Abstract
An apparatus and method for establishing a contact connection between at least one connection contact of a substrate and at least one connection contact of a semiconductor component, a conductor material web being formed on the substrate and the semiconductor component. The apparatus includes a joining tool for positioning and joining the semiconductor component on/to the substrate, a beam channel for optical radiation being formed within the joining tool, a laser device for applying laser radiation to the substrate and/or to the semiconductor component, a detection device for detecting optical radiation, and a substrate receptacle on which the substrate is fixed in place and with which at least one underside of the substrate can be brought into contact. An optical window having an optically transparent window body is incorporated in the substrate receptacle for the unobstructed passage of optical radiation into and/or out of the substrate, the optical window being disposed in a beam path of the laser device and/or in a beam path of the detection device.
Claims
1. An apparatus for establishing a contact connection between at least one connection contact of a substrate and at least one connection contact of a semiconductor component, a conductor material web being formed on the substrate and the semiconductor component, the apparatus comprising a joining tool for positioning and joining the semiconductor component on/to the substrate, a beam channel for optical radiation being formed within the joining tool, the apparatus comprising a laser device for applying laser radiation to the substrate and/or to the semiconductor component, and the apparatus further comprising a detection device for detecting optical radiation, and the apparatus further comprising a substrate receptacle on which the substrate is fixed in place and with which at least one underside of the substrate is brought into contact, wherein an optical window having an optically transparent window body is incorporated in the substrate receptacle for the unobstructed passage of optical radiation into and/or out of the substrate, the optical window being disposed in a beam path of the laser device and/or in a beam path of the detection device.
2. The apparatus according to claim 1, wherein the detection device comprises an infrared sensor unit and/or an image capturing unit.
3. The apparatus according to claim 2, wherein the optical window is disposed in a beam path of the laser device and the beam channel of the joining tool is disposed in the beam path of the infrared sensor unit.
4. The apparatus according to claim 2, wherein the optical window is disposed in a beam path of the infrared sensor unit and the beam channel of the joining tool is disposed in the beam path of the laser device.
5. The apparatus according to claim 2, wherein the optical window is disposed in a beam path of the image capturing unit and the beam channel of the joining tool is disposed in the beam path of the laser device and the infrared sensor unit, such that a beam path of the laser device and a beam path of the infrared sensor unit simultaneously pass through at least sections of the beam channel.
6. The apparatus according to claim 1, wherein the laser device and/or the detection device is/are disposed on a tool table capable of being displaced along at least two axes.
7. The apparatus according to claim 1, further comprising a base plate and at least one base for distancing the substrate receptacle from the base plate.
8. The apparatus according to claim 1, wherein the optical window lines up flush with the substrate receptacle on at least one side and forms a shared flat surface with the substrate receptacle, said shared flat surface being brought into contact with the underside of the substrate.
9. The apparatus according to claim 1, wherein the optical window is made of glass and/or has an anti-reflection coating.
10. A method for establishing a contact connection between at least one connection contact of a conductor material web and at least one connection contact of a semiconductor component, the conductor material web being formed on a non-conducting substrate, the substrate being fixed in place on a substrate receptacle in such a manner that an underside of the substrate is brought into contact with the substrate receptacle, and a semiconductor component being positioned on the substrate by a joining tool, and the substrate being subjected to laser radiation in order to at least partly melt the connection contacts and in order to create a substance-to-substance bond between the connection contacts of the conductor material web and the semiconductor component, and an optical radiation being detected by a detection device for detecting the position of the substrate and/or for detecting the position of the semiconductor component and/or for measuring the temperature of the substrate and/or for measuring the temperature of the semiconductor component, wherein at least one beam path of an optical radiation being guided into and/or out of the substrate through a window having an optically transparent window body, said window being inserted in the substrate receptacle, and a beam path of another optical radiation being guided through a beam channel formed within the joining tool.
11. The method according to claim 10, wherein at least one fiducial marker disposed on the substrate and/or on the semiconductor component is detected by the detection device, and the substrate, the semiconductor component and/or beam path of the optical radiation are aligned on the basis of the at least one detected fiducial marker.
12. The method according to claim 11, wherein the at least one fiducial marker is detected by of an infrared sensor unit on the basis of the infrared radiation reflected by the at least one fiducial marker when subjected to heat.
13. The method according to claim 10, wherein a measurement of the temperature of at least one connection contact of the substrate and/or at least one connection contact of the semiconductor component is carried out by an infrared sensor unit by measuring the infrared radiation reflected from a reference surface of the connection contacts.
14. The method according to claim 10, wherein the semiconductor component is applied to an at least partly transparent substrate and the detection of the at least one fiducial marker is carried out through the optical window and the substrate.
15. The method according to claim 10, wherein the laser device and/or the detection device are displaced along at least two axes for being aligned relative to the substrate.
16. The apparatus according to claim 1, wherein the semiconductor component is a chip.
17. The method according to claim 10, wherein the semiconductor component is a chip.
18. The method according to claim 15, wherein the laser device and/or the detection devices are below the optical window.
