RFID system suitable for being attached to fabrics and method for the digitalization of fabrics

Abstract

A Radio Frequency Identification (RFID) system for attaching to fabrics, includes a device having a dielectric base and cover layers, and a conductive foil having a slit. The conductive foil is provided between the dielectric base and cover layers, and is configured to refract magnetic waves emitted by an RFID reader. Further, a rigid electronic module having an antenna that fits in the slit. The rigid electronic module is provided between the conductive foil and the dielectric cover layer. Said slit being longitudinal and centred on the conductive foil to allow distribution of the magnetic field lines. The magnetic field crosses the conductive foil through the slit, thereby activating the rigid electronic module and amplifying a signal emitted thereby. Furthermore, a fabric layer structurally supports said device. The dielectric base and cover layers, the rigid electronic module, the conductive foil, and the fabric layer are fused together.

Claims

1. A Radio Frequency Identification (RFID) system for attaching to fabrics, said RFID system being one of a High-Frequency (HF) RFID or a Near-Field Communication (NFC) RFID system, the RFID system, comprising: at least one device, said device comprising: at least one dielectric base layer; at least one dielectric cover layer; a conductive foil comprising at least one slit, said conductive foil provided between the at least one dielectric base layer and the at least one dielectric cover layer; at least one rigid electronic module comprising an antenna is provided between said conductive foil and the at least one dielectric cover layer, wherein the antenna has dimensions such that the antenna fits in the at least one slit; at least one fabric layer structurally supporting said device and being provided on an outside of the at least one dielectric base layer, wherein said conductive foil being configured to refract magnetic waves emitted by an RFID reader, wherein said at least one slit being longitudinal and centred on the conductive foil to allow distribution of magnetic field lines, thereby reversing a direction of the magnetic field, wherein the magnetic field lines cross the conductive foil through the at least one slit, thereby activating the at least one rigid electronic module and amplifying a signal emitted by said at least one rigid electronic module, wherein the at least one dielectric base layer, the at least one rigid electronic module, the conductive foil, the at least one dielectric cover layer, and the at least one fabric layer are fused together.

2. The RFID system according to claim 1, wherein said at least one of the at least one dielectric base layer is a thermoplastic polymer or thermoadhesive (TPU) with at least one side with glue to penetrate into the at least one fabric layer improving the adhesion and at least a smooth layer to allow micro-movements of the conductive foil on the at least one dielectric base layer to improve a response of the RFID system to flex.

3. The RFID system as claimed in claim 2 further comprising a semi-finished product, wherein the semi-finished product comprises the at least one dielectric base layer and the conductive foil, wherein the conductive foil being an aluminium foil, thereby simplifying handling of the conductive foil.

4. The RFID system according to claim 1, wherein the at least one dielectric base layer is made of a polyimide material to increase a flexibility of the RFID system and a moisture resistance of the RFID system, the at least one fabric layer having any degree of elasticity, different than 0 configured to act as a supporting structure for the RFID system.

5. The RFID system according to claim 1, wherein said at least one dielectric base layer has a shape of symmetrical “butterfly wings”, wherein end portions are enlarged outwardly and centre portions are skewed inwardly.

Description

(1) These and further advantages related to the innovative fabric memory system and related process for the digitalization of innovative fabrics will be better highlighted and described with reference to the attached figures in which:

(2) In FIGS. 1a and 1b are represented an exploded view and a plan view of a first preferred embodiment of the system described by the present invention;

(3) in FIGS. 2a and 2b are represented an exploded view and a plan view of a second preferred embodiment of the system described by the present invention;

(4) in FIGS. 3a and 3b are represented an exploded view and a plan view of a third preferred embodiment of the system described by the present invention;

(5) in FIGS. 4a and 4b are represented an exploded view and a plan view of a fourth preferred embodiment of the system described by the present invention;

(6) in FIGS. 5a and 5b are represented an exploded view and a plan view of a fifth preferred embodiment of the system described by the present invention;

(7) in FIGS. 6aand 6b are represented an exploded view and a plan view of a sixth preferred embodiment of the system described by the present invention;

(8) in FIGS. 7a and 7b are represented an exploded view and a plan view of a seventh preferred embodiment of the system described by the present invention;

(9) and in FIG. 8 is represented further embodiment of the innovative system described by the present invention.

