PACKAGE FOR DISPLAY DEVICE

Abstract

Disclosed is a package for a display device. The package for a display device includes a body portion in which the display device is stored, and a support portion detachably coupled to the body portion and being in contact with at least a portion of the display device. The support portion includes a coupler detachably coupled to the body portion, a buffer disposed on a surface of the coupler, and a contact portion disposed on a surface of the buffer and having a hardness greater than a hardness of the buffer.

Claims

1. A package for a display device, the package comprising: a body portion in which the display device is stored; and a support portion detachably coupled to the body portion and being in contact with at least a portion of the display device, wherein the support portion includes: a coupler detachably coupled to the body portion; a buffer disposed on a surface of the coupler; and a contact portion disposed on a surface of the buffer and having a hardness greater than a hardness of the buffer.

2. The package of claim 1, wherein the hardness of the contact portion is a shore hardness within a range of about 75 to about 85.

3. The package of claim 1, wherein the hardness of the buffer is a shore hardness within a range of about 60 to about 72.

4. The package of claim 1, wherein the support portion further includes an adhesive member located between the buffer and the contact portion.

5. The package of claim 1, wherein the contact portion is in direct contact with the surface of the buffer.

6. The package of claim 1, wherein the buffer and the contact portion include different materials.

7. The package of claim 1, wherein the coupler further includes: a first connector; and a first fixing portion which protrudes from the first connector and in which the buffer is located.

8. The package of claim 7, wherein the coupler further includes a protrusion protruding from the first connector and inserted into the body portion.

9. The package of claim 1, wherein the coupler includes polycarbonate.

10. The package of claim 1, wherein the contact portion includes at least one of epoxy and silicon.

11. The package of claim 1, wherein a hardness of the coupler is a shore hardness equal to or greater than 80.

12. The package of claim 1, wherein a mixed hardness measured in a state in which the contact portion is located on the buffer is a shore hardness equal to or greater than 75.

13. A package for a display device, the package comprising: a body portion in which the display device is stored; and a support portion detachably coupled to the body portion and being in contact with at least a portion of the display device, wherein the support portion includes: a buffer disposed on a surface of the body portion; and a contact portion disposed on a surface of the buffer and having a hardness greater than a hardness of the buffer.

14. The package of claim 13, wherein the hardness of the contact portion is a shore hardness within a range of about 75 to about 85.

15. The package of claim 13, wherein the hardness of the buffer is a shore hardness within a range of about 60 to about 72.

16. The package of claim 13, wherein the support portion further includes an adhesive member located between the buffer and the contact portion.

17. The package of claim 13, wherein the support portion is in direct contact with the surface of the buffer.

18. The package of claim 13, wherein the buffer and the support portion include different materials.

19. The package of claim 13, wherein the buffer further includes: a connector; and a fixing portion which protrudes from the connector and in which the contact portion is located.

20. The package of claim 19, wherein a portion of the fixing portion, on which the contact portion is located, protrudes toward the contact portion from the connector.

21. The package of claim 13, wherein a planar shape of the body portion is square, and the support portion is located at a corner of the body portion.

22. The package of claim 13, wherein the buffer includes expanded polypropylene.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings.

[0031] FIG. 1 is a schematic perspective view of a package for a display device according to an embodiment.

[0032] FIG. 2 is a schematic perspective view of a support portion shown in FIG. 1.

[0033] FIGS. 3A and 3B are cross-sectional views of the support portion taken along a line III-III of FIG. 2.

[0034] FIG. 4 is a schematic perspective view of a package for a display device according to an embodiment.

[0035] FIG. 5 is a schematic perspective view of a support portion shown in FIG. 4.

[0036] FIG. 6 is a schematic cross-sectional view of a stored display device in FIG. 1 or FIG. 4.

[0037] FIG. 7 is a schematic plan view showing a display panel shown in FIG. 6.

[0038] FIG. 8 is a cross-sectional view of a portion of the display panel shown in FIG. 6.

