Flexible Display Cover Substrate

Abstract

The present invention provides a flexible display cover substrate, which comprises a transparent polyimide film; and a device protection layer formed by curing a hard coating composition and disposed on at least one surface of the transparent polyimide film. The hard coating composition includes a hydrophobic UV-curable resin, an antistatic agent, a compound with three or more reactive functional groups, an elastic oligomer, an initiator and a modified inorganic nanoparticle. According to the present invention, a flexible display cover substrate with low haze and good bending resistance can be obtained.

Claims

1. A flexible display cover substrate, comprising a transparent polyimide film; and a device protection layer formed by curing a hard coating composition and disposed on at least one surface of the transparent polyimide film, and the hard coating composition including a hydrophobic UV-curable resin, an antistatic agent, a compound with three or more reactive functional groups, an elastic oligomer, an initiator and a modified inorganic nanoparticle, wherein a weight ratio of the compound with three or more reactive functional groups to the elastic oligomer ranges from 0.25 to 3.

2. The flexible display cover substrate of claim 1, wherein the hydrophobic UV-curable resin comprises a fluorine-based UV-curable resin or a fluorine-polysiloxane-based UV-curable resin.

3. The flexible display cover substrate of claim 1, wherein the hydrophobic UV-curable resin accounts for 0.1 to 10 wt % of a total amount of the hard coating composition.

4. The flexible display cover substrate of claim 1, wherein the antistatic agent comprises an organic salt compound.

5. The flexible display cover substrate of claim 1, wherein the antistatic agent accounts for 0.1 to 5 wt % of a total amount of the hard coating composition.

6. The flexible display cover substrate of claim 1, wherein the compound with three or more reactive functional groups comprises a compound having three or more (meth)acrylate groups.

7. The flexible display cover substrate of claim 1, wherein the elastic oligomer comprises an urethane (meth)acrylate oligomer or an oligomer of urethane (meth)acrylates containing silicon.

8. The flexible display cover substrate of claim 1, wherein the modified inorganic nanoparticle comprises an inorganic nanoparticle modified with a silane coupling agent.

9. The flexible display cover substrate of claim 1, wherein a total amount of the compound with three or more reactive functional groups, the elastic oligomer and the initiator accounts for 10 to 95 wt % of a total amount of the hard coating composition.

10. The flexible display cover substrate of claim 1, having a water drop angle of greater than 105°.

11. The flexible display cover substrate of claim 1, having a water drop angle of 100° or more after being brushed with an eraser.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0030] FIG. 1 is a schematic view of the flexible display cover substrate of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] As used herein, a range represented by “one value to another value” is a general representation that avoids listing all the values in the range in the specification. Therefore, the recitation of a particular numerical range includes any numerical value within the numerical range and a smaller numerical range defined by any numerical value within the numerical range, as if the arbitrary numerical value and the smaller numerical range were expressly written in the specification. Hereinafter, the embodiments are given as examples in which the present invention can be actually implemented. However, these embodiments are merely illustrative, and the present disclosure is not limited thereto.

[0032] The present invention provides a flexible display cover substrate, which comprises a transparent polyimide film; and a device protection layer formed by curing a hard coating composition and disposed on at least one surface of the transparent polyimide film. The hard coating composition includes a hydrophobic UV-curable resin, an antistatic agent, a compound with three or more reactive functional groups, an elastic oligomer, an initiator and a modified inorganic nanoparticle, wherein a weight ratio of the compound with three or more reactive functional groups to the elastic oligomer ranges from 0.25 to 3.

[0033] <Transparent Polyimide Film>

[0034] The polyimide of the present invention can be composed of a unit represented by the following formula (1):

##STR00001##

[0035] In the above formula (1), X is a group remaining after two —C(O)—O—C(O)— are removed from a dianhydride. Examples of the dianhydride may include, but are not limited to: 2,2′-bis-(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), 4,4′-diphenyl ether tetraanhydride (ODPA), biphenyl tetracarboxylic dianhydride (BPDA), benzophenone tetracarboxylic dianhydride (BTDA), cyclobutane tetracarboxylic dianhydride (CBDA), cyclopentane tetracarboxylic dianhydride (CPDA), 3,3′,4,4′-diphenylsulfone tetracarboxylic dianhydride (DSDA), 4,4′-(4,4′-isopropyldiphenoxy)bis(phthalic anhydride) (BPADA), 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]hexafluoroisopropane dianhydride (HFBPADA), ethylene glycol bis-anhydro trimellitate) (TMEG), propylene glycol bis(trimellitic anhydride) (TMPG), bicyclo[2.2.1]heptane-2,3,5,6-tetracarboxylic dianhydride (BHDA), bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride (BOTDA), bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic dianhydride (BODA), etc. These dianhydrides can be used alone or in combination of two or more thereof. In a preferred embodiment, the polyimide of the present invention is prepared by using two or more dianhydrides.

