Lighting device, lighting arrangement comprising lighting device and method for operating a lighting device
09554439 · 2017-01-24
Assignee
Inventors
Cpc classification
H01L2924/00014
ELECTRICITY
H05B44/00
ELECTRICITY
H01L2924/00
ELECTRICITY
H05B47/20
ELECTRICITY
H05B45/50
ELECTRICITY
H01L2924/00014
ELECTRICITY
H01L2924/00
ELECTRICITY
H01L25/167
ELECTRICITY
International classification
H01L25/075
ELECTRICITY
H05B41/00
ELECTRICITY
Abstract
A lighting device comprising a plurality of components (2) provided for generating radiation, a plurality of row lines (Z1, Z2) and a plurality of column lines (S1, S2, . . . , S5) is specified, wherein the components are in each case electrically conductively connected to a row line and to a column line and the lighting device is provided for the simultaneous operation of at least two components. A lighting arrangement comprising such a lighting device and a method for operating a lighting device are furthermore specified.
Claims
1. A method for operating a lighting device comprising a plurality of components provided for generating radiation, a plurality of row lines and a plurality of column lines, wherein the components are in each case electrically conductively connected to a row line and to a column line, wherein in each case one of at least two states is set for an operating potential of the row lines and a current supply of the column lines is set in each case by means of a current driver, wherein a row line is operated in an activated state, wherein a further row line is operated in a high-impedance state, wherein a column line is operated in an activated state, and wherein a further column line is operated with an intermediate voltage, which is between the voltage of the activated state of the row line and the voltage of the activated state of the column line, such that the component connected to the activated row line and to the column line with the intermediate voltage is deactivated.
2. The method according to claim 1, wherein components provided for generating radiation are preselected by the setting of an activated state for the assigned row lines and are operated by the activation of the current driver of the assigned column line.
3. The method according to claim 2, wherein a current intensity provided by the current driver is set depending on the number of row lines in the activated state.
4. The method according to claim 1, wherein the row lines are operated with a duty cycle of 100% and in each case only entire rows and/or entire columns are deactivated.
5. The method according to claim 1, wherein at least two row lines are operated alternately with a duty cycle of less than 100%, such that at least one component is deactivated and at least one further component in the column associated with the deactivated component and a further component in the row associated with the deactivated component are activated simultaneously.
6. The method according to claim 1, wherein in each case an ESD protection element having unidirectional blocking behavior with respect to the forward direction is connected in antiparallel with the components.
7. The method according to claim 1, wherein at least two row lines are operated alternately with a duty cycle of less than 100%, such that at least one component is deactivated and at least one further component in the column associated with the deactivated component and a further component in the row associated with the deactivated component are activated simultaneously and the current intensity is increased in a manner corresponding to the inverse duty cycle.
Description
(1) Further features, configurations and expediencies will become apparent from the following description of the exemplary embodiments in association with the figures.
(2) In the figures:
(3)
(4)
(5)
(6)
(7) Elements that are identical, of identical type or act identically are provided with the same reference signs in the figures.
(8) The figures and the size relationships of the elements illustrated in the figures among one another should not be regarded as to scale, rather individual elements may be illustrated with an exaggerated size in order to enable better illustration and/or in order to afford a better understanding.
(9) One exemplary embodiment of a lighting device 1 is illustrated schematically in plan view in
(10) A row line Z1, Z2 and a column line S1, S2, S3, S4 are respectively assigned to the rows and columns of the lighting device 1.
(11) In this exemplary embodiment, the lighting device comprises two rows and four columns. It goes without saying, however, that the lighting device can also comprise more than two rows and correspondingly more row lines, for example between two and five row lines inclusive. Furthermore, the lighting device 1 can also comprise a number of columns deviating from four, for example between two and eight column lines inclusive.
(12) For a headlight, for instance for a motor vehicle, an arrangement comprising exactly two row lines is particularly suitable for the lighting device. By means of the separate drivability of the two row lines, the function of a high beam as adaptive front headlight system and of a low beam can be realized in a simplified manner.
(13) The row lines Z1, Z2 and the column lines S1 to S4 are embodied as continuous conductor tracks crossing one another. There is no direct electrical connection between the conductor tracks. By way of example, an insulation layer can be formed (not explicitly illustrated), between the conductor tracks for the row lines and the conductor tracks for the column lines.
(14) The row lines and column lines need not necessarily cross one another. By way of example, it is also conceivable for only the row lines or only the column lines to be embodied in a continuous fashion and for individual segments of the non-continuous column lines or row lines to be connected to one another via connection lines such as bonding wires.
(15) In each case exactly one component 2 is assigned to the crossover points of the row lines Z1, Z2 and column lines S1 to S4. In a departure from this, however, a group comprising a plurality of components can also be assigned to at least one crossover point. The components of a group can then be driven only jointly.
(16) The components 2 are embodied as unpackaged LED semiconductor chips. The distance between the semiconductor chips of adjacent components can thus be minimized. A particularly compact configuration of the lighting device 1 is simplified thereby. The components are preferably embodied as LEDs. Superluminescence diodes can also be used. The use of coherent radiation sources, for example laser diodes, is also conceivable.
