LOW TEMPERATURE SOLDERING SOLUTIONS FOR POLYMER SUBSTRATES, PRINTED CIRCUIT BOARDS AND OTHER JOINING APPLICATIONS

Abstract

A solder paste comprising: a solder alloy, and a solder flux comprising an activator, wherein the activator comprises an organic acid activator and an organic amine activator, and wherein the molar ratio of organic acid activator to organic amine activator is from 0.8 to 2.5. A method of forming a solder joint comprising: (i) providing two or more work pieces to be joined; (ii) providing the solder paste of claim 1; and (iii) heating the solder paste in the vicinity of the work pieces to be joined.

Claims

1. A solder paste comprising: a solder alloy, and a solder flux comprising an activator, wherein the activator comprises an organic acid activator and an organic amine activator, and wherein the molar ratio of organic acid activator to organic amine activator is from 0.8 to 2.5.

2. The solder paste of claim 1, wherein the molar ratio of organic acid activator to organic amine activator is from 1 to 2.

3. The solder paste of claim 1, wherein the solder paste comprises: from 78 to 92 wt. % of the solder alloy; and from 8 to 22 wt. % of the solder flux.

4. The solder paste of claim 1, wherein the solder flux comprises from 12 to 20 wt. % of the activator based on the total weight of the solder flux.

5. The solder paste of claim 1, wherein the solder flux comprises one or more of: one or more rosins and/or one or more resins; one or more solvents; one or more additives; one or more rheology modifying agents; and one or more corrosion inhibitors.

6. The solder paste of claim 1, wherein: the organic acid activator comprises one or more di-carboxylic acids, one or more mono-carboxylic acids, one or more halo-benzoic acids, and combinations thereof; and/or the organic amine activator comprises one or more aliphatic- or aromatic-containing primary, secondary or tertiary amines, heterocyclic amines, polyamines solely, and combinations thereof.

7. The solder alloy of claim 1, wherein the activator further comprises one or more amino acid activators.

8. The solder alloy of claim 7, wherein the amino acid activator comprises one or more of glutamic acid, aspartic acid, phenylalanine, valine, tyrosine and tryptophan.

9. The solder paste of claim 1, wherein the activator comprises: from 1 to 5 wt. % glutaric acid, from 5 to 12 wt. % adipic acid, from 0 to 2 wt. % 2-iodobenzoic acid, and from 2 to 10 wt. % 2-ethylimidazole.

10. The solder paste of claim 1, wherein the activator comprises: from 7 to 15 wt. % adipic acid, from 0 to 2 wt. % 2-iodobenzoic acid, and from 2 to 10 wt. % 2-ethylimidazole.

11. The solder paste of claim 1, wherein the activator comprises: from 1 to 5 wt. % glutaric acid, from 1 to 10 wt. % glutamic acid, from 3 to 10 wt. % adipic acid, from 0 to 2 wt. % 2-iodobenzoic acid, and from 2 to 10 wt. % 2-ethylimidazole.

12. The solder paste of claim 1, wherein the solder flux comprises: one or more thermoplastic polymers; and/or one or more waxes; and/or one or more thermoset network forming resins, the product of the reaction of epoxy with hardeners such as amine, acid, anhydrides, the product of the reaction of acid or its derivative with amine, the product of the reaction of acid or its derives with alcohol, the product of the reaction of multiple carbon-carbon bond having allyl, vinyl, methacrylate, methacrylamide functionality, the reaction of hydroxy and isocyanate.

13. The solder paste of claim 12, wherein the waxes are selected from vegetable oil waxes, natural waxes, and combinations thereof.

14. The solder paste of claim 1, wherein the solder flux comprises a corrosion inhibitor comprising triazole derivative.

15. The solder paste of claim 14, wherein the triazole derivative is selected from benzotriazole, tolyltrizaole, carboxybenzotriazole, and combinations thereof.

16. The solder paste of claim 1, wherein the solder alloy comprises bismuth and/or indium.

17. The solder paste of claim 1, wherein the solder alloy consists of: from 50 to 54 wt. % bismuth, from 4 to 6 wt. % indium, from 0.5 to 1.5 wt. % gallium and the balance tin together with any unavoidable impurities; or from 49 to 53 wt. % bismuth, from 5 to 7 wt. % indium, from 0.5 to 1.5 wt. % gallium and the balance tin together with any unavoidable impurities; or from 49 to 53 wt. % bismuth, from 4 to 6 wt. % indium, from 1.5 to 2.5 wt. % gallium and the balance tin together with any unavoidable impurities; or from 56 to 59 wt. % bismuth, from 0.1 to 0.3 wt. % copper, from 0.02 to 0.04 cobalt, from 2 to 4 wt. % indium and the balance tin together with any unavoidable impurities; or from 56 to 59 wt. % bismuth, from 0.1 to 0.3 wt. % copper, from 0.02 to 0.04 cobalt, from 4 to 6 wt. % indium, from 1 to 3 wt. % gallium and the balance tin together with any unavoidable impurities; or from 56 to 59 wt. % bismuth, from 0.2 to 0.6 wt. % silver, from 4 to 6 wt. % indium, from 1 to 3 wt. % gallium and the balance tin together with any unavoidable impurities.

