] 4. Material of Region #2

[0173] The region #2 is made of a conductive material. For example, a material of the region #2 is molybdenum, titanium, platinum, aluminum, copper, gold, or the like.

[0174] It should be understood that the foregoing listed materials of the region #2 are merely examples for description, and this application is not limited thereto.

[0175] 5. Density of the Region #2 (Specifically, a Relationship Between a Density of the Region #2 and a Density of the Region #1)

[0176] In this application, the density ρ2 of the region #2 is different from the density ρ1 of the region #1. Therefore, an acoustic reflection boundary condition is formed, and a transverse parasitic mode is suppressed.

[0177] For example, in this application, the density of the region #2 may be less than the density of the region #1 by selecting a material.

[0178] For another example, in this application, the density of the region #2 may be greater than the density of the region #1 by selecting a material.

[0179] As an example but not a limitation, for example, ρ1 may be three times or more than three times as large as ρ2 by selecting a material.

[0180] For another example, ρ2 may be three times or more than three times as large as ρ1 by selecting a material.

[0181] As an example but not a limitation, for example, ρ1 may be seven times or more than seven times as large as ρ2 by selecting a material. For example, the material of the region #1 is tungsten, and the material of the region #2 is aluminum.

[0182] For another example, ρ2 may be three times or more than three times as large as ρ1 by selecting a material. For example, the material of the region #1 is aluminum, and the material of the region #2 is molybdenum.

[0183] 6. Thermal Conductivity of Region #2 (Specifically, a Relationship Between a Thermal Conductivity of the Region #2 and a Thermal Conductivity of the Region #1)

[0184] In this application, a thermal conductivity k2 of the region #2 is less than a thermal conductivity k1 of the region #1.

[0185] Specifically, an FBAR uses the piezoelectric effect to generate resonance of a radio frequency band. Compared with a conventional dielectric device, the FBAR has dielectric loss, and also has electromechanical loss caused by mechanical vibration of a piezoelectric body. Therefore, obvious temperature rise or thermal stress occurs when the FBAR works, and the temperature rise or the thermal stress inevitably causes a performance drift of the FBAR. When the performance drift exceeds a design specification, the device cannot be used. This is why a power capacity of the FBAR is low. Because of mechanical resonance, a resonance amplitude is the largest in the middle of a resonance region because the most heat is generated at an electrode due to load. Because a suspended structure is the most difficult part of heat dissipation, a heat problem of the device is the most obvious in the suspended structure region, and adverse impact is the most serious. This is a key position that restricts a maximum power capacity of the device.

[0186] According to the solution provided in this application, the heat conductivity k2 of the region #2 is enabled to be less than the heat conductivity k1 of the region #1, so that a heat dissipation effect of the region #1 located in the middle of the resonance region can be improved, so that a power capacity of the FBAR is improved.

[0187] For example, in this application, the thermal conductivity k2 of the region #2 may be less than the thermal conductivity k1 of the region #1 by selecting a material.

[0188] The following describes a method for preparing the acoustic wave resonator.

[0189] (a) A sacrificial layer material is deposited on a silicon substrate, where the sacrificial layer material may be a dielectric material such as silicon dioxide or phosphorosilicate glass. A pattern of the sacrificial layer material is manufactured into a pattern of a predetermined acoustic isolation layer by photoetching and etching processes to form a sacrificial layer of the acoustic isolation layer.

[0190] (b) Silicon or germanium is epitaxially extended on a surface of the silicon substrate on which no sacrificial layer material is disposed by using an epitaxial process, an epitaxial height is greater than or equal to a height of the sacrificial layer, and the sacrificial layer and the substrate are processed into a flat surface by using a chemical mechanical polishing process, to facilitate subsequent electrode and piezoelectric layer deposition and patterning processes.

[0191] (c) A lower electrode material above the sacrificial layer and the substrate is deposited by using a physical vapor deposition process or another process, where the lower electrode material may be a metal material such as molybdenum, platinum, tungsten, or aluminum, and a lower electrode is formed by using photoetching and etching processes.

[0192] (d) A piezoelectric layer is deposited above the lower electrode by using the physical vapor deposition process.

[0193] (e) An electrode material of the region #1 is deposited above the piezoelectric layer by using the physical vapor deposition process, and an electrode of the region #1 is formed by using the photoetching and etching processes.

[0194] (f) An electrode material of the region #2 is deposited above the piezoelectric layer by using the physical vapor deposition process, and an electrode of the region #2 is formed by using the photoetching and etching processes.

