SYSTEM AND METHOD FOR THE MULTI-STEP PROCESSING OF PLANAR SUBSTRATES

Abstract

The invention relates to a system and a method for the multi-step processing of planar substrates, more particularly planar glass substrates, on a substrate carrier, wherein a plurality of mutually spatially separated processing stations are interconnected by means of a substrate-carrier conveying device, and wherein a substrate carrier is conveyed from one processing station to the next processing station by means of the substrate-carrier conveying device in order to subject a planar substrate laid on a substrate carrier to a plurality of processing steps in succession.

Claims

1. A plant for the multi-step processing of flat substrates, comprising: a plurality of processing stations spatially divided from one another, which are connected to one another by a substrate carrier conveyor apparatus in order to convey a substrate carrier along a conveyor path defined by the substrate carrier conveyor apparatus from one of the processing stations to the next one of the processing stations station, in order to subject a flat substrate placed on the substrate carrier successively to a plurality of processing steps in the respective processing stations, wherein one of the processing stations is configured as a loading station, which is designed to place a flat substrate on the substrate carrier, and wherein at least one of the processing stations is configured as an operating station, which is designed to process the flat substrate placed on the substrate carrier, and wherein one of the processing stations is configured as an unloading station, which is designed to remove a processed flat substrate from the substrate carrier.

2. The plant for the multi-step processing of flat substrates of claim 1, wherein the substrate carrier conveyor apparatus is configured as a carousel so that it defines a closed conveyor path in order to convey the substrate carrier from the loading station via the at least one operating station and the unloading station back again to the loading station; and/or wherein the substrate carrier conveyor apparatus comprises a plurality of conveyor sections, each of which define a respective conveyor direction, the conveyor directions of the plurality of conveyor sections extending at an angle with respect to one another; and/or wherein the substrate carrier conveyor apparatus defines a circular conveyor path.

3. The plant for the multi-step processing of flat substrates of claim 1, wherein the loading station comprises a reception device in order to receive the flat substrate and to place the received substrate on the substrate carrier, wherein the reception device comprises a handling system and/or a suction gripping device with reduced-pressure modules, in order to suction the flat substrate onto the suction gripping device; and/or wherein the loading station comprises an inspection device in order to inspect the flat substrate before it is received.

4. The plant for the multi-step processing of flat substrates of claim 1, wherein one or more of the processing stations comprise means in order to exert a force acting in a direction of the substrate carrier onto the substrate wherein the means are configured to induce the force acting in the direction of the substrate carrier by applying a reduced pressure to a surface of the substrate facing toward the substrate carrier and/or to induce the force acting in the direction of the substrate by mechanical pressing or attraction of the substrate onto the substrate carrier, and/or to induce the force acting in the direction of the substrate carrier by adhesion forces or surface forces; and/or wherein the plant comprises a substrate carrier which comprises openings or an open porosity for applying reduced pressure to a placed substrate, and/or has a surface that has an increased electrostatic chargeability or increased tribological properties, in order to fix a placed substrate on the substrate carrier.

5. The plant for the multi-step processing of flat substrates of claim 1, wherein one or more of the operating stations is configured as a pre-dividing station, which is designed to pre-divide the flat substrate placed on the substrate carrier along a predefined dividing line, wherein the pre-division comprises introduction of a damage into the substrate, and/or wherein the pre-division comprises introduction of laser radiation into the substrate, damages being introduced into the substrate in succession spaced apart from one another along the predefined dividing line.

6. The plant for the multi-step processing of flat substrates of claim 5, wherein one or more of the operating stations is configured as a separating station, which is designed to separate the flat substrate placed on the substrate carrier along the predefined dividing line into a plurality of portions, wherein the separation comprises action of force, moment, temperature, vibration and/or fracture of the flat substrate on the predefined dividing line at a damage or a plurality of damages which extend along the predefined dividing line.

7. The plant for the multi-step processing of flat substrates of claim 6, wherein one or more of the operating stations is configured as a waste station, which is configured to reject waste material, located on the substrate carrier, of the flat substrate from useful material, located on the substrate carrier, of the flat substrate to reject a portion separated along a predefined dividing line having a waste face of the substrate from a portion separated along the predefined dividing line having a useful face of the substrate, wherein the rejection comprises removal of the portion having the waste face of the substrate from the substrate carrier, and/or wherein the rejection comprises capture and isolation of the portion having the useful face of the substrate from the substrate carrier.