(10) With reference to FIG. 1 (model 1), there is represented the basic model of the memory system 1 for fabrics described by the present invention in view from the top and exploded; in particular, said system comprises at least one fabric layer 2, a layer of dielectric element 3, here shaped preferably in a “butterfly” shape, a foil 4 comprising a slit 5, at least one rigid electronic module 6 and at least one upper dielectric layer closing 7.

(11) In particular, the innovative advantages concerning the shape and the surface extension of the base dielectric layer, as well as the innovative advantages deriving from the type of fabric applied, that is, with substantially zero or no elongation, or the advantageous and innovative aspects of the system of Fabric memory described by the present invention, have been widely described above, here greater attention will be paid to the innovative aspects of the fabric digitalization process described by the present invention. In particular, this procedure for the system of model of type 1 comprises at least the steps of: fabric 2 sizing or fabric roll processing; pre-forming of the TPU 3 basic dielectric layer (model with a non-gluing side described previously) with a punch, laser cutting or mechanical cutting etc., construction with defined shape (base Sdie)<(Sdie closing); hot application of the TPU layer with hot heat press (15 seconds at 55° C. for example)

(12) or with ultrasound system;

(13) The ultrasonic system is advantageous because it lowers the overall working temperature of the processing and accelerates the time (4 seconds at room temperature). pre-forming of aluminum foil 4 through die-cutting, laser cutting or mechanical cutting; positioning of the foil centering it on the base TPU layer 3 with a numerical control or pick&place system;

(14) (A variant includes the passage with heat press at 150° C. for 1-2 seconds to make the foil adhere well to the TPU). gluing phase; a glue point is given with the machine; positioning of the rigid electronic module 6 using pick&place; pre-forming of the second layer 7 of dielectric closing TPU, always by means of die-cutting, laser cutting or mechanical cutting; the TPU closing layer 7 is placed and heated at 155° C. for 15 seconds.

(15) Subsequently the system 1 (and all the following systems so realized) will be assembled by stitching, or by other methods explained below, from the side of the closing layer TPU 7, for which the system 1 “visually” (and all other forms of realization) are mounted on the “reverse side” with respect to the figures.

(16) Therefore, the fabric 2 can advantageously be printed with any logo or pattern of the receiving fabric in such a way as to be practically invisible.

(17) In this configuration the system 1 is made directly on the base fabric 2, and a fabric edge 2 is obtained which exceeds the area of realization of the electronic device D of 5 mm in order to allow the subsequent stitching on a garment or other textile support.

(18) In FIG. 2 (model 2) there is shown a second particularly preferred embodiment of the fabric memory system 10 described by the present invention. In particular, in this embodiment the system 10 further comprises, placed above the closing dielectric layer 7, a further layer 80 of heat-sealable biadhesive material to make the system 10 adhere to a fabric T on which it is subsequently applied.

(19) In particular, in this embodiment the innovative process for digitalizing the fabrics comprises at least the steps of: sizing of fabric 2 or fabric roll processing; pre-forming of the TPU basic dielectric layer (model in this case with a non-gluing side described above) by means of a punch, or laser cutting or mechanical cutting, hot application of the TPU layer with heat press (15 seconds at 55° C. for example) or with an ultrasound system; pre-forming of aluminum foil 4 through die-cutting, laser cutting or mechanical cutting; positioning of the foil 4 centering it on the base layer 3 TPU with a numerical control system or pick&place;

(20) (A variant includes the passage with heat press at 150° C. for 1-2 seconds to make the foil adhere well to the TPU); gluing phase: a glue point is given with the machine; positioning of the rigid electronic module 6 by pick&place; pre-forming of the closing dielectric TPU material layer 7, always by means of punching, laser cutting or mechanical cutting; positioning and heat-sealing of the upper closing layer 7 of TPU at 155° C. for 15 seconds; pre-forming with a punch or laser cutting a layer of thermo-bi-adhesive material 80 and positioning with a numerical control system over the closing layer 7 of TPU; hot pressing with thermo-press (range from 100 to 150° C. for 1-15 seconds) or coupling with an ultrasonic system of the adhesive layer 80 with the rest of the device, to form said system 10.

