Copper alloy assembly and production method therefor

Abstract

A copper alloy bonded body composed of a plurality of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another. The copper alloy bonded body has undergone solution annealing and an aging treatment, the content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less, and (i) a bonding interface between the members has disappeared and/or (ii) a bonding interface between the members remains, and an oxide film at the bonding interface has a thickness of 0 nm or more and 5.0 nm or less.

Claims

1. A copper alloy bonded body composed of a plurality of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another, wherein the copper alloy bonded body has undergone solution annealing including heating at a temperature of 700 to 1100 C. for 1 to 180 minutes and an aging treatment at 350 to 550 C. for 30 to 480 minutes, wherein a content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less, and wherein: (i) a bonding interface between the members has disappeared and/or (ii) a bonding interface between the members remains, and an oxide film at the bonding interface has a thickness of 0 nm or more and 5.0 nm or less.

2. The copper alloy bonded body according to claim 1, comprising crystal grains of the age-hardenable copper alloy grown beyond the bonding interface or a position where the bonding interface was present.

3. The copper alloy bonded body according to claim 1, wherein the oxide film has a thickness of 0 nm or more and 1.0 nm or less.

4. The copper alloy bonded body according to claim 1, wherein a residual component derived from a material other than the age-hardenable copper alloy is absent at the bonding interface or a position where the bonding interface was present.

5. The copper alloy bonded body according to claim 1, wherein a base material and a bonding part of the copper alloy bonded body have a strength of 520 MPa or higher.

6. The copper alloy bonded body according to claim 5, wherein the base material and the bonding part of the copper alloy bonded body have a strength of 690 MPa or higher.

7. The copper alloy bonded body according to claim 1, wherein a base material including a bonding part of the copper alloy bonded body has a thermal conductivity of 209 W/mK or more.

8. The copper alloy bonded body according to claim 1, wherein a base material including a bonding part of the copper alloy bonded body has an electrical conductivity of 50 IACS % or more.

9. The copper alloy bonded body according to claim 1, wherein the age-hardenable copper alloy is at least one selected from the group consisting of beryllium copper alloy 11 (JIS alloy number C1751, EN material number CW110C, and UNS alloy number C17510), beryllium copper alloy 10 (EN material number CW104C and UNS alloy number C17500), beryllium copper CuCo1Ni1Be (EN material number CW103C), beryllium copper alloy 14Z (composed of Be: 0.2 to 0.6% by weight, Ni: 1.4 to 2.4% by weight, Zr: 0 to 0.5% by weight, and the balance being Cu and inevitable impurities), beryllium copper alloy 50 (composed of Be: 0.2 to 0.6% by weight, Ni: 1.4 to 2.1% by weight, Ag: 0.1 to 0.3% by weight, Zr: 0 to 0.5% by weight, and the balance being Cu and inevitable impurities), beryllium copper alloy 10Zr (composed of Be: 0.4 to 0.7% by weight, Co: 2.0 to 2.8% by weight, Zr: 0 to 0.3% by weight, and the balance being Cu and inevitable impurities), chromium copper (UNS alloy number C18200), chromium zirconium copper (UNS alloy number C18510 and EN material number CW106C), zirconium copper (UNS alloy number C15000, EN material number CW120C), and Corson copper (EN material number CW109C, CW111C, UNS alloy number C19010, C70250, AMPCO944 (composed of Ni: 6.5 to 7.5% by weight, Si: 1.5 to 2.5% by weight, Cr: 0.5 to 1.5% by weight, and the balance being Cu and inevitable impurities), and AMPCO940 (composed of Ni: 1.5 to 3.0% by weight, Si: 0.5 to 1.5% by weight, Cr: 0.3 to 1.5% by weight, and the balance being Cu and inevitable impurities)).

10. The copper alloy bonded body according to claim 9, wherein the age-hardenable alloy is at least one selected from the group consisting of beryllium copper alloy 11 (JIS alloy number C1751, EN material number CW110C, and UNS alloy number C17510), beryllium copper alloy 10 (EN material number CW104C and UNS alloy number C17500), beryllium copper CuCo1Ni1Be (EN material number CW103C), beryllium copper alloy 14Z (composed of Be: 0.2 to 0.6% by weight, Ni: 1.4 to 2.4% by weight, Zr: 0 to 0.5% by weight, and the balance being Cu and inevitable impurities), beryllium copper alloy 50 (composed of Be: 0.2 to 0.6% by weight, Ni: 1.4 to 2.1% by weight, Ag: 0.1 to 0.3% by weight, Zr: 0 to 0.5% by weight, and the balance being Cu and inevitable impurities), and beryllium copper alloy 10Zr (composed of Be: 0.4 to 0.7% by weight, Co: 2.0 to 2.8% by weight, Zr: 0 to 0.3% by weight, and the balance being Cu and inevitable impurities).

11. The copper alloy bonded body according to claim 1, prepared using a copper alloy member having an RRA (Relative Reduction of Area) of 0.8 or more in a hydrogen gas, measured in a slow strain rate tensile test performed at a strain rate of 510.sup.5 s.sup.1 or less.

12. The copper alloy bonded body according to claim 1, wherein the copper alloy bonded body including a bonding part has a tensile strength of 520 MPa or higher in a hydrogen gas, measured in a slow strain rate tensile test performed at a strain rate of 510.sup.5 s.sup.1 or less.

13. The copper alloy bonded body according to claim 12, wherein the copper alloy bonded body including a bonding part has a tensile strength of 690 MPa or higher in a hydrogen gas, measured in a slow strain rate tensile test performed at a strain rate of 510.sup.5 s.sup.1 or less.

14. The copper alloy bonded body according to claim 1, wherein the copper alloy bonded body comprises a flow passage space inside.

15. A method for producing the copper alloy bonded body according to claim 1, comprising: providing a plurality of members made of an age-hardenable copper alloy, wherein each surface to be bonded is a flat surface having a flatness of 0.1 mm or less and a ten-point average roughness Rzjis of 6.3 m or less, and wherein the content of beryllium is 0.7% by weight or less; removing an oxide film present at each surface to be bonded of a plurality of the members; subjecting a plurality of the members to diffusion bonding by hot pressing to provide an intermediate bonded body; subjecting the intermediate bonded body to solution annealing including heating at a temperature of 700 to 1100 C. for 1 to 180 minutes and subsequent water cooling; and subjecting the solution-annealed intermediate bonded body to an aging treatment at 350 to 550 C. for 30 to 480 minutes.

16. The method according to claim 15, wherein removing the oxide film is performed by washing each surface to be bonded of a plurality of the members with an inorganic acid solution.

17. The method according to claim 15, wherein the hot pressing is performed by applying a pressure of 1.0 MPa or higher at a temperature of 500 to 1050 C. for 30 to 480 minutes in a furnace wherein a degree of vacuum is higher than 1.010.sup.2 Torr (that is, pressure is lower than 1.010.sup.2 Torr).

18. The method according to claim 15, wherein when the age-hardenable copper alloy is free of Be, the hot pressing is performed by applying a pressure of 1.0 MPa or higher at a temperature of 500 to 1050 C. for 30 to 480 minutes in a furnace wherein a degree of vacuum is higher than 1.010.sup.1 Torr (that is, pressure is lower than 1.010.sup.1 Torr).

19. The method according to claim 15, wherein the method further comprises, prior to the solution annealing, subjecting the intermediate bonded body to a homogenization treatment at a temperature of 900 to 1050 C. for 60 to 480 minutes in a furnace wherein a degree of vacuum is higher than 1.010.sup.1 Torr (that is, pressure is lower than 1.010.sup.1 Torr) or in a furnace under an atmosphere of nitrogen or another non-oxidizing gas.

20. The method according to claim 19, wherein the hot pressing and the homogenization treatment are continuously performed by releasing a pressing load without decreasing the temperature in the furnace; and increasing the temperature.

21. The method according to claim 15, wherein the method further comprises, prior to removing the oxide film, forming a groove that provides a flow passage space after bonding to each surface to be bonded of a plurality of the members.

22. The method according to claim 21, wherein the hot pressing is performed in a furnace wherein a degree of vacuum is higher than 1.010.sup.2 Torr (that is, pressure is lower than 1.010.sup.2 Torr) by: (i) applying a pressure of 1 MPa or higher and 4 MPa or lower at a temperature of higher than 840 C. and 930 C. or lower for 30 to 480 minutes, (ii) applying a pressure of 2 MPa or higher and 8 MPa or lower at a temperature of higher than 720 C. and 840 C. or lower for 30 to 480 minutes, or (iii) applying a pressure of 4 MPa or higher and 30 MPa or lower at a temperature of 600 C. or higher and 720 C. or lower for 30 to 480 minutes, and wherein the method further comprises, prior to the solution annealing, subjecting the intermediate bonded body to a homogenization treatment at a temperature of 900 to 1050 C. for 60 to 480 minutes in a furnace wherein a degree of vacuum is higher than 1.010.sup.1 Torr (that is, pressure is lower than 1.010.sup.1 Torr) or in a furnace under an atmosphere of nitrogen or another non-oxidizing gas.

23. The method according to claim 22, wherein the hot pressing and the homogenization treatment are continuously performed by releasing a pressing load without decreasing the temperature in the furnace; and increasing the temperature.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1A is a diagram for describing procedures of an experiment of performing elemental analysis of oxide films formed on surfaces of copper alloys in a thermal treatment in a high-vacuum furnace, and conceptually shows progress of oxidation, and shows positions of an in-furnace open surface and a close contact surface where the elemental analysis is performed, and appearances of samples.

(2) FIG. 1B shows results of the elemental analysis of the oxide films formed on the surfaces (acid-washed surface, in-furnace open surface and/or close contact surface) of the copper alloys when the thermal treatment was performed in the high-vacuum furnace according to the procedures of the experiment shown in FIG. 1A. Specifically, FIG. 1B shows results of XPS for beryllium copper alloy 25, beryllium copper alloy 165, beryllium copper alloy 11, beryllium copper alloy 10Zr, beryllium copper alloy 50, and chromium copper alloy.

(3) FIG. 1C shows results of the elemental analysis of the oxide films formed on the surfaces (acid-washed surface, in-furnace open surface and/or close contact surface) of the copper alloys when the thermal treatment was performed in the high-vacuum furnace according to the procedures of the experiment shown in FIG. 1A. Specifically, FIG. 1C shows results of XPS for Corson copper AMPCO940 and Corson copper AMPCO944.

(4) FIG. 2 shows optical microscope images taken at 200 magnifications, 500 magnifications, and 1000 magnifications, obtained by observing each section including a bonding part of copper alloy bonded bodies of Examples 2, 30, 33, 43, and 46 prepared through solution annealing and an aging treatment.

(5) FIG. 3 shows optical microscope images taken at 200 magnifications, 500 magnifications, and 1000 magnifications, obtained by observing each section including a bonding part of copper alloy bonded bodies of Examples 26, 27, and 28 prepared through solution annealing and an aging treatment.

(6) FIG. 4 shows optical microscope images taken at 200 magnifications, 500 magnifications, and 1000 magnifications, obtained by observing each section including a bonding part of copper alloy bonded bodies of Examples 47 and 53 prepared through solution annealing and an aging treatment.

(7) FIG. 5 shows STEM images and EELS/EDX element mapping images of a section including a bonding surface of a copper alloy bonded body (CuBe11) of Example 2 as diffusion-bonded (not through solution annealing and an aging treatment).

(8) FIG. 6A shows STEM images and EELS/EDX element mapping images of a section including a bonding surface of a copper alloy bonded body (CuBe25) of Example 43 (comparison) as diffusion-bonded (not through solution annealing and an aging treatment).

(9) FIG. 6B is a STEM image (HAADF image) of the section including the bonding surface of the copper alloy bonded body (CuBe25) shown in FIG. 6A.

(10) FIG. 6C shows STEM images and EELS/EDX element mapping images of the section including the bonding surface of the copper alloy bonded body (CuBe25) shown in FIG. 6A.

(11) FIG. 7 shows STEM images and EELS/EDX element mapping images of a section including a bonding surface of a copper alloy bonded body (Corson copper AMPCO940) of Example 47 on which solution annealing and an aging treatment was performed after diffusion bonding.

(12) FIG. 8 shows STEM images and EELS/EDX element mapping images of a section including a bonding surface of a copper alloy bonded body (Corson copper AMPCO944) of Example 53 on which solution annealing and an aging treatment was performed after diffusion bonding.

(13) FIG. 9A is a stress-stroke diagram in a slow strain rate tensile test (SSRT) performed in air or a hydrogen gas on a copper alloy bonded body (CuBe11) of Example 2 prepared through solution annealing and an aging treatment.