[0195] (h) The sacrificial layer material is removed by using a corrosion solution or gas to form an acoustic isolation layer.

[0196] FIG. 5 is a front sectional view of still another example of an acoustic wave resonator according to this application. A difference from the acoustic wave resonator shown in FIG. 2 lies in that the lower electrode of the acoustic wave resonator shown in FIG. 5 includes two regions, and parameters of the two regions are similar to parameters of two regions of the upper electrode of the acoustic wave resonator shown in FIG. 2. To avoid repetition, detailed description is omitted herein.

[0197] In addition, to improve performance of the piezoelectric layer, in the acoustic wave resonator shown in FIG. 5, heights (specifically, heights in the z-axis direction) of the two regions of the lower electrode are the same, and flatness of upper surfaces (that is, surfaces in contact with the piezoelectric layer) of the two regions of the lower electrode is the same.

[0198] FIG. 6 and FIG. 7 show still another example of an acoustic wave resonator according to this application. A difference from the acoustic wave resonator shown in FIG. 2 lies in that the upper electrode of the acoustic wave resonator shown in FIG. 6 and FIG. 7 includes three regions. To avoid repetition, the following mainly describes the three regions of the upper electrode in detail.

[0199] As shown in FIG. 6 or FIG. 7, in this application, the top electrode may include the region #1 (namely, an example of the first region), the region #2 (namely, an example of the second region), and a region #3 (namely, an example of a third region).

[0200] The region #2 is formed as a loop region surrounding the region #1.

[0201] In addition, the region #2 is electrically connected to the region #1. For example, the region #2 that is electrically connected to the region #1 may be generated around the region #1 in a manner such as vapor deposition.

[0202] The region #3 forms a loop region surrounding the region #2.

[0203] In addition, the region #3 is electrically connected to the region #2. For example, the region #3 that is electrically connected to the region #2 may be generated around the region #2 in a manner such as vapor deposition.

[0204] As an example but not a limitation, a boundary (or an edge) of the region #1 is located inside the boundary of the acoustic isolation layer. In other words, a projection of the region #1 on the plane #A is located inside the projection of the acoustic isolation layer on the plane #A.

[0205] In addition, a height (specifically, a height in the z-axis direction) of the region #1 is greater than or equal to 0.05 micrometers (μm) and less than or equal to 0.6 μm.

[0206] The region #1 is made of a conductive material. For example, the material of the region #1 is molybdenum, titanium, platinum, aluminum, copper, gold, or the like.

[0207] It should be understood that the foregoing listed materials of the region #1 are merely examples for description, and this application is not limited thereto.

[0208] The following describes parameters in the region #2 in detail.

[0209] 1. Size of Region #2

[0210] A boundary of the region #2 may be located on the inner side of the boundary of the acoustic isolation layer. In other words, a projection of the region #2 on the plane #A is located inside the projection of the acoustic isolation layer on the plane #A.

[0211] 2. Width of Region #2

[0212] As an example but not a limitation, a width d2 of an edge of an outer ring and an edge of an inner ring of the region #2 (or a loop width of a projection of the region #2 on the plane #A, or a thickness of the region #2) is greater than or equal to 0.5 μm and less than or equal to 10 μm.

[0213] It should be understood that the foregoing enumerated values of the width d2 of the region #2 are merely examples for description. This is not particularly limited in this application. A value of the width d2 of the region #2 may be randomly adjusted based on parameters such as a range of the region #1 and a range of the acoustic isolation layer.

[0214] 3. Height of Region #2

[0215] A height of the region #2 (specifically, a height in the z-axis direction) may be greater than or equal to 0.05 micrometers (μm), and may be less than or equal to 0.6 μm.

[0216] For example, as shown in FIG. 2, the height of the region #2 may be the same as the height of the region #1.

[0217] Alternatively, the height h2 of the region #2 may be different from the height h1 of the region #1. For example, as shown in FIG. 4, h1 is greater than h2.

[0218] 4. Material of Region #2

[0219] The region #2 is made of a conductive material. For example, the material of the region #2 is molybdenum, titanium, platinum, aluminum, copper, gold, or the like.

[0220] It should be understood that the foregoing listed materials of the region #2 are merely examples for description, and this application is not limited thereto.

[0221] 5. Density of Region #2 (Specifically, a Relationship Between the Density of the Region #2 and the Density of the Region #1)

[0222] In this application, the density ρ2 of the region #2 is less than the density ρ1 of the region #1. Therefore, an acoustic reflection boundary condition is formed, and a transverse parasitic mode is suppressed.