DETAILED DESCRIPTION

[0039] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are merely described below, by referring to the figures, to explain aspects of the present description. As used herein, the term and/or includes any and all combinations of one or more of the associated listed items. Throughout the disclosure, the expression at least one of a, b or c indicates only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0040] As the disclosure allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. The attached drawings for illustrating embodiments are referred to gain a sufficient understanding of embodiments, the merits thereof, and the features accomplished by the implementation of the disclosure. However, the disclosure is not limited to the embodiments disclosed below, but may be implemented in various different forms.

[0041] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, and when describing with reference to the drawings, the same or corresponding components are given the same reference numerals, and repeated descriptions thereof will be omitted.

[0042] In the following embodiments, terms such as first and second are used for the purpose of distinguishing one component from another component without a limiting meaning.

[0043] In the following embodiments, the singular expressions include the plural expressions unless clearly specified otherwise in context.

[0044] In the following embodiments, terms such as include or have represent that the features or elements described in the specification exist, and do not preclude the possibility that one or more other features or elements may be added.

[0045] In the following embodiments, when various components such as a film, a region, and a component are referred to as being on other components, this includes the case in which the components is directly on other components as well as the case in which other components are located therebetween.

[0046] For convenience of explanation, in the drawings, the size of components may be exaggerated or reduced. For example, sizes and thicknesses of the elements shown in the drawings are for the purpose of descriptive convenience, and thus the disclosure is not necessarily limited thereto.

[0047] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes in the Cartesian coordinate system, but may be interpreted in a broad sense including these. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may also refer to different directions that are not orthogonal to each other.

[0048] When it is possible to differently implement an embodiment, a certain process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially at the same time, or may be performed in an order opposite to the order in which they are described.

[0049] FIG. 1 is a schematic perspective view of a package 100 for a display device DP according to an embodiment.

[0050] Referring to FIG. 1, the package 100 for the display device DP may include a body portion 110 and a support portion 120.

[0051] The body portion 110 may provide a space within which the display device DP is stored. In this case, a planar shape of the body portion 110 may be formed in various ways depending on a planar shape of the display device DP. For example, the planar shape of the body portion 110 may be circular, oval, or polygonal. According to an embodiment, the planar shape of the body portion 110 may be irregular, excluding circular, oval, and polygonal shapes, such as a star shape. Hereinafter, for convenience of explanation, a detailed description will be given in terms of the case in which the planar shape of the body portion 110 is square.

[0052] The body portion 110 may include a support protrusion 113 protruding into the space of the body portion 110 and an insertion portion 111 into which the support portion 120 is inserted. In this case, the support protrusion 113 may protrude from a surface of the body 110 into the space of the body portion 110 and may be provided in a plurality of support protrusions that are located apart from each other on the surface of the body portion 110. In this case, when the display device DP moves within the space of the body portion 110 during movement of the package 100, sometimes called the display device package 100, the support protrusion 113 may selectively be in contact with the display device DP or may be maintained in contact with the display device DP with less force than a force generated when the support portion 120 is in contact with the display device DP, thereby reducing the movement of the display device DP. The body portion 110 may include a damping portion 112 located at at least one of corners of the body portion 110. The damping portion 112 may have a space formed therein.

[0053] The support portion 120 may be detachably coupled to the body portion 110. In this case, the support portion 120 may be located at various portions of the body portion 110 and may be in contact with lateral surfaces of the display device DP. The support portion 120 may be in contact with at least one of the lateral surfaces of the display device DP, and thus the display device DP may be prevented from moving inside the body portion 110 after being located on the body portion 110. Hereinafter, for convenience of explanation, a detailed description will be given in terms of the case in which the support portion 120 is located at a corner of the body portion 110.

[0054] The support portion 120 may be provided in a plurality of support portions. In this case, the support portions 120 may be located to correspond to the corners of the body portion 110, respectively. The respective support portions 120 may be in contact with one or two different lateral surfaces of the display device DP. Hereinafter, for convenience of explanation, a detailed description will be given in terms of the case in which the respective support portions 120 are in contact with two different lateral surfaces of the display device DP.

[0055] The support portions 120 may be located at the corners of the body portion 110, respectively. The support portions 120 may be in contact with the display device DP at the corners of the body portion 110 to separate the surface of the body portion 110 from the display device DP.