Description
BRIEF DESCRIPTION OF THE FIGURES
[0043] Embodiments are schematically illustrated in the drawings and are described in an exemplary manner hereinafter.
[0044] FIG. 1 shows a first schematic illustrative example of an apparatus according to this disclosure.
[0045] FIG. 2 shows a second schematic illustrative example of an apparatus according to this disclosure.
[0046] FIG. 3 shows a third schematic illustrative example of an apparatus according to this disclosure.
[0047] FIG. 4 shows a fourth schematic illustrative example of an apparatus according to this disclosure.
DETAILED DESCRIPTION
[0048] FIGS. 1 and 2 both show an embodiment of the apparatus according to this disclosure for establishing a contact connection 22 between at least one connection contact 18 of a substrate 04 and at least one connection contact 19 of a semiconductor component 03, semiconductor component 03 being a chip. It can be seen in FIGS. 1 and 2 that an optical window 06, which allows the rearward application of optical radiation to substrate 04, is incorporated in substrate receptacle 05. Laser radiation is applied to underside 41 of substrate 04 by means of laser device 07, which, in addition to laser emitter 09, comprises a lens system 08. Beam path 10 of laser device 07 passes through optical window 06 onto underside 41 of substrate 04. According to the embodiments shown in FIGS. 1 and 2, semiconductor component 03 and in particular connection contacts 19 of semiconductor component 03 can be subjected to laser radiation through optical window 06 and substrate 04 and can be at least partly melted by means of the energy input of the laser radiation. It is conceivable that the substrate is transparent for this purpose. By means of joining tool 02, semiconductor component 03 can be positioned and disposed on substrate 04. After semiconductor component 03 has been applied to substrate 04, at least partly melted connection contacts 19 create a contact connection 22 between semiconductor component 03 and substrate 04, preferably a conductor material web (not shown) formed on substrate 04. For measuring the temperature of semiconductor component 03 and/or for detecting the position of semiconductor component 03 relative to substrate 04, an infrared sensor unit 17 is disposed above substrate 04, beam path 15 of infrared sensor unit 17 passing through beam channel 20 formed within joining tool 02. As can be seen in FIGS. 1 and 2, the reflected radiation reflected by semiconductor component 03 and passing through beam channel 20 is detected by infrared sensor unit 17 and is evaluated to determine the temperature and/or position. Furthermore, the embodiments according to FIGS. 1 and FIG. 2 of apparatus 01 for establishing a contact connection 22 have a tool table 11 displaceable in the X-Y direction. The travel path in the Y direction runs into the image plane, the travel path in the X direction runs perpendicular thereto, and another possible travel path in the Z direction runs perpendicular to the X and Y directions and from base plate 13 towards substrate receptacle 05. The arrangement of substrate receptacle 05 on bases 12, which connect substrate receptacle 05 to base plate 13, serves to provide the required space to be able to arrange laser device 07 below substrate receptacle 05 and optical window 06. It can also be seen from FIGS. 1 and 2 that optical window 06 is flush with the upper side of substrate receptacle 05, at least on its upper side facing substrate 04. This makes it possible to form a flat supporting surface for substrate underside 41 on the upper side of substrate receptacle 05 or of optical window 06.
[0049] The first illustrative example according to FIG. 1 and the second illustrative example according to FIG. 2 of the apparatus according to this disclosure essentially differ in the different arrangement of tool table 11 and laser device 07. In the first illustrative example, which is shown in FIG. 1, bases 12 are disposed on tool table 11, whereby substrate receptacle 05 is displaceable in the X-Y direction by means of tool table 11. This makes it easy to position substrate 04 relative to laser device 07 and joining tool 02 and thus also to semiconductor component 03. Furthermore, laser device 07 of the first illustrative example of the apparatus according to this disclosure has a laser emitter 09 and a lens system 08, lens system 08 and laser emitter 09 being disposed below optical window 06 or substrate 04 such that a deflection of laser radiation is not required and thus beam path 10 hits substrate underside 41 directly, without being deflected, or beam path 10 hits semiconductor component 03 directly after passing through substrate 04.
[0050] In contrast, laser device 07 according to the second illustrative example shown in FIG. 2 has, in addition to laser emitter 09 and lens system 08, a deflection mirror 21, which deflects the laser radiation after passing through lens system 08 and thus directs it onto substrate 04. Thus, beam path 10 of the laser radiation first runs in the X direction, starting from laser emitter 09, up to deflection mirror 21, and from there the beam path continues in the Z direction towards substrate 04. It can also be seen from FIG. 2 that, according to the second illustrative example, laser device 07 is disposed on tool table 11 and can thus be moved in the X-Y direction. Thus, according to the second illustrative example, laser device 07 can be positioned relative to substrate 04 in a simple manner.
