Hinged MEMS diaphragm

Abstract

A micromechanical structure, comprising a substrate having a through hole; a residual portion of a sacrificial oxide layer peripheral to the hole; and a polysilicon layer overlying the hole, patterned to have a planar portion; a supporting portion connecting the planar portion to polysilicon on the residual portion; polysilicon stiffeners formed extending beneath the planar portion overlying the hole; and polysilicon ribs surrounding the supporting portion, attached near a periphery of the planar portion. The polysilicon ribs extend to a depth beyond the stiffeners, and extend laterally beyond an edge of the planar portion. The polysilicon ribs are released from the substrate during manufacturing after the planar region, and reduce stress on the supporting portion.

Claims

1. A micromechanical structure, comprising: a substrate having a through hole; a residual portion of a sacrificial oxide layer peripheral to the through hole formed on the substrate; and a polysilicon layer overlying the through hole, patterned to have: a planar portion; at least one supporting portion connecting the planar portion overlying the through hole to a portion of the polysilicon layer supported on the residual portion of the sacrificial oxide layer peripheral to the through hole, the at least one supporting portion being configured to permit movement of the planar portion with respect to the substrate; a first pattern of polysilicon stiffeners formed extending beneath the planar portion overlying the through hole, the first pattern of polysilicon stiffeners having a first depth and being configured to stiffen the planar portion; and a second pattern of polysilicon ribs selectively disposed proximate to the at least one supporting portion, attached near a periphery of the planar portion, wherein the polysilicon ribs extend from the planar portion to a depth beyond a depth of the polysilicon stiffeners, and extend laterally beyond an edge of the planar portion.

2. The micromechanical structure according to claim 1, wherein the polysilicon ribs have a height at least 10 times a thickness of the planar portion.

3. The micromechanical structure according to claim 1, wherein the polysilicon stiffeners intersect the polysilicon ribs.

4. The micromechanical structure according to claim 1, wherein at least a portion of the first pattern of polysilicon stiffeners is configured as a set of fingers which interdigitate with a corresponding set of fingers, formed of polysilicon, extending from a portion of the polysilicon layer on the residual portion of the sacrificial oxide layer peripheral to the through hole, wherein the planar portion is configured to move, by at least one of a flexion and a torsion of the at least one supporting region, to thereby cause a relative movement of the set of fingers with respect to the corresponding set of fingers out of a plane of the planar portion.

5. The micromechanical structure according to claim 4, wherein the set of fingers and the corresponding set of fingers are conductive and electrically isolated from each other, and are configured to act as a capacitive displacement sensor.

6. The micromechanical structure according to claim 4, wherein the planar portion is configured to move with respect to the substrate in response to acoustic vibrations.

7. The micromechanical structure according to claim 4, wherein the planar portion comprises a diaphragm of a directional microphone and is supported by a pair of opposed supporting portions, and is configured to rotate in response to acoustic vibrations about an axis defined by the pair of opposed supporting portions.

8. The micromechanical structure according to claim 1, wherein a plurality of independently movable planar portions are provided over a plurality of respective through holes on an integral substrate, in an array.

9. A micromechanical structure, comprising: a substrate having at least one through hole; a residual portion of a sacrificial oxide layer peripheral to the at least one through hole formed on the substrate; and a polysilicon layer overlying the at least one through hole and the residual portion of the sacrificial oxide layer; each respective through hole being associated with a patterned region of the polysilicon layer comprising: a planar portion overlying the respective through hole; at least one supporting portion connecting a the planar portion to a portion of the polysilicon layer on the residual portion of the sacrificial oxide layer peripheral to the respective through hole, being configured to permit movement of the planar portion with respect to the substrate; a first pattern of polysilicon stiffeners formed extending beneath the planar portion overlying the respective through hole, configured to stiffen the planar portion; and a second pattern of polysilicon ribs selectively disposed surrounding the at least one supporting portion, attached near a periphery of the planar portion, wherein the polysilicon ribs extend from the planar portion to a depth beyond a depth of the polysilicon stiffeners, and extend laterally beyond an edge of the respective planar portion.