[0056] Therefore, the package 100 for a display device may store the display device DP therein to reduce damage to the display device DP when the display device DP is moved. The package 100 for a display device may reduce movement of the display device DP.

[0057] Although not shown in the drawing, the package 100 for a display device may further include a cover that is coupled to the body portion 110 to shield the space inside the body portion 110. In this case, the cover may be formed in a similar shape to the body portion 110 and may be coupled to an entrance of the space formed in the body portion 110.

[0058] FIG. 2 is a schematic perspective view of a support portion shown in FIG. 1. FIGS. 3A and 3B are cross-sectional views of the support portion taken along a line III-III of FIG. 2.

[0059] Referring to FIGS. 2 to 3B, the support portion 120 includes a coupler 121, a buffer 122, and a contact portion 123.

[0060] The coupler 121 may be formed to correspond to the corner of the body portion 110 and may support movement of the contact portion 123 by a force applied to the contact portion 123 from the display device DP when the contact portion 123 is in contact with the display device DP. The coupler 121 may fix the positions of the buffer 122 and the contact portion 123 to some extent by being coupled to the body portion 110 and support the buffer 122 and the contact portion 123. The coupler 121 may include plastic such as polycarbonate (PC). In this case, the hardness of the coupler 121 may be equal to or greater than 80. The hardness of the coupler 121 may be Shore hardness. Shore hardness, using a Shore A scale, measures the hardness of a material by measuring a resistance of the material to indentation using a durometer. The shore hardness scale operates within a numeric range of 00 to 100, with 00 being the softest material and 100 being the hardest. When the hardness of the coupler 121 is less than 80, the coupler 121 may not provide sufficient support and coupling force after being coupled to the body portion 110. The coupler 121 as described above is not limited to the above materials and may include any material that satisfies the hardness described above.

[0061] The coupler 121 may include a first connecter 121a, a first fixing portion 121b, and a protrusion 121c. The first connecter 121a may be located at the corner of the body portion 110 and may be connected to each of the first fixing portion 121b and the protrusion 121c. In this case, a portion of the first connecter 121a may be bent.

[0062] The first fixing portion 121b may be connected to the first connecter 121a, and a portion the first fixing portion 121b may protrude from the first connecter 121a toward the buffer 122. The first fixing portion 121b may accommodate the buffer 122 thereon and support the buffer 122.

[0063] The protrusion 121c may protrude from the first connecter 121a in a direction opposite to the first fixing portion 121b. In this case, the protrusion 121c may be provided in at least one protrusion. When the protrusion 121c is provided in a plurality of protrusions, the protrusions 121c may be arranged in different directions and inserted into the body portion 110 to prevent the support portion 120 from rotating.

[0064] The buffer 122 may be located at the first fixing portion 121b. According to an embodiment, the buffer 122 may be located on the first fixing portion 121b through injection or the like. According to an embodiment, the buffer 122 may be attached to the first fixing portion 121b through a separate adhesive member. Hereinafter, for convenience of explanation, a detailed description will be given in terms of the case in which the buffer 122 is located on the first fixing portion 121b through injection or the like.

[0065] The hardness of the buffer 122 may be in the range of about 60 to about 72. In this case, the hardness may be Shore hardness. When the hardness of the buffer 122 is less than 60, the display device DP may not be supported when the contact portion 123 is in contact with a lateral surface of the display device DP, and thus the display device DP may move excessively. When the hardness of the buffer 122 exceeds 72, the buffer 122 may not absorb and buffer the force applied to the display device DP. The buffer 122 may include at least one of urethane, expanded polypropylene (EPP), and rubber. In this case, when the buffer 122 includes urethane, the buffer 122 may be directly coupled to the support portion 120 (e.g., the first fixing portion 121b) through injection or the like. According to an embodiment, when the buffer 122 includes at least one of expanded polypropylene (EPP) and rubber, the buffer 122 may be fixed to the support portion 120 (e.g., the first fixing portion 121b) through a separate adhesive member. The buffer 122 as described above is not limited to the above materials and may include any material that satisfies the hardness described above.

