METHOD OF MANUFACTURING DISPLAY PANEL
20230165048 ยท 2023-05-25
Inventors
Cpc classification
H10K59/8731
ELECTRICITY
H10K71/00
ELECTRICITY
International classification
Abstract
A method of manufacturing a display panel includes fabricating a display portion on a glass substrate; forming a barrier layer on the glass substrate outside the display portion; forming an encapsulation film on the barrier layer and the display portion; and obtaining a panel area by removing the barrier layer and the encapsulation film outside a predetermined limited area on the glass substrate. The predetermined limited area corresponds to the display portion.
Claims
1. A method of manufacturing a display panel, comprising: fabricating a display portion on a glass substrate; forming a barrier layer on the glass substrate outside the display portion, wherein the barrier layer is adhesively attached to the glass substrate outside the display portion; forming an encapsulation film on the barrier layer and the display portion; separating the barrier layer and the encapsulation film outside a predetermined limited area on the glass substrate from the barrier layer and the encapsulation film in the predetermined limited area; and obtaining, by peeling away the barrier layer and the encapsulation film outside the predetermined limited area, a panel area, wherein the predetermined limited area corresponds to the display portion.
2. The method of manufacturing the display panel of claim 1, wherein the barrier layer and the encapsulation film outside the predetermined limited area on the glass substrate are separated from the barrier layer and the encapsulation film in the predetermined limited area through a laser cutting method along a predetermined cutting line, wherein the predetermined cutting line corresponds to a position of an edge of the predetermined limited area.
3. The method of manufacturing the display panel of claim 1, wherein the predetermined limited area has an orthographic projection on the glass substrate with an area greater than that of an orthographic projection of the display portion on the glass substrate.
4. The method of manufacturing the display panel of claim 1, wherein the barrier layer is spaced apart from the display portion.
5. The method of manufacturing the display panel of claim 4, wherein a distance between the barrier layer and the display portion is defined according to a predetermined frame width of the display panel.
6. The method of manufacturing the display panel of claim 1, wherein the display portion comprises a display area, and the forming the encapsulation film on the barrier layer and the display portion comprises: forming a first inorganic layer on the barrier layer and the display portion; forming an organic layer on the first inorganic layer corresponding to the display area; and forming a second inorganic layer on the organic layer, wherein the second inorganic layer covers the first inorganic layer.
7. The method of manufacturing the display panel of claim 1, wherein an adhesion force between the barrier layer and the glass substrate is less than a preset value.
8. The method of manufacturing the display panel of claim 1, wherein the barrier layer is configured to block moisture and oxygen and to protect the glass substrate.
9. A method of manufacturing a display panel, comprising: fabricating a display portion on a glass substrate; forming a barrier layer on the glass substrate outside the display portion; forming an encapsulation film on the barrier layer and the display portion; and obtaining, by removing the barrier layer and the encapsulation film outside a predetermined limited area on the glass substrate, a panel area, wherein the predetermined limited area corresponds to the display portion.
10. The method of manufacturing the display panel of claim 9, wherein the removing the barrier layer and the encapsulation film outside the predetermined limited area on the glass substrate comprises: separating the barrier layer and the encapsulation film outside the predetermined limited area from the barrier layer and the encapsulation film in the predetermined limited area; and peeling away the barrier layer and the encapsulation film outside the predetermined limited area.
11. The method of manufacturing the display panel of claim 10, wherein the barrier layer and the encapsulation film outside the predetermined limited area on the glass substrate are separated from the barrier layer and the encapsulation film in the predetermined limited area through a laser cutting method along a predetermined cutting line, wherein the predetermined cutting line corresponds to a position of an edge of the predetermined limited area.
12. The method of manufacturing the display panel of claim 9, wherein the predetermined limited area has an orthographic projection on the glass substrate with an area greater than that of an orthographic projection of the display portion on the glass substrate.
13. The method of manufacturing the display panel of claim 9, wherein the barrier layer is spaced apart from the display portion.
14. The method of manufacturing the display panel of claim 13, wherein a distance between the barrier layer and the display portion is defined according to a predetermined frame width of the display panel.
15. The method of manufacturing the display panel of claim 9, wherein the display portion comprises a display area, and the forming the encapsulation film on the barrier layer and the display portion comprises: forming a first inorganic layer on the barrier layer and the display portion; forming an organic layer on the first inorganic layer corresponding to the display area; and forming a second inorganic layer on the organic layer, wherein the second inorganic layer covers the first inorganic layer.
16. The method of manufacturing the display panel of claim 15, wherein the first inorganic layer is made of a material comprising at least one of silicon nitride, silicon oxide, and aluminum oxide.
17. The method of manufacturing the display panel of claim 9, wherein the barrier layer is adhesively attached to the glass substrate outside the display portion.