[0036] In the above formula (1), Y is a group remaining after two —NH.sub.2 are removed from a diamine. Examples of the diamine may include, but are not limited to: bis[4-(4-aminophenoxy)phenyl]sulfone (BAPS), 2,2′-bis[4-(4-aminophenoxy) phenyl]propane (BAPP), 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane (APHF), 2, 2′-bis(trifluoromethyl)benzidine (TFMB), 4,4′-diaminodiphenyl ether (ODA), diamino diphenyl sulfone (such as: 3DDS, 4DDS), 2,2-bis(4-aminophenyl)hexafluoropropane (BISAF), cyclohexanediamine (CHDA), 1,3-bis(3-aminophenoxy)benzene (TPE-M), 1,3-bis(4-aminophenoxy)benzene (TPE-R), 1,4-bis(3-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene (TPE-Q) etc. These diamines can be used alone or in combination of two or more thereof. In a preferred embodiment, the polyimide of the present invention is prepared by using two or more diamines.

[0037] As to the polymerization method, the dianhydride and the diamine can be individually dissolved in a solvent, and then the dissolved dianhydride and the dissolved diamine are mixed and reacted to obtain a polyamic acid resin (polyimide resin precursor). The solvent can be an aprotic solvent, such as N,N-dimethylacetamide, N,N-diethylacetamide, N,N-dimethylformamide, N-methyl-2-pyrrolidone, etc., but is not limited thereto, and other suitable aprotic solvents can also be used.

[0038] The method of imidization can use high temperature curing, such as continuous or staged heating of the polyamic acid resin (polyimide resin precursor). When the polyimide resin is to be made into a film or an insulating layer, the polyamic acid resin (polyimide resin precursor) can be spread on the substrate first, and then the entire substrate is sent into an oven for heating and curing. A chemical ring closure method can also be used, that is, under nitrogen or oxygen, an unlimited basic reagent (such as pyridine, triethylamine or N,N-diisopropylethylamine, etc.) and a dehydrating reagent (such as: acetic anhydride) are added into the polyamic acid resin. After the reaction is completed, the colloid is washed with water and filtered to obtain a polyimide powder, which is then dissolved in a solvent. In addition, a heating ring closure method can be used, which adds an azeotropic agent (such as toluene or xylene) to the polyamic acid resin, raises the temperature to 180° C., and removes the water and the azeotropic agent produced by the ring closure of the polyamic acid resin. After the reaction is completed, the polyimide resin solution can be obtained.

[0039] In a preferred embodiment, the thickness of the transparent polyimide film is between 25 μm and 100 μm, and the total light transmittance is above 90%. The transparent polyimide film of the present invention may or may not contain one or more (such as: two or more, three or more) ultraviolet absorbers. The ultraviolet absorber may be selected from materials commonly used as ultraviolet absorbers for general plastics, or may be light compounds or inorganic nanomaterials that absorb wavelengths below 400 nm. Examples of the ultraviolet absorber include, but are not limited to, benzophenone-based compounds, salicylates-based compounds, benzotriazole-based compounds, triazine-based compounds, and the like. By adding the ultraviolet absorber, the yellowing and deterioration of the material of the polyimide resin due to ultraviolet irradiation can be suppressed. In a preferred embodiment, the transparent polyimide film does not contain an infrared absorber. The infrared absorber can be a blue infrared absorber, such as: cesium tungsten oxide, tungsten oxide, Prussian blue, tin antimony oxide.

[0040] <Device Protection Layer>

[0041] The device protective layer of the present invention is formed by curing the hard coating composition, and the device protective layer is disposed on at least one side of the transparent polyimide film. As shown in FIG. 1, the hard coating composition of the present invention is coated on at least one surface of the transparent polyimide film 100 and cured by ultraviolet light or heating to form the device protection layer 110. The coating method can be a conventional coating method, including slot coating, spin coating or inkjet printing, but is not limited thereto. In the present invention, the hard coating composition comprises a hydrophobic UV-curable resin, an antistatic agent, a compound with three or more reactive functional groups, an elastic oligomer, an initiator and a modified inorganic nanoparticle. Based on the total weight of the hard coating composition, the total content of the compound with three or more reactive functional groups, the elastic oligomer and the initiator is preferably 10 wt % to 95 wt %, such as: 15 wt % to 90 wt %. The content of the hydrophobic UV-curable resin is preferably 0.1 wt % to 10 wt %, based on the total weight of the hard coating composition. In a preferred embodiment, the hard coating composition does not contain fluorescent colorants. In some embodiments, the surface of the device protective layer has hydrophobicity with a water drop angle of greater than 105°.