[0066] The buffer 122 as described above may be disposed on one surface alone of the first fixing portion 121b (for example, a front surface of the first fixing portion 121b based on FIG. 3A or 3B). According to an embodiment, the buffer 122 may be located to surround not only one surface of the first fixing portion 121b but also at least one of lateral surfaces connected to one surface of the first fixing portion 121b. Hereinafter, for convenience of explanation, a detailed description will be given in terms of the case in which the buffer 122 is located to surround at least one of one surface of the first fixing portion 121b and a lateral surface of the first fixing portion 121b.

[0067] The contact portion 123 may be disposed on the buffer 122 and may be in contact with the display device DP. In this case, the contact portion 123 may be disposed on a surface of the buffer 122 and may be in direct contact with the buffer 122. For example, the contact portion 123 may be coated on the surface of the buffer 122. The contact portion 123 may include a different material from the buffer 122. In this case, the hardness of the contact portion 123 may be greater than that of the buffer 122. For example, the hardness of the contact portion 123 may be in the range of about 75 to about 85. In this case, the hardness may be Shore hardness. When the hardness of the contact portion 123 is less than 75, a portion of the contact portion 123 may be damaged when the display device DP is in contact with the contact portion 123. If the hardness of the contact portion 123 exceeds 85, components of the display device DP, which are in contact with the contact portion 123, may be separated from each other, or a film disposed on the display device DP may be separated from the display device DP. The contact portion 123 may include at least one of epoxy and silicon. The contact portion 123 as described above is not limited to the above materials and may include any material that satisfies the hardness described above.

[0068] The contact portion 123 described above may be disposed on the buffer 122 in various methods. According to an embodiment, as shown in FIG. 3A, an adhesive member 124 may be located between the buffer 122 and the contact portion 123 to fix the contact portion 123 to the buffer 122. According to an embodiment, as shown in FIG. 3B, the contact portion 123 may be coated on the surface of the buffer 122 or may be injected into a surface of the buffer 122, and thus may be in direct contact with and fixed to the buffer 122.

[0069] The mixed hardness of the contact portion 123 and the buffer 122, which is measured while the contact portion 123 is disposed on the buffer 122 may be equal to or greater than 75. In this case, the mixed hardness may be Shore hardness. In particular, when the mixed hardness of the contact portion 123 and the buffer 122 is less than 75, the display device DP may not be firmly supported, and thus the display device DP may move and the contact portion 123 may be damaged. In this case, the buffer 122 and the contact portion 123 as described above may include any combination of materials that satisfy the hardness described above.

[0070] In the above case, the coupler 121 may be located at a corner of the display device DP and may be in contact with one or two of lateral surfaces of the display device DP to support the display device DP. In this case, even if the display device DP is shaken inside the body portion 110 or an impact is applied from outside the body portion 110, vibration of the display device DP may be reduced or external force transmitted to the display device DP may be reduced through the buffer 122. The contact portion 123 may have the hardness described above to not only support the display device DP but also be prevented from being damaged due to contact with the display device DP when the display device DP is stored in the body portion or the display device DP moves.

[0071] FIG. 4 is a schematic perspective view of a package 100 for a display device DP according to an embodiment. FIG. 5 is a schematic perspective view of a support portion 120 shown in FIG. 4.

[0072] Referring to FIGS. 4 and 5, the package 100 for the display device DP may include the body portion 110 and the support portion 120. In this case, the body portion 110 is similar to that described with reference to FIG. 1, and thus a detailed description thereof will be omitted.

[0073] The support portion 120 may be located at a corner of the body portion 110. In this case, the support portion 120 may be formed integrally with the body portion 110 or may be separable from the body portion 110 and located at a corner of the body portion 110. In this case, when the support portion 120 and the body portion 110 are separated from each other, the body portion 110 may include a groove in which at least a portion of the support portion 120 is inserted or protrusions that are located apart from each other to allow at least a portion of the support portion 120 to be inserted therebetween. Hereinafter, for convenience of explanation, a detailed description will be given in terms of the case in which the support portion 120 is disposed at a corner of the body portion 110 to be separable from the body portion 110.