10. The micromechanical structure array according to claim 9, wherein the polysilicon ribs have a height at least 10 times a thickness of the respective planar portion, and the polysilicon stiffeners intersect the polysilicon ribs.

11. The micromechanical structure array according to claim 9, wherein at least a portion of the second pattern of polysilicon ribs is configured as a set of fingers which interdigitate with a corresponding set of fingers, formed of polysilicon, extending from a portion of the polysilicon layer on the residual portion of the sacrificial oxide layer peripheral to the at least one through hole, wherein the respective planar portion is configured to move, by a flexion or torsion of the at least one supporting portion, to thereby cause a relative movement of the set of fingers with respect to the corresponding set of fingers out of a plane of the respective planar portion.

12. The micromechanical structure array according to claim 11, wherein the set of fingers and the corresponding set of fingers are conductive and electrically isolated from each other, and are together configured to act as a capacitive displacement sensor.

13. The micromechanical structure array according to claim 11, wherein a respective planar portion comprises a diaphragm of a directional microphone and is supported by a pair of opposed supporting portions, the diaphragm being configured to rotate in response to acoustic vibrations about an axis defined by the pair of opposed supporting portions.

14. A micromechanical structure, comprising: at least one trench etched into a substrate; a sacrificial layer formed on the substrate and walls of the at least one trench; a structural layer deposited over the sacrificial layer and the trench, having at least one separated structure having a respective peripheral boundary etched from the structural layer, wherein at least a portion of the structural layer overlying portions of the at least one trench is removed, exposing a portion of the structural layer extending into the at least one trench preserved at the respective peripheral boundary, to thereby define a respective supporting member which extends across the peripheral boundary; and at least one void formed through the substrate and the sacrificial layer, configured to expose an underside of the structural layer; wherein the sacrificial layer has higher residual compressive stresses than the structural layer, such that an unconstrained region of the sacrificial layer adjacent to the structural layer is subject to mechanical distortion in response to a difference in the respective residual compressive stresses, and the portion of the sacrificial layer surrounding the exposed portion of the structural layer extending into the trench preserved at the peripheral boundary is configured to be preserved during a removal of the sacrificial layer under the structural layer through the substrate during a formation of the at least one void to prevent damage to the structural layer, and to be removed after formation of the at least one void.

15. The micromechanical structure according to claim 14, the at least one portion of the structural layer separated from the substrate by a fluid space and is flexibly supported by a narrow portion of the structural layer prone to damage due to mechanical distortion, and the at least one trench is formed proximate to the narrow portion, the sacrificial layer underlying the narrow portion being removed before the sacrificial layer on the walls of the at least one trench, such that the narrow portion remains held in position by the structural layer which extends into the at least one trench while the sacrificial layer underlying the structural layer in regions absent the at least one trench is removed before the sacrificial layer adjacent to the structural layer which extends into the at least one trench, the sacrificial layer being removed sufficiently such that the structural layer which extends into the at least one trench is free to move into and out of the trench by a flexion or torsion of the narrow portion.

16. The micromechanical structure according to claim 15, wherein the substrate comprises silicon, the sacrificial layer comprises silicon dioxide formed by oxidizing a surface of the silicon substrate, and the structural layer comprises polysilicon.

17. The micromechanical structure according to claim 15, wherein the at least one trench comprises at least two trenches, having respectively different depths, wherein the deeper trench is formed proximate to the narrow portion, to thereby support the narrow portion while the sacrificial layer on the walls of the shallower trench is removed.

18. The micromechanical structure according to claim 14, wherein the at least one separated structure has a set of interdigitated fingers at a peripheral edge, and the interdigitated fingers have a depth greater than about ten times a thickness of the structural layer.

19. The micromechanical structure according to claim 14, wherein the at least one separated structure comprises a diaphragm of a microphone and has a set of conductive interdigitated fingers at a peripheral edge of the diaphragm forming part of a capacitive displacement sensor, the diaphragm being displaceable in response to acoustic vibrations.

20. The micromechanical structure according to claim 14, wherein a plurality of separated structures are formed on the substrate, each separated structure comprising a diaphragm of a microphone, the plurality of separated structures together forming a microphone diaphragm array.