[0042] The composition can be cured by ultraviolet light. For example, the composition is irradiated with ultraviolet light having a wavelength of 312 nm to 365 nm and an energy of 100 to 10,000 mJ/cm.sup.2, so that the components in the composition undergo a cross-linking reaction to be cured. By heating to be cured, the composition is baked at 150° C. to 200° C., and the components in the composition undergo a crosslinking reaction and are cured. In the present invention, when the thickness of the device protective layer is, for example, 1 μm to 30 μm, it has excellent pencil hardness (e.g., 7H to 9H), and can be folded 100,000 times with a folding radius of 1 mm.

[0043] <Hydrophobic UV-Curable Resin (Hydrophobic Ultraviolet Light-Cured Resin)>

[0044] The hydrophobic UV-curable resin includes, but is not limited to, a fluorine-based UV-curable resin or a fluoro-polysiloxane-based UV-curable resin. The fluorine-based UV curable resin may be a fluorine-based acrylic monomer. The fluoro-polysiloxane-based UV-curable resin can be a fluoro-polysiloxane-based acrylic monomer. The fluorine groups contained in these UV-curable resins include, but are not limited to: fluoroolefin groups (such as fluoroethylene, vinylidene fluoride, tetrafluoroethylene, hexafluoropropenyl, perfluorobutadienyl, perfluoro-2,2-dimethyl-1,3-dioxole group. The fluorine-based acrylic monomer may be a (meth)acrylate compound having a fluorine atom in the molecule. Examples of the (meth)acrylate compound having a fluorine atom in the molecule include, but are not limited to: 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3,3-pentafluoropropyl (meth)acrylate, 2-(perfluorobutyl)ethyl (meth)acrylate, 2-(perfluorohexyl)ethyl (meth)acrylate, 2-(perfluorooctyl)ethyl (meth)acrylate, 2-(perfluorodecyl)ethyl (meth)acrylate, α-trifluoro(meth)methylacrylate. The (meth)acrylate compound having a fluorine atom in the molecule can also be a fluorine-containing polyfunctional (meth)acrylate compound, which includes in the molecule: (1) a C.sub.1-14 fluoroalkyl, fluorocycloalkyl or fluoroalkylene having at least 3 fluorine atoms; and (2) at least 2 (meth)acryloyloxy groups. The fluorine groups contained in these UV-curable resins can also be fluoropolymer groups or oligomer groups with fluorinated alkylene groups on the main chain. The fluorine groups contained in these UV-curable resins can also be fluorinated polymer groups, oligomer groups, etc. with fluorinated alkylene groups or fluorinated alkyl groups on the main chain and branched chains. The polysiloxane part of the above fluorine-polysiloxane-based UV-curable resin structure includes but is not limited to: (poly)dimethylsiloxane, (poly)diethylsiloxane, (poly)diphenylsiloxane, (poly)methylphenylsiloxane, alkyl modified (poly)dimethylsiloxane, (poly)dimethylsiloxane containing an azo group, dimethylpolysiloxane, phenyl methyl polysiloxane, alkyl-aralkyl-modified polysiloxane, fluoropolysiloxane, polyether-modified polysiloxane, fatty acid ester-modified polysiloxane, methyl hydrogen polysiloxane, silanol-containing polysiloxane, alkoxy-containing polysiloxane, polysiloxane containing a phenol group, methacrylic acid modified polysiloxane, acrylic acid modified polysiloxane, amine group modified polysiloxane, carboxylic acid modified polysiloxane, methanol modified polysiloxane, epoxy modified polysiloxane, mercapto modified polysiloxane, fluorine modified polysiloxane, polyether modified polysiloxane, etc. Among them, those having a dimethylsiloxane structure are preferred.