[0074] The support portion 120 may include a buffer 122 and a contact portion 123. The buffer 122 may include at least one of urethane, expanded polypropylene (EPP), and rubber. In this case, the buffer 122 may include a second connector 122a and a second fixing portion 122b. The second connector 122a may be formed to correspond to a corner of the body portion 110. In this case, the second connector 122a may be formed to be bent at a certain angle, and thus may come into close contact with the surface of the body portion 110 located in the space of the body portion 110. The second fixing portion 122b may be located at an end of the second connector 122a. In this case, a portion of the second fixing portion 122b may protrude from an internal space of the body portion 110. That is, the thickness of the second fixing portion 122b measured in one direction may be greater than the thickness of the second connector 122a, and a portion of second fixing portion 122b may protrude in one direction toward the contact portion 123 from a surface of the second connector 122a.

[0075] The contact portion 123 may be the same as or similar to that described with reference to FIGS. 2 to 3B. In this case, the contact portion 123 and the buffer 122 may include different materials. The hardness of the contact portion 123 may be greater than that of the buffer 122.

[0076] Accordingly, the package 100 for the display device DP may store the display device DP in a space inside the body portion 110 to stably protect the display device DP.

[0077] The package 100 for the display device DP may reduce breakage or damage to the contact portion 123 when the display device DP vibrates. Through this, the package 100 for the display device DP may be reused.

[0078] The package 100 for the display device DP may reduce external force transmitted to the display device DP and may accept the movement of the display device DP to some extent when the display device DP vibrates.

[0079] When the package 100 for the display device DP stores the display device DP, separation of components of the display device DP or separation of a film on the display device DP from the display device DP may be minimized.

[0080] Although not shown in the drawing, the package 100 for the display device DP may further include a cover that is coupled to the body portion 110 to shield the space inside the body portion 110. In this case, the cover may be formed in a similar shape to the body portion 110 and may be coupled to an entrance of the space formed in the body portion 110.

[0081] FIG. 6 is a schematic cross-sectional view of the stored display device DP in FIG. 1 or FIG. 4.

[0082] Referring to FIG. 6, the display device DP may include a display panel 1. According to an embodiment, the display device DP may include the display panel 1 and an optical functional layer 2 disposed on the display panel 1. According to an embodiment, the display device DP may include the display panel 1, the optical functional layer 2, and a film layer 4. According to an embodiment, the display device DP may include the display panel 1 and the film layer 4. Hereinafter, for convenience of explanation, a detailed description will be given in terms of the case in which the display device DP includes the display panel 1, the optical functional layer 2, and the film layer 4.

[0083] The optical functional layer 2 may include a black matrix and color filters. The color filters may be arranged in consideration of the color of light emitted from each pixel of the display panel 1. Each of the color filters may contain red, green, or blue pigment or dye. In an embodiment, each of the color filters may further include a quantum dot in addition to the pigment or dye described above. In an embodiment, some of the color filters may not contain the above-mentioned pigment or dye, but may contain scattering particles such as titanium oxide. The color filters as described above may be formed by discharging liquid droplets by using a display device manufacturing apparatus according to an embodiment.

[0084] According to an embodiment, the optical functional layer 2 may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer that are disposed on different layers. First reflected light and second reflected light that are reflected from the first reflective layer and the second reflective layer, respectively, may interfere destructively, and thus external light reflectance may be reduced.

[0085] According to an embodiment, the optical functional layer 2 may include an upper substrate located to face the display panel 1, a color conversion layer disposed on the upper substrate, a transmission layer, and a light blocking pattern.

[0086] The film layer 4 may reduce the reflectance of light (external light) incident from the outside toward the display panel 1 and/or improve the color purity of light emitted from the display panel 1. According to an embodiment, the optical functional layer 2 may include a retarder and a polarizer. The retarder may be a film type or a liquid crystal coating type, and may include a /2 retarder and/or a /4 retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a certain arrangement. The film layer 4 may include a protective film that protects the display panel 1 or the optical functional layer 2 from the outside.

[0087] In the above case, the film layer 4 may be attached to the optical functional layer 2 or the display panel 1 through an adhesive member or the like.

[0088] When the display device DP includes the optical functional layer 2 as described above, the display device DP may include a protective layer 3 located to surround lateral surfaces of the display panel 1 and the optical functional layer 2.