[0223] For example, in this application, the density of the region #2 may be less than the density of the region #1 by selecting a material.

[0224] 6. Thermal Conductivity of Region #2 (Specifically, a Relationship Between a Thermal Conductivity of the Region #2 and a Thermal Conductivity of the Region #1)

[0225] In this application, the thermal conductivity k2 of the region #2 is less than the thermal conductivity k1 of the region #1.

[0226] For example, in this application, the thermal conductivity k2 of the region #2 may be less than the thermal conductivity k1 of the region #1 by selecting a material.

[0227] The following describes parameters in the region #3 in detail.

[0228] a. Size of Region #3

[0229] A boundary of the region #3 may be located on the inner side of the boundary of the acoustic isolation layer. In other words, a projection of the region #3 on the plane #A is located inside the projection of the acoustic isolation layer on the plane #A.

[0230] b. Width of Region #3

[0231] As an example but not a limitation, a width d3 of an edge of an outer ring and an edge of an inner ring of the region #3 (or a loop width of a projection of the region #3 on the plane #A, or a thickness of the region #3) is greater than or equal to 0.5 μm and less than or equal to 10 μm.

[0232] It should be understood that the foregoing enumerated values of the width d3 of the region #3 are merely examples for description. This is not particularly limited in this application. A value of the width d3 of the region #3 may be randomly adjusted based on parameters such as a range of the region #1, a range of the region #2, and a range of the acoustic isolation layer.

[0233] c. Height of Region #3

[0234] A height of the region #3 (specifically, a height in the z-axis direction) may be greater than or equal to 0.05 micrometers (μm), and may be less than or equal to 0.6 μm.

[0235] For example, as shown in FIG. 6, the height of the region #3 is the same as the height of the region #1 and/or the height of the region #2.

[0236] Alternatively, a height h3 of the region #3 may be different from a height h1 of the region #1. For example, as shown in FIG. 8, h3 is greater than h1. Alternatively, the height h3 of the region #3 may be different from the height h2 of the region #2. For example, as shown in FIG. 8, h3 is greater than h2.

[0237] For example, h1=h2=h3.

[0238] For another example, h3>h1>h2.

[0239] d. Material of Region #3

[0240] The region #3 is made of a conductive material. For example, the material of the region #3 is molybdenum, titanium, platinum, aluminum, copper, gold, or the like.

[0241] It should be understood that the foregoing listed materials of the region #3 are merely examples for description, and this application is not limited thereto.

[0242] e. Density of Region #3 (Specifically, a Relationship Between a Density of the Region #3 and the Density of the Region #1 and the Density of the Region #2)

[0243] In this application, a density ρ3 of the region #3 is greater than the density ρ1 of the region #1, and the density ρ3 of the region #3 is greater than the density ρ2 of the region #2. Therefore, an acoustic reflection boundary condition is formed, and a transverse parasitic mode is suppressed.

[0244] For example, ρ3>ρ1>ρ2.

[0245] In this application, the density of the region #3 may be greater than the density of the region #1 and the density of the region #2 by selecting a material.

[0246] f. Thermal Conductivity of Region #3 (Specifically, a Relationship Between the Thermal Conductivity of the Region #3 and a Thermal Conductivity of the Region #1 and/or a Thermal Conductivity of the Region #2)

[0247] In this application, a thermal conductivity k3 of the region #3 is less than the thermal conductivity k1 of the region #1.

[0248] For example, in this application, the thermal conductivity k3 of the region #3 may be less than the thermal conductivity k1 of the region #1 by selecting a material.

[0249] In addition, in this application, a relationship between the thermal conductivity k3 of the region #3 and the thermal conductivity k2 of the region #2 is not particularly limited.

[0250] The following describes a method for preparing the acoustic wave resonator.

[0251] (a) A sacrificial layer material is deposited on a silicon substrate, where the sacrificial layer material may be a dielectric material such as silicon dioxide or phosphorosilicate glass. A pattern of the sacrificial layer material is manufactured into a pattern of a predetermined acoustic isolation layer by photoetching and etching processes to form a sacrificial layer of the acoustic isolation layer.

[0252] (b) Silicon or germanium is epitaxially extended on a surface of the silicon substrate on which no sacrificial layer material is disposed by using an epitaxial process, an epitaxial height is greater than or equal to a height of the sacrificial layer, and the sacrificial layer and the substrate are processed into a flat surface by using a chemical mechanical polishing process, to facilitate subsequent electrode and piezoelectric layer deposition and patterning processes.