[0045] <Antistatic Agent>

[0046] Examples of the antistatic agent include, but are not limited to: cationic copolymers with side groups having quaternary ammonium salt groups, negative ionic compounds containing polystyrene sulfonic acid, compounds with polyalkylene oxide chains (preferably polyethylene oxide chain, polypropylene oxide chain), non-ionic polymers (such as: polyethylene glycol methacrylate copolymer, polyether ester amide, polyether amide imide, polyether ester, ethylene oxide-epichlorohydrin copolymer), π-conjugated conductive polymers. These antistatic agents may be used alone or in combination of two or more thereof. In a preferred embodiment, the antistatic agent is an organic salt compound with a conductivity of greater than or equal to 0.1 mS/cm.

[0047] <Compound with Three or More Reactive Functional Groups>

[0048] This compound with three or more reactive functional groups includes compounds with three or more (meth)acrylate groups. Examples of the compound with three or more reactive functional groups include, but are not limited to: dipentaerythritolhexaacrylate, pentaerythritoltriacrylate, dipentaerythritoltriacrylate, dipentaerythritolacrylate, pentaerythritolhexaacrylate, trimethylolpropane triacrylate, trimethallyl isocyanurate, triallyl isocyanurate, tetramethyltetravinylcyclotetrasiloxane, ethoxylated trimethylolpropane triacrylate (TMPEOTA), propoxylated glycerol triacrylate (GPTA), pentaerythritol tetra acrylates (PETA), pentaerythritol Tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, tripentaerythritol hepta(meth)acrylate. These compounds may be used alone or in combination of two or more thereof, depending on needs.

[0049] <Elastic Oligomer>

[0050] The elastic oligomers comprise oligomers of urethane (meth)acrylates or oligomers of silicon-containing urethane (meth)acrylates, which can be obtained by reacting hydroxy(meth)acrylates with diisocyanates. The hydroxy(meth)acrylate can be synthesized from (meth)acrylate or acryl-containing compound and polyol. (Meth)acrylate can be methyl (meth)acrylate, ethyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate or cyclohexyl (meth)acrylate. The polyol can be ethylene glycol, 1,3 propylene glycol, diethylene glycol, neopentyl glycol, 1,4-butanediol, 1,6-hexanediol, 1,5-pentanediol, trimethylol propane, glycerol, 1,3,5-triol, pentaerythritol, dipentaerythritol, etc. The diisocyanate may be hexamethylene diisocyanate, 2,4-toluene diisocyanate, xylene diisocyanate, trimethyl hexamethylene diisocyanate, 4-diphenylmethane diisocyanate, 1,5 naphthalene diisocyanate and the like. Commercially available urethane (meth)acrylate oligomers can also be used, such as: U-2PPA, U10-HA, U10-PA, UA-1100H, UA-15HA, UA-33H, U-200PA, UA-290TM, UA-160TM, UA-122P, etc. produced by Shin Nakamura Chemical Industry Co.; UO22-081, UO26-001, UO22-162, UO52-002, UO26-012, UO22-312 etc. produced by SUN PROSPER CHEMICALS LIMITED. The molecular weight of the elastic oligomer ranges preferably from 500 g/mol to 5000 g/mol, such as: 520 g/mol to 4800 g/mol, 550 g/mol to 4500 g/mol. The content of the elastic oligomer is preferably 0.1 wt % to 80 wt %, based on the total weight of the hard coating composition.

[0051] <Initiator>

[0052] The initiator includes a photoinitiator or a thermal initiator, and may be used alone or in combination of two or more. The compounding amount of the compound with three or more reactive functional groups and the initiator is not particularly limited. Generally speaking, the composition ratio of the compound with three or more reactive functional groups and the initiator ranges preferably 5:1 to 100:1. In addition, based on the total weight of the hard coating composition, the content of the compound with three or more reactive functional groups, the elastic oligomer and the initiator is, for example, 10 wt % to 95 wt %. If the amount of the initiator is above the above-mentioned lower limit, the degree of polymerization can be maintained to a certain extent, and the polymer formed by the monomers can retain the high-molecular properties. If the amount of the initiator is below the above-mentioned upper limit, the polymer formed by the monomer will not have the problem of excessively high polymerization and brittleness. If the amount of the monomer with UV-curable groups is too low, the degree of crosslinking of the polymer is insufficient and the polymer cannot be cured. If the proportion of the monomer with UV-curable groups is too high, the polymer is brittle.

