Discharging workpieces

Abstract

A method of discharging workpieces cut from a planar material on a processing machine. A workpiece discharge device has several holding elements to receive and carry respective workpieces. After receiving a cut workpiece, the discharge device is moved to a waiting position outside and adjacent a processing region of the machine, and may then be moved back into the processing region to receive a subsequently cut workpiece before being moved to an unloading station.

Claims

1. A Method of processing and discharging workpieces from planar material, the method comprising: cutting a first workpiece from the planar material with a processing device in a processing region of a processing machine, while the planar material is supported on a workpiece support, leaving a residual connection between the first workpiece and adjacent planar material; positioning a discharge device in a receiving position in which a first of multiple holding elements of the discharge device is positioned to receive the first workpiece; holding the first workpiece with the first holding element in the receiving position; with the first workpiece held, severing the residual connection to separate the first workpiece from the adjacent planar material; moving the discharge device from the receiving position to a waiting position outside and adjacent the processing region while the first workpiece is held; cutting a further workpiece from the planar material with the processing device, while the planar material is supported on the workpiece support, leaving a further residual connection between the further workpiece and the adjacent planar material; moving the discharge device from the waiting position to a receiving position for the further workpiece; holding the further workpiece with another of the holding elements of the discharge device in the receiving position for the further workpiece; with the further workpiece held, severing the further residual connection to separate the further workpiece from the adjacent planar material; and then moving the discharge device to an unloading station and unloading the first and further workpieces from the discharge device.

2. The method of claim 1, wherein, after the residual connection is severed, the discharge device is lifted in the Z-direction and moved in either or both of the X- and Y-directions to a position corresponding to either the receiving position for the further workpiece or to the waiting position.

3. The method of claim 2, further comprising determining a movement path of the discharge device from the receiving position of the first workpiece to the receiving position of the further workpiece as a function of an X-dimension of the further workpiece.

4. The method of claim 2, wherein moving the discharge device to the receiving position for the further workpiece comprises orienting the discharge device in accordance with a contact spacing of the holding elements of the discharge device.

5. The method of claim 1, wherein the first and further workpieces are produced successively from the planar material along a lateral edge of the planar material and received by the holding elements of the discharge device one after the other and in the same order as produced.

6. The method of claim 1, further comprising determining a movement path between the waiting position and the receiving position for the further workpiece as a function of contact spacing of the holding elements of the discharge device and workpiece size.

7. The method of claim 1, wherein unloading the workpieces comprises depositing all workpieces received by the discharge device in the unloading station either simultaneously, individually one after the other, or in a stack.

8. The method of claim 1, wherein the workpieces are stored in an intermediate buffer of the discharge device after discharge from the processing region.

9. The method of claim 1, wherein cutting of the first and further workpieces from the planar material is carried out by skeleton-free processing.

10. The method of claim 1, wherein the planar material comprises a plate-like material.

11. The method of claim 1, wherein the planar material comprises a sheet of metal.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a perspective view of a processing machine.

(2) FIGS. 2a to 2c are schematic views, from above, of successive work steps to process and discharge workpieces.

(3) FIG. 3 is a schematic view from above of an alternative embodiment to FIGS. 2a to 2c.

(4) FIG. 4 is a further schematic view from above of an alternative embodiment to FIG. 3.

(5) FIG. 5 is a schematic side view of an alternative embodiment of the discharge device.

(6) FIG. 6 is a schematic side view of a further alternative embodiment of the discharge device.

DETAILED DESCRIPTION

(7) In FIG. 1, a processing machine 11 is formed, for example, as a punching machine. A preferably immovable processing device 21 having a punching head 14 and having a punching stamp that is not depicted in more detail is provided for the separation processing of a planar workpiece 12, for example, in the form of a sheet of metal. Alternatively, a laser punching machine can also be used in which a laser processing head is provided adjacent the punching head 14. The workpiece 12 to be processed lies on a workpiece support 16 during the workpiece processing. The workpiece 12 is held during the processing with a holding device 17, which preferably comprises brackets 18, and can be moved with respect to the punching head 14 in the X-direction of the workpiece plane (X/Y-plane) by means of a conventional linear drive 19, as indicated in the figure by an arrow. The workpiece 12 can be moved in the Y-direction of the workpiece plane, in that the workpiece support 16 is moved together with the holding device 17 relative to a base 24, on which the workpiece support 16 is supported, by means of a conventional linear drive 20, as indicated by another arrow. The workpiece 12 is able to be displaced in this way in both the X- and Y-direction relative to the punching head 14, such that the respective region of the workpiece 12 to be processed can be positioned in the processing region of the punching head 14, if these are present. The processing region lies between the punching head 14 and a punching matrix, which is not depicted in more detail and which is able to be exchanged. Accordingly, laser optics can be arranged in the immovable processing region of the laser processing head in a laser punching machine.