(17) The semiconductor chips of the components 2 in each case have a rear-side contact relative to a main emission direction of the lighting device 1, said contact being electrically conductively connected to the row lines Z1, Z2, for example by means of a solder layer or an electrically conductive adhesive layer. An electrically conductive connection to the associated column lines S1 to S4 is effected via a connection line 3, for example a bonding wire, between a top-side contact of the semiconductor chip 2 and the associated column line. In the exemplary embodiment shown, the connection line extends through an opening 35 as far as the respective column line.
(18) With regard to the arrangement of the contacts, however, other semiconductor chip geometries can also be used. By way of example, the semiconductor chip can be electrically connected via two front-side contacts by means of two connection lines. In this case, the rear side of the semiconductor chip can be electrically insulated from the row lines and the column lines. Semiconductor chips using so-called flip-chip geometry can also be used. A connection line can be dispensed with in this case.
(19) Furthermore, the components 2 need not necessarily overlap the row lines Z1, Z2 in plan view. By way of example, the components can be arranged in a manner spaced apart laterally from the row lines and can be electrically conductively connected to the row lines via a connection line. It goes without saying that the components 2 can also be arranged on the column lines S1 to S4.
(20) The semiconductor chips of the optoelectronic components 2 are preferably based on a III-V compound semiconductor material. III-V compound semiconductor materials are particularly suitable for generating radiation in the ultraviolet (Al.sub.xIn.sub.yGa.sub.1-x-yN) through the visible (Al.sub.xIn.sub.yGa.sub.1-x-y N, in particular for blue to green radiation, or Al.sub.xIn.sub.yGa.sub.1-x-yP, in particular for yellow to red radiation) to the infrared (Al.sub.xIn.sub.yGa.sub.1-x-yAs) spectral range. It holds true here in each case that 0x1, 0y1 and x+y1, in particular where x1, y1, x0 and/or y0. With III-V compound semiconductor materials, in particular from the material systems mentioned, high internal quantum efficiencies can furthermore be obtained when generating radiation.
(21) Instead of unpackaged semiconductor chips, designs in which the semiconductor chips provided for generating radiation are arranged in a package can also be used for the components 2. Although such components require more space on the carrier, they can be distinguished by a higher mechanical robustness, for example.
(22) A circuit for a lighting arrangement 11 comprising a lighting device 1 and a drive circuit 10 is illustrated in
(23) In each case a separate current driver I1 to I5 is assigned to the column lines S1 to S5. In order to reduce the averaged radiation power, a pulse width modulation with which the components 2 can be dimmed can be used in all of the exemplary embodiments.
(24) Different operating modes of the lighting arrangement during operation are illustrated in the tables in
(25) In the case of the configuration illustrated in
(26) In contrast thereto, in the case of the configuration illustrated in
(27) In the configuration illustrated in
(28)
(29) Instead of the configuration of the lighting arrangement illustrated in
(30) By means of the ESD protection elements 4, each individual component 2 can be protected against damage on account of an electrostatic discharge. Such a lighting arrangement is distinguished by a particularly high robustness and a reduced failure risk associated therewith. The ESD protection elements 4 can be arranged on the same carrier 5 as the optoelectronic components 2. Furthermore, the ESD protection element can also be integrated into the component 2, in particular into the semiconductor chip. Alternatively, however, the ESD protection elements 4 can also be arranged on a printed circuit board provided in addition to the carrier 5.
(31) Using bidirectionally blocking ESD protection elements an ESD protection for the components may be integrated, without the drive circuit 10 having to be modified for this purpose.
(32) In contrast thereto,
(33) Different operating modes of the lighting device are illustrated on the basis of the tables in
(34) In contrast to the description of
(35) A potential of 1.9 V0.7 V=1.2 V is established on the row line Z2 to which the high-impedance state Z is assigned, since the protection diode 4 connected in antiparallel with the component 2 assigned to the row Z2 and the column S2, for the intermediate voltage M present, is oriented in the forward direction. However, this resulting voltage of 1.2 V does not bring about radiation emission of the components 2 assigned to the row line Z2.
(36) A deactivation of an entire column can be achieved, as illustrated by way of example for the column S2 in
(37) A deactivation of an individual component 2 can be achieved, as illustrated in
(38) The circuit of the fifth exemplary embodiment of a lighting arrangement as illustrated in
(39) Compared with a configuration in which an ESD protection element is individually assigned to each component 2, the number of protection elements required can be reduced. In this exemplary embodiment, by way of example, a zener diode or a diode arrangement comprising two series-connected diodes oriented oppositely with regard to their forward direction, a thyristor or a varistor is suitable for the ESD protection element.
(40) This patent application claims the priority of German patent application 10 2012 105 630.7, the disclosure content of which is hereby incorporated by reference.
(41) The invention is not restricted by the description on the basis of the exemplary embodiments. Rather, the invention encompasses any novel feature and also any combination of features, which in particular includes any combination of features in the patent claims, even if this feature or this combination itself is not explicitly specified in the patent claims or exemplary embodiments.