Description

BRIEF DESCRIPTION OF THE FIGURES

(1) The invention will now be explained by way of example, in which:

(2) FIGS. 1A and 1B show a top view of a diaphragm, and cross section view of a prior art planar microstructure that is supported on flexible hinges; the structure is fabricated on a silicon chip that supports the hinges, and the diaphragm is separated from the surrounding substrate by etching a slit around the perimeter while leaving the connection at the hinges intact.

(3) FIG. 2 shows the stiffened diaphragm of FIGS. 1A and 1B, as seen through the hole in the backside of the chip.

(4) FIGS. 3A-3F show a fabrication process according to the prior art for microphone diaphragm shown in FIGS. 1A, 1B, and 2, with interdigitated comb fingers at the perimeter of the diaphragm, in which:

(5) FIG. 3A shows deep reactive ion etching (RIE);

(6) FIG. 3B shows thermal oxide growth;

(7) FIG. 3C shows polysilicon deposition;

(8) FIG. 3D shows polysilicon smoothing and RIE to define diaphragm and comb fingers;

(9) FIG. 3E shows backside RIE; and

(10) FIG. 3F shows buffered hydrofluoric acid etching to remove the thermal oxide.

(11) FIG. 3G shows an L-Edit image of the prior art silicon differential microphone diaphragm shown in FIGS. 1A, 1B, and 2 with comb fingers, slits that define the diaphragm and the comb fingers, and stiffeners that reinforce the diaphragm.

(12) FIG. 4 shows a predicted capacitance of a diaphragm according to the present invention, as a function of the out of plane displacement of the planar diaphragm, for electrodes having thickness of one or five microns.

(13) FIG. 5 shows a mask design (showing only the region near the supporting hinge) of comb fins to protect the supporting hinge according to the present invention.

(14) FIGS. 6A-6F show a fabrication process for interdigitated comb fins according to the present invention, in which stiffeners can be incorporated through the use of a separate trench etch as in the initial step, in which:

(15) FIG. 6A shows trench etching;

(16) FIG. 6B shows trench oxidation;

(17) FIG. 6C shows polysilicon deposition;

(18) FIG. 6D shows polysilicon patterning;

(19) FIG. 6E shows backside etching; and

(20) FIG. 6F shows buffered hydrofluoric acid release.

(21) FIG. 7 shows a flowchart of the fabrication process according to FIG. 6.

(22) FIGS. 8A-8C show cross section views of micromechanical device during fabrication in which FIG. 8A corresponds to the stage represented in FIG. 6E, FIG. 8C corresponds to the stage represented in FIG. 6F, and FIG. 8B is an intermediate stage.

DESCRIPTION OF THE INVENTION

(23) According to one embodiment of the technology, a 1 mm2 mm microphone diaphragm is made of polysilicon and has stiffeners and carefully designed hinge supports to ensure that it responds like a rigid body on flexible hinges. Larger microphone diaphragms, e.g., 1 mm3 mm are also possible. The diaphragm is designed to respond to pressure gradients, e.g., due to acoustic waves in air, giving it a first-order directional response to incident sound. Both the diaphragm and stiffening ribs are made of LPCVD (low pressure chemical vapor deposition) polysilicon. The diaphragm is about 2 m thick and the stiffening ribs are 4 m wide and 40 m tall. This structure provides a highly compliant differential microphone that responds to the differences in pressure on the two sides of the diaphragm that are separated by the hinges at the center [4, 20-22]. Interdigitated fingers, which consist of 100 m long, 1.5 m wide fingers with 6 m periodicity, are incorporated at the perimeter of the two ends of the diaphragm, the locations with maximum deflection. FIG. 3G shows the L-Edit image for the microphone diaphragm with interdigitated comb sense fingers.

(24) FIGS. 1A and 1B show a planar microstructure diaphragm 12 that is supported on flexible hinges 14. The structure is fabricated on a silicon chip that supports the hinges 14. The diaphragm 12 is separated from the surrounding silicon substrate 3 by etching a slit 15 around the perimeter while leaving the connection at the hinges 14 intact. The diaphragm 12 is intended to rotate like a rigid body without bending, so that its motion is dominated by rotation about its central axis 11. In applications where the rotation of the structure is intended to occur rapidly, it is essential that the mass moment of inertia about the pivot axis be as small as possible. To achieve the stiff diaphragm 12, stiffeners 2 may be provided on a thin membrane, to maintain its rigid body motion.