[0253] (c) A lower electrode material above the sacrificial layer and the substrate is deposited by using a physical vapor deposition process or another process, where the lower electrode material may be a metal material such as molybdenum, platinum, tungsten, or aluminum, and a lower electrode is formed by using photoetching and etching processes.

[0254] (d) A piezoelectric layer is deposited above the lower electrode by using the physical vapor deposition process.

[0255] (e) An electrode material of the region #1 is deposited above the piezoelectric layer by using the physical vapor deposition process, and an electrode of the region #1 is formed by using the photoetching and etching processes.

[0256] (f) An electrode material of the region #2 is deposited above the piezoelectric layer by using the physical vapor deposition process, and an electrode of the region #2 is formed by using the photoetching and etching processes.

[0257] (g) An electrode material of the region #3 is deposited above the piezoelectric layer by using the physical vapor deposition process, and an electrode of the region #3 is formed by using the photoetching and etching processes.

[0258] (h) The sacrificial layer material is removed by using a corrosion solution or gas to form an acoustic isolation layer.

[0259] FIG. 9 is a front sectional view of still another example of an acoustic wave resonator according to this application. A difference from the acoustic wave resonator shown in FIG. 6 lies in that the lower electrode of the acoustic wave resonator shown in FIG. 9 includes three regions, and parameters of the three regions are similar to parameters of three regions of the upper electrode of the acoustic wave resonator shown in FIG. 6. To avoid repetition, detailed description is omitted herein.

[0260] In addition, to improve performance of the piezoelectric layer, in the acoustic wave resonator shown in FIG. 9, heights (specifically, heights in the z-axis direction) of the three regions of the lower electrode are the same, and flatness of upper surfaces (that is, surfaces in contact with the piezoelectric layer) of the three regions of the lower electrode is the same.

[0261] FIG. 10 and FIG. 11 show still another example of an acoustic wave resonator according to this application. A difference from the acoustic wave resonator shown in FIG. 2 lies in that the upper electrode of the acoustic wave resonator shown in FIG. 10 and FIG. 11 includes four regions. To avoid repetition, the following mainly describes the four regions of the upper electrode in detail.

[0262] As shown in FIG. 10 or FIG. 11, in this application, the top electrode may include the region #1 (namely, an example of the first region), the region #2 (namely, an example of the second region), a region #3′ (namely, an example of the third region), and a region #4 (namely, an example of the third region).

[0263] The region #2 is formed as a loop region surrounding the region #1.

[0264] In addition, the region #2 is electrically connected to the region #1. For example, the region #2 that is electrically connected to the region #1 may be generated around the region #1 in a manner such as vapor deposition.

[0265] The region #3 forms a loop region surrounding the region #2.

[0266] In addition, the region #3′ is electrically connected to the region #2. For example, the region #3′ that is electrically connected to the region #2 may be generated around the region #2 in a manner such as vapor deposition.

[0267] In addition, the region #4 is electrically connected to the region #3′. For example, the region #4 that is electrically connected to the region #3′ may be generated around the region #3′ in a manner such as vapor deposition.

[0268] As an example but not a limitation, a boundary (or an edge) of the region #1 is located inside the boundary of the acoustic isolation layer. In other words, a projection of the region #1 on the plane #A is located inside the projection of the acoustic isolation layer on the plane #A.

[0269] In addition, a height (specifically, a height in the z-axis direction) of the region #1 is greater than or equal to 0.05 micrometers (μm) and less than or equal to 0.6 μm.

[0270] The region #1 is made of a conductive material. For example, the material of the region #1 is molybdenum, titanium, platinum, aluminum, copper, gold, or the like.

[0271] It should be understood that the foregoing listed materials of the region #1 are merely examples for description, and this application is not limited thereto.

[0272] The following describes parameters in the region #2 in detail.

[0273] 1. Size of Region #2

[0274] A boundary of the region #2 may be located on the inner side of the boundary of the acoustic isolation layer. In other words, a projection of the region #2 on the plane #A is located inside the projection of the acoustic isolation layer on the plane #A.

[0275] 2. Width of Region #2

[0276] As an example but not a limitation, a width d2 of an edge of an outer ring and an edge of an inner ring of the region #2 (or a loop width of a projection of the region #2 on the plane #A, or a thickness of the region #2) is greater than or equal to 0.5 μm and less than or equal to 10 μm.

[0277] It should be understood that the foregoing enumerated values of the width d2 of the region #2 are merely examples for description. This is not particularly limited in this application. A value of the width d2 of the region #2 may be randomly adjusted based on parameters such as a range of the region #1 and a range of the acoustic isolation layer.