(14) FIG. 9B is a stress-stroke diagram in a slow strain rate tensile test (SSRT) performed in air or a hydrogen gas on copper alloy bonded bodies (CuBe11) of Examples 17 and 18 prepared through solution annealing and an aging treatment.

(15) FIG. 9C is a stress-stroke diagram in a slow strain rate tensile test (SSRT) performed in air or a hydrogen gas on a solution-annealed and aging-treated beryllium copper alloy 11 or beryllium copper alloy 25 used as a bonding material.

(16) FIG. 9D is a stress-stroke diagram in a slow strain rate tensile test (SSRT) performed in air or a hydrogen gas on solution-annealed and aging-treated Corson copper AMPCO940 used as a bonding material.

(17) FIG. 9E is a stress-stroke diagram in a slow strain rate tensile test (SSRT) performed in air or a hydrogen gas on solution-annealed and aging-treated Corson copper AMPCO944 used as a bonding material.

(18) FIG. 10A is a SEM image obtained by observing a broken surface after a slow strain rate tensile test (SSRT) in air for a copper alloy bonded body (CuBe11) of Example 17 prepared through solution annealing and an aging treatment.

(19) FIG. 10B is an enlarged SEM image obtained by observing a particular position of the broken surface shown in FIG. 10A.

(20) FIG. 11 shows optical microscope images obtained by observing a section including a bonding part of a bonded body sample of Example 62 including flow passage spaces, the sample prepared through a homogenization treatment at 980 C.

DETAILED DESCRIPTION OF THE INVENTION

(21) Copper Alloy Bonded Body

(22) A copper alloy bonded body of the present invention is composed of a plurality of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another, wherein the copper alloy bonded body has undergone solution annealing and an aging treatment. The content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less. In this copper alloy bonded body, (i) a bonding interface between the members has disappeared and/or (ii) a bonding interface between the members remains, and an oxide film at the bonding interface has a thickness of 0 nm or more and 5.0 nm or less. In this way, in the case of selectively adopting the age-hardenable copper alloy of which the beryllium content is 0.7% by weight or less and performing the solution annealing and the aging treatment (after performing a homogenization treatment as necessary) in such a way as to allow the bonding interface to disappear (or otherwise to make the thickness of the oxide film at the bonding interface 5.0 nm or less), it is possible to provide a copper alloy bonded body having an extremely high bonding strength.

(23) As described above, when diffusion bonding is performed, in a similar step, on the copper alloy wherein (i) the copper alloy has a strong oxide film that is not easily removed by simple pressure reduction and temperature increase and/or (ii) an oxide film is also likely to be formed again under high vacuum, a certain bonding strength is secured, but it has been difficult to obtain a texture and strength equal to those of a base material. Particularly, to realize a copper alloy member having an extremely high strength required in uses of the above-described heat exchanger, solution annealing and an aging treatment need to be performed on an age-hardenable copper alloy, but there has been a problem that a diffusion-bonded body of an age-hardenable copper alloy cannot withstand severe thermal shock or dimensional fluctuation accompanying the solution annealing and the aging treatment and is broken at a bonding part.

(24) In this regard, according to the constitution of the present invention, such problems are conveniently solved and a copper alloy bonded body having an extremely high bonding strength can be provided. The reason is as follows, as made clear in confirmation tests conducted by the present inventors, which will be described later. That is, the age-hardenable copper alloy in which the content of beryllium is 0.7% by weight or less is selectively adopted, the flatness and surface roughness of each bonding surface are adjusted in such a way as to be suitable for diffusion bonding and an oxide film at the bonding surface is then removed, bonding interfaces of copper alloy members are brought into contact with each other, and the pressure is applied and the temperature is increased to perform diffusion bonding. In this case, an oxide film at the bonding surface, which is formed in an age-hardenable copper alloy in which the content of beryllium is more than 0.7% by weight, is not formed or formed only extremely slightly, and therefore high-quality diffusion bonding that is sufficiently bearable to solution annealing and an aging treatment is realized.

(25) It is known that stainless steel, pure copper, and the like can be bonded with high reliability by diffusion bonding. Stainless steel has strong weatherability because a dense chromium oxide film as the surface layer formed under the air serves as a protecting film, but this oxide film is sublimated when heated at a temperature higher than 700 C. under high vacuum. Therefore, the oxide film is naturally removed during temperature increase in diffusion bonding and a surface of active stainless steel whose surface layer is free from an oxide film is easily obtained, so that favorable bonding such that an oxide and another foreign material do not remain at the bonding interface can be performed only by pressurization at a bonding temperature. In addition, pure copper has a copper oxide (CuO) film as the surface layer, but the oxide decomposes and oxygen diffuses into the copper matrix during the time when the temperature is kept at a diffusion bonding temperature, and therefore favorable bonding such that an oxide and another foreign material do not remain at the bonding interface can be performed on pure copper as well as stainless steel.

(26) The present inventors have confirmed in the tests prior to the completion of the present invention that when conventionally known diffusion bonding is performed on an age-hardenable copper alloy, a certain bonding strength is obtained, but when solution annealing and aging treatment are performed on a resultant bonded body, the bonding strength is deteriorated and the bonded body is broken in many cases. This phenomenon is remarkable for beryllium copper alloy 25 (JIS C1720), which is known as providing the highest strength among age-hardenable copper alloys. The present inventors have inferred that the cause of this is an oxide film which is not recognized in stainless steel and pure copper and which remains at a bonding surface, and have conducted the following experiment as shown in FIG. 1A in order to clarify the mechanism that allows the oxide film to remain. Each alloy shown in FIGS. 1B and 1C is processed into a plate shape whose size is 15 mm15 mm5 mm, the top and bottom surfaces having a size of 15 mm15 mm of a resultant specimen 10 are then lapped and flattened to make the flatness 0.1 mm or less and make the surface roughness Rzjis 0.8 m or less, and the specimen is then washed with 30% nitric acid to remove an oxide film immediately before the test is conducted. Three specimens 10 are prepared for each alloy. As shown in FIG. 1A, one of the specimens 10 is placed in a furnace for bonding in a condition of being in contact with a vacuum atmosphere in the furnace, and the other two specimens 10 are stacked and placed in the furnace for bonding in a condition of being in a close contact with each other (like the bonding surfaces in diffusion bonding). After a thermal treatment which is the same as that during diffusion bonding is performed in the furnace for bonding under various reduced pressure conditions, the specimens were taken out, and elemental analysis is performed for each oxide film 12 as the surface layer with an X-ray photoelectron spectrometer (XPS, product name: Quantera SXM, manufactured by ULVAC-PHI, Inc.) while a surface which was in contact with the in-furnace atmosphere (hereinafter, referred to as in-furnace open surface) is etched with argon for the former and each surface where the samples were in close contact with each other (hereinafter, referred to as close contact surface) is etched with argon for the latter.

(27) FIGS. 1B and 1C show the measurement results for the oxide films of each alloy after the acid washing, after the thermal treatment of the in-furnace open surface, and/or after the thermal treatment of the close contact surfaces. These results show that the oxide films are completely removed by the acid washing in the tests for all the alloys and that a very thick oxide film is formed on each in-furnace open surface even under a high vacuum of 510.sup.5 Torr. With regard to the degree of oxide film formation on the close contact surface, which is an issue in bonding, the following have been confirmed: i) when the alloys in which the content of beryllium is 0.7% by weight or less (beryllium copper alloy 11, beryllium copper alloy 50, beryllium copper alloy 10Zr, chromium copper alloy, Corson copper AMPCO940, and Corson copper AMPCO944) are treated at a bonding temperature under a high vacuum of 510.sup.5 Torr (the degree of vacuum that is achieved during continuous exhaust with a diffusion pump), an oxide film is not formed or is formed only very slightly, ii) even for the alloys in which the content of beryllium is 0.7% by weight or less, an oxide film can be formed at a degree of vacuum of about 110.sup.1 Torr due to oxygen which penetrates into the close contact surface, and iii) even when the alloys in which the content of beryllium is more than 0.7% by weight (beryllium copper alloy 25 and beryllium copper alloy 165) are treated under a high vacuum of 510.sup.5 Torr, an oxide film is formed due to oxygen which penetrates into the close contact surface. The above results show that beryllium has extremely high affinity to oxygen and therefore when the concentration of beryllium is a certain level or higher, it is difficult to suppress the oxide film formation due to oxygen which penetrates between close contact surfaces even if the degree of close contact between members is increased under a high degree of vacuum, so that the content of beryllium has to be taken into consideration in selecting materials in order not to allow the oxide film to remain at the bonding surface.

(28) The age-hardenable copper alloy which is used for the copper alloy bonded body of the present invention is not particularly limited as long as the content of beryllium is 0.7% by weight or less. A bonded body using a beryllium copper alloy in which the content of Be is high, as high as more than 0.7% by weight, (for example, beryllium copper alloy 25 (JIS alloy number C1720)) cannot withstand solution annealing and an aging treatment because an oxide film at a bonding surface remains remarkably, and therefore is broken at the bonding surface after the solution annealing and the aging treatment. However, by performing diffusion bonding using selectively an age-hardenable copper alloy in which the content of Be is low, as low as 0.7% by weight or less, a copper alloy bonded body that withstands solution annealing and an aging treatment and has an extremely high bonding strength can be realized. Examples of the age-hardenable copper alloy include beryllium copper alloy 11 (JIS alloy number C1751, EN material number CW110C, and UNS alloy number C17510), beryllium copper alloy 10 (EN material number CW104C and UNS alloy number C17500), beryllium copper CuCo1Ni1Be (EN material number CW103C), beryllium copper alloy 14Z, beryllium copper alloy 50, beryllium copper alloy 10Zr, chromium copper (UNS alloy number C18200), chromium zirconium copper (UNS alloy number C18510 and EN material number CW106C), zirconium copper (UNS alloy number C15000, EN material number CW120C), and Corson copper (EN material number CW109C, CW111C, UNS alloy number C19010, C70250, AMPCO944, and AMPCO940), and the age-hardenable copper alloy is more preferably beryllium copper alloy 11, beryllium copper alloy 10, beryllium copper CuCo1Ni1Be, beryllium copper alloy 14Z, beryllium copper alloy 50, or beryllium copper alloy 10Zr, most preferably beryllium copper alloy 11. These preferred age-hardenable copper alloys can realize an extremely high bonding strength after solution aging, and is superior in a hydrogen-embrittlement-resistant property and a thermal conductive property as well, and is particularly advantageous as a material for a heat exchanger of a pre-cooler for a hydrogen station. The compositions of the above-described various copper alloys are shown in Table 1 below.

Table 1

(29) TABLE-US-00001 TABLE 1 JIS Alloy UNS Alloy EN Material Essential elements Optional elements number number number (% by weight) (% by weight) Balance Beryllium copper alloy 11 C1751 C17510 CW110C Be:0.20~0.60, Ni:1.40~2.20 Co:0~0.3, Fe:0~0.2 Cu and Beryllium copper alloy 10 C17500 CW104C Be:0.40~0.70, Co:2.00~2.80 Co:0~0.3, Fe:0~0.2 Inevitable Beryllium copper CW103C Be:0.4~0.7, Ni:0.8~1.3, Co:0.8~1.3, impurities CuCo1Ni1Be Fe:0~0.2 Beryllium copper alloy 14Z Be:0.20~0.60, Ni: 1.40~2.40 Zr:0~0.5 Beryllium copper alloy 50 Be:0.20~0.60, Ni: 1.40~2.10, Ag:0.1~0.3 Zr:0~0.5 Beryllium copper alloy 10Zr Be:0.40~0.70, Co:2.00~2.80 Zr:0~0.3 Chromium copper C18200 Cr:0.7~1.4 Chromium zirconium copper C18510 CW106C Cr:0.5~1.2, Zr:0.03~0.3 Si:0~0.1, Fe:0~0.08 Zirconium copper C15000 CW120C Zr:0.1~0.2 Corson copper CuNi1Si CW109C Ni:1.0~1.6, Si:0.4~0.7 Fe:0~0.2, Mn:0~0.1, Pb:0~0.02 Corson copper CuNi2Si CW111C Ni:1.6~2.5, Si:0.4~0.8 Fe:0~0.2, Mn:0~0.1, Pb:0~0.02 Corson copper C1901 C19010 Ni:1.5~3.0, Si:0.5~1.5, Cr:0.1~1.5 Sn:0.1-0.3 Corson copper C7025 C70250 Ni:2.2~4.2, Si:0.25~1.2, Mg:0.05~0.3 Fe:0-0.2, Zn:0-1.0, Pb:0~0.05 Corson copper AMPCO944 Ni:6.5~7.5, Si: 1.5~2.5, Cr:0.5~1.5 Corson copper AMPCO940 Ni:1.5~3.0, Si:0.5~1.5, Cr:0.3~1.5 Sn:0~0.3 Note) In alloy standards of JIS, UNS, and EN, there are slight differences in upper and lower limit values of respective component standards and in specifications for optional elements, but control values for commercially produced alloys are substantially the same.