[0089] When the display device DP as described above is located in a package similar to the package 100 for the display device DP shown in FIG. 1 or 4 but absent the buffer 122 or 122, the support portion of the package may be in contact with the lateral surface of the display device DP to apply force to the lateral surface of the display device DP. In this case, the support portion of the package may apply force to the lateral surface of the display device DP, and the display device DP may move in a vertical direction in the package, and thus one of the optical functional layer 2 or the display panel 1 may be separated from the film layer 4. A surface of the support portion of the package may be damaged due to the movement of the display device DP as described above.

[0090] However, the disclosure may provide a buffer 122 or 122 on a rear surface of the contact portion 123 or 123, and thus when the lateral surface of the display device DP is in contact with the contact portion 123 or 123, the buffer 122 or 122 may be deformed and the contact portion 123 or 123 may not apply excessive force to the lateral surface of the display device DP. As described above, the contact portion 123 or 123 may have sufficient hardness, and thus the contact portion 123 or 123 may not be damaged due to contact with the lateral surface of the display device DP.

[0091] The film layer 4 as described above may be separated by an average force of 20 Kgf or 14.9 Kgf during contact with a member with a hardness of about 60 (e.g., hardness between about 60 and about 70). In contrast, the film layer 4 may be separated by an average force of 8.5 Kgf or 4.7 Kgf during contact with a member with a hardness of about 76 (e.g., hardness between about 76 and about 78). That is, according to the disclosure, when the contact portion alone described above is provided, the film layer 4 may be separated from the display panel 1 with a small amount of force. However, according to the disclosure, the buffer 122 or 122 may be provided on a rear surface of the contact portion 123 or 123, and the force applied to the film layer 4 when the film layer 4 comes into contact the contact portion 123 or 123 may be partially reduced. As such, separation of the film layer 4 from the display panel 1 may be reduced.

[0092] Therefore, when the display device DP is stored in the package 100 for the display device DP, the display device DP may not damage the contact portion 123 or 123, and the support portion 123 or 123 may also reduce separation between one of the optical functional layer 2 or the display panel 1 and the film layer 4.

[0093] FIG. 7 is a schematic plan view showing the display panel 1 shown in FIG. 6. FIG. 8 is a cross-sectional view of a portion of the display panel 1 shown in FIG. 6.

[0094] Referring to FIGS. 7 and 8, the display panel 1 includes a display area DA that displays an image, e.g., in a z-direction, and a non-display area NDA that does not display an image. The display panel 1 may provide an image by using light emitted from a plurality of pixels PX arranged in the display area DA. Each pixel PX may emit red, green, blue, or white light. In this case, in FIG. 1, there is one pixel Px, but the disclosure is not limited, and the plurality of pixels Px may be arranged apart from each other in the display area DA.

[0095] The display panel 1 may be a device that displays an image and may be a portable mobile device such as a game console, a multimedia device, or a micro-PC. The display panel 1, which will be described below, may include a liquid crystal display, an electrophoretic display, an organic light emitting display, an inorganic electroluminescence (EL) display, a field emission display, a surface-conduction electron-emitter display, a quantum dot display, a plasma display, and a cathode ray display. Hereinafter, the display panel 1 manufactured using the display device manufacturing apparatus according to an embodiment will be described with an organic light emitting display device as an example. However, embodiments may be used to manufacture various types of display devices as described above.

[0096] The pixel PX may be electrically connected to each of a scan line SL and a data line DLn. The scan line SL may extend in an x-direction, and the data line DLn may extend in a y-direction.

[0097] A display layer DL and a thin film encapsulation layer 50 may be disposed on a substrate 10. The display layer DL may include a pixel circuit layer PCL and a display element layer DEL.

[0098] The substrate 10 may include glass or polymer resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate.

[0099] A barrier layer (not shown) may be further provided between the display layer DL and the substrate 10. The barrier layer may be a barrier layer that prevents penetration of external foreign substances, and may be a single layer or multilayer including an inorganic material such as silicon nitride (SiN.sub.x, x>0) or silicon oxide (SiO.sub.x, x>0).