8. The plant for the multi-step processing of flat substrates of claim 7, wherein one or more of the operating stations is both configured as a separating station and is configured as a waste station, in such a way that the operating station forms a combined separating and waste station.

9. The plant for the multi-step processing of flat substrates of claim 1, wherein the unloading station comprises a reception device in order to receive from the substrate carrier a processed flat substrate and/or useful material of the flat substrate, wherein the reception device comprises a handling system and/or a suction gripping device with reduced-pressure modules, in order to suction the processed flat substrate and/or useful material of the flat substrate onto the suction gripping device, and/or wherein the unloading station comprises an inspection device in order to inspect a processed flat substrate and/or useful material of the flat substrate before it is received.

10. The plant for the multi-step processing of flat substrates of claim 8, wherein one of the processing stations is configured as a substrate carrier cleaning station, which is designed to clean the substrate carrier after a processed flat substrate (1) and/or useful material of the flat substrate has been taken from the substrate carrier.

11. The plant for the multi-step processing of flat substrates of claim 10, wherein the loading station is arranged between the substrate carrier cleaning station and the pre-dividing station within the conveyor path; and/or wherein the pre-dividing station is arranged between the loading station and the separating station within the conveyor path; and/or wherein the separating station is arranged between the pre-dividing station and the waste station within the conveyor path; and/or wherein the waste station is arranged between the separating station and the unloading station within the conveyor path; and/or wherein the combined separating and waste station is arranged between the pre-dividing station and the unloading station within the conveyor path and/or wherein the unloading station is arranged between the waste station and the substrate carrier cleaning station within the conveyor path; and/or wherein the substrate carrier cleaning station is arranged between the unloading station and the loading station within the conveyor path.

12. The plant for the multi-step processing of flat substrates of claim 10, wherein the substrate carrier conveyor apparatus comprises a first conveyor section, a second conveyor section, a third conveyor section, and a fourth conveyor section, wherein at least one of the following is also satisfied: wherein the loading station is arranged inside the first conveyor section or the second conveyor section of the substrate carrier conveyor apparatus; wherein the pre-dividing station is arranged inside the second conveyor section of the substrate carrier conveyor apparatus; wherein the separating station is arranged inside the second conveyor section or the third conveyor section of the substrate carrier conveyor apparatus; wherein the waste station is arranged inside the second conveyor section or the third conveyor section of the substrate carrier conveyor apparatus; wherein the combined separating and waste station is arranged inside the second conveyor section or the third conveyor section of the substrate carrier conveyor apparatus; wherein the unloading station is arranged inside the third conveyor section or the fourth conveyor section of the substrate carrier conveyor apparatus; or wherein the substrate carrier cleaning station is arranged inside the fourth conveyor section of the substrate carrier conveyor apparatus.

13. The plant for the multi-step processing of flat substrates of claim 1, further comprising a white room and/or a clean room in which the substrate carrier conveyor apparatus and/or the processing stations are arranged; and/or wherein the plant is joined directly, to a device for melting and/or shaping raw material for the flat substrates.

14. A method for the multi-step processing of flat substrates on a substrate carrier, wherein a flat substrate is placed on the substrate carrier in a processing station configured as a loading station; and wherein the substrate carrier is conveyed together with the placed flat substrate from the loading station by means of a substrate carrier conveyor apparatus directly or via one or more further processing stations to a processing station configured as an operating station; and wherein the flat substrate placed on the substrate carrier is processed in the operating station; and wherein the substrate carrier is conveyed together with the placed processed flat substrate from the operating station by means of the substrate carrier conveyor apparatus directly or via one or more further processing stations to a processing station configured as an unloading station; and wherein the processed flat substrate placed on the substrate carrier is taken from the substrate carrier in the unloading station.

15. The method for the multi-step processing of flat substrates of claim 14, wherein the substrate carrier is conveyed from the unloading station by means of the substrate carrier conveyor apparatus back again to the loading station.