(30) As described above, the copper alloy bonded body of the present invention, on which the solution annealing and the aging treatment have been performed, satisfies any one or both of the following conditions: (i) a bonding interface between the members has disappeared, and (ii) a bonding interface between the members remains, and an oxide film at the bonding interface has a thickness of 0 nm or more and 5.0 nm or less, and contributes to the realization of a high bonding strength. Whether the bonding interface has disappeared or remains is decided by observing a section including a bonding part of the copper alloy bonded body with an optical microscope at 200 to 1000 magnifications (see, for example, FIGS. 2 and 3). Whether the bonding interface has disappeared or remains should be decided according to whether the trace of the bonding surfaces of the copper alloy members before being bonded remains or not, and when a grain boundary derived from the bonding surfaces has moved due to grain growth beyond a bonding interface, the bonding interface is not decided as remaining. As a result, when a bonding interface of a plurality of members remains, the thickness of an oxide film at the bonding interface may be measured to decide whether or not the thickness of the oxide film is 0 nm or more and 5.0 nm or less. With regard to the thickness of the oxide film at the bonding interface, a section including the bonding interface is observed with a scanning transmission electron microscope (STEM) to acquire element mapping images at the section by electron energy loss spectroscopy (EELS)/energy dispersive X-ray analysis (EDX), the STEM image and the EELS/EDX element mapping images are compared, and thereby the oxide film can be specified and the thickness of the oxide film can be determined. Note that the oxide film present at the bonding interface is not always a layered film but a film of grains (that is, oxide grains) in some cases, and when the oxide film is a film of grains, the thickness of the oxide film includes the height of the oxide grains. In any case, whether the bonding interface is present or not can be confirmed with an optical microscope, and therefore the confirmation can be performed relatively simply and inexpensively, but on the other hand, STEM-EELS/EDX is an analysis method that is time-consuming and expensive. Accordingly, when whether the conditions (i) and/or (ii) are satisfied or not is decided, it is preferable to adopt the following scheme: 1) whether the condition (i) is satisfied or not is checked with an optical microscope (when the condition (i) is satisfied, checking the oxide film is unnecessary), 2) when the condition (i) is not satisfied, the thickness of the oxide film at the bonding interface is measured by STEM-EELS/EDX.

(31) The oxide film that can be present at the bonding interface of the copper alloy bonded body of the present invention preferably has a thickness of 0 nm or more and 5.0 nm or less, preferably 0 nm or more and 4.0 nm or less, more preferably 0 nm or more and 3.0 nm or less, still more preferably 0 nm or more and 2.0 nm or less, particularly preferably 0 nm or more and 1.5 nm or less, most preferably 0 nm or more and 1.0 nm or less. Such a thin oxide film provides a copper alloy bonded body that withstands the solution annealing and aging treatment and has an extremely high bonding strength after the aging treatment in the case where the bonding interface remains as well as the case where the bonding interface has disappeared.

(32) The copper alloy bonded body of the present invention can contain crystal grains of the age-hardenable copper alloy grown beyond the bonding interface or the position (former bonding interface) where the bonding interface was present. That is, the copper alloy bonded body of the present invention has, at the bonding interface or the former bonding interface, a structure formed in such a way that crystal grains which were present at the bonding surface of the copper alloy members before being bonded have recombined and recrystallized after bonding, and a phenomenon such that the bonding interface has changed from what it initially was at the time of bonding can be observed. The copper alloy bonded body, when having such a fine bonding structure, is more superior in bonding strength.

(33) In the copper alloy bonded body of the present invention, a residual component derived from a material other than the age-hardenable copper alloy is preferably absent at the bonding interface or the position (former bonding interface) where the bonding interface was present from the viewpoint of securing a high bonding strength equal to the strength of the base material and a hydrogen-resistant property equal to that of the base material. Accordingly, the copper alloy bonded body of the present invention is desirably free from a bonding agent, such as a brazing filler metal, at the bonding interface. That is, the copper alloy bonded body of the present invention preferably consists of the age-hardenable copper alloy.

(34) The base material and the bonding part of the copper alloy bonded body after the solution annealing and aging treatment preferably have a strength of 520 MPa or higher, more preferably 690 MPa or higher. The copper alloy bonded body having such a strength sufficiently satisfies criteria required in high-strength applications including uses of the copper alloy bonded body as a heat exchanger of a pre-cooler for a hydrogen station. The strength is desired to be high, and therefore the upper limit value of the strength should not be specified, but the base material and the bonding part of the copper alloy bonded body of the present invention, in which the content of beryllium is 0.7% by weight or less, after the solution annealing and aging treatment typically have a strength of 895 MPa or lower. The strength of the base material and the bonding part of the copper alloy bonded body before and after the solution annealing and aging treatment can be measured by preparing a specimen in accordance with ASTM E8M Specimen 3 in such a way that the bonding part is at the central position of the specimen and performing a tensile test following the procedures in accordance with ASTM E8M on the specimen.

(35) The thermal conductivity of the base material including the bonding part of the copper alloy bonded body is desired to be high. Thermal conductance as well as electrical conductance is energy transfer based on conduction electrons, therefore there is a correlation between the two called the Wiedemann-Franz law, and the thermal conductivity and the electrical conductivity that is more simply measurable can be mutually converted. The base material including the bonding part of the copper alloy bonded body preferably has a thermal conductivity (and a converted electrical conductivity) of 209 W/mK or more (50 IACS % or more in terms of electrical conductivity), more preferably 228 W/mK or more (55 IACS % or more in terms of electrical conductivity), still more preferably 246 W/mK or more (60 IACS % or more in terms of electrical conductivity). Such a high thermal conductivity is advantageous when the copper alloy bonded body is used for a heat exchanger in that the heat exchange efficiency is extremely high (for example, a SUS316L Ni equivalent product which is superior in a property to hydrogen and therefore currently used for a heat exchanger of a pre-cooler has a very low thermal conductivity, as low as 16 W/mK, and the poor heat exchange efficiency is an operational drawback.). The thermal conductivity is desired to be high, and therefore the upper limit value of the thermal conductivity should not be specified, but the base material that includes the bonding part of the copper alloy bonded body of the present invention, in which the content of beryllium is 0.7% by weight or less, and that can secure a strength of 520 MPa or higher for the base material and the bonding part typically has a thermal conductivity of 280 W/mK or less.

(36) The copper alloy bonded body including the bonding part preferably has a tensile strength of 520 MPa or higher, more preferably 690 MPa or higher, in a hydrogen gas in a slow strain rate tensile (SSRT: Slow Strain Rate Tensile) test performed at a strain rate in a range of 510.sup.5 s.sup.1 or less (for example, 510.sup.5 s.sup.1). This copper alloy bonded body including the bonding part is superior in the hydrogen-embrittlement-resistant property and has a high tensile strength. This slow strain rate tensile test is performed in accordance with ASTM-G-142. The slow strain rate tensile test may be performed using, for example, a standard-size specimen (smooth specimen). Generally, with a smooth specimen, the sensitivity to hydrogen is evaluated by relative tensile strength RTS or relative reduction of area RRA obtained by dividing tensile strength or reduction of area in a hydrogen gas by tensile strength or reduction of area in a reference gas which is free from an influence of hydrogen. In the slow strain rate tensile test for a smooth specimen, measurement may be performed at a strain rate of, for example, 510.sup.5 s.sup.1. This slow strain rate tensile test is performed at a hydrogen gas pressure of 95 MPa or higher assuming a 70 MPa-class FCV (fuel cell vehicle) or hydrogen station. When the hydrogen gas pressure is higher, the amount of hydrogen which penetrates into a material increases more, and therefore the specimen is more likely to be susceptible to an influence due to hydrogen exposure and the hydrogen brittleness can be evaluated more properly. In the tests regarding the present application, the property to hydrogen has been evaluated using standard-size specimens (smooth specimens) by the relative tensile strength RTS or the relative reduction of area RRA.

(37) As for the copper alloy bonded body including a bonding part, when the tensile strength is 520 MPa or higher, desirably 690 MPa or higher, in the slow strain rate tensile test, the relative reduction of area RRA is preferably 0.8 or more, more preferably 0.9 or more. In addition, the relative tensile strength RTS is preferably 0.8 or more, more preferably 0.9 or more. That the value of the tensile strength of the copper alloy bonded body including a bonding part is within the above-described range at normal temperature under the air or a hydrogen gas pressure of 95 MPa or higher and the RRA and RTS of the copper alloy bonded body including a bonding part also satisfy the values within the above-described ranges means that this copper alloy bonded body has a high strength and is superior in the hydrogen-embrittlement-resistant property, and therefore is particularly suitable for uses thereof as a heat exchanger of a pre-cooler for a hydrogen station. The tensile strength is desired to be high, and therefore the upper limit value of the tensile strength should not be specified, but the copper alloy bonded body of the present invention, in which the content of beryllium is 0.7% by weight or less, typically have a tensile strength of 895 MPa or lower at normal temperature under the air or a hydrogen gas pressure of 95 MPa or higher in the slow strain rate tensile test.

(38) The copper alloy bonded body may include a flow passage space inside as one embodiment. In this case, the flow passage space can be utilized as an internal space for allowing a medium, such as hydrogen or a refrigerant, to pass. Accordingly, the copper alloy bonded body including a flow passage space can preferably be used for uses thereof as a heat exchanger of a pre-cooler for a hydrogen station, which is desired to include a plurality of flow passage spaces for allowing hydrogen and a refrigerant to pass respectively.

(39) Production Method

(40) The copper alloy bonded body of the present invention can be produced by sequentially performing smoothening (arbitrary step) of bonding surfaces as necessary, removing an oxide film, bonding by hot pressing (diffusion bonding), a homogenization treatment (arbitrary step) as necessary, solution annealing, and an aging treatment on a plurality of members made of an age-hardenable copper alloy. Specifically, the production method is as follows.

(41) (a) Providing Copper Alloy Members

(42) First of all, a plurality of members made of an age-hardenable copper alloy to be used for bonding is provided. As this age-hardenable copper alloy, an age-hardenable copper alloy that is as described above, wherein the content of beryllium is 0.7% by weight or less, can be used. As the uppermost surface material and lowermost surface materials of a stacked-and-bonded body to be produced as a heat exchanger, a rolled material or a forged material is preferably used, and as a plurality of laminating materials which are other than the uppermost surface material and lowermost surface materials and which have or do not have a cooling water passage inside, a rolled material is preferably used.

(43) A copper alloy material which does not cause deterioration in properties due to hydrogen is preferably used for the copper alloy bonded body of the present invention. With regard to copper alloy materials, it has been known that the deterioration in properties to hydrogen is remarkable in, for example, cupronickel (Cu10% to 30%) in which the concentration of Ni is 20% or more and that the deterioration in properties to hydrogen also remarkably occurs in tough pitch copper (undeoxidized pure copper). Thus, desirably, in selecting a copper alloy which is used for the copper alloy bonded body of the present invention, a slow strain rate tensile test (for example, at a displacement rate of 0.001 mm/sec (a strain rate of 0.00005/sec) for smooth specimens in accordance with ASTM-G-142), is performed in each of the atmospheres in the air and under high-pressure hydrogen (for example, in 95 MPa hydrogen), and test result in the air and the test result under high-pressure hydrogen are compared to thereby confirm that the copper alloy is a copper alloy material which does not cause deterioration under hydrogen. For example, the copper alloy bonded body of the present invention is preferably prepared using a copper alloy member having an RRA (relative reduction of area) of 0.8 or more, more preferably 0.9 or more, in a hydrogen gas, measured in the slow strain rate tensile test performed at a strain rate of 510.sup.5 s.sup.1 or less.