(25) FIG. 2 shows a stiffened diaphragm 12, as seen from the backside, through the backside hole below the diaphragm 12. This structure's motion is dominated by the rocking motion about the central hinge axis 11 as in the concept of FIGS. 1A and 1B [7]. FIG. 2 does not show the slit that surrounds the diaphragm at all locations other than at the pivots.

(26) The stiffeners 2 shown in FIG. 2 are formed using the same polysilicon material that is used to make the planar portion (the skin) of the diaphragm 12. The diaphragm 12 shown in FIG. 2 is 2 mm long and 1 mm wide. The stiffeners 2 are 30 microns tall and 2 microns wide. The skin of the diaphragm is approximately 1.5 microns thick. The substrate chip is 500 microns thick, which is also the depth of the rectangular hole shown in FIG. 2. The planar microstructure is created by processing silicon wafers 3 using the tools commonly employed in silicon microfabrication.

(27) FIGS. 3A-3F show a cross section view of the fabrication process flow for manufacturing a prior art microphone diaphragm 12. The process begins in step 1 shown in FIG. 3A, with a deep reactive ion etch of a bare silicon wafer 3 to create trenches 6 that are approximately 3 microns wide and 30 microns deep that act as the mold for the polysilicon stiffeners 10.

(28) This is followed, in step 2 shown in FIG. 3B, by a wet oxidation at 1100 degrees Celsius to grow a one-micron thick thermal oxide layer 4 on the wafer surface and in the trenches 6. This oxide is used as an etch stop for a subsequent backside cavity etch shown in FIG. 3E.

(29) The phosphorus-doped polysilicon is then deposited onto the thermal oxide 4 at 580 degrees Celsius through low-pressure chemical vapor deposition (LPCVD) and subsequently annealed to form polycrystalline silicon 5 at 1100 degrees Celsius in argon gas for 60 minutes in order to reduce intrinsic stress in the film in step 3 shown in FIG. 3C.

(30) The next step 4 shown in FIG. 3D planarizes the annealed polysilicon to form a flat diaphragm surface 8 having stiffeners 10, followed by reactive ion etching to define the interdigitated comb sense fingers 16 and slits 7 that separate the diaphragm 12 from the substrate 3 around the perimeter of the diaphragm 12 so that it will eventually be supported only on the flexible hinges 14 (shown in top view FIG. 3G).

(31) A through-wafer, deep reactive ion etch of the back cavity is then performed in step 5 shown in FIG. 3E, to free the back side of the diaphragm 12. This etch stops on the thermal oxide layer 4 film grown in step 2 shown in FIG. 3B.

(32) Finally, the diaphragm 12 is released in step 6 shown in FIG. 3F, using buffered hydrofluoric acid to remove the exposed portion of the thermal oxide layer 4.

(33) The process of FIGS. 3A-3F schematically show a practical method to create light-weight, yet stiff planar structures that are supported on flexible hinges. To create a device that can be actuated (such as a mirror) or to create a sensor (such as a motion detector or microphone), one may incorporate capacitive electrodes into the fabrication process of FIGS. 3A-3F. This could be accomplished either by constructing parallel plate-type capacitive electrodes at either end of the diaphragm or by modifying the slit etch to construct interdigitated fingers at the ends as shown in FIG. 5. The biologically-inspired microphone with interdigitated comb sense fingers 16, see e.g., U.S. Pat. No. 7,545,945 and U.S. Pat. No. 8,073,167, expressly incorporated herein by reference, is fabricated on a silicon substrate using a combination of surface and bulk micromachining techniques. This fabrication technique uses deep-trench etching and sidewall deposition to create very lightweight, very stiff membranes with stiffening ribs at optimal locations.