[0100] The pixel circuit layer PCL is disposed on the substrate 10. FIG. 8 shows the case in which the pixel circuit layer PCL includes a thin film transistor TFT, and a buffer layer 11, a first gate insulating layer 12, a second gate insulating layer 13, an interlayer insulating layer 15 and a planarization insulating layer 17 that are located below and/or above components of the thin film transistor TFT.

[0101] The buffer layer 11 may include an inorganic insulating material such as silicon nitride, silicon oxynitride, and silicon oxide, and may be a single layer or multilayer including the above-described inorganic insulating material.

[0102] The thin film transistor TFT may include a semiconductor layer A1, and the semiconductor layer A1 may include polysilicon. In an embodiment, the semiconductor layer A1 may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The semiconductor layer A1 may include a channel region, and a drain region and a source region, which are respectively located on both sides of the channel region.

[0103] A gate electrode G1 may overlap the channel region. The gate electrode G1 may include a low-resistance metal material. The gate electrode G1 may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may be formed as a multilayer or single layer including the above materials.

[0104] The first gate insulating layer 12 between the semiconductor layer A1 and the gate electrode G1 may include an inorganic insulating material such as silicon oxide (SiO.sub.2), silicon nitride (SiN.sub.X), silicon oxynitride (SiON), aluminum oxide (Al.sub.2O.sub.3), titanium oxide (TiO.sub.2), tantalum oxide (Ta.sub.2O.sub.5), hafnium oxide (HfO.sub.2), or zinc oxide (ZnO.sub.2).

[0105] The second gate insulating layer 13 may be provided to cover the gate electrode G1. Similarly to the first gate insulating layer 12, the second gate insulating layer 13 may include an inorganic insulating material such as silicon oxide (SiO.sub.2), silicon nitride (SiN.sub.X), silicon oxynitride (SiON), aluminum oxide (Al.sub.2O.sub.3), titanium oxide (TiO.sub.2), tantalum oxide (Ta.sub.2O.sub.5), hafnium oxide (HfO.sub.2), or zinc oxide (ZnO.sub.2).

[0106] An upper electrode Cst2 of a storage capacitor Cst may be disposed on the second gate insulating layer 13. The upper electrode Cst2 may overlap the gate electrode G1 therebelow. In this case, the gate electrode G1 and the upper electrode Cst2 that overlap each other with the second gate insulating layer 13 therebetween may form the storage capacitor Cst. That is, the gate electrode G1 may function as a lower electrode Cst1 of the storage capacitor Cst.

[0107] As such, the storage capacitor Cst and the thin film transistor TFT may be formed to overlap each other. In some embodiments, the storage capacitor Cst may be formed not to overlap the thin film transistor TFT.

[0108] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu), and may be a single layer or multilayer of the materials described above.

[0109] The interlayer insulating layer 15 may cover the upper electrode Cst2. The interlayer insulating layer 15 may include silicon oxide (SiO.sub.2), silicon nitride (SiN.sub.X), silicon oxynitride (SiON), aluminum oxide (Al.sub.2O.sub.3), titanium oxide (TiO.sub.2), tantalum oxide (Ta.sub.2O.sub.5), and hafnium oxide (HfO.sub.2), or zinc oxide (ZnO.sub.2). The interlayer insulating layer 15 may be a single layer or a multilayer including the inorganic insulating material described above.

[0110] A drain electrode D1 and a source electrode D2 may each be disposed on the interlayer insulating layer 15. The drain electrode D1 and the source electrode D2 may include a material with high conductivity. The drain electrode D1 and the source electrode D2 may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may be formed as a multilayer or single layer including the above materials. According to an embodiment, the drain electrode D1 and the source electrode D2 may have a multilayer structure of Ti/Al/Ti.

[0111] The planarization insulating layer 17 may include an organic insulating layer. The planarization insulating layer 17 may include an organic insulating material, for example, a general-purpose polymer such as polymethylmethacrylate (PMMA) or polystyrene (PS), a phenolic group-containing polymer derivative, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and a blend thereof.

[0112] The display element layer DEL is disposed on the pixel circuit layer PCL of the structure described above. The display element layer DEL may include an organic light emitting device OLED, and a pixel electrode 31 of the organic light emitting device OLED may be electrically connected to the thin film transistor TFT through a contact hole in the planarization insulating layer 17.