(8) A handling device 26 is provided on the front side of the workpiece support 16 of the processing machine 11, said handling device 26 also configured to include a discharge device 27, which is configured to move along at least one linear axis 28 between a loading and unloading position 29, 30 for the planar material 12 and a discharge or waiting position 32, as shown in FIG. 2c.

(9) The discharge device 27 comprises several holding elements 34, which each can be formed, for example, as a magnetic sucker, a vacuum sucker or an electro-adhesive sucker. In the exemplary embodiment a holding element 34 having several individual suckers is shown (FIG. 2c). Several holding elements 34 are arranged in a row one behind the other, and the size or position and width of the holding elements 34 can be determined freely by the allocation of the suckers 35 and can be adjusted to the size of the workpiece.

(10) The holding elements 34 can be moveably driven in at least one further axis, so in a Y and/or Z axis, along the X-Y-Z coordinate system, which is depicted in FIG. 1, having at least one linear drive.

(11) In FIG. 2a, the planar workpiece 12 as well as the holding device 17 having the brackets 18 are depicted in a schematically enlarged view, said brackets 18 receiving the planar workpiece 12. Additionally, the punching head 14 is depicted symbolically in an initial position. This workpiece 12 lies on the workpiece support 16, whichlike further components of the processing machine 11is not depicted in more detail.

(12) To produce a workpiece 36 from the planar material 12, the planar material 12 is moved, such that the punching head 14 is firstly situated in the position 38 in order to introduce a first cut into the planar material 12 from there, which ends in position 39. Subsequently, the planar material 12 is moved such that the punching head 14 is in position 41, in order to carry out a second cut from there, which ends in position 42. A residual connection 43 remains for a final cut.

(13) After the first and second cuts have been carried out according to FIG. 2a, in order, for example, to cut free a square work piece 36, the discharge of the workpiece 36 is initiated. The discharge device 27 is moved to a receiving position 45 from a loading or unloading position 29, 30, or preferably from a waiting position 32, which is depicted in FIG. 2c and was assumed during the first cuts to produce the workpiece 36, such that a holding element 34, which comprises, for example, three suckers, is positioned at the workpiece 36, which is then gripped by the holding element 34. Subsequently, the final cut occurs by means of the punching head 14, or alternatively with the laser processing head, separating the residual connection 43 such that the workpiece 36 comes completely free.

(14) Subsequent to this, the discharge device 27 is lifted at least slightly in the Z-direction and/or is led out in the Y-direction from the receiving position 45, such that the discharge device 27 in turn occupies the waiting position 32 depicted in FIG. 2c.

(15) Subsequentlyas is depicted in FIG. 2ca subsequent workpiece 36 is cut in the same way as the first work piece 36, by means of similar first and second cuts. Due to this work method, skeleton-free processing of the planar material 12 is enabled. After the first and second cut for the subsequent workpiece 36 have been completed, leaving a residual connection 43, the discharge device 27 is positioned in the receiving position 45 above the workpiece 36 in turn by a movement in the Y-direction and/or a slight movement in the Z-direction by means of the further holding element 34, such that the holding element 34 can grasp this and the discharge device now holds two workpieces 36, 36.

(16) In the depicted exemplary embodiment, the length of the planar material 12 preferably corresponds to the length of the discharge device 27 or to the holding elements 34 arranged in a row, such that a row of workpieces 36 arranged one behind the other can be received by the discharge device 27. Thus an intermediate buffer is formed. After, for example, one row of holding elements 34 is filled with workpieces 36, the discharge device 27 is moved from the waiting position 32 to an unloading station 51 via the handling device 26, which, in this example, comprises a magazine 52 positioned under the workpiece support 16. Alternatively, the unloading station 51 can be positioned adjacent the loading and unloading station 29, 30 in the work region of the linear axis 28, which is able to be operated via the handling device 26. In the unloading station 51, the workpieces 36 can be deposited, for example, stacked on top of one another. Alternatively, the workpieces can be deposited simultaneously into the magazine 52 and in the way in which they are discharged from their respective receiving position 45 by the discharge device 27.

(17) In the discharge device 27 depicted in FIG. 2c, for example, two rows of holding elements 34 arranged one behind the other are provided. For example, one frame receiving the holding elements 34 may be configured to rotate around 180, such that the second row of holding elements 34 is subsequently filled after the filling of the first row of holding elements 34.