(21) It should be noted that for this specific processing a thermostabilized PET film is used with a detaching material since the material, being adhesive on one side, must maintain the glue but at the same time adhere to the fabric of the fabric memory system. By virtue of this film, the remaining “solid” glue is active only when the system is thermowelded to the garment (typically at 150-160° C. for 15-20 seconds). The layer 80 is completely melted allowing the adhesion of the system, for example, on a t-shirt in a solid manner. It should be noted that it is not possible to directly realize the system on a jersey, generally because the fabric of the t-shirts is substantially elastic and does not guarantee the mechanical structure which the device requires.

(22) FIGS. 3a and 3b (model 3) show a variant of the embodiment of FIG. 2a and 2b, or a further particularly preferred embodiment of the fabric memory system 100 described by the present invention. In particular, in this embodiment the system comprises a “crown” 800 of material suitable for welding the fabric memory system 100 to the head to which it will be destined. In this case, the layer of thermo-sealing material 800 does not remain positioned under the system 100, but rather forms a crown around the area of installation of the system; the system 100 is fixed to the heat-sealing material layer in turn by means of heat pressing with a temperature range from 100 to 150° C. for a period of from 1 to 15 seconds or through ultrasound for an application time from 1 to 12 seconds.

(23) In this way the flexibility of the system is not reduced, the joint between the base fabric 2 of the system and the recipient fabric is hidden by the thermo-welded crown which creates a polyurethane layer along the junction with considerable technical and aesthetic improvement.

(24) In particular, in this embodiment the innovative process for digitalizing the fabrics comprises at least the steps of: fabric sizing or fabric roll processing 2; pre-forming of the TPU dielectric base layer 3 (a model with a non-gluing side described previously) with a punch, or laser cutting or mechanical cutting, etc; hot application of the TPU 3 base layer on fabric 2 with heat press (15 seconds at 155° C. for example) or with ultrasound system (advantageous as it lowers the overall working temperature of the processing and accelerates the time (4 seconds to room temperature); pre-forming of aluminum foil 4 through die-cutting, laser cutting or mechanical cutting; positioning of the foil centering it on the TPU layer 3 with a numerical control system or pick&place;

(25) (A variant includes the passage with heat press at 150° C. for 1-2 seconds to make the foil adhere well to the TPU). gluing phase; point glue given with a machine suitable for gluing; positioning the rigid electronic module 6 using pick&place; pre-forming of the dielectric TPU material layer 7, always closing by means of punching, laser cutting or mechanical cutting; positioning and heat-sealing of the second layer of TPU at 155° C. for approximately 15 seconds;

(26) (note that the ranges are generally in general from 80-90 to 180° C. for a time that varies from 4/5 seconds to 20/25 depending on the heat required for adhesion); pre-forming with punch or laser cutting a layer of thermo-sealing TPU material 800 in the shape of a “crown”; positioning of the fabric memory system on this “crown” and centering of the assembly=system 100 comprising the crown 800.

(27) Note that the surface of the fabric 2 remains completely inscribed in the crown 800, the crown 800 (as shown above) remains overlapped by 2.5 mm from the edge of the inner perimeter on the assembly and remains overlapped by 2.5 mm from the external perimeter on the support (whereby said crown 800 remains partially overlapped on the system 100 and partially superimposed on the fabric or support T. heating with thermo-press (at 100/120° C. for 1-3 seconds) of the assembly that serves to pre-glue the crown on the system and then weld onto the support fabric T subsequently by heat press (or the same procedure in particular cases can be carried out with an ultrasound system); welding on the support (mesh or T fabric) with a temperature range from 100 to 180° C. for a period of 3/4 to 25 seconds using a heat press. If the support is in polyester it is possible to weld also ultrasound for a time range of 3 to 15 seconds.

(28) It should be noted that the further advantage of ultrasounds is that they only operate where they are needed, that is, they bond the thermoadhesive material to the fabric of the device but do not affect the rest of the material that will adhere to the garment. For this reason the use in the present invention of said technology is particularly interesting.