(34) An analytical model predicts the capacitance of these interdigitated electrodes as a function of the out of plane displacement of the planar diaphragm, as shown in FIG. 4. This technology enables the creation of electrodes having thickness on the order of five to ten microns, leading to substantial improvements in performance as shown. The fabrication process enables fabrication of interdigitated fingers having substantially larger thickness (in the direction normal to the plane of the diaphragm) than has been practical previously. Rather than constructing fingers having a thickness that is equal to that of the diaphragm skin (on the order of one micron), this process allows construction of interdigitated fins having a thickness on the order of five to ten microns. This results in a dramatic increase in capacitance as shown in FIG. 4. In addition, the predicted capacitance is seen to vary much more linearly with the diaphragm deflection with this increased electrode thickness.

(35) The results shown in FIG. 4 are for a device having dimensions that are appropriate for a MEMS microphone, and indicate that the nominal sensor capacitance is increased significantly by the use of five micron thick electrodes rather than one micron electrodes. The source capacitance is greater than the target minimum value of 1 pF, and is seen to vary linearly with the diaphragm deflection for a wide range of displacement.

(36) While the fabrication process exemplified in FIGS. 3A-3F easily permits the incorporation of interdigitated fingers, the resulting diaphragms can be subject to stress-induced fracture during the final release etch depicted in FIG. 3F. The diaphragm material is subjected to substantial stresses after completion of the back side deep reactive ion etch (FIG. 3E) because the sacrificial thermal oxide layer 4 typically has approximately 350 MPa of compressive stress relative to that of the bulk silicon wafer 3. This is in contrast to the polysilicon that comprises the diaphragm 12 which has approximately 50 MPa of stress (either compressive or tensile, depending on the anneal process, etc.). This substantial compressive stress on such a thin diaphragm 12 results in substantial deflection, typically in the negative direction (toward the back side hole). As the wet etch release of FIG. 3F commences, portions of the slit 7 may be released while sacrificial thermal oxide layer 4 remains over much of the diaphragm 12 surface, resulting in even greater deflections of the diaphragm 12. This can result in excessive deformations and stresses at the hinge 14 support, which can produce cracks in this critical element of the system.

(37) The present technology creates interdigitated electrodes having significantly increased thickness (i.e., depth into the plane of the structure) which causes the electrodes to also have substantially increased bending stiffness, that resist flexure of the diaphragm during the fabrication process. The interdigitated electrodes are separated by sacrificial oxide having a thickness of approximately one micron. During the release process, this oxide is likely to remain longer than that on the planar portions of the diaphragm. This is because the oxide that separates the electrodes is contained within a space that is approximately five microns deep, one micron wide and having a length equal to that of the electrodes (typically 50 to 100 microns). The wet etch process will require considerably longer to remove this buried material than that which is covering the plane surface of the diaphragm. The electrodes will thus resist flexure (and the associated damaging stresses and strains) that occur around the perimeter of the diaphragm. If the electrodes are also utilized in the vicinity of the delicate hinge support, they would provide considerable protection from the oxide compressive stress.

(38) The thickened interdigitated electrodes may be configured to provide a substantial increase in resistance to flexure in the vicinity of the diaphragm's hinge support. It is believed that this increased stiffness will provide sufficient protection to prevent cracks in the hinge and diaphragm during the wet release.

(39) The technology provides a method for creating interdigitated fins that provide the dual benefits of substantially increased capacitance over what can be achieved with interdigitated fingers which are limited to the thickness of the diaphragm (itself limited in thickness due to mass issues), and a reduction in structural stress during the critical steps in the fabrication process. These benefits may be achieved together or independently, and thus the thick interdigitated fins do not require protection of a hinge structure, and a protected hinge structure does not also require thick fins. The fins essentially combine the structural functions of the stiffeners and the capacitive functions of the fingers, described above. This process enables the practical construction of interdigitated electrodes having a depth that can be substantially greater than the thickness of the diaphragm skin. For example, a fin depth can be 5 to 10 microns, rather than the approximately one micron depth of the skin. Since the bending stiffness of the fins is proportional to the cube of the depth, this structure provides a dramatic increase in resistance to flexure, which serves to protect the supporting hinge during the release process. In addition, the increased depth of the interdigitated electrodes provides an increase in capacitance as shown in FIG. 4.