18. The method of manufacturing the display panel of claim 17, wherein an adhesion force between the barrier layer and the glass substrate is less than a preset value.
19. The method of manufacturing the display panel of claim 9, wherein the barrier layer is configured to block moisture and oxygen and to protect the glass substrate.
20. The method of manufacturing the display panel of claim 9, wherein the display portion comprises a switch array layer and an organic light-emitting display layer.
Description
BRIEF DESCRIPTION OF DRAWINGS
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DESCRIPTION OF PREFERRED EMBODIMENTS
[0017] The following embodiments are referring to the accompanying drawings for exemplifying specific implementable embodiments of the present invention. Directional terms described by the present invention, such as upper, lower, front, back, left, right, inner, outer, side, etc., are only directions by referring to the accompanying drawings, and thus the used directional terms are used to describe and understand the present invention, but the present invention is not limited thereto.
[0018] As shown in
[0019] Please refer to
[0020] A method of manufacturing a display panel in the embodiment of the present invention includes:
[0021] S101: fabricating a display portion on a glass substrate.
[0022] Specifically, as shown in
[0023] S102: forming a barrier layer on the glass substrate outside the display portion.
[0024] Specifically, as shown in
[0025] In one embodiment, in order to facilitate subsequent processes and to simplify the processes, the barrier layer 23 is adhesively attached to the glass substrate 10 outside the display portion 20. In order to remove the barrier layer, an adhesion force between the barrier layer 23 and the glass substrate 10 is less than a preset value. That is, the adhesion force between the barrier layer 23 and the glass substrate 10 is relatively small.
[0026] The barrier layer 23 is configured to block moisture and oxygen and to protect the glass substrate. Specifically, the barrier layer protects the glass substrate from being damaged during a subsequent laser cutting process.
[0027] S103: forming an encapsulation film on the barrier layer and the display portion.
[0028] Specifically, as shown in
[0029] S1031: forming a first inorganic layer on the barrier layer and the display portion.
[0030] For example, a first inorganic layer 31 is formed on the barrier layer 23 and the display portion 20, wherein the first inorganic layer 31 is made of a material including at least one of silicon nitride, silicon oxide, and aluminum oxide.
[0031] S1032: forming an organic layer on the first inorganic layer corresponding to the display area.
[0032] For example, in one embodiment, an organic layer 32 is formed on the first inorganic layer 31 by inkjet printing, and a position of the organic layer 32 corresponds to positions of a plurality of the display areas 201. That is, the organic layer 32 is disposed on the first inorganic layer corresponding to one of the display areas.
[0033] S1033: forming a second inorganic layer on the organic layer.
[0034] For example, a second inorganic layer 33 is formed on the organic layer 32, wherein the second inorganic layer 33 covers the first inorganic layer 31. That is, the second inorganic layer 33 is disposed on the organic layer 32 and on the first inorganic layer 31 not covered by the organic layer 32. The second inorganic layer 33 may cover the first inorganic layer 31 and the organic layer 32. The second inorganic layer 33 is made of a material including at least one of silicon nitride, silicon oxide, and aluminum oxide. It can be understood that a structure of the encapsulation film is not limited to the above.
[0035] S104: obtaining a panel area by removing the barrier layer and the encapsulation film outside the predetermined limited area.
[0036] Further referring to
[0037] S1041: separating the barrier layer and the encapsulation film outside the predetermined limited area from the barrier layer and the encapsulation film in the predetermined limited area.
[0038] For example, as shown in
[0039] In one embodiment, the step may include:
[0040] S201: the barrier layer and the encapsulation film outside the predetermined limited area on the glass substrate are separated from the barrier layer and the encapsulation film in the predetermined limited area through a laser cutting method along a predetermined cutting line.
[0041] For example, as shown in
[0042] The laser cutting method can be implemented using a carbon dioxide (CO2) laser cutting machine.
[0043] S1042: peeling away the barrier layer and the encapsulation film outside the predetermined limited area.
[0044] For example, as shown in
[0045] A method of manufacturing a display panel of the present invention is implemented by fabricating a display portion on a glass substrate; forming a barrier layer on the glass substrate outside the display portion; forming an encapsulation film on the barrier layer and the display portion; and removing the barrier layer and the encapsulation film outside a predetermined limited area on the glass substrate to obtain a panel area, wherein the predetermined limited area corresponds to the display portion. Because a film formation area of inorganic layers is defined by forming a barrier layer outside the display portion, outer edges of the inorganic layers can be prevented from expanding, thereby reducing a frame of the display panel.
[0046] Accordingly, although the present invention has been disclosed as a preferred embodiment, it is not intended to limit the present invention. Those skilled in the art without departing from the spirit and scope of the present invention may make various changes or modifications, and thus the scope of the present invention should be after the appended claims and their equivalents.