(29) FIGS. 4a and 4b (model 4) show a further particularly preferred embodiment of the fabric memory system 101 described by the present invention; in particular, in this variant, in a particularly advantageous way, the fabric memory system comprises a Lyner 102 instead of a fabric base layer 2, or in this case a film (thickness from 80 microns to ⅘ mm, for example PET) which will be coupled to the dielectric base layer 3 to provide structural support to enable the finished system 101 to be moved.

(30) In this case, the innovative process for digitalizing the fabric described by the present invention comprises at least the steps of: unrolling the dielectric coil to form the base TPU layer 3; positioning of the preformed foil 4 previously with a pick&place on calibrated points,

(31) (The calibrated reference points are necessary to guarantee the correct functioning of the assembly, in fact, in order to work, the foil and the rigid module must be coupled in a very precise way to exploit the effect of the inversion of the magnetic field. Therefore the rigid module must be perfectly close to the slot with three sides slightly surmounting the foil.) positioning and gluing of the rigid electronic module 6; unrolling of the second closing and coupling layer 7 of TPU with the lower layers; thermo-welding phase at a temperature range from 80-120/130° C. for 2 to 10 seconds to make the base TPU 3 with TPU 7 adhere to all elements in between. Work can also be performed using ultrasound for 2-5 seconds; optional phase: heat-sealing by means of heated rollers which, by means of a combination of pressure and temperature, allow a slight fusion of the upper TPU material 7 and make it adhere to the whole underlying assembly. The temperature activates the sticky part of the TPU 7. (as previously indicated that the TPU is composed of a layer of glue and a “normal” polymeric layer); cutting by laser, dies or mechanical cutting of the semi-finished products that fall into a basket and go into storage;

(32) After passing through a heat press, programming the contents of the memory if requested by the customer via an antenna (known art).

(33) It should be noted that both starting coils have equal widths (in this case 50 cm wide reels have been used but the process can be extended to coils even much longer (even 3 meters).

(34) Subsequently the phases of: hot thermo pressing (100-120° C. for about 5-6 seconds) to make the materials adhere slightly.

(35) It should be noted that this operation can be done either by heat press or by heated rollers which couple the melting materials.

(36) (Note that the TPU used is made of a multilayer of polyurethanes with different chemical structures and constructions. Each layer is designed to optimize adhesion with the underlying products. The first layers are mainly melting and are usually activated at a temperature around at 80 degrees. More in detail, the first immediately adheres to the fabric, the second melts at a slightly higher temperature up to the 5th layer that melts at 135° C. The upper layers are slightly thicker from 12 to 18 microns and are composed in this way: polyurethane base layer with high temperature resistance, polyurethane layer with the desired color always resistant to temperatures and protective layer also resistant to temperature.

(37) It should be noted that, particularly advantageously, it has been verified that the chemical/physical conformation of the support added to the pressure which the heat press allows the melting materials to penetrate between the weft and the warp of the fabric, with a penetration index inversely proportional to the melting temperature of the layer (the former becomes almost liquid until the fifth layer that remains semi-solid). Once the spaces are saturated, on the surface of the fabric the other thick layers of “full” material remain in “floating”.

(38) The concept is analogous to the closing layer 7. The melting layers are able to penetrate into the base 3 because the temperature softens the upper layers of this layer and “merges” together the fused layers of the closure 7 with the base 3. The waterproofing occurs due to the saturation of the gluing layers inside the fabric and due to the solid conformation of the non-melting states. removal of the PET support film 102 from the upper TPU layer (the layer may also remain positioned);

(39) Note that in order to extrude the TPU there is always need of a PET support to give it a “shape”. This supporting film can then be mounted on the TPU or removed to allow further processing. The TPU of the base in most of the preferred embodiments is without PET film to eliminate the phase of elimination of the film itself (impossible in the automation phase but to be done by hand). On the other hand, for the closing layer 7, the PET layer applied to the finished manufacturing process is applied as protection, and then the final customer will remove it. positioning under a laser to cut the various single forms of semi-finished products (before this phase there is a “roll” with inside a series of sheets and rigid modules positioned and sealed at the top with the closing layer 7. To obtain the individual semi-finished parts need to be cut with the laser); storage of the semi-finished system 101 comprising PET support film 102;