(18) Due to this unloading strategy, in which the discharge device 27 moves between the receiving position 45 and the waiting position 32 without each individual workpiece being led away after the discharge from the processing region in the unloading station 51, an increase in productivity or in the degree of automation can be achieved. The long movement paths in the X-direction to unload the workpieces 36, 36 can be reduced in frequency.

(19) The discharge device 27 described above can be configured to have multiple holding elements 34, each with one or several suckers 35, in which the individual holding elements 34 are configured to be moved and controlled individually or as a group in the Z-direction. This enables an analogous work method to the work method described above. Additionally, processing to produce the workpieces 36 having a remaining skeleton can occur in place of skeleton-free processing of the planar material 12. Through the ability of the holding elements 34 to move along the Z-axis, the suckers 35 can be lowered onto the workpiece 36 to be discharged.

(20) Alternatively, in the case of a discharge device 27 with holding elements 34 that have, for example, suckers 35 or magnetic grippers, a discharge of workpieces 36 during processing with a remaining skeleton occurs, with the holding elements 34 being able to move in the Z-direction. The suction power of the suckers 35 or the magnetic force of a magnetic gripper can bridge the remaining gap, which remains in the case of a positioning of the discharge device 27, having a workpiece 36 that has already been received, to discharge a further workpiece 36, as a complete lowering of the discharge device 27 is not possible due to the remaining skeleton.

(21) In FIG. 3, an alternative embodiment is depicted in order to enable a discharge of several parts with the discharge device 27 before the punching head 14. In order to be able to move the workpieces 36 on the punching head 14 in the X-direction, it is suggested to design the discharge device 27 with a movement axis in the Y-direction, such that the discharge device 27 can also be positioned beyond the processing device 21, in order to enable a discharge of several parts. The movement of the discharge device 27 can occur analogously to the movement described in FIGS. 2a to 2c. The holding elements 34 in this embodiment can be, for example, a group of suckers 35 arranged at a distance to one another.

(22) In FIG. 4, a further alternative embodiment for an unloading strategy is depicted, in which a receiving position 45 or unloading position is provided next to the punching head 14. The holding elements 34 are at a distance to one another in order to form a free space or a gap 55 between them, which enables an at least partial receiving of the punching head 14 within the gap 55 in the case of a movement of the discharge device 27 in the Y-direction. Thus, the holding elements 34 can be positioned laterally to the punching head 14, in order to discharge workpieces 36, 36. To discharge the workpiece 36, 36, the discharge device 27 is moved in the Y-direction, with a short simultaneous or preliminary movement in the Z-direction.

(23) In FIG. 5, a schematic side view of an alternative embodiment of the discharge device 27 is depicted. This discharge device has a rotating band or a chain 61, on which a plurality of suckers 35 are arranged, in place of several holding elements 34 arranged in a plane having suckers 35. This discharge device 27 is transferred to the receiving position 45, such that the next free sucker 35 can discharge the workpiece 36. Subsequently, the discharge device 27 is again moved to the waiting position 32 and the chain 61 is rotated in the direction of the arrow 62, such that the next free sucker 35 is provided for receiving. This arrangement has the advantage that an intermediate buffer 67 is created in turn by such a chain 61 with suckers 35 or grippers. Additionally, such a chain 61 can be formed narrowly with suckers 35 arranged thereon. The possibility also exists that several chains 61 with suckers 35 arranged thereon are arranged in a row next to one another and form a discharge device 27, said suckers 35 being used one after the other.

(24) In FIG. 6, a further alternative embodiment of the discharge device 27 is depicted. This version of the discharge device 27 comprises a holding element 34, which is formed as a suction frame, in order to, for example, discharge the planar material 12 from the loading position 29 and to supply it to the processing region. Additionally, unloading equipment or a handling robot 66 is arranged on the suction frame, which is formed, for example, as a uni or multi-axial robot, which comprises a gripper. The gripper can be formed as a suction gripper or a magnetic gripper. After the discharge of the workpiece 36, it is transferred via the handling robot 66 to the intermediate buffer 67. The buffer can, for example, be a storage space on the back side or the upper side of the suction frame of the holding elements 34, configured to receive the produced workpieces 36.

(25) Both embodiments of the discharge device 27 are suitable for both skeleton-free processing and processing of the planar material in which a skeleton remains, which is removed in its entirety from the processing region after the production of the workpiece or is already reduced after the production of the respective workpiece and is continuously removed via an opening in the workpiece support 16.