[0051] FIG. 3 shows a third illustrative example of the apparatus according to this disclosure. Laser device 07 is disposed in the Z direction above substrate 04 and in such a way that beam path 10 of laser device 07 passes through beam channel 20 of joining tool 02. Laser device 07 has a laser emitter 09 for emitting a laser radiation and a lens system 08 for beam widening or beam focusing. It can be seen in FIG. 3 that a semiconductor component 03 is already connected to substrate 04 via two connection contacts 19 or is conductively connected to a conductor material web (not shown) formed on substrate 04. Another semiconductor component 03 is held by joining tool 02, for example by a negative pressure, and can be positioned on substrate 04 by means of joining tool 02. For at least partly melting connection contacts 19, semiconductor component 03 held on joining tool 02 is exposed to laser radiation from above through beam channel 20. The joining process, in particular the melting of connection contacts 19, is monitored by infrared sensor unit 17. Infrared sensor unit 17 detects an infrared radiation reflected from substrate 04 and/or semiconductor component 03 to detect the temperature and/or the position of semiconductor 03 relative to substrate 04. In addition, infrared sensor unit 17 can recognize the fiducial marker (not shown) arranged on substrate 04 on the basis of its reflected radiation and can thus also monitor the correct positioning of substrate 04 relative to substrate receptacle 05 and/or relative to joining tool 02 or semiconductor component 03 held thereon. According to the third illustrative example, infrared sensor unit 17 is disposed below substrate receptacle 05, whereby beam path 15 of infrared sensor unit 17 passes through optical window 06 towards substrate 04. Disposing infrared sensor unit 17 is made possible by the fact that substrate receptacle 05 is disposed on bases 12, which distance substrate receptacle 05 from base plate 13 of apparatus 01. Optical window 06 is incorporated in substrate receptacle 05 in such a manner that substrate underside 41 can rest on the upper side of substrate receptacle 05 and on the upper side of optical window 06 in a flush manner. In order to be able to position substrate receptacle 05 and thus substrate 04 in a simple manner relative to infrared sensor unit 17 and/or joining tool 02, bases 12, on which substrate receptacle 05 is disposed, are connected to a tool table 11 which can be moved at least in the X-Y direction.
[0052] FIG. 4 shows a fourth illustrative example of apparatus 01 according to this disclosure. According to the fourth illustrative example, substrate receptacle 05 is again distanced from base plate 13 by bases 12, substrate receptacle 05 being displaceable in the X-Y direction by disposing base 12 on a tool table 11. Substrate 04 comes into contact with substrate underside 41 both on the upper side of substrate receptacle 05 and on the upper side of optical window 06 integrated in substrate receptacle 05. According to the shown fourth illustrative example, the detection device has both an infrared sensor unit 17 and an image capturing unit realized as a camera 14. Camera 14 is disposed below substrate receptacle 05 between base plate 13 and substrate receptacle 05, such that the radiation detected by camera 14 or beam path 16 of camera 14 passes through optical window 06 and transparent substrate 04. Thus, both the positioning of substrate 04 on substrate receptacle 05 and the positioning of semiconductor component 03 relative to substrate 04 can be monitored from below substrate receptacle 05 by means of camera 14. Thus, the positioning of substrate 04 can be easily monitored based on fiducial markers, which can be detected by camera 14. One semiconductor component 03 is already disposed on substrate 04 and another semiconductor component 03 is held on joining tool 02 for being positioned on substrate 04. To at least partly melt connection contacts 19 of semiconductor component 03, laser radiation is applied to semiconductor component 03, the energy input of the laser radiation into semiconductor component 03 melting connection contacts 19. For the application of laser radiation, laser device 07 has a laser emitter 09 and a lens system 08. It can be seen that beam path 10 of the laser radiation passes through beam channel 20 of joining tool 02, and thus beam channel 20 is disposed in beam path 10 of laser device 07 disposed above substrate receptacle 05. Furthermore, apparatus 01 has an infrared sensor unit 17 which, for measuring the temperature of semiconductor component 03 and/or substrate 04, detects an infrared radiation reflected by semiconductor component 03 and/or substrate 04. Infrared beam path 15 is deflected by deflection mirror 21, so that the reflected radiation hits infrared sensor unit 17, which is not arranged perpendicular above semiconductor component 03, but so as to be offset. By disposing laser device 07 and infrared sensor unit 17 above substrate 04, both beam path 15 of infrared sensor unit 17 and beam path 10 of laser device 07 simultaneously pass through at least sections of beam channel 20. Since, according to the fourth illustrative example shown in FIG. 4, the apparatus comprises a camera 14 and a detection device comprising infrared sensor unit 17, the joining process, in particular the temperature of the joining partners and the positioning of the joining partners, can be detected particularly reliably. The simultaneous use of camera 14 and infrared sensor unit 17 is made possible by the fact that at least one beam path 10, 15, 16, in this case beam path 16 of camera 14, passes through optical window 06 and the optical radiation can thus be detected below substrate receptacle 05.