(44) A plurality of the members made of an age-hardenable copper alloy to be used for bonding need to have a flat surface to be bonded having a flatness of 0.1 mm or less and a ten-point average roughness Rzjis of 6.3 m or less (preferably 2.0 m or less). That is, as described above, to suppress the re-oxidation on the bonding surfaces in bonding by hot pressing (diffusion bonding) even though an oxide film on each surface of bonding members is removed, the close contact property between the bonding surfaces needs to be secured in such a way that oxygen atoms which penetrate into the bonding surfaces sufficiently decrease even under a high-vacuum atmosphere, and this close contact property can be secured when the bonding surfaces have a flatness and a ten-point average roughness within the above-described ranges. When the members to be bonded are rolled materials, the rolled materials satisfy the flatness and the ten-point average roughness within the above-described ranges in many cases, and therefore a special smoothening step is unnecessary. On the other hand, when the flatness and the ten-point average roughness within the above-described ranges are not satisfied, flat surfaces having a flatness and a ten-point average roughness within the above-described ranges are formed by polishing, cutting, and/or another method. Note that curl or the like is seen for a plate material in some cases, which is not a problem as long as the plate thickness accuracy is favorably adjusted, and, in applying a necessary load in bonding by hot pressing (diffusion bonding), the flatness is 0.1 mm or less and an intended close contact property can be secured. Note that the ten-point average roughness Rzjis is the surface roughness specified in JIS B 0601-2001. In addition, the flatness herein is a parameter defined as magnitude of deviation in a planar form from a geometrically correct plane (geometric plane) in JIS B 0621-1984, and when an object is sandwiched by a pair of planes, the flatness means a value of the width of the object.

(45) Prior to removing the oxide film, which is a step that follows, a groove that provides a flow passage space after bonding is preferably formed as necessary on each surface to be bonded of a plurality of the members. The formation of the groove may be performed by any of various known methods, such as etching, press working, and mechanical processing. When such a groove is formed, thereby the members can be used for producing a copper alloy bonded body including a flow passage space inside, as described above. For example, copper ally plates with a groove and copper alloy plates without a groove are alternately stacked, and the copper alloy plates are bonded, thereby making it possible to produce a copper alloy laminated body in which many flow passages are formed. The multilayer bonded body having such a configuration can preferably be used for uses thereof as a heat exchanger of a pre-cooler for a hydrogen station, which is desired to include a plurality of flow passage spaces for allowing hydrogen and a refrigerant to pass respectively.

(46) (b) Removing Oxide Film

(47) As described above, an oxide film is present at each surface of the copper alloy members. Therefore, the oxide film present at each surface to be bonded of the copper alloy members is removed. Removing the oxide film is preferably performed by washing the surface to be bonded of the copper alloy members with an inorganic acid solution in that the oxide film can be removed effectively. Examples of the inorganic acid solution include nitric acid, sulfuric acid, a chemical polishing solution, hydrochloric acid, a kirinsu bath, and hydrofluoric acid, and the inorganic acid solution is particularly preferably a nitric acid. Note that the chemical polishing solution is an acid obtained by adding hydrogen peroxide that is an oxidizing agent to sulfuric acid, and the kirinsu bath is a mixed acid of sulfuric acid, nitric acid, and hydrochloric acid, in which a small amount of sodium hydroxide is added in some cases. Examples of preferred mixing ratios in the kirinsu bath include sulfuric acid:nitric acid:hydrochloric acid=61:4:4, 81:1:0.02, or 11:1:0.02. Alternatively, removing the oxide film may also be performed by mechanical polishing, or by a combination of mechanical polishing and washing with an inorganic acid solution.

(48) (c) Bonding by Hot Pressing (Diffusion Bonding)

(49) A plurality of the copper alloy members is bonded by hot pressing to make an intermediate bonded body. This bonding can be performed in accordance with a diffusion bonding method. For example, the hot pressing is preferably performed by applying a pressure of 1.0 MPa or higher at a temperature of 500 to 1050 C. for 30 to 480 minutes in a furnace wherein a degree of vacuum is higher than 1.010.sup.2 or higher (that is, pressure is lower than 1.010.sup.2 Torr). However, when the age-hardenable copper alloy is free of Be (for example, Corson copper), the hot pressing can be performed by applying a pressure of 1.0 MPa or higher at a temperature of 500 to 1050 C. for 30 to 480 minutes in a furnace wherein a degree of vacuum is higher than 1.010.sup.1 or higher (that is, pressure is lower than 1.010.sup.1 Torr). In any case, this hot pressing is performed in such a way that the amount of deformation in length of each copper alloy member in the direction of pressurization during bonding is preferably 0.5% or more and 30% or less, more preferably 1% or more and 20% or less, still more preferably 2% or more and 8% or less. There are proper combinations in the hot-pressing temperature and pressure, and the combination is preferably such that when the temperature is higher than 840 C. and 1050 C. or lower, the pressure is 1 MPa or higher and 16 MPa or lower, when the temperature is higher than 720 C. and 840 C. or lower, the pressure is 2 MPa or higher and 24 MPa or lower, and when the temperature is 600 C. or higher and 720 C. or lower, the pressure is 4 MPa or higher and 50 MPa or lower. The time for the hot pressing is preferably 15 to 480 minutes, more preferably 30 to 150 minutes, still more preferably 30 to 60 minutes. Note that the degree of vacuum in the furnace during the hot pressing is preferably lower than 1.010.sup.3 Torr, more preferably lower than 1.010.sup.4 Torr, still more preferably lower than 5.010.sup.5 Torr, from the viewpoint of suppressing progress of oxidation.

(50) Particularly when a groove is formed on the surface of the copper alloy member to allow the intermediate bonded body to have a flow passage space, the hot pressing is preferably performed at a relatively low temperature and a relatively high pressure in that the hot pressing can be controlled in such a way as to make crush of the flow passage due to the pressing slight. Specifically, the hot pressing in this aspect is preferably performed in a furnace wherein the degree of vacuum is higher than 1.010.sup.2 Torr (that is, pressure is lower than 1.010.sup.2 Torr), more preferably in a furnace wherein the degree of vacuum is higher than 1.010.sup.4 Torr (that is, pressure is lower than 1.010.sup.4 Torr), by (i) applying a pressure of 1 MPa or higher and 4 MPa or lower at a temperature of higher than 840 C. and 930 C. or lower for 30 to 480 minutes (preferably 30 to 60 minutes), (ii) applying a pressure of 2 MPa or higher and 8 MPa or lower at a temperature of higher than 720 C. and 840 C. or lower for 30 to 480 minutes (preferably 30 to 60 minutes), or (iii) applying a pressure of 4 MPa or higher and 30 MPa or lower at a temperature of 600 C. or higher and 720 C. or lower for 30 to 480 minutes (preferably 30 to 60 minutes).
(d) Homogenization Treatment (Arbitrary Step)

(51) When a groove is formed on the surface of the copper alloy member to allow the intermediate bonded body to have a flow passage space and the hot pressing is performed at a relatively low temperature and a relatively high pressure, it is preferable to perform, prior to the solution annealing, on the intermediate bonded body, a homogenization treatment at a temperature of 900 to 1050 C. for 60 to 480 minutes in a furnace wherein a degree of vacuum is preferably higher than 1.010.sup.1 Torr (that is, pressure is lower than 1.010.sup.1 Torr) or in a furnace preferably under an atmosphere (inert atmosphere) of nitrogen or another non-oxidizing gas (at normal pressure or reduced pressure). The homogenization treatment is a treatment also called homogenization annealing, but the term of homogenization treatment is used herein. That is, when the hot pressing is performed at a relatively low temperature and a relatively high pressure, bonding interfaces are likely to remain, but performing the homogenization treatment enables reduction or disappearance of the bonding interfaces, and through the subsequent solution annealing and aging treatment, an extremely high bonding strength can be realized. That is, both suppression of crush of a flow passage and high bonding strength can be realized. The homogenization treatment is preferably performed in the air atmosphere wherein the pressure is lower than 1.010.sup.1 Torr or lower, or at normal pressure, or in an inert atmosphere, such as in nitrogen, wherein the pressure is reduced to lower than 1.010.sup.1 Torr, in order to suppress progress of oxidation. The homogenization treatment temperature is preferably 900 to 1050 C., more preferably 930 to 1000 C., still more preferably 960 to 990 C. The holding time at the homogenization treatment temperature is 60 to 480 minutes, more preferably 60 to 360 minutes, still more preferably 60 to 240 minutes. It is needless to say that even when grooves are not formed on the surfaces of the copper alloy members, the homogenization treatment may be performed as necessary.

(52) Note that the bonding by hot pressing (diffusion bonding) (c) and the homogenization treatment (d) are preferably performed continuously by releasing a pressing load without decreasing the temperature in the furnace; and increasing the temperature. When (c) and (d) are performed in such a manner, thereby the bonding by hot pressing (diffusion bonding) and the homogenization treatment can be performed as a series of continuous operations without performing pressurization to crush a flow passage space in such a way that the homogenization treatment at a temperature effective for homogenization of textures can be performed after the bonding by hot pressing (diffusion bonding) is performed under a temperature and pressurization condition not to crush a flow passage space excessively, which is advantageous not only from the viewpoint of improving reliability of the bonding parts but also from the economical viewpoint.

(53) (e) Solution Annealing

(54) The solution annealing is performed on the intermediate bonded body. This solution annealing is preferably performed by heating the intermediate bonded body in a furnace, such as an atmospheric furnace, a non-oxidizing atmospheric furnace, or a salt bath furnace, at a temperature of 700 to 1100 C. for 1 to 180 minutes, and then cooling the intermediate bonded body with water. The copper alloy which is used in the present invention is an age-hardenable alloy and can exhibit optional tempered properties (for example, a high strength), especially an extremely high bonding strength, through the solution annealing and the subsequent aging treatment which are performed after the bonding interface is made to disappear or the thickness of the oxide film at the bonding interface is adjusted to a certain level or lower. The solution annealing temperature is preferably 700 to 1100 C., more preferably 800 to 1050 C., still more preferably 900 to 1000 C., although the proper region is somewhat different depending on the alloy composition. The substantial holding time at the solution annealing temperature is preferably 1 to 180 minutes, more preferably 5 to 90 minutes, still more preferably 10 to 60 minutes.

(55) (f) Aging Treatment

(56) The aging treatment is performed on the solution-annealed intermediate bonded body. This aging treatment is preferably performed at 350 to 550 C. for 30 to 480 minutes although the proper range is somewhat different depending on the alloy composition. As described above, the age-hardenable alloy, such as a beryllium copper alloy, can exhibit optional tempered properties (for example, a high strength), especially an extremely high bonding strength, through the solution annealing and the aging treatment. The aging treatment temperature is preferably 350 to 550 C., more preferably 400 to 500 C., still more preferably 450 to 480 C. The holding time at the aging treatment temperature is preferably 30 to 480 minutes, more preferably 30 to 300 minutes, still more preferably 60 to 240 minutes, particularly preferably 90 to 180 minutes. From the viewpoint of suppression of oxidation, the aging treatment is preferably performed in a furnace wherein the degree of vacuum is higher than 1.010.sup.1 Torr (that is, pressure is lower than 1.010.sup.1 Torr) or in a furnace under a non-oxidizing atmosphere, such as nitrogen.

(57) Hydrogen-Resistant Member

(58) According to another aspect of the present invention, there is provided a hydrogen-resistant member composed of Corson copper (EN material number CW109C, CW111C, UNS alloy number C19010, C70250, AMPCO944, and AMPCO940). The hydrogen-resistant member of the present aspect is not limited to the copper alloy bonded body as described above and can be any of copper alloy products in various forms. That is, as will be demonstrated in Examples below, Corson copper also has a hydrogen-embrittlement-resistant property and therefore has a utility value as a hydrogen-resistant member. Corson copper in particular has an advantage of capable of stably producing a product accompanied by bonding and therefore is advantageous in that a product made of a hydrogen-resistant member can be supplied stably. The hydrogen-resistant member is defined as a member that is used in a state of coming into contact with hydrogen. Example of the use of the hydrogen-resistant member include a storage member that stores hydrogen, a heat exchange member (for example, a heat exchanger) that circulates hydrogen to perform heat exchange, a piping member that circulates hydrogen, a valve member to be connected to a piping member that circulates hydrogen, a seal member to be connected to a piping member that circulates hydrogen, and combinations thereof. This hydrogen-resistant member can be used in a state of coming into in contact with medium-pressure hydrogen of, for example, 30 MPa or higher, or 45 MPa or higher, or high-pressure hydrogen of, for example, 70 MPa or higher, or 90 MPa or higher. The hydrogen-resistant member may be used in, for example, a hydrogen station or a fuel cell vehicle (FCV) that handles high-pressure hydrogen.

EXAMPLES

(59) The present invention will be described more specifically by the following Examples.

Examples 1 to 57

(60) Copper alloy bonded bodies were prepared according to the following procedures to perform evaluations.

(61) (1) Providing Copper Alloys

(62) For each Example, provided was a plurality of copper alloy round bars of the alloy types and compositions shown in Tables 2A, 3A, 4A, and 5A and of a size of 32 mm in diameter50 mm in length or 80 mm in diameter50 mm in length.

