Die molding apparatus
12296381 ยท 2025-05-13
Assignee
Inventors
Cpc classification
C21D9/0062
CHEMISTRY; METALLURGY
B22D17/02
PERFORMING OPERATIONS; TRANSPORTING
B21J5/02
PERFORMING OPERATIONS; TRANSPORTING
International classification
B21J1/00
PERFORMING OPERATIONS; TRANSPORTING
B21J5/02
PERFORMING OPERATIONS; TRANSPORTING
B22D17/02
PERFORMING OPERATIONS; TRANSPORTING
C21D9/00
CHEMISTRY; METALLURGY
Abstract
The present application relates to the technical field of amorphous alloy molding apparatuses, and more particularly to a die molding apparatus. The die molding apparatus includes: a forming structure, a material loading structure, and a vacuum pumping structure. The forming structure includes a forming furnace body having a heating cavity, a material waiting housing having a transition cavity, a feeding pipe having two ends respectively connected with the heating cavity and the transition cavity, and a vacuum control valve arranged on the feeding pipe. The material loading structure includes a material loading arm and a material loading driving mechanism, one end of the material loading arm is located in the transition cavity, and the other end of the material loading arm is penetrated through a material loading hole sealingly.
Claims
1. A die molding apparatus for thermoplastic forming of an amorphous alloy, comprising: a forming structure, comprising: a forming furnace body with a heating cavity; a material waiting housing with a transition cavity, a feeding pipe provided with two ends respectively in communication with the heating cavity and the transition cavity, and a vacuum control valve arranged on the feeding pipe; a material loading structure, comprising: a material loading arm and a material loading driving mechanism; wherein the material waiting housing is provided with a material loading hole being in communication with the transition cavity, one end of the material loading arm is located in the transition cavity and configured for carrying the amorphous alloy, the other end of the material loading arm is configured to penetrate through the material loading hole sealingly and slidably, and the material loading driving mechanism is connected with the other end of the material loading arm; and a vacuum pumping structure, configured for pumping out gas in the heating cavity and the transition cavity, such that vacuum degrees of the heating cavity and the transition cavity reach a predetermined value; wherein the vacuum control valve has a turn-on state and a turn-off state, and when the vacuum control valve is in the turn-on state, the feeding pipe communicates the heating cavity and the transition cavity, the material loading driving mechanism drives the material loading arm to slide, such that the material loading arm carries the amorphous alloy to the heating cavity or carries the amorphous alloy back to the transition cavity through the feeding pipe; and after the amorphous alloy is thermoplastic formed in the heating cavity, and is then conveyed to the transition cavity for cooling; the vacuum control valve is in the turn-off state, to seal and isolate the heating cavity from the transition cavity; wherein a material waiting area is arranged in the transition cavity, an amorphous alloy to be thermoplastic formed is placed in the material waiting area in advance, and the vacuum degree of the transition cavity is pumped to the predetermined value; the material waiting area is further configured to receive a previous amorphous alloy being thermoplastic formed and conveyed from the heating cavity, and the amorphous alloy to be thermoplastic formed is then conveyed to the heating cavity to continue the thermoplastic forming of the amorphous alloy; and wherein die molding apparatus further comprises: a mold mechanism, comprising: an upper pressure head arranged in the heating cavity, a lower pressure head located below the upper pressure head and arranged slidably relative to the upper pressure head, a forming driving mechanism connected with the forming furnace body and configured for driving the lower pressure head to move up and down relative to the upper pressure head, and a forming mold detachably arranged on the lower pressure head; the forming mold is provided with a forming cavity configured for accommodating the amorphous alloy, and the lower pressure head moves toward the upper pressure head to press against the forming mold to plastically form the amorphous alloy.
2. The die molding apparatus according to claim 1, wherein the forming structure further comprises: a heat insulation mechanism, comprising a heat insulation shield arranged in the heating cavity and a heat insulation driver connected with the forming furnace body; the heat insulation driver drives the heat insulation shield to seal an orifice of the feeding pipe, so as to prevent heat from entering the transition cavity through the feeding pipe.
3. The die molding apparatus according to claim 1, wherein the material loading arm comprises an arm body and a clamping claw arranged at an end of the arm body, the other end of the arm body passes through the material loading hole and is connected with the material loading driving mechanism, the clamping claw is located in the transition cavity and configured to detachably clamp the forming mold.