(40) FIG. 5 shows a plan view of a mask design the interdigitated fins 26 near the supporting hinge 24 of the diaphragm, which serve to protect the supporting hinge 24. The fins 21 are fixed to the substrate and the planar sheet on each side, and form an interdigitated comb fin 26 structure where they approach one another, the slit 23 etch is immediately lateral on each side of the supporting hinge 24, and define the lateral edges of a torsional bridge between the substrate and planar sheet, and the stiffeners 25 extend perpendicular or diagonal to the comb fins 21, as well as being provided parallel to the comb fins 21 adjacent to the slit 23 etch. FIG. 5 shows only the region near the supporting hinge. The supporting hinge 24 in this case consists of a stiffener that spans the entire width of the approximately rectangular structure and terminates in the bulk silicon comprising the substrate. FIG. 5 shows interdigitated fins 26 in the vicinity of the hinge 24 but they may also be incorporated around the entire diaphragm perimeter. The fins that are adjacent to the hinge 24 are primarily employed to protect the hinge 24 during fabrication; the limited motion of the diaphragm near the hinge 24 causes these nearby electrodes to have minimal use for sensing or actuation.

(41) The fabrication process to create the interdigitated comb fins is shown in FIGS. 6A-6F and FIG. 7. Note that stiffeners can be incorporated through the use of a separate trench etch, as in step 801 of FIG. 7. FIGS. 6A-6F show cross section views of the wafer at the interdigitated fins, i.e., beyond the edge of the surface of the diaphragm. A plan view is provided in FIG. 5, which shows that the trenches 6 used to create the fins 26 have separate terminations for fins that move with the diaphragm and for those that are fixed to the surrounding substrate.

(42) The fabrication starts in step 801, with a deep trench etch (FIG. 6A) into the silicon wafer to create a mold (trench 6) for the diaphragm 33 and foundation stiffeners having a first depth 39 from a first etch, and for the two sets of comb-fins having a shallower second depth 37 from a second etch. See FIG. 8C. The ends of the fin trenches intersect with the stiffener-trenches. According to alternate embodiments, the first etch may be the same or deeper than the second etch. In like manner, various structures may be formed at different, independently controlled depths to form a complex structure.

(43) A layer of sacrificial wet oxide 4 (FIG. 6B) is grown in step 802 to form an etch stop for the backside cavity etch (See FIG. 6E), and to form the gap between the fixed comb-fins and moving comb-fins. The oxide layer 4 should be thick enough such that the bulk silicon between the trenches 6 for the two sets of comb-fins is completely oxidized (as shown in FIG. 6B). The oxide layer 4 also keeps the fragile diaphragm 33 from being fully released following the backside cavity etches, as shown in FIG. 8B. The oxide 4 will hold the diaphragm 33 firmly in place until it is etched away from between the fins 35 during the final step, as shown in FIG. 8B, and thus serves to avoid stress and curling.

(44) The polysilicon is deposited in step 803 (FIG. 6C), such that the deposited polysilicon 5 fills the trenches 6 that will become the supporting stiffeners 36 and the comb-fins 35. The polysilicon 5 on the surface of the wafer will form the diaphragm 33 skin.

(45) The polysilicon film 5 is then patterned (FIG. 6D) in step 804, with a reactive ion etch, to separate the diaphragm 33 from the foundation 31 and remove the polysilicon layer 5 above the two sets of comb-fins 35 so that they can be displaced in and out of the plane of the diaphragm 33.

(46) Step 805 consists of a through-wafer, deep reactive ion etch on the backside (FIG. 6E), to create a cavity 9 that defines the air chamber behind the diaphragm 33. The wafer may be diced into chips, to provide separate microphones, or maintained as an integral substrate for a microphone array.

(47) Step 806 provides the final release, achieved by dissolving the sacrificial oxide layer 4 in buffered hydrofluoric acid (FIG. 6F, FIGS. 8B and 8C). The structures are rinsed, and placed in a critical point drier (to avoid stiction).

(48) In this description, several preferred embodiments were discussed. It is understood that this broad invention is not limited to the embodiments discussed herein, but rather is composed of the various combinations, subcombinations and permutations thereof of the elements disclosed herein. The invention is limited only by the following claims.

REFERENCES

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