(63) In Examples 1 to 40 and 43 to 57, each end surface (hereinafter, referred to as bonding surface) to be used for bonding the copper alloy round bars was made into a flat surface having a ten-point average roughness Rzjis of less than 6.3 m, measured in accordance with JIS B 0601-2001, and having a flatness of 0.1 mm or less, measured in accordance with JIS B 0621-1984 by processing, such as lathe machining or lapping.

(64) On the other hand, as for Example 41, each bonding surface of two copper alloy round bars was intentionally adjusted in such a way as to be made into a flat surface having a flatness of 0.1 mm or less, measured in accordance with JIS B 0621-1984 but having a ten-point average roughness Rzjis of larger than 6.3 m. Further, as for Example 42, each bonding surface of two copper alloy round bars was intentionally adjusted in such a way as to have a ten-point average roughness Rzjis of smaller than 6.3 m, measured in accordance with JIS B 0601-2001, but having a flatness of larger than 0.2 mm, measured in accordance with JIS B 0621-1984.

(65) (2) Removing Oxide Film (Excluding Example 36)

(66) In Examples 1 to 35, 37 to 48, and 50 to 53, each bonding surface of two of the copper alloy round bars was washed with 30% nitric acid to remove an oxide film present at the bonding surface. In Example 55, each bonding surface of two of the copper alloy round bars was washed with a chemical polishing solution (20% sulfuric acid containing 3% of hydrogen peroxide water) to remove an oxide film present at the bonding surface. In Examples 49, 54, and 56, each bonding surface of two of the copper alloy round bars was mechanically polished with emery paper #600 to remove an oxide film present at the bonding surface. In Example 57, each bonding surface of two of the copper alloy round bars was mechanically polished with buff #320 (nylon/polyester nonwoven fabric) to remove an oxide film present at the bonding surface. Note that in Example 36 (comparative example), removing an oxide film was not performed.

(67) (3) Hot Pressing

(68) Bonding surfaces of two copper alloy round bars washed with nitric acid was made to directly butt against each other (without interposing a brazing filler metal) to perform hot pressing in a vacuum furnace under bonding conditions shown in Tables 2A, 3A, 4A, and 5A to provide intermediate bonded body in the form of a round bar. The amount of deformation D during bonding on that occasion was determined by the following formula:
D=[(L.sub.0L.sub.1)/L.sub.0]100
assuming the integrated length in the boding direction of the two samples before bonding to be L.sub.0 and assuming the length in the bonding direction of the samples after bonding to be L.sub.1, and the results were as shown in Tables 2A, 3A, 4A, and 5A. For each Example, in order to perform respective evaluations, a plurality of tensile test specimens was prepared, and samples for observing a texture before and after the thermal treatment were prepared from the positions adjacent to the tensile test specimens.
(4) Solution Annealing

(69) Solution annealing was performed on the intermediate bonded bodies. This solution annealing was performed by holding the copper alloy bonded bodies in a molten salt bath at 930 C. for 5 minutes (in Examples 1 to 42 and 47 to 57) or at 780 C. for 5 hours (in Examples 43 to 46) and then cooling the copper alloy bonded bodies with water.

(70) (5) Aging Treatment

(71) An aging treatment was performed on the solution-annealed intermediate bonded bodies. This aging treatment was performed by holding the copper alloy bonded bodies in a vacuum furnace wherein the degree of vacuum was 110.sup.1 Torr at 450 C. for 3 hours (in Examples 1 to 42 and 55 to 57), at 320 C. for 3 hours (in Examples 43 to 46), or at 500 C. for 2 hours (in Examples 47 to 54), and then cooling the copper alloy bonded bodies in the furnace. Thus, copper alloy bonded bodies in the form of a round bar, tempered by the solution annealing and the aging treatment, were provided.

(72) (6) Evaluations

(73) The following evaluations were performed for the intermediate bonded bodies as bonded by the hot pressing, the copper alloy bonded bodies as solution-annealed, the copper alloy bonded bodies subjected to the solution annealing and the aging treatment, and/or the copper alloy bonded bodies subjected to the solution annealing and the aging treatment which were performed after the homogenization treatment was performed on the intermediate bonded bodies under various temperature and time conditions (hereinafter, there are collectively referred to as bonded body samples).

(74) <Bonding Strength>

(75) Each bonded body sample was processed to prepare a specimen in accordance with ASTM E8M Specimen 3 in such a way that the bonding part was at the central position of the specimen. A tensile test was performed on this specimen in accordance with ASTM E8M to measure the tensile strength (bonding strength), and then the breaking position was checked. The results were as shown in Table 2A to Table 5C.

(76) <Observation of Section of Bonding Part with Optical Microscope>

(77) For the bonded body samples which were as bonded or on which the solution annealing and the aging treatment had further been performed after bonding, a section including the bonding part was cut out and polished. As a sample for observation, each region which was adjacent to the region cut out as a tensile test specimen as described above and had been subjected to the same thermal treatment step for bonding was utilized. The obtained section was observed with an optical microscope at 200 magnifications, 500 magnifications, and 1000 magnifications to check whether the bonding interface had disappeared or not (in other words, whether the bonding interface remained or not). The results were as shown in Tables 2B, 3B, 4B, and 5B. FIG. 2 shows photographs of sections obtained in Examples 2, 30, 33, 43, and 46, FIG. 3 shows photographs of sections obtained in Examples 26, 27, and 28, and FIG. 4 shows photographs of sections obtained in Examples 47 and 53. These figures demonstrate that the bonding interface had disappeared in Example 2 (CuBe11) and Example 30 (CuBe10Zr), which are embodiments, suggesting high bonding quality, and that, in contrast, the bonding interface remained in the bonded body samples of Example 43 (CuBe25) and Example 46 (CuBe165), which are comparative examples. However, in the bonded body samples of Example 33 (CuBe50), Example 26 (CuCr), Example 27 (CuCrZr), and Examples 28 and 47 (Corson copper AMPCO940), and Example 53 (Corson copper AMPCO944), which are embodiments, the bonding interface was confirmed to remain in spite of the fact that a high bonding strength was obtained. This shows that disappearance of the bonding interface is effective in realizing a high bonding strength, which is an object of the present invention, but is not essential. Based on the fact that a high bonding strength was obtained, it can be said that a favorable bonding state is also realized in bonded body samples of Examples 33, 26, 27, 28, 47, and 53, where the bonding interface was confirmed to remain, as well as Examples 2 and 3.

(78) <STEM Observation and EELS/EDX Elemental Analysis of Bonding Interface>

(79) A section including the bonding interface was cut out for the bonded body samples as diffusion-bonded and/or bonded body samples subjected to the solution annealing and the aging treatment (hereinafter, referred to solution aging) of Examples 2, 3, 26, 30, 33, 43, 46, 47, and 53, and processed into the form of a thin piece with a focused ion beam (FIB, product name: NB5000, manufactured by Hitachi High-Technologies Corporation). The obtained section including the bonding interface of each bonded body sample was observed with a scanning transmission electron microscope (STEM, product name: HD-2700, manufactured by Hitachi High-Technologies Corporation) including a spherical aberration correction function under a measurement condition of an acceleration voltage of 200 kV to check the presence or absence of an oxide film at the bonding interface or measure the thickness of the oxide film. Further, the elemental analysis of the bonding surface and the vicinity of the bonding surface was performed with an electron energy loss spectrometer (EELS, trade name: Enfinium, manufactured by Gatan, Inc.)/an energy dispersive X-ray analyzer (EDX, trade name; XMAXN 100TLE, manufactured by Oxford Instruments plc), which were attached to STEM. Those results were shown in Tables 2B, 3B, 4B, and 5B, and FIGS. 5 to 8, and as described below.

(80) Examples 2 and 3 are examples in which a bonded body having a high bonding strength (>690 MPa) was realized as a result of using CuBe11 and allowing the bonded body to withstand the solution aging. In these bonded body samples of Examples 2 and 3, the presence of the bonding surface was not confirmed by optical microscope observation, but STEM observation shows that a part which was able to be specified as the bonding surface was present. However, as can be seen from the STEM images and EELS/EDX element mapping images shown in FIG. 5, an observation result shows that an oxide film did not remain at the bonding surface in Example 2 (that is, the thickness of the oxide film was 0 nm). An oxide film was not confirmed to remain from EELS mapping either. On the other hand, in the bonded body (as bonded) of Example 3, an oxide film having a thickness of 0.7 nm was observed in a part. EELS mapping also confirmed that an oxide film having a thickness of 1 nm or less remained. As described above, an oxide film having a thickness of 0 to 1 nm was present in CuBe11, but it is understood that an oxide film approximately as thin as this makes it possible to secure a favorable bonding strength.

(81) Example 30 is an example in which a bonded body having a high bonding strength (>690 MPa) was realized as a result of using CuBe10Zr and allowing the bonded body to withstand the solution aging. STEM observation and EELS/EDX elemental analysis show that an oxide film did not remain, which was the same as in Example 2 (CuBe11). The presence of a part where Zr was concentrated was confirmed in the base material matrix but does not affect the bonding quality because an oxide (ZrO) did not remain at the bonding interface.

(82) Example 33 is an example in which a bonded body having a high bonding strength (>690 MPa) was realized as a result of using CuBe50 and allowing the bonded body to withstand the solution aging. STEM observation and EELS/EDX elemental analysis show that an oxide film did not remain, which was the same as in Example 2 (CuBe11) and Example 19 (CuBe10Zr). These results agree with the mechanically characteristic behavior that the bonded bodies withstand the solution aging.

(83) Example 26 is an example in which a bonded body having a high bonding strength was realized as a result of using CuCr and allowing the bonded body to withstand the solution aging. STEM observation and EELS/EDX elemental analysis show that an oxide film did not remain, which was the same as in Example 2 (CuBe11), Example 30 (CuBe10Zr), and Example 33 (CuBe50). The presence of a part where Cr was concentrated was confirmed in the base material matrix and at the bonding interface but does not affect the bonding quality because an oxide (CrO) did not remain at the bonding interface. These results agree with the mechanically characteristic behavior that the bonded bodies withstand the solution aging.

(84) Example 43 (Comparison) is a comparative example regarding a bonded body broken during the solution aging as a result of using CuBe25. STEM observation and EELS/EDX elemental analysis show that a homogeneous oxide film having a thickness of about 6 nm was present over the whole bonding interface in the bonded body (as bonded). The oxide film had a thickness of 5.8 nm and 6.2 nm at particular two positions (see FIG. 6A). In addition, as shown in FIG. 6B, in which a region where the concentration of BeO is high is shown by black points (stressed by arrows), an observation result shows that thick sphere-like oxide films were present in places. In FIG. 6B, the thicknesses of the oxide films in these spherical parts were decided as about 15 to about 20 nm from EELS mapping shown in FIG. 6C.

(85) Example 46 (Comparison) is a comparative example regarding a bonded body broken during the solution aging as a result of using CuBe165. STEM observation and EELS/EDX elemental analysis show that a homogeneous oxide film over the whole bonding surface was not present and a region where an oxide film is absent was present locally. However, an observation result shows that thick sphere-like oxide films caused by high-concentration BeO were present in places. The thicknesses of these sphere-like oxide films were decided as about 20 nm to about 50 nm or more. The thickness of the oxide film including both of the homogeneous oxide films and the sphere-like oxide films was decided as within a range of 1 to 80 nm.

(86) Examples 47 and 53 are examples in which a bonded body having a high bonding strength was realized as a result of using Corson copper AMPCO940 and Corson copper AMPCO944 respectively so that the bonded body could withstand the solution aging. In these bonded bodies of Examples 47 and 53, STEM observation shows that a part which was able to be specified as the bonding surface was present. However, as can be seen from the STEM images and EELS/EDX element mapping images shown in FIGS. 7 and 8 (corresponding to Examples 47 and 53 respectively), observation results show that an oxide film did not remain at the bonding surface (that is, the thickness of the oxide film was 0 nm) in Examples 47 and 53. An oxide film was not confirmed to remain from EELS mapping either.

(87) <Measurement of Electrical Conductivity and Conversion to Thermal Conductivity>

(88) The electrical conductivity (IACS %) of each bonded body sample was measure at room temperature using an eddy current electrical conductivity meter (product name: Hocking AutoSigma 3000DL, manufactured by GE Sensing & Inspection Technologies). The obtained electrical conductivity was converted with a correlation equation based on the Wiedemann-Franz law to determine the thermal conductivity (W/mK).