4. The die molding apparatus according to claim 3, wherein the clamping claw is provided with a clamping groove, and an end of the forming mold is clamped in the clamping groove.
5. The die molding apparatus according to claim 4, wherein groove walls on both sides of the clamping groove are protruded with positioning blocks, and positions on the forming mold corresponding to the positioning blocks are provided with positioning grooves matched with the positioning blocks.
6. The die molding apparatus according to claim 1, further comprising: a cooling structure configured for cooling the forming mold.
7. The die molding apparatus according to claim 6, wherein the cooling structure comprises a lower cooling column vertically arranged and provided with a lower cooling channel; an end of the lower cooling column is located in the transition cavity and provided with a cooling end surface configured for placing the forming mold, and the other end of the lower cooling column is located outside of the transition cavity and connected with an external cooling water source.
8. The die molding apparatus according to claim 7, wherein the lower cooling column is connected with the material waiting housing slidably and sealingly.
9. The die molding apparatus according to claim 8, wherein the cooling structure further comprises a cooling driving mechanism for driving the lower cooling column to slide up and down, and an upper cooling column arranged opposite to be to the lower cooling column, the upper cooling column is provided with an upper cooling channel.
10. The die molding apparatus according to claim 7, wherein the material waiting housing is provided with a discharge port arranged in communication with the transition cavity, and the die molding apparatus further comprises a blanking groove, one end of the blanking groove is connected with the discharge port, and the other end of the blanking groove is arranged adjacent to the cooling end surface.
11. The die molding apparatus according to claim 10, wherein the material waiting housing is further provided with a feeding port, and the die molding apparatus further comprises a discharging valve configured for sealing the discharging port and a feeding valve configured for sealing the feeding port.
12. The die molding apparatus according to claim 1 wherein the forming furnace body comprises a furnace body provided with the heating cavity and a heating mechanism arranged in the heating cavity.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) In order to explain the embodiments of the present application more clearly, a brief introduction regarding the accompanying drawings that need to be used for describing the embodiments of the present application or the prior art is given below; it is obvious that the accompanying drawings described as follows are only some embodiments of the present application, for those skilled in the art, other drawings can also be obtained according to the current drawings on the premise of paying no creative labor.
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DETAILED DESCRIPTION OF EMBODIMENTS
(6) In order to make the purpose, the technical solution and the advantages of the present application be clearer and more understandable, the present application will be further described in detail below with reference to accompanying figures and embodiments. It should be understood that the specific embodiments described herein are merely intended to illustrate but not to limit the present application.
(7) It is noted that when a component is referred to as being fixed to or disposed on another component, it can be directly or indirectly on another component. When a component is referred to as being connected to another component, it can be directly or indirectly connected to another component. It needs to be understood that, directions or location relationships indicated by terms such as up, down, left, right, and so on are the directions or location relationships shown in the accompanying figures, which are only intended to describe the present application conveniently and simplify the description, but not to indicate or imply that an indicated device or component must have specific locations or be constructed and manipulated according to specific locations; therefore, these terms shouldn't be considered as any limitation to the present application. The terms the first and the second are only used in describe purposes, and should not be considered as indicating or implying any relative importance, or impliedly indicating the number of indicated technical features, a plurality of means two or more, unless there is additional explicit and specific limitation.
(8) In order to explain the technical solution described in the present application, the following is a detailed description in combination with the specific drawings and embodiments.
(9) As shown in
(10) As shown in
(11) As shown in
(12) In an embodiment, a material waiting area is arranged in the transition cavity 121, and the amorphous alloy 321 to be thermoplastic formed can be placed in the material waiting area in advance, and the vacuum degree of the transition cavity 121 can be pumped to the predetermined value at the same time. After the thermoplastic forming of the previous amorphous alloy 321 is completed, it is conveyed back to the transition cavity 121, and then the amorphous alloy 321 in the material waiting area is conveyed to the heating cavity 111 to continue the thermoplastic forming of the amorphous alloy 321, so as to achieve continuous production.