[0278] 3. Height of Region #2

[0279] A height of the region #2 (specifically, a height in the z-axis direction) may be greater than or equal to 0.05 micrometers (μm), and may be less than or equal to 0.6 μm.

[0280] For example, as shown in FIG. 2, the height of the region #2 may be the same as the height of the region #1.

[0281] Alternatively, the height h2 of the region #2 may be different from the height h1 of the region #1. For example, as shown in FIG. 4, h1 is greater than h2.

[0282] 4. Material of Region #2

[0283] The region #2 is made of a conductive material. For example, the material of the region #2 is molybdenum, titanium, platinum, aluminum, copper, gold, or the like.

[0284] It should be understood that the foregoing listed materials of the region #2 are merely examples for description, and this application is not limited thereto.

[0285] 5. Density of Region #2 (Specifically, a Relationship Between the Density of the Region #2 and the Density of the Region #1)

[0286] In this application, the density ρ2 of the region #2 is less than the density ρ1 of the region #1. Therefore, an acoustic reflection boundary condition is formed, and a transverse parasitic mode is suppressed.

[0287] For example, in this application, the density of the region #2 may be less than the density of the region #1 by selecting a material.

[0288] 6. Thermal Conductivity of Region #2 (Specifically, a Relationship Between the Thermal Conductivity of the Region #2 and the Thermal Conductivity of the Region #1)

[0289] In this application, the thermal conductivity k2 of the region #2 is less than the thermal conductivity k1 of the region #1.

[0290] For example, in this application, the thermal conductivity k2 of the region #2 may be less than the thermal conductivity k1 of the region #1 by selecting a material.

[0291] The following describes parameters in the region #3 in detail.

[0292] a. Size of Region #3′

[0293] A boundary of the region #3′ may be located on the inner side of the boundary of the acoustic isolation layer. In other words, a projection of the region #3′ on the plane #A is located inside the projection of the acoustic isolation layer on the plane #A.

[0294] b. Width of Region #3′

[0295] As an example but not a limitation, a width d3′ of an edge of an outer ring and an edge of an inner ring of the region #3′ (or a loop width of a projection of the region #3′ on the plane #A, or a thickness of the region #3′) is greater than or equal to 0.1 μm and less than or equal to 2 μm.

[0296] It should be understood that the foregoing enumerated values of the width d3′ of the region #3′ are merely examples for description. This is not particularly limited in this application. A width d3′ of the region #3′ may be randomly adjusted based on parameters such as a range of the region #1, a range of the region #2, a range of the region #4, and a range of the acoustic isolation layer.

[0297] c. Height of Region #3′

[0298] A height of the region #3′ (specifically, a height in the z-axis direction) may be greater than or equal to 0.05 micrometers (μm), and may be less than or equal to 0.6 μm.

[0299] For example, as shown in FIG. 10, a height of the region #3′ is the same as the height of the region #1 and/or the height of the region #2.

[0300] Alternatively, the height h3′ of the region #3′ may be different from the height h2 of the region #2. For example, as shown in FIG. 12, h3′ is greater than h2.

[0301] In addition, a relationship between the height of the region #3′ and the height of the region #1 is not particularly limited in this application.

[0302] For example, h1=h2=h3.

[0303] For another example, h3=h1>h2.

[0304] d. Material of Region #3′

[0305] The region #3′ is made of a conductive material. For example, a material of the region #3′ is molybdenum, titanium, platinum, aluminum, copper, gold, or the like.

[0306] It should be understood that the foregoing listed materials of the region #3′ are merely examples for description, and this application is not limited thereto.

[0307] As an example but not a limitation, materials of the region #3′ and the region #1 may be the same.

[0308] e. Density of Region #3′ (Specifically, a Relationship Between a Density of the Region #3′ and the Density of the Region #1 and the Density of the Region #2)

[0309] As an example but not a limitation, in this application, a density ρ3′ of the region #3′ is greater than the density ρ2 of the region #2. The density ρ3′ of the region #3′ is equal to the density ρ1 of the region #1.

[0310] That is, ρ3′=ρ1>ρ2.

[0311] In this application, the foregoing density relationships may be implemented by selecting a material.

[0312] f. Thermal Conductivity of Region #3′ (Specifically, a Relationship Between a Thermal Conductivity of the Region #3′ and the Thermal Conductivity of the Region #1 and/or the Thermal Conductivity of the Region #2)

[0313] In this application, a thermal conductivity k3′ of the region #3′ is equal to the thermal conductivity k1 of the region #1.