(40) subsequently, in order to apply the semi-finished products to the fabrics to which they are destined, the semi-finished products; positioning of the semi-finished product by means of pick&place on the destination fabric;
note that the fabric may also be in this phase in a coil and the parts of the fabric can be cut later by laser; or it is possible to place the semi-finished products on pieces already cut; thermo-pressing of the semi-finished system 101 and T fabric at 160° C. for 15-20 seconds (or using an ultrasound welding machine for a total processing time of 4 seconds).

(41) Also for this embodiment it is then possible to add at the end of the process the thermo-bi-adhesive (layer 80 model 2) or the crown (thermo-welding 800 model 3).

(42) It should be noted that this innovative process can be carried out also by reversing the assembly order of the system; that is, it is possible to start from the upper dielectric closing layer, then positioning the rigid module 6 and gluing it (gluing phase) to the aluminum plate 4. Finally, the base TPU layer 3 is coupled.

(43) However, even if possible, the phases of the innovative process are avoided, because during the pressing of the base layer of TPU 3 with the upper closure layer of TPU 7 where the foil remains between the two TPUs, said foil could break because the plate of the upper heat press is rigid (as opposed to the lower heat press plate); so by inverting the plates of the press the result would be adequate.

(44) This occurs because the heat press which is normally used has a fixed part in heat-resistant neoprene capable of compressing even 5-6 mm and a movable part activated by a pneumatic cylinder on which a rigid metal or ceramic material plane is installed. which is heated to the desired temperature. Pressure, temperature, cycle time can be adjusted and, if necessary, also the response of the fixed plane by replacing the neoprene with a less elastic one and therefore less compressible.

(45) In any case, the type of heat press is not considered limiting for the purposes of the present invention.

(46) A further variant to the innovative process described herein includes, in particular, the steps of: incision of the TPU coil to make the base 3 and obtain a shape (Sdie base)<(Sdie closure) (for example of a “butterfly” type); elimination of waste or processing residual (namely using laser or cutting plotter to engrave the TPU without affecting the lower supporting film).

(47) In this way it is possible to obtain a preferred embodiment, such as for example the “butterfly” shape with regard to the base TPU layer 3 without necessarily having the upper and lower layer of TPUs 7 having an identical shape.

(48) It should be noted that it is possible in alternative embodiments to perform only one laser cutting of the reel at the end of the procedure, in which case the geometry of the base 3 of the closure 7 is the same and this does not alter the operation of the system.

(49) Subsequently there are the steps of: positioning of the previously pre-formed foil 4 with a pick&place on calibrated points; positioning and gluing of the rigid electronic module 6; unrolling the second closing layer of TPU 7 and coupling with the lower layers by means of thermo-welding with a temperature range of 80-120/130° C. from 2 to 10 seconds to make the base TPU adhere with the TPU 7 included all the elements between the two layers 3/7, alternatively machining can also be performed using ultrasound for 2-5 seconds; alternatively, optional: thermo-welding by means of heated rollers which, by means of a combination of pressure and temperature, allow a slight melting of the upper TPU layer 7 making it adhere to the whole underlying assembly. The temperature activates the sticky part of the TPU layer 7;

(50) It should be noted that both starting coils have equal widths (in this case 50 cm wide reels have been used, but the process can be extended to coils even much longer (even from 3 meters). hot thermo-pressing (100-120° C. for about 5-6 seconds) to make the elements adhere provisionally to keep them in position;

(51) It should be noted that this operation can be performed either by heat press or by heated rollers which couple the melt materials. removal of the PET support film 102 (as above); positioning under a laser that cuts the various forms of semi-finished electronic product; stocking the semi-finished assembly system 101+PET support film 102;

(52) Subsequently, in order to apply the semi-finished products to the fabrics for which they are destined, there are the phases of: positioning of the semi-finished product by means of pick&place on the destination fabric;

(53) It should be noted that the fabric may also be in a coil at this stage and the parts of the fabric may be subsequently cut by laser; or it is possible to place the semi-finished products on already cut pieces. semi-finished and fabric thermo-pressing at 160° C. for 15-20 seconds (or using an ultra sound welding machine for a total processing time of 4 seconds).