[0113] The pixel PX may include the organic light emitting device OLED and the thin film transistor TFT. Each pixel PX may emit, for example, red, green, or blue light, or may emit red, green, blue, or white light through the organic light emitting device OLED.

[0114] The pixel electrode 31 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In.sub.2O.sub.3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). According to an embodiment, the pixel electrode 31 may include a reflective film including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a compound thereof. According to an embodiment, the pixel electrode 31 may further include a film including ITO, IZO, ZnO, or In.sub.2O.sub.3 above/below the reflective film described above.

[0115] A pixel defining film 19 having an opening 19OP exposing a central portion of the pixel electrode 31 therethrough is disposed on the pixel electrode 31. The pixel defining film 19 may include an organic insulating material and/or an inorganic insulating material. The opening 19OP may define an emission area of light emitted from the organic light emitting device OLED (hereinafter referred to as an emission area EA). For example, the width of the opening 19OP may correspond to the width of the emission area EA.

[0116] An intermediate layer 32 including an organic light-emitting layer may be located in the opening 19OP of the pixel defining film 19. The intermediate layer 32 may include a high-molecular or low-molecular organic material that emits light of a predetermined color. This intermediate layer 32 may be formed by discharging liquid droplets by using a display device manufacturing apparatus according to an embodiment.

[0117] Although not shown, a first functional layer and a second functional layer may be located below and above the organic light-emitting layer of the intermediate layer 32, respectively. For example, the first functional layer may include a hole transport layer (HTL), or may include a HTL and a hole injection layer (HIL). The second functional layer is a component disposed on the intermediate layer 32 and is optional. The second functional layer may include an electron transport layer (ETL) and/or an electron injection layer (EIL). The first functional layer and/or the second functional layer may be a common layer formed to entirely cover the substrate 10, similarly to a common electrode 33, which will be described below.

[0118] The common electrode 33 may include a conductive material with a low work function. For example, the common electrode 33 may include a (semi) transparent layer including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or an alloy thereof. In an embodiment, the common electrode 33 may further include a layer such as ITO, IZO, ZnO, or In.sub.2O.sub.3 on the (semi) transparent layer including the material described above.

[0119] According to an embodiment, the thin film encapsulation layer 50 includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. FIG. 15 shows the case in which the thin film encapsulation layer 50 includes a first inorganic encapsulation layer 51, an organic encapsulation layer 52, and a second inorganic encapsulation layer 53, which are sequentially stacked.

[0120] The first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53 may include one or more inorganic materials selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 52 may include a polymer-based material. The polymer-based material may include acrylic resin, epoxy resin, polyimide, and polyethylene. According to an embodiment, the organic encapsulation layer 52 may include acrylate.

[0121] According to an embodiment, the thin film encapsulation layer 50 may have a structure in which the substrate 10 and the upper substrate, which is a transparent member, are coupled to each other using a sealing member to seal an internal space between the substrate 10 and the upper substrate. In this case, a moisture absorbent or a filler may be located in the internal space. The sealing member may be a sealant, and according to an embodiment, the sealing member may include a material that is hardened by a laser beam. For example, the sealing member may be a frit. In detail, the sealing member may include an organic sealant such as urethane resin, epoxy resin, or acrylic resin, or an inorganic sealant such as silicon. As the urethane-based resin, for example, urethane acrylate may be used. As the acrylic resin, for example, butyl acrylate, ethyl hexyl acrylate, or the like may be used. The sealing member may include a material that hardens by heat.

[0122] A touch electrode layer (not shown) including touch electrodes may be disposed on the thin film encapsulation layer 50. The touch electrode layer may obtain coordinate information according to an external input, for example, a touch event.

[0123] As such, the disclosure has been described with reference to an embodiment shown in the drawings, but this is merely an example, and those of skill in the art will understand that various modifications and variations of the embodiment are possible therefrom. Therefore, the true technical scope of the disclosure needs to be determined by the technical spirit of the attached claims.

[0124] The package for a display device according to embodiments may safely protect the display device.

[0125] In the package for a display device according to embodiments, damage to a portion in contact with the display device may be reduced.

[0126] It should be understood that embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope as defined by the following claims.