(89) <Studies on Homogenization Treatment Temperature>

(90) On the intermediate bonded bodies (before being subjected to the solution annealing) of Examples 1 to 3, 8 to 11, 16 to 25, 30, 32 to 35, 47, 48, 53, and 55 to 57, subjected to the hot pressing, homogenization treatments (high-temperature soaking) at different temperatures of 900 C., 930 C., 960 C., or 980 C. were performed for 8 hours, and the intermediate bonded bodies were cooled in a furnace and then held at 930 C. for 5 minutes and cooled with water (solution annealing). The resultant bonded bodies were held at 450 C. for 3 hours (in Examples 1 to 3, 8 to 11, 16 to 25, 30, 32 to 35, and 55 to 57) or at 500 C. for 2 hours (in Examples 47, 48, and 53) and then cooled in a furnace (aging treatment). Each bonded body sample was processed to prepare a specimen in accordance with ASTM E8M Specimen 3 in such a way that the bonding part was at the central position of the specimen. A tensile test was performed on this specimen following the procedures in accordance with ASTM E8M to measure the tensile strength (bonding strength), and then the breaking position was checked. The results were as shown in Tables 2C, 30, 4C, and 5C. As is clear from the results shown in these tables, when the homogenization treatment temperature is higher, the bonding interface is more likely to disappear, and fracture of the base material, not at the bonding surface, is more likely to occur in the tensile test (however, even when the homogenization treatment was not performed, fracture of the base material occurred in some bonded body samples, therefore the homogenization treatment is not essential in crystal grain growth beyond the bonding interface or the position where the bonding interface was present, but by the homogenization treatment, the bonding surface disappeared more completely and the fracture of the base material occurred in all the bonded bodies.).

Table 2A

(91) TABLE-US-00002 TABLE 2A Surface Bonding Amount of Copper alloy roughness conditions deformation Alloy Rzjis (m) Degree of during Alloy Applicable composition Top Bottom Surface Temp. Pressure vacuum bonding Ex. type standard (% by weight) side side treatment time (MPa) (Torr) (%) 1 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.65 0.57 30% Nitric acid 840 C. 1 h 32.7 5 10.sup.4 19.4 2 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.55 0.62 30% Nitric acid 840 C. 1 h 14.9 5 10.sup.4 6.1 3 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.58 0.62 30% Nitric acid 840 C. 1 h 14.9 5 10.sup.4 6.3 4 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.50 0.54 30% Nitric acid 840 C. 1 h 6.5 5 10.sup.4 0.8 5 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.64 0.65 30% Nitric acid 900 C. 1 h 32.7 5 10.sup.4 24.1 6 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.66 0.52 30% Nitric acid 900 C. 1 h 23.2 5 10.sup.4 20.0 7 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.52 0.41 30% Nitric acid 900 C. 1 h 14.9 5 10.sup.4 18.7 8 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.47 0.69 30% Nitric acid 900 C. 1 h 11.2 5 10.sup.4 18.7 9 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.62 0.75 30% Nitric acid 900 C. 1 h 6.5 5 10.sup.4 5.4 10 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.54 0.69 30% Nitric acid 900 C. 1 h 11.2 1 10.sup.3 9.6 11 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.58 0.77 30% Nitric acid 900 C. 1 h 11.2 1 10.sup.2 7.8 12 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.76 0.66 30% Nitric acid 780 C. 1 h 16.0 5 10.sup.4 1.0 13 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.49 0.52 30% Nitric acid 720 C. 1 h 16.0 5 10.sup.4 0.8 14 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.59 0.70 30% Nitric acid 720 C. 1 h 25.0 5 10.sup.4 2.0 15 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.66 0.81 30% Nitric acid 660 C. 1 h 25.0 5 10.sup.4 1.2 16 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 2.11 2.45 30% Nitric acid 840 C. 1 h 6.5 5 10.sup.4 1.5 17 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 2.90 2.62 30% Nitric acid 840 C. 1 h 14.9 5 10.sup.4 6.8 18 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 2.20 2.39 30% Nitric acid 640 C. 1 h 25.0 5 10.sup.4 1.8

Table 2B

(92) TABLE-US-00003 TABLE 2B After bonding (as bonded) After solution annealing Thickness (same as right column) Copper Bonding (nm) of (not aging-treated) alloy interface oxide film Bonding Bonding Alloy remains or at bonding strength Breaking strength Breaking Ex. type not part (MPa) position (MPa) position 1 CuBe11 Not 305 Base material 286 Base material 2 CuBe11 Not 0 293 Base material 295 Base material 3 CuBe11 Not 0~1.0 295 Base material 297 Base material 4 CuBe11 Remains 299 Base material 257 Base material 5 CuBe11 Not 299 Base material 287 Base material 6 CuBe11 Not 293 Base material 291 Base material 7 CuBe11 Not 298 Base material 295 Base material 8 CuBe11 Not 297 Base material 297 Base material 9 CuBe11 Remains 301 Base material 296 Base material 10 CuBe11 Remains 298 Base material 288 Base material 11 CuBe11 Remains 298 Base material 298 Base material 12 CuBe11 Remains 327 Base material 13 CuBe11 Remains 240 Base material 14 CuBe11 Remains 260 Base material 15 CuBe11 Remains 271 Base material 16 CuBe11 Remains 290 Base material 255 Base material 17 CuBe11 Not 288 Base material 276 Base material 18 CuBe11 Remains 293 Base material 288 Base material After solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (450 C. 3 h .fwdarw. cooling in furnace) Thickness Bonding (nm) interface of oxide film Bonding Electrical Thermal remains or at bonding strength Breaking conductivity conductivity Ex. not part (MPa) position (IACS %) (W/mK) 1 Not 0 692 Bonding part 56.7 234 2 Not 0 787 Bonding part 56.2 232 3 Not 792 Bonding part 56.2 232 4 Remains 720 Bonding part 55.9 231 5 Not 709 Base material 55.7 230 6 Not 731 Base material 56.2 232 7 Not 770 Bonding part 55.7 230 8 Not 786 Bonding part 56.7 234 9 Remains 0 792 Base material 55.2 229 10 Remains 0 743 Bonding part 56.6 234 11 Remains 0.5 750 Bonding part 56.2 232 12 Remains 514 Bonding part 55.8 231 13 Remains 418 Bonding part 55.4 230 14 Remains 0.6 697 Bonding part 56.2 232 15 Remains 705 Bonding part 55.7 230 16 Remains 717 Bonding part 56.7 234 17 Not 770 Bonding part 56.6 234 18 Remains 756 Bonding part 56.2 232

Table 2C

(93) TABLE-US-00004 TABLE 2C Bonded body subjected to solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (450 C. 3 h .fwdarw. cooling in furnace) after homogenization treatment (temperature below 8 h .fwdarw. cooling in furnace) 900 C. 930 C. Copper Bonding Bonding alloy interface Bonding Electrical interface Bonding Alloy remains strength Breaking conductivity remains strength Breaking Ex. type or not (MPa) position (IACS %) or not (MPa) position 1 CuBe11 Not 56.3 2 CuBe11 Not 692 Bonding part 56.7 3 CuBe11 Not 4 CuBe11 5 CuBe11 6 CuBe11 7 CuBe11 8 CuBe11 Remains 698 Bonding part 57.0 Not 748 Base material 9 CuBe11 Remains 733 Base material 56.9 Not 783 Base material 10 CuBe11 Remains 814 Bonding part 55.4 Not 794 Base material 11 CuBe11 792 Bonding part 55.9 Not 806 Base material 12 CuBe11 13 CuBe11 14 CuBe11 15 CuBe11 16 CuBe11 Remains 751 Bonding part 56.2 Remains 748 Bonding part 17 CuBe11 Remains 728 Bonding part 56.9 Not 783 Base material 18 CuBe11 Remains 755 Bonding part 56.0 Remains Bonding part Bonded body subjected to solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (450 C. 3 h .fwdarw. cooling in furnace) after homogenization treatment (temperature below 8 h .fwdarw. cooling in furnace) 960 C. 980 C. Bonding Bonding interface Bonding interface Bonding Electrical remains strength Breaking remains strength Breaking conductivity Ex. or not (MPa) position or not (MPa) position (IACS %) 1 56.7 2 Not 735.1 Base material Not 774 Base material 56.3 3 56.3 4 5 6 7 8 Not 742 Base material Not 724 Base material 57.8 9 Not 767 Base material Not 762 Base material 57.2 10 Not 729 Base material Not 720 Base material 55.9 11 Not 786 Base material Not 748 Base material 56.5 12 Not 737 Base material 55.2 13 Not 719 Base material 55.1 14 Not 774 Base material 56.9 15 Not 769 Base material 56.6 16 Not 770 Base material Not 782 Base material 56.5 17 Not 769 Base material Not 779 Base material 56.6 18 Not 772 Base material Not 769 Base material 56.8

Table 3A

(94) TABLE-US-00005 TABLE 3A Surface roughness Bonding conditions Amount of Copper alloy Rzjis (m) Degree of deformation Applicable Alloy composition Top Bottom Surface Pressure vacuum during Ex. Alloy type standard (% by weight) side side treatment Temp. time (MPa) (Torr) bonding (%) 19 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 2.91 3.03 30% Nitric acid 900 C. 1 h 6.5 5 10.sup.4 1.2 20 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 3.05 3.22 30% Nitric acid 840 C. 1 h 16.0 5 10.sup.4 1.1 21 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.66 0.52 30% Nitric acid 600 C. 1 h 25.0 5 10.sup.4 2.8 22 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.59 0.55 30% Nitric acid 600 C. 1 h 40.0 5 10.sup.4 4.5 23 CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.62 0.58 30% Nitric acid 900 C. 1 h 6.6 5 10.sup.4 1.5 24 CuBe11 JIS C1751 Cu-1.89Ni-0.42Be 0.54 0.68 30% Nitric acid 930 C. 1 h 6.6 5 10.sup.4 4.2 25 CuBe11 JIS C1751 Cu-1.89Ni-0.42Be 0.65 0.52 30% Nitric acid 930 C. 1 h 8.3 5 10.sup.4 3.7 26 CuCr C18200 Cu-0.9Cr 0.75 0.47 30% Nitric acid 870 C. 1 h 6.6 5 10.sup.4 8.7 27 CuCrZr CW106C Cu-0.9Cr-0.08Zr 0.69 0.62 30% Nitric acid 840 C. 1 h 6.6 5 10.sup.4 10.0 28 AMPCO940 Cu-2.3Ni-0.6Si-0.5Cr-0.1Sn 0.62 0.54 30% Nitric acid 840 C. 1 h 16.0 5 10.sup.4 17.3 (Corson copper) 29 AMPCO944 Cu-7.1Ni-1.7Si-0.6Cr 0.62 0.66 30% Nitric acid 840 C. 1 h 12.0 5 10.sup.4 2.1 (Corson copper) 30 CuBe10Zr Cu-2.59Co-0.50Be-0.24Zr 0.54 0.73 30% Nitric acid 840 C. 1 h 14.9 5 10.sup.4 18.2 31 CuBe14Z Cu-1.40Ni-0.45Be-0.28Zr 0.65 0.62 30% Nitric acid 840 C. 1 h 16.0 5 10.sup.4 3.5 32 CuBe14Z Cu-1.40Ni-0.45Be-0.28Zr 0.69 0.62 30% Nitric acid 900 C. 1 h 12.0 5 10.sup.4 12.8 33 CuBe50 Cu-1.40Ni-0.45Be-0.1Ag- 0.79 0.59 30% Nitric acid 840 C. 1 h 14.9 5 10.sup.4 7.5 0.18Zr 34 CuCo1Ni1Be CW103C Cu-1.0Co-1.1Ni-0.45Be 0.69 0.65 30% Nitric acid 900 C. 1 h 6.6 5 10.sup.4 8.2

Table 3B

(95) TABLE-US-00006 TABLE 3B After bonding After solution annealing (as bonded) (same as right column) Copper Bonding Thickness (not aging-treated) alloy interface (nm) of oxide Bonding Bonding Alloy remains or film at strength Breaking strength Breaking Ex. type not bonding part (MPa) position (MPa) position 19 CuBe11 Not 298 Base material 269 Base material 20 CuBe11 Remains 288 Base material 266 Base material 21 CuBe11 Not 299 Base material 287 Base material 22 CuBe11 Not 293 Base material 298 Base material 23 CuBe11 Not 292 Base material 299 Base material 24 CuBe11 Not 297 Base material 25 CuBe11 Not 289 Base material 26 CuCr Remains 0 244 Base material 27 CuCrZr Remains 180 Base material 28 AMPCO940 Not 478 Base material 29 AMPCO944 Remains 348 Bonding part 30 CuBe10Zr Not 0 317 Base material 31 CuBe14Z Remains 288 Base material 32 CuBe14Z Remains 310 Base material 33 CuBe50 Remains 0 297 Base material 34 CuCo1Ni1Be Remains 285 Base material After solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (450 C. 3 h .fwdarw. cooling in furnace) Bonding Thickness interface (nm) of oxide Bonding Electrical Thermal remains or film at strength Breaking conductivity conductivity Ex. not bonding part (MPa) position (IACS %) (W/mK) 19 Not 730 Bonding part 56.2 232 20 Remains 722 Bonding part 58.0 239 21 Not 760 Bonding part 56.2 232 22 Not 783 Bonding part 55.8 231 23 Not 808 Bonding part 56.2 232 24 Not 758 Bonding part 55.9 231 25 Not 756 Base material 55.6 230 26 Remains 382 Base material 80.2 318 27 Remains 279 Bonding part 83.5 330 28 Not 695 Base material 50.5 211 29 Remains 0.8 709 Base material 33.7 146 30 Not 775 Bonding part 52.3 218 31 Remains 564 Bonding part 54.5 226 32 Remains 1.2 695 Bonding part 54.2 225 33 Remains 0 801 Bonding part 58.2 240 34 Remains 730 Bonding part 53.2 221