(54) Also for this embodiment it is then possible to add at the end of the process the 2 layers of thermoadhesive in order to make them adhere to the supports with models 2 or 3.

(55) FIGS. 5a and 5b (model 5) show a further particularly preferred embodiment of the fabric memory system 110 described by the present invention; in particular in this variant, in a particularly advantageous manner, the fabric memory system 110 in this case comprises a base dielectric layer 310 made of kapton, for example of 25 microns or, preferably, of 50 microns.

(56) The kapton advantageously has the capacity to replace the fabric layer 2 as a supporting structure, since it has characteristics suitable for supporting the system.

(57) In this case, therefore, further advantageously, the base fabric 202 can also have any degree of elasticity, that is, significant, so that it is not equal to 0 or substantially zero.

(58) In this case, the innovative process for digitalizing the fabrics described by the present invention comprises at least the steps of: pre-forming of the layer in kapton 310 with punch, or laser cutting or mechanical cutting etc.; positioning of the kapton layer 310 using an equipment that creates vacuum or it can be placed on a PET thermofilm that remains attached to the kapton layer to simplify handling; pre-forming of aluminum foil 4 through die-cutting, laser cutting or mechanical cutting; positioning of the foil 4 centering it on the kapton layer 310 with a numerical control system or pick&place;

(59) or: a variant further comprising the passage with a heat press from 100° C. to 150° C. from 1 to 12 seconds to make the foil adhere well with the kapton layer; gluing phase: glue point given with a specific machine; positioning of the rigid electronic module 6 by pick&place; pre-forming of the closing layer of dielectric TPU material 7, always by means of laser cutting punches or mechanical cutting; positioning and heat-sealing of the second dielectric layer TPU 7 from 80° C. to 180° C. for approximately from 5 to 25 seconds; pre-forming with punch or laser cutting a layer of thermo-sealing TPU material 800 in the shape of a “crown”; positioning of the fabric memory system on the “crown” and centering of the system assembly 110+crown 81.

(60) In this way, a semi-finished product is always obtained as in the embodiment of the fabric memory system 100; the adhesion on the fabric takes place through the TPU overlap of the closing layer, that is, the closing TPU layer 7 has a larger surface than the surfaces of the underlying layers, whereby the surplus surface part is used to fix the system on the fabric of destination.

(61) It should be noted that on the layer surface 310 of kapton, the semi-finished product does not adhere to the target fabric.

(62) This offers a sliding effect between the system 110 and the target fabric which leads the system to be decidedly advantageously flexible.

(63) Also for this embodiment it is then possible to add at the end of the process one of the two layers of thermoadhesive to make the system adhere to the supports, i.e. fabrics T, as described by models 2 and 3.

(64) Furthermore, in the embodiments of FIGS. 6a, 6b and 7a, 7b (models 6 and 7) two systems 200, 220 are shown comprising a device D, formed here by a base layer 3, foil 4, module 6 and layer of closure of reduced dimensions with respect to the supporting fabric layer 2.

(65) In the case of FIGS. 6a and 6b, a larger size of the fabric 2 is maintained to increase the so-called Brand Awareness; that is, having the smallest electronic area to the touch, the fabric 2 is softer and more pleasant.

(66) The electronic area is only 25×25 mm compared to a 52×55 fabric.

(67) Cutting can be done by computerized laser. This is advantageous because it is possible to realize not only an “electronic” component but also ornamental solutions printed and with particular geometries.

(68) The rest is fabric 2 without electronic parts and is lighter and more flexible.

(69) In the case of FIGS. 7a and 7b, one of the smallest models is shown. (For example, the system will have device D dimensions 25×25 mm, fabric 35×35 mm, module 3×3 mm)

(70) In this case, some advantages of an embodiment of this kind is the possible insertion of the system where a smaller measure is needed, if it were a wearable garment the user would not even notice having it.