[0053] Photoinitiators suitable for use in the present invention include, but are not limited to: acetophenones, such as 2-methyl-1-(4-(methylthio)phenyl) morpholino-propane, 1-hydroxycyclohexyl phenyl ketone, diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, 2-benzyl-2-(dimethylamino)-1-[4-(morpholinyl)phenyl]-1-butanone, other suitable acetophenones; benzoins such as benzoin, benzoin methyl ether, benzyl dimethyl ketal, other suitable benzoins; diphenylketones, such as benzophenone, 4-phenyl benzophenone, hydroxyl benzophenone or other suitable benzophenone; thioxanthones, such as isopropyl thioxanthone, 2-chlorothioxanthone or other suitable thioxanthone; anthraquinones, such as 2-ethylanthraquinone or other suitable anthraquinone. In addition to using alone, the above-mentioned photoinitiators can also be used in a mixture of two or more, depending on the needs of users. For example, in order to obtain a quick photosensitive speed, isopropyl thioxanthone can be mixed with 2-tolyl-2-(dimethylamino)-1-[4-(morpholinyl)phenyl]-1-butyl-1-one to be used as the photoinitiator.

[0054] Thermal initiators suitable for the present invention include, but are not limited to: azos, such as 2,2′-azobis (2,4-dimethyl valeronitrile), dimethyl 2,2′-azobis (2-methylpropionate), 2,2-azobisiso butyronitrile (AIBN), 2,2-azobis(2-methylisobutyronitrile), 1,1′-azobis(cyclohexane-1-carbonitrile), 2,2′-azobis[N-(2-propenyl)-2-methyl propionamide], 1-[(cyano-1-methylethyl)azo]formamide, 2,2′-azobis(N-butyl-2-methylpropionamide), 2,2′-azobis (N-cyclohexyl-2-methylpropionamide or other suitable azo initiators; peroxides, such as benzoyl peroxide, 1,1-bis(tert-butylperoxy)cyclohexane, 2,5-bis(tert-butylperoxy)-2,5-dimethylcyclohexane, 2,5-bis(tert-butylperoxy)-2,5-dimethyl-3-cyclohexyne, bis(1-(tert-butylpeorxy)-1-methyethyl) benzene, tert-butyl hydroperoxide, tert-butyl peroxide, tert-butyl peroxybenzoate, cumene hydroperoxide, cyclohexanone peroxide, dicumyl peroxide, lauroyl peroxide or other suitable peroxides. The above-mentioned thermal initiators may be used alone or in combination of two or more, depending on needs.

[0055] <Modified Inorganic Nanoparticle>

[0056] The modified inorganic nanoparticle can be obtained through reaction of reactive components comprising an unmodified inorganic nanoparticle and a modifying agent. In the reactive components, the content of the unmodified inorganic nanoparticle is preferably 90-98 wt %; the content of the modifying agent is preferably 2-10 wt %. The unmodified inorganic nanoparticle suitable for the present invention include, but are not limited to, metal oxide inorganic nanoparticles such as titanium dioxide, silicon dioxide, zirconium oxide, zinc oxide, and aluminum oxide etc. The modifying agent suitable for use in the present invention may be silane coupling agents, which are organosilicon compounds containing chlorosilanes, alkoxysilanes or silazanes. The functional groups contained in the silane coupling agent may include vinyl, methacryloyloxy, acryloyloxy, amine, urea, chloropropyl, mercapto, polysulfide or isocyanate, but are not limited thereto. Examples of silane coupling agents may include, but are not limited to: vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, 3-methacryloyloxypropyl-methyldimethoxysilane, 3-methacryloyloxypropyl-trimethoxysilane, 3-methacryloyloxypropyl-methyldiethoxysilane, 3-methacryloyloxypropyl-triethoxysilane, 3-acryloyloxypropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyl trimethoxysilane, N-(2-aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-benzene aminopropyltrimethoxysilane, 3-chloropropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, bis(triethoxysilylpropyl)tetrasulfide, 3-isocyanatopropyltriethoxysilane.

[0057] In the present invention, the mixing method of the modified inorganic nanoparticle and the mixture of the monomer with UV-curable groups and the initiator is not particularly limited. Generally, ball milling, screw, planetary mixing or stirring can be used to make it evenly mixed. The content of the modified inorganic nanoparticle is preferably 0.1 wt % to 60 wt % based on the total weight of the hard coating composition.

[0058] In a preferred embodiment, the hard coating composition does not contain a perfluoropolyether polymer. In certain embodiments, the hard coating composition does not include (meth)acrylate monomers with alkylene oxide repeating units, mono(meth)acrylate monomers with perfluoropolyether groups or a combination thereof. In certain embodiments, the hard coating composition does not include a quaternary ammonium salt-containing polymer.

[0059] In a preferred embodiment, after the flexible display cover substrate is brushed with steel wool or an eraser, the water drop angle can be kept more than or equal to 100°, such as: 101°, 102°, 104°.