Table 3C

(96) TABLE-US-00007 TABLE 3C Bonded body subjected to solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (450 C. 3 h .fwdarw. cooling in furnace) after homogenization treatment (temperature below 8 h .fwdarw. cooling in furnace) 900 C. 930 C. Bonding Bonding interface Bonding Electrical interface Bonding Copper alloy remains strength Breaking conductivity remains strength Breaking Ex. Alloy type or not (MPa) position (IACS %) or not (MPa) position 19 CuBe11 Remains 753 Base material 56.8 Not 794 Base material 20 CuBe11 Remains 712 Bonding part 57.9 Not 731 Bonding part 21 CuBe11 Remains 733 Bonding part 57.8 Remains 790 Bonding part 22 CuBe11 Remains 731 Bonding part 56.9 Not 749 Bonding part 23 CuBe11 Not 711 Bonding part 58.4 24 CuBe11 Not 711 Bonding part 58.1 25 CuBe11 Not 769 Base material 57.7 26 CuCr 27 CuCrZr 28 AMPCO940 29 AMPCO944 Not 741 Base material 30 CuBe10Zr Remains 720 Bonding part 52.9 Remains 708 Bonding part 31 CuBe14Zr 32 CuBe14Zr Remains 739 Bonding part 53.9 Not 758 Base material 33 CuBe50 Remains 778 Bonding part 59.8 Remains 770 Bonding part 34 CuCo1Ni1Be Remains 730 Bonding part Bonded body subjected to solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (450 C. 3 h .fwdarw. cooling in furnace) after homogenization treatment (temperature below 8 h .fwdarw. cooling in furnace) 960 C. 980 C. Bonding Bonding interface Bonding interface Bonding Electrical remains strength Breaking remains strength Breaking conductivity Ex. or not (MPa) position or not (MPa) position (IACS %) 19 Not 777 Base Not 799 Base 57.2 material material 20 Not 729 Base Not 720 Base 55.9 material material 21 Not 778 Base Not 772 Base 56.5 material material 22 Not 769 Base Not 779 Base 56.6 material material 23 Not 762 Base Not 734 Base 58.9 material material 24 Not 770 Base Not 735 Base 57.8 material material 25 Not 734 Base Not 740 Base 57.2 material material 26 27 28 29 Not 821 Base Not 840 Base 32.7 material material 30 Not 763 Base Not 724 Base 51.8 material material 31 32 33 Not 754 Base 58.4 material 34 Not 744 Base 54.7 material

Table 4A

(97) TABLE-US-00008 TABLE 4A Copper alloy Surface roughness Bonding conditions Amount of Alloy Rzjis (m) Degree of deformation Alloy Applicable composition Top Bottom Surface Temp. Pressure vacuum during Ex. type standard (% by weight) surface surface treatment time (MPa) (Torr) bonding (%) 35* CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.76 0.66 30% Nitric acid 900 C. 1 h 14.9 5 10.sup.1 8.0 36* CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.49 0.52 Not performed 900 C. 1 h 6.5 5 10.sup.4 4.2 37* CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.52 0.55 30% Nitric acid 720 C. 1 h 16.0 5 10.sup.4 0.2 38* CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.65 0.58 30% Nitric acid 660 C. 1 h 16.0 5 10.sup.4 0.1 39* CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.66 0.50 30% Nitric acid 600 C. 1 h 16.0 5 10.sup.4 0.1 40* CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 2.63 2.90 30% Nitric acid 660 C. 1 h 16.0 5 10.sup.4 0.1 41* CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 8.26 9.54 30% Nitric acid 900 C. 1 h 6.5 5 10.sup.4 5.5 42* CuBe11 JIS C1751 Cu-1.91Ni-0.39Be 0.66 0.65 30% Nitric acid 900 C. 1 h 6.5 5 10.sup.4 3.1 43* CuBe25 JIS C1720 Cu-1.87Be-0.23Co 0.64 0.52 30% Nitric acid 800 C. 1 h 32.7 5 10.sup.4 24 44* CuBe25 JIS C1720 Cu-1.87Be-0.23Co 0.66 0.70 30% Nitric acid 800 C. 1 h 14.9 5 10.sup.4 15 45* CuBe25 JIS C1720 Cu-1.87Be-0.23Co 0.52 0.81 30% Nitric acid 800 C. 1 h 6.6 5 10.sup.4 9.5 46* CuBe165 JIS C1700 Cu-1.69Be-0.23Co 0.74 0.60 30% Nitric acid 800 C. 1 h 14.9 5 10.sup.4 2.7 *shows comparative examples.

Table 4B

(98) TABLE-US-00009 TABLE 4B After bonding After solution annealing (as bonded) (same as right column) Copper Bonding Thickness (not aging-treated) alloy interface (nm) of oxide Bonding Bonding Alloy remains or film at strength Breaking strength Breaking Ex. type not bonding part (MPa) position (MPa) position 35* CuBe11 Remains 105 Bonding part 0.sup.# Bonding part 36* CuBe11 Remains 45 Bonding part 0.sup.# Bonding part 37* CuBe11 .sup.0.sup.# Bonding part 38* CuBe11 .sup.0.sup.# Bonding part 39* CuBe11 .sup.0.sup.# Bonding part 40* CuBe11 .sup.0.sup.# Bonding part 41* CuBe11 .sup.0.sup.# Bonding part 42* CuBe11 .sup.0.sup.# Bonding part 43* CuBe25 Remains 6~20 546 Bonding part 0.sup.# Bonding part 44* CuBe25 Remains 520 Bonding part 0.sup.# Bonding part 45* CuBe25 Remains 390 Bonding part 0.sup.# Bonding part 46* CuBe165 Remains 1~80 269 Bonding part 0.sup.# Bonding part After solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (450 C. 180 min .fwdarw. cooling in furnace) (Examples 35 to 42), or after solution annealing (780 C. 5 min .fwdarw. cooling with water) and aging treatment (320 C. 180 min .fwdarw. cooling in furnace) (Examples 43 to 46) Bonding Thickness interface (nm) of oxide Bonding Electrical Thermal remains film at strength Breaking conductivity conductivity Ex. or not bonding part (MPa) position (IACS %) (W/mK) 35* Remains 0.sup.# Bonding part 36* Remains 0.sup.# Bonding part 37* 38* 39* 40* 41* 42* 43* Remains 0.sup.# Bonding part 27.5 44* 0.sup.# Bonding part 45* Remains 0.sup.# Bonding part 46* Remains 0.sup.# Bonding part 28.2 *shows comparative examples. 0.sup.# means that the bonding strength was regarded as 0 MPa because the test specimen was broken during the thermal treatment, during processing the test specimen, or during attaching the test specimen to the tensile tester.

Table 4C

(99) TABLE-US-00010 TABLE 4C Bonded body subjected to solution annealing and aging treatment after homogenization treatment (temperature below 480 min .fwdarw. cooling in furnace) 900 C. 930 C. Copper Bonding Bonding alloy interface Bonding Electrical interface Bonding Alloy remains strength Breaking conductivity* remains or strength Breaking Ex. type or not (MPa) position (IACS %) not (MPa) position 35* CuBe11 Remains 264 Bonding 56.0 Remains 226 Bonding part part 36* CuBe11 37* CuBe11 38* CuBe11 39* CuBe11 40* CuBe11 41* CuBe11 42* CuBe11 43* CuBe25 44* CuBe25 45* CuBe25 46* CuBe165 Bonded body subjected to solution annealing and aging treatment after homogenization treatment (temperature below 480 min .fwdarw. cooling in furnace) 960 C. 980 C. Bonding Bonding interface Bonding interface Bonding Electrical remains or strength Breaking remains or strength Breaking conductivity* not (MPa) position not (MPa) position (IACS %) Ex. Remains 666 Bonding Remains 194 Bonding 35* part part 36* 37* 38* 39* 40* 41* 42* 43* 44* 45* *shows comparative examples.

Table 5A

(100) TABLE-US-00011 TABLE 5A Surface roughness Copper alloy Rzjis (m) Ex. Applicable Alloy composition Top Bottom Alloy type standard (% by weight) side side 47 AMPCO940 Cu-2.3Ni-0.6Si-0.5Cr- 2.440 1.859 (Corson copper) 0.1Sn 48 AMPCO940 Cu-2.3Ni-0.6Si-0.5Cr- 2.568 2.012 (Corson copper) 0.1Sn 49 AMPCO940 Cu-2.3Ni-0.6Si-0.5Cr- 2.687 2.345 (Corson copper) 0.1Sn 50 AMPCO940 Cu-2.3Ni-0.6Si-0.5Cr- 1.752 2.056 (Corson copper) 0.1Sn 51 AMPCO940 Cu-2.3Ni-0.6Si-0.5Cr- 1.982 2.361 (Corson copper) 0.1Sn 52 AMPCO940 Cu-2.3Ni-0.6Si-0.5Cr- 2.498 1.709 (Corson copper) 0.1Sn 53 AMPCO944 Cu-7.1Ni-1.7Si-0.6Cr 3.245 3.655 (Corson copper) 54 AMPCO944 Cu-7.1Ni-1.7Si-0.6Cr 1.565 1.782 (Corson copper) 55 CuBe11 JISC1751 Cu-1.91Ni-0.39Be 0.267 0.215 56 CuBe11 JISC1751 Cu-1.91Ni-0.39Be 1.82 1.64 57 CuBe11 JISC1751 Cu-1.91Ni-0.39Be 2.45 3.25 Bonding conditions Amount of Degree of deformation Pressure vacuum during Ex. Surface treatment Temp. time (MPa) (Torr) bonding (%) 47 30% Nitric acid 900 C. 1 h 12 5 10.sup.4 16.1 48 30% Nitric acid 900 C. 1 h 16 1 10.sup.1 24.6 49 Emery paper 900 C. 1 h 16 5 10.sup.4 21.5 #600 50 30% Nitric acid 780 C. 1 h 9 5 10.sup.4 5.9 51 30% Nitric acid 840 C. 1 h 16 5 10.sup.4 13.6 52 30% Nitric acid 840 C. 1 h 16 1 10.sup.1 15.1 53 30% Nitric acid 900 C. 1 h 16 5 10.sup.4 9.5 54 Emery paper 900 C. 1 h 16 5 10.sup.4 10.0 #600 55 20% Sulfuric acid 900 C. 1 h 16 5 10.sup.4 8.5 containing 3% of H.sub.2O.sub.2 56 Emery paper 900 C. 1 h 16 5 10.sup.4 6.4 #600 57 Buff 900 C. 1 h 16 5 10.sup.4 9.1 #320

Table 5B

(101) TABLE-US-00012 TABLE 5B After solution After bonding annealing (same (as bonded) as right column) Bonding Thickness (not aging-treated) interface (nm) of Bonding Bonding Copper alloy remains or oxide film at strength Breaking strength Breaking Ex. Alloy type not bonding part (MPa) position (MPa) position 47 AMPCO940 Remains 438 Base material (Corson copper) 48 AMPCO940 Remains 473 Base material (Corson copper) 49 AMPCO940 Remains 474 Base material (Corson copper) 50 AMPCO940 Remains 436 Bonding part (Corson copper) 51 AMPCO940 Remains 326 Bonding part (Corson copper) 52 AMPCO940 Remains 321 Bonding part (Corson copper) 53 AMPCO944 Remains 503 Bonding part (Corson copper) 54 AMPCO944 Remains 497 Bonding part (Corson copper) 55 CuBe11 Not 315 Base material 56 CuBe11 Not 289 Base material 57 CuBe11 Not 295 Base material After solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (500 C. 2 h.fwdarw. cooling in furnace) (Examples 47 to 54), or after solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (450 C. 3 h .fwdarw. cooling in furnace) (Examples 55 to 57) Bonding Thickness interface (nm) of oxide Bonding Electrical Thermal remains or film at strength Breaking conductivity conductivity Ex. not bonding part (MPa) position (IACS %) (W/mK) 47 Remains 0 657 Base material 41.6 177 48 Remains 0 597 Bonding part 42.7 181 49 Remains 638 Base material 42.3 180 50 Remains 609 Bonding part 41.9 178 51 Remains 593 Bonding part 42 179 52 Remains 632 Bonding part 41.4 176 53 Remains 0 807 Bonding part 31 136 54 Remains 863 Bonding part 29.8 131 55 Remains 0.5 717 Bonding part 56.6 234 56 Remains 698 Bonding part 55.7 230 57 Remains 702 Bonding part 55.2 229