[0314] In addition, in this application, a relationship between the thermal conductivity k3′ of the region #3′ and the thermal conductivity k2 of the region #2 is not particularly limited.

[0315] The following describes parameters in the region #4 in detail.

[0316] I. Size of Region #4

[0317] A boundary of the region #4 may be located on the inner side of the boundary of the acoustic isolation layer. In other words, a projection of the region #4 on the plane #A is located inside the projection of the acoustic isolation layer on the plane #A.

[0318] II. Width of Region #4

[0319] As an example but not a limitation, a width d4 of an edge of an outer ring and an edge of an inner ring of the region #4 (or a loop width of a projection of the region #4 on the plane #A, or a thickness of the region #4) is greater than or equal to 0.5 μm and less than or equal to 10 μm.

[0320] It should be understood that the foregoing enumerated values of the width d4 of the region #4 are merely examples for description. This is not particularly limited in this application. A width d4 of the region #4 may be randomly adjusted based on parameters such as a range of the region #1, a range of the region #2, a range of the region #3′, and a range of the acoustic isolation layer.

[0321] III. Height of Region #4

[0322] A height of the region #4 (specifically, a height in the z-axis direction) may be greater than or equal to 0.05 micrometers (μm), and may be less than or equal to 0.6 μm.

[0323] For example, as shown in FIG. 10, the height of the region #4 is the same as the height of the region #1, the height of the region #2, and/or the height of the region 3′.

[0324] Alternatively, the height h4 of the region #4 may be different from the height h2 of the region #2. For example, as shown in FIG. 12, h4 is greater than h2. In addition, the height h4 of the region #4 may be different from the height h1 of the region #1. For example, as shown in FIG. 12, h4 is greater than h1.

[0325] For example, h1=h2=h3=h4.

[0326] For another example, h4>h3=h1>h2.

[0327] IV. Material of Region #4

[0328] The region #4 is made of a conductive material. For example, a material of the region #4 is molybdenum, titanium, platinum, aluminum, copper, gold, or the like.

[0329] It should be understood that the foregoing listed materials of the region #4 are merely examples for description, and this application is not limited thereto.

[0330] V. Density of Region #4 (Specifically, a Relationship Between a Density of the Region #4 and the Density of the Region #1, the Density of the Region #2, and the Density of the Region #3)

[0331] As an example but not a limitation, in this application, a density ρ4 of the region #4 is greater than the density ρ2 of the region #2. The density ρ4 of the region #4 is greater than the density ρ1 of the region #1.

[0332] That is, ρ4>ρ3′=ρ1>ρ2.

[0333] In this application, the foregoing density relationships may be implemented by selecting a material. Therefore, an acoustic reflection boundary condition is formed, and a parasitic mode of the resonator is suppressed.

[0334] VI. Thermal Conductivity of Region #4 (Specifically, a Relationship Between a Thermal Conductivity of the Region #4 and the Thermal Conductivity of the Region #1)

[0335] In this application, a thermal conductivity k4 of the region #4 is less than the thermal conductivity k1 of the region #1.

[0336] In addition, in this application, a relationship between the thermal conductivity k4 of the region #4 and the thermal conductivity k2 of the region #2 is not particularly limited.

[0337] The following describes a method for preparing the acoustic wave resonator.

[0338] (a) A sacrificial layer material is deposited on a silicon substrate, where the sacrificial layer material may be a dielectric material such as silicon dioxide or phosphorosilicate glass. A pattern of the sacrificial layer material is manufactured into a pattern of a predetermined acoustic isolation layer by photoetching and etching processes to form a sacrificial layer of the acoustic isolation layer.

[0339] (b) Silicon or germanium is epitaxially extended on a surface of the silicon substrate on which no sacrificial layer material is disposed by using an epitaxial process, an epitaxial height is greater than or equal to a height of the sacrificial layer, and the sacrificial layer and the substrate are processed into a flat surface by using a chemical mechanical polishing process, to facilitate subsequent electrode and piezoelectric layer deposition and patterning processes.

[0340] (c) A lower electrode material above the sacrificial layer and the substrate is deposited by using a physical vapor deposition process or another process, where the lower electrode material may be a metal material such as molybdenum, platinum, tungsten, or aluminum, and a lower electrode is formed by using photoetching and etching processes.

[0341] (d) A piezoelectric layer is deposited above the lower electrode by using the physical vapor deposition process.