[0060] After the flexible display cover substrate of the present invention is folded with a radius of curvature (for example, 1 mm), it will not cause surface cracks on the device protective layer or breakage of the substrate.

[0061] Hereinafter, the present invention will be described in detail by way of Examples and Comparative Examples. However, the following Examples and Comparative Examples are not intended to limit the present invention.

Preparation Example

[0062] The modified inorganic nanoparticle in the hard coating composition was obtained by the following method: 1 part by weight of the unmodified silica nanoparticle solution, in which the content of the unmodified silica nanoparticle is 0.5 wt %, and 0.01 part by weight of 3-methacryloyloxypropyl-trimethoxysilane were mixed and heated at 50° C. for 4 hours under nitrogen for modification. After the reaction was completed, the temperature was lowered to room temperature, and 0.133 parts by weight of pentaerythritol hexaacrylate and 0.133 parts by weight of the elastic oligomer UA-160TM were added into 1 part by weight of the modified nanoparticle solution and stirred for 30 minutes, followed by solution phase inversion according to the required solvent. Finally, 1.5 parts by weight of the modified inorganic nanoparticle solution, 0.03 parts by weight of 2-methyl-1-(4-(methylthiol)phenyl-2-morpholinyl propyl ketone) and 0.01 part by weight of a leveling agent were mixed, and ethyl acetate was added as a solvent to obtain a mixture with a solid content of 55%. The hard coating compositions used in the subsequent Examples and Comparative Examples were prepared using the mixture.

Example 1

[0063] 1.1 g of hydrophobic UV-curable resin (10% by weight dissolved in butanone) and 1.1 g of the antistatic agent (10% by weight dissolved in butanone) were added into 20 g of the mixture prepared in the above Preparation Example. After stirring and mixing for 30 minutes, the resulting mixture was spin coated on the surface of a transparent polyimide (CPI) film at 250 rpm for 10 seconds, soft baked at 90° C. for 5 minutes, and then cured by exposure to UV light at 4000 mJ/cm.sup.2.

Example 2

[0064] 3.3 g of hydrophobic UV-curable resin (10% by weight dissolved in butanone) and 1.1 g of the antistatic agent (10% by weight dissolved in butanone) were added into 20 g of the mixture prepared in the above Preparation Example. After stirring and mixing for 30 minutes, the resulting mixture was spin coated on the surface of a transparent polyimide (CPI) film at 250 rpm for 10 seconds, soft baked at 90° C. for 5 minutes, and then cured by exposure to UV light at 4000 mJ/cm.sup.2.

Example 3

[0065] 5.5 g of hydrophobic UV-curable resin (10% by weight dissolved in butanone) and 1.1 g of the antistatic agent (10% by weight dissolved in butanone) were added into 20 g of the mixture prepared in the above Preparation Example. After stirring and mixing for 30 minutes, the resulting mixture was spin coated on the surface of a transparent polyimide (CPI) film at 250 rpm for 10 seconds, soft baked at 90° C. for 5 minutes, and then cured by exposure to UV light at 4000 mJ/cm.sup.2.

Example 4

[0066] 3.3 g of hydrophobic UV-curable resin (10% by weight dissolved in butanone) and 3.3 g of the antistatic agent (10% by weight dissolved in butanone) were added into 20 g of the mixture prepared in the above Preparation Example. After stirring and mixing for 30 minutes, the resulting mixture was spin coated on the surface of a transparent polyimide (CPI) film at 250 rpm for 10 seconds, soft baked at 90° C. for 5 minutes, and then cured by exposure to UV light at 4000 mJ/cm.sup.2.

Example 5

[0067] A mixture having a solid content of 55% was prepared according to the same method of the aforementioned Preparation Example, except that the weight parts of pentaerythritol hexaacrylate and the elastic oligomer UA160-TM were changed to 0.2128 weight part and 0.0532 weight part respectively. 3.3 g of hydrophobic acrylic monomer (10% by weight dissolved in butanone) serving as the hydrophobic UV-curable resin and 3.3 g of the antistatic agent (10% by weight dissolved in butanone) were added into 20 g of the mixture. After stirring and mixing for 30 minutes, the resulting mixture was spin coated on the surface of a transparent polyimide (CPI) substrate at 250 rpm for 10 seconds, soft baked at 90° C. for 5 minutes, and then cured by exposure to 4000 mJ/cm.sup.2.