18. A method of forming a solder joint comprising: (i) providing two or more work pieces to be joined; (ii) providing the solder paste of claim 1; and (iii) heating the solder paste in the vicinity of the work pieces to be joined.

19. Use of the solder paste of claim 1 in a soldering method.

20. The use according to claim 19, wherein the soldering method is selected from wave soldering, Surface Mount Technology (SMT) soldering, die attach soldering, thermal interface soldering, hand soldering, laser and RF induction soldering, soldering to a solar module, soldering of level 2 LED package boards, and rework soldering.

Description

BRIEF DESCRIPTION OF THE FIGURES

[0294] The present invention will now be described further, by way of few non-limiting examples of these alloys and a summary of their performance, with reference to the following drawings in which:

[0295] FIG. 1 shows a DSC plot (Heat Flow Q (mW) versus Temperature T ( C.) for the alloy SnBi-6In.

[0296] FIG. 2 shows a DSC plot (Heat Flow Q (mW) versus Temperature T ( C.) for the alloy SnBi-6In-1Ga.

EXAMPLES

[0297] The present invention will now be described further with reference to the following non-limiting examples.

Example 1

[0298] The following solder alloys were prepared: Sn-5Bi-6 In and Sn-5Bi-6In-1Ga. As can be seen from FIGS. 1 and 2, the addition of 1% Ga to Sn-5Bi-6 In solder reduces the onset temperature of the main melting phase from 118 C. to 110 C. and eliminates phases melting at 78 C. and 100 C. It also introduces a small fraction of another phase melting around 87 C.

[0299] Solder joints were prepared using the two solder alloys. The additional of 1% Ga did not have a significant detrimental effect on the mechanical properties of the solder joint. In Particular, the alloys exhibited similar shear strengths and similar thermal cycling behaviours.

Example 2

[0300] A solder alloy was prepared having the following composition: [0301] (a) from 53 to 54 wt. % of Bi [0302] (b) from 4 to 5 wt % of In [0303] (c) 0 to 0.05 wt. % nickel [0304] (d) the balance tin, together with unavoidable impurities.

[0305] The alloy exhibited a combination of low reflow temperature and favourable mechanical properties.

Example 3

[0306] A solder alloy was prepared having the following composition: [0307] (a) from 55 to 56 wt. % of Bi [0308] (b) from 2 to 3 wt % of In [0309] (c) 0 to 0.05 wt. % nickel [0310] (d) 0.3 to 0.5% Cu [0311] (e) the balance tin, together with unavoidable impurities.

[0312] The alloy exhibited a combination of low reflow temperature and favourable mechanical properties.

Example 4

[0313] A solder alloy was prepared having the following composition: [0314] (a) from 51 to 53 wt % of In [0315] (b) 0 to 0.05 wt. % nickel [0316] (c) 0.3 to 0.5% Cu [0317] (d) the balance tin, together with unavoidable impurities.

[0318] The alloy exhibited a combination of low reflow temperature and favourable mechanical properties.

Example 5

[0319] A solder alloy was prepared having the following composition: [0320] (a) from 51 to 53 wt % of In [0321] (b) 0 to 0.05 wt. % nickel [0322] (c) 0 to 0.05% Ge [0323] (d) the balance tin, together with unavoidable impurities.

[0324] The alloy exhibited a combination of low reflow temperature and favourable mechanical properties.

Example 6

[0325] A solder alloy was prepared having the following composition: [0326] (a) from 51 to 53 wt % of In [0327] (b) 0 to 0.05 wt. % nickel [0328] (c) 0 to 0.03% P [0329] (d) the balance tin, together with unavoidable impurities.

[0330] The alloy exhibited a combination of low reflow temperature and favourable mechanical properties.

[0331] The foregoing detailed description has been provided by way of explanation and illustration, and is not intended to limit the scope of the appended claims. Many variations in the presently preferred embodiments illustrated herein will be apparent to one of ordinary skill in the art, and remain within the scope of the appended claims and their equivalents.