[0342] (e) An electrode material of the region #1 is deposited above the piezoelectric layer by using the physical vapor deposition process, and an electrode of the region #1 is formed by using the photoetching and etching processes.

[0343] (f) An electrode material of the region #2 is deposited above the piezoelectric layer by using the physical vapor deposition process, and an electrode of the region #2 is formed by using the photoetching and etching processes.

[0344] (g) An electrode material of the region #3 is deposited above the piezoelectric layer by using the physical vapor deposition process, and an electrode of the region #3 is formed by using the photoetching and etching processes.

[0345] (h) An electrode material of the region #4 is deposited above the piezoelectric layer by using the physical vapor deposition process, and an electrode of the region #4 is formed by using the photoetching and etching processes.

[0346] (i) The sacrificial layer material is removed by using a corrosion solution or gas to form an acoustic isolation layer.

[0347] FIG. 13 is a front sectional view of still another example of an acoustic wave resonator according to this application. A difference from the acoustic wave resonator shown in FIG. 10 lies in that the lower electrode of the acoustic wave resonator shown in FIG. 13 includes four regions, and parameters of the four regions are similar to parameters of four regions of the upper electrode of the acoustic wave resonator shown in FIG. 10. To avoid repetition, detailed description is omitted herein.

[0348] In addition, to improve performance of the piezoelectric layer, in the acoustic wave resonator shown in FIG. 13, heights (specifically, heights in the z-axis direction) of the four regions of the lower electrode are the same, and flatness of upper surfaces (that is, surfaces in contact with the piezoelectric layer) of the four regions of the lower electrode is the same.

[0349] FIG. 14 is a schematic diagram of an example of a filter according to this application. As shown in FIG. 14, the filter includes a plurality of acoustic wave resonators, and at least one resonator in the plurality of acoustic wave resonators has a structure of the acoustic wave resonator shown in any one of FIG. 2 to FIG. 13. To avoid repetition, detailed description thereof is omitted herein. In addition, structures of two acoustic wave resonators connected in parallel may be the same or may be different. This is not specifically limited in this application. In addition, a grid filter may be formed according to a connection manner of the acoustic wave resonator shown in FIG. 14.

[0350] FIG. 15 is a schematic diagram of another example of a filter according to this application. As shown in FIG. 15, the filter includes a plurality of acoustic wave resonators, and at least one resonator in the plurality of acoustic wave resonators has a structure of the acoustic wave resonator shown in any one of FIG. 2 to FIG. 13. To avoid repetition, detailed description thereof is omitted herein. In addition, structures of two acoustic wave resonators connected in parallel may be the same or may be different. This is not specifically limited in this application. In addition, a stepped filter may be formed according to a connection manner of the acoustic wave resonator shown in FIG. 15.

[0351] FIG. 16 is a diagram of a structure of a wireless communications device (specifically, a radio frequency front-end of the wireless communications device) according to this application. As shown in FIG. 16, the communications device includes two communications links: a receive (Rx) communications link and a transmit (Tx) communications link. On one hand, an antenna receives a weak Rx signal, and an Rx filter #1, for example, a band-pass filter (Band Pass Filter, BPF) selects the weak Rx signal from a wide electromagnetic wave spectrum, and amplifies the weak Rx signal by using a low noise amplifier (LNA). Then the weak signal passes through an Rx filter #2, for example, a BPF, and the weak signal is transmitted to a frequency mixer. On the other hand, a Tx signal transmitted from a modulator first passes through a Tx filter #2, for example, a BPF, to filter out a spectrum other than the Tx signal. Then the Tx signal passes through a power amplifier (PA) at which a to-be-transmitted Tx signal is amplified, the Tx signal passes through a Tx filter #1, for example, a BPF, and the Tx signal is transmitted through a same antenna.

[0352] At least one of the Rx filter #1, the Rx filter #2, the Tx filter #1, and the Tx filter #2 has a structure of the acoustic wave resonator shown in any one of the foregoing accompanying drawings FIG. 2 to FIG. 13. To avoid repetition, detailed description thereof is omitted herein.