16. The method for the multi-step processing of flat substrates of claim 14, wherein the substrate carrier is conveyed together with the placed flat substrate from the loading station by means of the substrate carrier conveyor apparatus directly or via one or more further processing stations to an operating station configured as a pre-dividing station; and wherein the flat substrate placed on the substrate carrier is pre-divided along a predefined dividing line in the pre-dividing station; and wherein the substrate carrier is conveyed together with the placed pre-divided flat substrate from the pre-dividing station by means of the substrate carrier conveyor apparatus directly or via one or more further processing stations to an operating station (500) configured as a separating station; and wherein the pre-divided flat substrate placed on the substrate carrier is separated along the predefined dividing line into a plurality of portions in the separating station; and wherein the substrate carrier is conveyed together with the plurality of portions of the flat substrate from the separating station by means of the substrate carrier conveyor apparatus directly or via one or more further processing stations to an operating station configured as a waste station, or wherein the operating station configured as a separating station is simultaneously configured as a waste station; and wherein at least one portion of the flat substrate is rejected in the waste station.

Description

[0148] The invention will be explained in more detail below with the aid of some figures, in which:

[0149] FIG. 1 shows a schematic diagram of a plant for the processing of flat substrates according to a first embodiment,

[0150] FIG. 2 shows a schematic diagram of a plant for the processing of flat substrates according to a second embodiment.

[0151] FIG. 1 shows a plant 100 for the post-processing of flat glass substrates 1 which are placed on a substrate carrier 10 (carrier). The plant comprises a substrate carrier conveyor apparatus 110 configured as a rotary machine or carousel having four conveyor sections 112, 114, 116, 118, which respectively have a conveyor direction denoted by an arrow. The plant 100 furthermore comprises a plurality of processing stations 200 spatially separated from one another, which are connected to one another by the substrate carrier conveyor apparatus 110 in order to convey the substrate carrier 100 respectively along the conveyor direction from one processing station 200 to the next processing station 200.

[0152] In this example, the processing station 200 arranged in the first conveyor section 112 is configured as a loading station 300 in order to place the flat substrate 1 onto the substrate carrier 10. The processing station 200 arranged in the second conveyor section 114 is configured as an operating station 500 in order to subject the substrate 1 located on the substrate carrier 10 to a processing step. The processing station 200 arranged in the third conveyor section 116 is configured as an unloading station 400 in order to take the processed substrate off. Via the conveyor section 118, the empty substrate carrier 10 returns to the loading station 300.

[0153] FIG. 2 likewise shows a plant 100 for the post-processing of glass substrates 1, in particular of UTG. The plant 100 comprises a processing station 200 configured as a loading station 300, wherein the loading station 300 may in particular also comprise an inspection device in order to inspect a flat substrate before it is received. In this example, the plant 100 optionally also comprises an airlock 600 into a white/clean room. The plant 100 furthermore comprises an operating station 500 configured as a pre-dividing station 501, in which the substrate is pre-divided along a dividing line by means of a laser. The plant 100 furthermore comprises an operating station 500 configured as a combined separating and waste station 504, in which the substrate is fractured along the dividing line, the useful material is separated from the waste material and the waste material is rejected. In addition, the plant 100 comprises a processing station 200 configured as an unloading station 400, wherein the latter may in particular also comprise an inspection device in order to inspect a processed flat substrate before it is received, and possibly to reject it. The plant 100 further comprises a processing station 200 configured as a substrate carrier cleaning station 450 in order to clean and/or prepare the substrate carrier 10, wherein an adjustment of surface forces optionally used for the adhesion may be carried out here too.

[0154] While during the production of UTG in the online process a horizontal acceleration or a transverse acceleration is difficult, it becomes possible in this case because of the substrate carrier. The post-processing operation may in particular be understood as a downstream offline process, so that a glass strip no longer needs to be paused in an upstream online process in order to carry out particular process steps, for example cutting. Division, in particular spatial division, of the process chain into raw glass production and post-processing may therefore be carried out. For example, an intermediate step of packaging and transport may be provided between shaping and trimming. Nevertheless, direct joining of the post-processing to the upstream process, for example the shaping, may be provided.

[0155] The raw glass production may for example comprise a batch mixture which is supplied to a melting process, followed by shaping, an online inspection for glass faults and/or a thickness measurement. This may result in a raw glass sheet (UTG) having borders, which sometimes does not yet have a final format. Transport may, for example, be carried out in a raw glass box or any other suitable transport system.

[0156] An offline post-processing line may be configured as a ring concept, or carousel, as stated, wherein the post-processing may preferably be carried out under white or clean room conditions and/or adjusted climatic conditions (T, p, humidity, etc.).