Table 5C

(102) TABLE-US-00013 TABLE 5C Bonded body (Examples 47 to 54) subjected to solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (500 C. 2 h .fwdarw. cooling in furnace) after homogenization annealing (temperature below 8 h .fwdarw. cooling in furnace), or bonded body (Examples 55 to 57) subjected to solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (450 C. 3 h .fwdarw. cooling in furnace) after homogenization annealing (temperature below 8 h .fwdarw. cooling in furnace) 900 C. 930 C. Bonding Bonding interface Bonding Electrical interface Bonding Copper alloy remains strength Breaking conductivity remains strength Breaking Ex. Alloy type or not (MPa) position (IACS %) or not (MPa) position 47 AMPCO940 (Corson copper) 48 AMPCO940 (Corson copper) 49 AMPCO940 (Corson copper) 50 AMPCO940 (Corson copper) 51 AMPCO940 (Corson copper) 52 AMPCO940 (Corson copper) 53 AMPCO944 (Corson copper) 54 AMPCO944 (Corson copper) 55 CuBe11 Remains 730 Bonding part 56 CuBe11 57 CuBe11 Bonded body (Examples 47 to 54) subjected to solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (500 C. 2 h .fwdarw. cooling in furnace) after homogenization annealing (temperature below 8 h .fwdarw. cooling in furnace), or bonded body (Examples 55 to 57) subjected to solution annealing (930 C. 5 min .fwdarw. cooling with water) and aging treatment (450 C. 3 h .fwdarw. cooling in furnace) after homogenization annealing (temperature below 8 h .fwdarw. cooling in furnace) 960 C. 980 C. Bonding Bonding interface Bonding interface Bonding Electrical remains strength Breaking remains strength Breaking conductivity Ex. or not (MPa) position or not (MPa) position (IACS %) 47 Remains 646 Base material 48 Remains 622 Base material 49 50 51 52 53 Remains 878 Bonding part 54 55 Not 765 Base material Not 752 Base 55.8 material 56 Remains 715 Bonding part 57 Not 725 Bonding part Not 732 Base 56.3 material
<Evaluation of Hydrogen-Embrittlement-Resistant Property by Slow Strain Rate Tensile Test (SSRT)>

(103) Each of the copper alloy bonded bodies (CuBe11) prepared through the bonding and the solution aging in Examples 2, 17, and 18 was cut out to prepare a specimen in accordance with ASTM E8M Specimen 4 in such a way that the bonding part was at the central position of the specimen. Note that the homogenization treatment was not performed on those specimens. The slow strain rate tensile test was performed in accordance with ASTM-G-142 at a displacement rate of 0.001 mm/sec (a strain rate of 0.00005/sec) in the air or in 95 MPa hydrogen for smooth specimens. Note that in the slow strain rate tensile test for smooth specimens, the hydrogen-embrittlement-resistant property was evaluated by RRA (relative reduction of area). Table 6A shows the test results, FIGS. 9A and 9B show stress-stroke diagrams, and FIGS. 10A and 10B show SEM images obtained by observing a breaking surface of the specimen of Example 17. There was no change in tensile strength and reduction of area for each specimen under the air or under hydrogen and hydrogen embrittlement was not recognized. Fracture shown in FIGS. 10A and 10B occurred in the base material part, the fracture form is cup-and-corn fracture, and the breaking surface had a dimple shape characteristic of ductile fracture. These show that the bonded materials of the present invention exhibit favorable properties in that the bonded materials of the present invention have a high tensile strength and are superior in the hydrogen-embrittlement-resistant property.

(104) In addition, the hydrogen-embrittlement-resistant property of each of the copper alloy materials themselves to be used for preparing the copper alloy bonded bodies was also evaluated instead of the copper alloy bonded bodies. Specifically, each solution-annealed and aging-treated material of CuBe alloy 25 (material 1), CuBe alloy 11 (material 2), Corson copper AMPCO940 (material 3), and Corson copper AMPCO944 (material 4) was cut out to prepare a specimen in accordance with ASTM E8M Specimen 4. The slow strain rate tensile test was performed in accordance with ASTM-G-142 at a displacement rate of 0.001 mm/sec (a strain rate of 0.00005/sec) in the air or in 95 MPa hydrogen for smooth specimens. Note that in the slow strain rate tensile test for smooth specimens, the hydrogen-embrittlement-resistant property was evaluated by RRA (relative reduction of area). Table 6B shows the test results, and FIGS. 9C to 9E show stress-stroke diagrams. There was no change in tensile strength and reduction of area for each specimen under the air or under hydrogen and hydrogen embrittlement was not recognized. The fracture form is cup-and-corn fracture, and the breaking surface had a dimple shape characteristic of ductile fracture. These results show that these materials exhibit favorable properties as copper alloy materials to be used for preparing the copper alloy bonded materials of the present invention in that these materials have a high tensile strength after bonding and are superior in the hydrogen-embrittlement-resistant property.

Table 6A

(105) TABLE-US-00014 TABLE 6A Relative Strain tensile Specimen Alloy rate .sub.B strength number type (s.sup.1) Atmosphere (MPa) RTS Ex. 2 SJ58-B4 CuBe11 5.0 10.sup.5 Room temp., air 772 SJ58-B5 CuBe11 5.0 10.sup.5 Room temp., 95 MPa H.sub.2 798 1.03 SJ58-B6 CuBe11 5.0 10.sup.5 Room temp., 95 MPa H.sub.2 784 1.02 Ex. 17 SJ98-A01 CuBe11 5.0 10.sup.5 Room temp., air 761 SJ98-A02 CuBe11 5.0 10.sup.5 Room temp., 95 MPa H.sub.2 790 Ex. 18 SJ99-A01 CuBe11 5.0 10.sup.5 Room temp., air 779 1.02 SJ99-A02 CuBe11 5.0 10.sup.5 Room temp., 95 MPa H.sub.2 789 1.00 Relative Relative elongation reduction of Breaking (%) REL (%) area RRA position Ex. 2 12 21 Bonding part 26 2.19 42 2.00 Base material 23 1.93 25 1.19 Bonding part Ex. 17 18 25 Bonding part 22 20 Base material Ex. 18 24 1.37 38 1.52 Base material 23 1.88 35 1.75 Base material

Table 6B

(106) TABLE-US-00015 TABLE 6B Strain Specimen Alloy rate .sub.B number type (s.sup.1) Atmosphere (MPa) Material 1 A1801-1 CuBe25ST 5.0 10.sup.5 Room temp., air 1182 A1801-2 CuBe25ST 5.0 10.sup.5 Room temp., 95 MPa H.sub.2 1178 Material 2 C64207-1 CuBe11AT 5.0 10.sup.5 Room temp., air 724 C64207-2 CuBe11AT 5.0 10.sup.5 Room temp., 95 MPa H.sub.2 734 Material 3 CNEA01 AMPCO940 5.0 10.sup.5 Room temp., air 676 (Corson copper) CNEA02 AMPCO940 5.0 10.sup.5 Room temp., 95 MPa H.sub.2 663 (Corson copper) Material 4 CNFA01 AMPCO944 5.0 10.sup.5 Room temp, air 854 (Corson copper) CNFA03 AMPCO944 5.0 10.sup.5 Room temp., 95 MPa H.sub.2 860 (Corson copper) Relative Relative tensile Relative reduction strength elongation of area RTS (%) REL (%) RRA Material 1 8 13 1.00 9 1.18 20 1.54 Material 2 26 47 1.01 25 0.95 47 1.00 Material 3 14 23 0.98 16 1.12 29 1.26 Material 4 10 23 1.01 12 1.17 26 1.13

Examples 58 to 67

(107) Bonded body samples including a flow passage space inside were prepared under various conditions and evaluated.

(108) <Studies on Bonding Conditions for Alleviating Crush of Flow Passage>

(109) A plurality of copper alloy plates (cast products) of alloy types and compositions shown in Table 7 and of a thickness of 1.6 mm and a size of 50 mm50 mm was provided. A groove having an arch-shaped section of a size of 2.4 mm in width1.2 mm in depth for forming a flow passage space was formed by etching on the surfaces of half of the copper alloy plates. An oxide film on each bonding surface was removed with 30% nitric acid, and then the copper alloy plate with a groove and the copper alloy plate without a groove were alternately stacked or the alloy boards including a groove on each surface were alternately stacked, and then diffusion-bonded by hot-pressing under bonding conditions and amount of deformation during bonding shown in Table 7. Thus, intermediate bonded bodies having a flow passage space were obtained. The degree of crush of each flow passage and the bonding state were evaluated by observation with a microscope for the obtained intermediate bonded bodies. Diffusion bonding is more favorably performed as the temperature is higher, but as can be seen from the results shown in Table 7, with respect to the hollow bodies of the present examples, in which a flow passage was formed, there is a tendency that the crush is remarkable and the flow passage is narrow and even blocked at high temperatures and high pressures. To alleviate such crush, bonding conditions of a temperature of 840 C. or lower and a pressure of 5 MPa or higher are considered to be preferable for the hollow bodies. In addition, when the bonding state was observed with a microscope for the intermediate bonded bodies, disappearance of the bonding surface was confirmed under bonding conditions of a high temperature and a high pressure, but the bonding surface was confirmed to remain irrespective of bonding pressure as the temperature was decreased. However, as demonstrated by the above-described Examples, the homogenization treatment at a high temperature enables disappearance of the bonding surface. Accordingly, in the production of a bonded body including a flow passage space, it can be said to be advantageous to perform a high-temperature homogenization treatment after performing bonding at a high load and at a somewhat lower temperature to such an extent that the crush of a flow passage is suppressed.

Table 7

(110) TABLE-US-00016 TABLE 7 Amount of Copper alloy Bonding conditions deformation Degree of Alloy Alloy composition Pressure during bonding crush of flow Ex. type (% by weight) Temp. time (MPa) (%) passage 58 CuBe11 Cu-1.89Ni-0.43Be 900 C. 1 h 12 19.4 Large (crushed) 59 900 C. 1 h 6 10.7 Large 60 900 C. 1 h 3 7.8 Moderate 61 840 C. 1 h 6 11.0 Moderate 62 840 C. 1 h 3 5.7 Small 63 810 C. 1 h 3 5.9 Small 64 760 C. 1 h 24 13.5 Large 65 700 C. 1 h 8 3.5 Minimum 66 700 C. 1 h 24 8.4 Small 67 640 C. 1 h 24 1.7 Minimum

(111) To support this, the following experiment including performing a high-temperature homogenization treatment on the intermediate bonded body of Example 62 was conducted. First of all, a homogenization treatment (high-temperature soaking) was performed at 980 C. for 8 hours on the intermediate bonded body which was prepared in Example 62 (840 C., 3 Pa) and includes a flow passage space. This intermediate bonded body was held at 930 C. for 5 minutes and cooled with water (solution annealing). The resultant bonded body was held at 450 C. for 3 hours and then cooled in a furnace (aging treatment). Thus, a copper alloy bonded body (including a flow passage) on which the homogenization treatment and the solution aging had been performed was obtained. FIG. 11 shows optical microscope images obtained by observing a section including the bonding part near a flow passage of the prepared copper alloy bonded body of Example 62. As shown in FIG. 11, disappearance of the bonding interface was confirmed in the bonded body on which the homogenization treatment had been performed. As described above, when the homogenization treatment is performed after diffusion bonding, the bonding interface disappears and becomes indistinguishable from the base material, resulting in complete homogenization (in other words, crystal grains of the age-hardenable copper alloy grown beyond the former bonding interface are present at the bonding part.). Therefore, when a tensile test is performed, fracture of the base material, not at the bonding surface, occurs (however, even when the homogenization treatment is not performed, fracture of the base material occurs in some bonded bodies, and therefore the homogenization treatment is not essential for crystal grain growth beyond the former bonding interface.). Accordingly, as described above, when bonding at a low temperature and at a high load, which hardly causes crush of a flow passage, is performed, the bonding surface is confirmed to remain, but performing a high-temperature homogenization treatment enables disappearance of the bonding surface.