[0353] FIG. 17 is a simplified schematic diagram of a structure of a terminal device. For ease of understanding and illustration, an example in which the terminal device is a mobile phone is used in FIG. 17. As shown in FIG. 17, the terminal device includes a processor, a memory, a radio frequency circuit, an antenna, and an input/output apparatus. The processor is mainly configured to: process a communications protocol and communications data, control the terminal device, execute a software program, process data of the software program, and the like. The memory is mainly configured to store the software program and the data. The radio frequency circuit is mainly configured to: perform conversion between a baseband signal and a radio frequency signal, and process the radio frequency signal. The antenna is mainly configured to receive and send the radio frequency signal in a form of an electromagnetic wave. The input/output apparatus such as a touchscreen, a display screen, or a keyboard is mainly configured to receive data input by a user and output data to the user. It should be noted that some types of terminal devices may not have the input/output apparatus. In this application, the radio frequency circuit may include a plurality of filters, and at least one of the plurality of filters has a structure of the acoustic wave resonator shown in any one of FIG. 2 to FIG. 13.

[0354] When data needs to be sent, the processor performs baseband processing on to-be-sent data, and outputs a baseband signal to the radio frequency circuit. After performing radio frequency processing on the baseband signal, the radio frequency circuit sends the radio frequency signal in an electromagnetic wave form by using the antenna. When data is sent to the terminal device, the radio frequency circuit receives the radio frequency signal by using the antenna, converts the radio frequency signal into the baseband signal, and outputs the baseband signal to the processor. The processor converts the baseband signal into data and processes the data. For ease of description, FIG. 17 shows only one memory and one processor. In an actual terminal device product, there may be one or more processors and one or more memories. The memory may also be referred to as a storage medium, a storage device, or the like. The memory may be disposed independently of the processor, or may be integrated with the processor. This is not limited in this embodiment of this application.

[0355] In this embodiment of this application, the antenna and the radio frequency circuit that have receiving and sending functions may be considered as a transceiver unit of the terminal device, and the processor that has a processing function may be considered as a processing unit of the terminal device.

[0356] FIG. 18 is a simplified schematic diagram of a structure of a base station. The base station includes a transceiver and a processor. The transceiver is mainly configured to receive and send a radio frequency signal and perform conversion between the radio frequency signal and a baseband signal. A processor part is mainly configured to perform baseband processing, control the base station, and the like. The transceiver may be usually referred to as a transceiver unit, a transceiver, a transceiver circuit, or the like. The processor is usually a control center of the base station, and may be usually referred to as a processing unit.

[0357] The transceiver includes an antenna and a radio frequency circuit. The radio frequency circuit is mainly configured to perform radio frequency processing. Optionally, a component configured to implement a receiving function in the transceiver may be considered as a receiving unit, and a component configured to implement a sending function may be considered as a sending unit. In other words, the transceiver includes the receiving unit and the sending unit. The receiving unit may also be referred to as a receiver machine, a receiver, a receiver circuit, or the like, and the sending unit may be referred to as a transmitter, a transmitter circuit, or the like.

[0358] The processor may include one or more boards, and each board may include one or more processors and one or more memories. The processor is configured to read and execute program in the memory to implement a baseband processing function and control the base station. If there are a plurality of boards, the boards may be interconnected to enhance a processing capability. In an optional implementation, a plurality of boards may share one or more processors, a plurality of boards share one or more memories, or a plurality of boards simultaneously share one or more processors.

[0359] In this application, the transceiver (for example, a radio frequency circuit in the transceiver) may include a plurality of filters, and at least one of the plurality of filters has a structure of the acoustic wave resonator shown in any one of FIG. 2 to FIG. 13.

[0360] A person skilled in the art may use different methods to implement the described functions for each particular application, but it should not be considered that the implementation goes beyond the scope of this application.

[0361] It may be clearly understood by a person skilled in the art that, for the purpose of convenient and brief description, for a detailed working process of the foregoing system, apparatus, and unit, refer to a corresponding process in the foregoing method embodiments. Details are not described herein again.

[0362] In several embodiments provided in this application, it should be understood that the disclosed system and apparatus may be implemented in other manners. For example, the described apparatus embodiment is merely an example. For example, division into the units is merely logical function division and may be other division in an actual implementation. For example, a plurality of units or components may be combined or integrated into another system, or some features may be ignored or not performed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections may be implemented by using some interfaces. The indirect couplings or communication connections between the apparatuses or units may be implemented in an electrical form, a mechanical form, or another form.

[0363] The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one position, or may be distributed on a plurality of network units. Some or all of the units may be selected based on an actual requirement to achieve the objectives of the solutions of embodiments.

[0364] In addition, functional units in embodiments of this application may be integrated into one processing unit, each of the units may exist alone physically, or two or more units may be integrated into one unit.

[0365] The foregoing description is merely specific implementation of this application, but is not intended to limit the protection scope of this application. Any variation or replacement readily figured out by a person skilled in the art within the technical scope disclosed in this application shall fall within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.