[0157] An exemplary plant may for example comprise one or more of the following aspects, in particular stations: [0158] i. inspection of raw glass substrates (fractures, cracks, etc.) [0159] ii. automated removal of the raw glass substrates (including optional rejection of dividing (spacer) material, for example sheets of paper) and calibrated placement of the raw glass substrates onto the substrate carrier [0160] iii. optionally: cleaning of the raw glass substrates (here or at point v.) [0161] iv. placement of raw glass substrates onto substrate carriers (one or more raw glass substrates) [0162] v. optionally: cleaning of the raw glass substrates (see above point iii.) [0163] vi. optionally: checking of the correct position of the raw glass substrates (adjustment of the laser cutting plant to the glass layer on the substrate carrier) [0164] vii. optionally: inspection and localization of glass faults in order to adapt the filamentation [0165] viii. (laser, wheel, diamond, water-jet, ultrasonic) cutting to the desired format (for example Gen2, Gen3, Gen5, but also wafer and freeform) [0166] ix. fracture or separation [0167] x. discarding of separators (including waste goods), borders [0168] xi. if appropriate, optionally cleaning of the glass substrates [0169] xii. inspection (sidewalls, fractures, format) [0170] xiii. removal of the glass substrates from the substrate carriers (manual and/or automated) [0171] xiv. packaging (final packaging) including insertion of dividing (spacer) material (pieces of paper) [0172] xv. cleaning of the substrate carriers [0173] xvi. supply of substrate carriers to step iv.

[0174] With an exemplary plant, a continuous or discontinuous method comprising one or more of the following steps may for example be carried out: [0175] 1) melting a batch mixture, [0176] 2) refining the glass melt, [0177] 3) homogenizing the glass melt, [0178] 4) shaping an endless glass strip by means of down-draw or overflow down-draw methods, [0179] 5) cooling the glass strip, [0180] 6) examining the glass strip for glass faults, [0181] 7) trimming the glass strip into individual glass panels, [0182] 8) depositing the glass panels in suitable transport or storage packaging, [0183] 9) airlocking the glass panels into the post-processing line, [0184] 10) inspecting the glass panel for glass faults and/or cracks, [0185] 11) transferring the glass panels onto a suitable substrate carrier, [0186] 12) introducing the glass panel on the substrate carrier into a cutting plant, [0187] 13) generating premade break points in the glass panel, [0188] 14) fracturing the glass panel at the premade break point, [0189] 15) separating a useful face of a substrate from a waste face of a substrate, [0190] 16) optionally cleaning the net material, inspecting the net material, [0191] 17) removing the net material from the substrate carrier, [0192] 18) packaging the net material in suitable transport packaging, [0193] 19) cleaning the substrate carrier and supplying it to the transfer station (11), [0194] 20) airlocking the packaged net material out of the post-processing line.

[0195] Advantages of the invention are, in particular, a flexible adaptation of the format to be trimmed without downtimes in the melt operation (in the hot manufacturing), added value of the product, by delivering an end product to the customer, in particular by trimming to customer format, high flexibility in relation to the cycle time of the hot forming and offline post-processing, short changeover times in melt operation, in particular when identical raw glass can be produced there continuously (high degree of optimization). For the melt operation, this offers an independence from the final product format, less area requirement in the hot manufacturing, in particular by reducing the cold end. The division of the process chain into online/offline processing may furthermore ensure a higher overall equipment effectiveness (OEE) and minimization of downtime and/or allow clean or white room conditions during the post-processing. It further allows higher precision of the trimming and optionally an additional quality control before the packaging and conveyor, simplification of upscaling, for example by the parallel operation of a plurality of post-processing lines. In addition, the production in melt operation may be optimized to the extent that a melting tank does not have to be utilized all year round for one type of glass and/or one glass thickness, and may therefore be used for the production of other types of glass and formats. Finally, the invention allows the selection of the substrate area in a glass substrate before the actual trimming, which can lead to less waste in hot manufacturing.

[0196] In a plant according to the invention, a cycle time of less than 20 seconds, preferably less than 15 seconds, particularly preferably less than 10 seconds, per substrate may be provided. This makes it possible, for example, for a plurality of plants to be supplied by one upstream production line (hot manufacturing plant/melting tank) in order to generate maximal OEE and cycle rates. For small formats, an even shorter cycle time may sometimes be provided. The invention is preferably suitable for the processing of ultra-thin glass, thin glass, flat glass, wafers, films or other thin substrates.