(71) Still, advantageously, it is possible to hide the system and only the operators of the sector know its precise location, it is possible to apply the system for example to on hats and caps and for children's clothing.

(72) On the other hand, among the disadvantages there is a more rigid structure, a smaller reading distance and a greater difficulty in the management of the aluminum foil during production.

(73) All models of fabric memory system are supplied with a sewing solution, with a thermo-sealing solution similar to model 2 or with a thermo-sealing solution similar to model 3.

(74) Finally, in FIG. 8 (model 8) are represented the steps of the process for the digitalization of the innovative fabrics for the realization in this case of a particularly preferred embodiment, wherein the fabric memory system 300 described by the present invention is achieved by modifying some processing steps. In particular, a semi-finished product is advantageously comprising at least the base dielectric layer 3 and the aluminum foil 4. The module 6 is positioned at a later time.

(75) In a particularly advantageous way, the realization of this semi-finished product makes it possible to avoid having to handle the aluminum foil autonomously, a factor which (as previously described) causes problems, since the foil is very thin, so fragile and difficult to handle and difficult to be positioned, the semi-finished product thus made simplifies the movement of the foil 4.

(76) The base layer TPU 3 can be coupled to a layer or film 103 which is used only to move the various semi-finished parts during processing. On the contrary it would be impossible to transport them because they are not mechanically structured enough to be manipulated accurately.

(77) Processing steps starting from the coil: unrolling the base dielectric coil 3 (previously coupled to the “transport” film 20 or layer 103; unrolling the aluminum coil (to make the plate 4); centering and alignment of the two coils (they must fit in the width and the unwinding axis); pre-coupling heat-pressed medium-heat for 1-5 seconds at 80-120° C. to give a basic pre-adhesion and foil;

(78) or passage between two rollers also heated from 80° C. to 120° C., die cutting of the assembly made up of base TPU 3 and aluminum 4 (thus obtaining, for example, the incision for the “butterfly” shape of the base TPU 3 and for the geometry of the plate 4); removal of the excess material from the semi-processed system 300 on the film or layer remains only the system 300 rigid module positioning 6; closing with TPU 7 as described previously; phases as described in the previous embodiments.

(79) Note that the layer 3 of base TPU and the aluminum foil 4 should not “stick” to each other, but only adhere to one another (bonding the two layers would lose the advantage of having a smooth side of the base TPU 3).

(80) As mentioned, once the two base dielectric layers 3 and aluminum foil 4 are coupled, these are punched.

(81) The dies can have cutting footsteps at different heights. This allows the two materials to be etched with different shapes. Removing the scraps from the base TPU 3 and the aluminum foil 4. To remove these scraps, re-roll the roll of TPU and the scrap aluminum, so it is rolled up. only the discarded part, the foils will have their own geometry with a slit, while the base dielectric 3 (for example of a butterfly shape) will have a preferably a formed shape, maintaining a lower surface with respect to the closing dielectric layer 7.

(82) The film or layer 103 connected to the base layer 3 of support, on the other hand, will remain intact, it is not cut to allow the assembly to be dragged.

(83) It should be noted that a variant provides for obtaining the same result by crossing the base TPU assembly 3/aluminum foil 4 under two different lasers. In fact, to cut the metals (i.e. the aluminum foil in this case) it is necessary to use “fiber” lasers that operate at a light frequency which does not affect the basic TPU dielectric layer 3.

(84) On the contrary, in order to cut the dielectric it is necessary to use a CO2 laser which does not advantageously cut the metals, so by properly adjusting the powers it is possible to operate on the two coupled materials without damaging them.

(85) The remaining part of the processing is in line with the processing of models 2, 3 and 4.

(86) It should be noted that variations in the order of carrying out the steps of the innovative process for digitalizing the fabrics, or variations in the temperatures and processing times are to be considered mere alternative embodiments to the innovative process described herein, as they are to be considered mere embodiments of the system of memory for innovative fabrics thus obtained. Further variations in materials, such as those used for the foil, such as aluminum, copper or other conductive materials, process steps, additional alternatives, machining formats, supports on which the systems are made, for which supports with adequate structure and not only textile supports are all to be considered variants embodied in the object of the present invention as better described by the appended claims.