Example 6

[0068] A mixture having a solid content of 55% was prepared according to the same method of the aforementioned Preparation Example, except that the weight parts of pentaerythritol hexaacrylate and the elastic oligomer UA160-TM were changed to 0.1995 weight part and 0.0665 weight part respectively. 3.3 g of hydrophobic acrylic monomer (10% by weight dissolved in butanone) serving as the hydrophobic UV-curable resin and 1.1 g of the antistatic agent (10% by weight dissolved in butanone) were added into 20 g of the mixture. After stirring and mixing for 30 minutes, the resulting mixture was spin coated on the surface of a transparent polyimide (CPI) substrate at 250 rpm for 10 seconds, soft baked at 90° C. for 5 minutes, and then cured by exposure to 4000 mJ/cm.sup.2.

Example 7

[0069] A mixture having a solid content of 55% was prepared according to the same method of the aforementioned Preparation Example, except that the weight parts of pentaerythritol hexaacrylate and the elastic oligomer UA160-TM were changed to 0.0665 weight part and 0.1995 weight part respectively. 3.3 g of hydrophobic acrylic monomer (10% by weight dissolved in butanone) serving as the hydrophobic UV-curable resin and 1.1 g of the antistatic agent (10% by weight dissolved in butanone) were added into 20 g of the mixture. After stirring and mixing for 30 minutes, the resulting mixture was spin coated on the surface of a transparent polyimide (CPI) substrate at 250 rpm for 10 seconds, soft baked at 90° C. for 5 minutes, and then cured by exposure to 4000 mJ/cm.sup.2.

Example 8

[0070] A mixture having a solid content of 55% was prepared according to the same method of the aforementioned Preparation Example, except that the weight parts of pentaerythritol hexaacrylate and the elastic oligomer UA160-TM were changed to 0.0532 weight part and 0.2128 weight part respectively. 3.3 g of hydrophobic acrylic monomer (10% by weight dissolved in butanone) serving as the hydrophobic UV-curable resin and 1.1 g of the antistatic agent (10% by weight dissolved in butanone) were added into 20 g of the mixture. After stirring and mixing for 30 minutes, the resulting mixture was spin coated on the surface of a transparent polyimide (CPI) substrate at 250 rpm for 10 seconds, soft baked at 90° C. for 5 minutes, and then cured by exposure to 4000 mJ/cm.sup.2.

Comparative Example 1

[0071] 3.3 g of hydrophobic UV-curable resin (10% by weight dissolved in butanone) was added into 20 g of the mixture prepared in the above Preparation Example. After stirring and mixing for 30 minutes, the resulting mixture was spin coated on the surface of a transparent polyimide (CPI) film at 250 rpm for 10 seconds, soft baked at 90° C. for 5 minutes, and then cured by exposure to UV light at 4000 mJ/cm.sup.2.

Comparative Example 2

[0072] 3.3 g of the antistatic agent (10% by weight dissolved in butanone) was added into 20 g of the mixture prepared in the above Preparation Example. After stirring and mixing for 30 minutes, the resulting mixture was spin coated on the surface of a transparent polyimide (CPI) film at 250 rpm for 10 seconds, soft baked at 90° C. for 5 minutes, and then cured by exposure to UV light at 4000 mJ/cm.sup.2.

Comparative Example 3

[0073] A mixture having a solid content of 55% was prepared according to the same method of the aforementioned Preparation Example, except that the weight parts of pentaerythritol hexaacrylate and the elastic oligomer UA160-TM were changed to 0.2217 weight part and 0.0443 weight part respectively. 3.3 g of hydrophobic acrylic monomer (10% by weight dissolved in butanone) serving as the hydrophobic UV-curable resin and 1.1 g of the antistatic agent (10% by weight dissolved in butanone) were added into 20 g of the mixture. After stirring and mixing for 30 minutes, the resulting mixture was spin coated on the surface of a transparent polyimide (CPI) substrate at 250 rpm for 10 seconds, soft baked at 90° C. for 5 minutes, and then cured by exposure to 4000 mJ/cm.sup.2.

Comparative Example 4

[0074] A mixture having a solid content of 55% was prepared according to the same method of the aforementioned Preparation Example, except that the weight parts of pentaerythritol hexaacrylate and the elastic oligomer UA160-TM were changed to 0.0443 weight part and 0.2217 weight part respectively. 3.3 g of hydrophobic acrylic monomer (10% by weight dissolved in butanone) serving as the hydrophobic UV-curable resin and 1.1 g of the antistatic agent (10% by weight dissolved in butanone) were added into 20 g of the mixture. After stirring and mixing for 30 minutes, the resulting mixture was spin coated on the surface of a transparent polyimide (CPI) substrate at 250 rpm for 10 seconds, soft baked at 90° C. for 5 minutes, and then cured by exposure to 4000 mJ/cm.sup.2.