(13) As shown in
(14) As shown in
(15) In an embodiment, the driving force range of forming driving mechanism 34 for driving the lower pressure head 33 is 100-30000 N, the travel range of lower pressure head 33 is 050 mm, and the moving speed range of lower pressure head 33 is 0.012 mm/s; in an embodiment, the lower pressure head 33 pre-presses the forming mold 32 between the upper pressure head 31 and the lower pressure head 33 with a driving force of 100 N. In an embodiment, the die molding apparatus 100 further includes an infrared thermometer 141 connected to the forming furnace body 11. The infrared thermometer 141 directly detects the real-time temperature of the amorphous alloy 321 in the forming mold 32 through the temperature measurement window. When the temperature reaches the temperature conversion point Tg in the supercooled liquid phase region of the amorphous alloy 321, the forming driving mechanism 34 drives the lower pressure head 33 to move to pressurize the forming mold 32 and perform thermoplastic forming. In an embodiment, the temperature measuring window is made of vacuum glass. The infrared thermometer 141 directly detects the temperature of amorphous alloy 321 through non-contact manner, which is conducive to improving the forming quality, automatic feeding and discharging, and realizing continuous production.
(16) As shown in
(17) In an embodiment, the material loading arm 22 includes an arm body 221 and a clamping claw 222 arranged at one end of the arm body 221. The other end of the arm body 221 is penetrated the material loading hole and connected with the loading driving mechanism 21. The clamping claw 222 is located in the transition cavity 121 and is used to detachably clamp the forming mold 32. The forming mold 32 can be conveyed from the transition cavity 121 to the lower pressure head 33, or the forming mold 32 can be conveyed from the lower pressure head 33 back to the transition cavity 121 through clamping the forming mold 32 with the clamping claw 222. In an embodiment, the material loading driving mechanism 21 includes a servo motor, the speed range of the material loading arm 22 moving towards the lower pressure head 33 is 2100 mm/s, the travel range of the material loading arm 22 is 0650 mm, and the speed of the material loading arm 22 returning to the transition cavity 121 is 100 mm/s.
(18) As shown in
(19) In an embodiment, the die molding apparatus 100 further includes a cooling structure 40 for cooling the forming mold 32. The cooling structure 40 includes a lower cooling column 41 vertically arranged and provided with a lower cooling channel 411. An end of the lower cooling column 41 is located in the transition cavity 121 and provided with a cooling end surface for placing the forming mold 32. The other end of the lower cooling column 41 is located outside the transition cavity 121 and is connected with an external cooling water source. In an embodiment, after the amorphous alloy 321 completes the thermoplastic forming, the material loading arm 22 carries the forming mold 32 to the cooling end surface of the lower cooling column 41, and the cooling end surface faces upwards, and the forming mold 32 is cooled through the cooling water in the lower cooling channel 411, thus the cooling efficiency of the forming mold 32 is improved.
(20) As shown in
(21) As shown in
(22) In an embodiment, the circulating cooling water with temperature of 300K is introduced into the lower cooling channel 411 and the upper cooling channel 421 to cool the forming mold 32 below a temperature of 425K.
(23) As shown in
(24) In an embodiment, the die molding apparatus 100 further includes a receiving box 125 loaded with coolant. The receiving box 125 is located below the discharge port. After the forming mold 32 is transported to the cooling end surface, the cooling driving mechanism drives the lower cooling column 41 to rise by a predetermined distance, so that the positioning grooves 225 and the positioning blocks 224 are separated from each other, the loading driving mechanism 21 drives the material loading arm 22 to retract, and the cooling driving mechanism drives the lower cooling column 41 to fall by a predetermined distance, such that the material loading arm 22 is driven by the material loading driving mechanism 21 to push the forming mold 32 into the blanking groove 124, so that the forming mold 32 falls into the receiving box 125 from the discharge port, and the receiving box 125 is located below the discharge port.
(25) In an embodiment, the material waiting housing 12 is further provided with a feeding port, and the die molding apparatus further includes a discharge valve 123 for sealing the discharge port and a feeding valve 122 for sealing the feeding port. The forming mold 32 loaded with the amorphous alloy 321 to be machined can be placed on the material loading arm 22 through the feeding port.
(26) As shown in
(27) In an embodiment, the die molding apparatus 100 further includes a human-machine interface, which is connected to the material waiting housing 12 and can rotate 360.
(28) In an embodiment, the die molding apparatus 100 further includes a control structure, which is a PLC control system and is used to control the forming structure 10, the material loading structure 20 and the vacuum pumping structure 50.
(29) The aforementioned embodiments are only preferred embodiments of the present application. For one of ordinary skill in the art, according to the thought of the present application, specific implementation modes and application scopes may be modified, and the content of the specification should not be interpreted as any limitation to the present application.