[0075] Performance Evaluation

[0076] Thickness Measurement

[0077] The thickness of each transparent polyimide film was measured by contact with a thickness gauge, and then the thickness of the device protective layer formed from the hard coating composition on the transparent polyimide film was measured by Alpha Step.

[0078] Steel Wool Brush Test

[0079] By using a reciprocating abrasion tester, 2×2 cm of steel wool SW #0000 was used to brush a fixed area on the cover substrate at a speed of 25 times/min under a load of 1,000 g for 2,500 times, and then the water drop angle of the brushed area was measured.

[0080] Eraser Brush Test

[0081] By using a reciprocating abrasion tester, an eraser with a diameter of 6 mm (tensile strength=11.91 kgf/cm.sup.2) and a hardness of 81 (Durometer A type) was used to brush a fixed area on the cover substrate at a speed of 17 times/min under a load of 1,000 g for 2,500 times, and then the water drop angle of the brushed area was measured.

[0082] Determination of Pencil Hardness

[0083] Using an electronic pencil hardness tester, a Mitsubishi test pencil was used to draw a line of 10 mm in length at a speed of 30 mm/min under a load of 750 g on each cover substrate for five times, and then the surface scratches were observed and compared with the pencil hardness.

[0084] Total Light Transmittance (%) and Haze

[0085] The total light transmittance and haze of the cover substrate were measured using a Nippon Denshoku DOH 5500 according to ASTM D1007.

[0086] Bending Performance

[0087] The cover substrate was attached to a folding tester (YUASA System U-shape Folding) and folded 100,000 times with R=1 mm. First, observe whether the cover substrate was broken or not, and then observe whether the device protective layer had cracks with the naked eye and a microscope. Any breakage of the cover substrate or cracks in the device protective layer was marked as unacceptable (X), and no breakage and cracks was marked as acceptable (O).

[0088] The test results of the aforementioned performance evaluation are recorded in Table 1 and Table 2.

TABLE-US-00001 TABLE 1 Ex. 1 Ex. 2 Ex. 3 Ex. 4 Comp. Ex. 1 Comp. Ex. 2 Hydrophobic UV- 1 wt % 3 wt % 5 wt % 3 wt % 3 wt % curable resin Antistatic agent 1 wt % 1 wt % 1 wt % 3 wt % 3 wt % Compound with 92 wt %  92 wt %  92 wt %  92 wt %  92 wt %  92 wt %  three or more reactive functional groups + Elastic oligomer Device protection layer test results Haze <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 Water Initial value 110 111 112 112 113 87 drop After steel 100 102 101 104 102 53 angle wool brush After eraser 100 100 101 102 76 67 brush Bending resistance ◯ ◯ ◯ ◯ ◯ ◯

TABLE-US-00002 TABLE 2 Ex. 5 Ex. 6 Ex. 7 Ex. 8 Comp. Ex. 3 Comp. Ex. 4 Hydrophobic UV- 3 wt % 3 wt % 3 wt % 3 wt % 3 wt % 3 wt % curable resin Antistatic agent 1 wt % 1 wt % 1 wt % 1 wt % 1 wt % 1 wt % Compound with 4/1 3/1 1/3 1/4 5/1 1/5 three or more reactive functional groups + Elastic oligomer (wt/wt) Device protection layer test results Haze <0.5 <0.5 <0.5 <0.5 >0.5 <0.5 Water Initial value 108 110 109 109 109 108 drop After steel 101 102 101 101 86 90 angle wool brush After eraser 100 100 101 102 65 73 brush Bending resistance ◯ ◯ ◯ ◯ ◯ X

[0089] As shown in table 1, compared with Comparative Examples 1 and 2, Examples 1 to 4 can obtain no less than 100 degrees of water drop angles after brushing with an eraser meanwhile maintaining a certain level of haze and bending resistance. This fact proves that the hard coating composition of the present invention has unexpected effects.

[0090] As shown in Table 2, compared with Comparative Example 3 and Comparative Example 4, Examples 5 to 8 have good haze and bending resistance because their weight ratios of the compounds with three or more reactive functional groups to the elastic oligomers ranges from 0.25 to 3.

[0091] It can be seen from the above, according to the present invention, a flexible display cover substrate with low haze and good bending resistance can be obtained.

[0092] Those described above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. It should be pointed out that for people having ordinary skill in the art, several improvements and modifications can be made without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.