METHOD FOR CONFECTIONING RESISTORS, RESISTOR, AND HEATING DEVICE

Abstract

This disclosure refers to a method for confectioning resistors that each comprise a PTC ceramic plate and metallic electrode layers covering opposite faces of the ceramic plate, said method comprising the following steps: measuring an electrical resistance of a resistor to be confectioned by applying an electrical potential to one of electrode layers such that an electric current flows from one of the electrode layers through the ceramic plate to the electrode layer on the opposite face of the ceramic plate, comparing the measured resistance to a target resistance, and removing, if the measured resistance is lower than the target resistance, a section of at least one of the electrode layers. This disclosure also refers to such a resistor and a heating device comprising such resistors.

Claims

1. A method for confectioning resistors that each comprise a PTC ceramic plate and metallic electrode layers covering opposite faces of the ceramic plate, said method comprising: measuring an electrical resistance of a resistor to be confectioned by applying an electrical potential to one of the electrode layers such that an electric current flows from the one electrode layer through the ceramic plate to the electrode layer on the opposite face of the ceramic plate; comparing the measured resistance to a target resistance; and removing a section of at least one of the electrode layers when the measured resistance is lower than the target resistance.

2. The method according to claim 1, wherein the section of at least one of the electrode layers that is removed, if the measured resistance is lower than the target resistance, is a rim section.

3. The method according to claim 1, wherein a section of both electrode layers is removed if the measured resistance is lower than the target resistance.

4. The method according to claim 3, wherein both electrode layers are congruent.

5. The method according to claim 1, wherein the area of the removed section increases as the difference between the target resistance and the measured resistance increases.

6. The method according to claim 1, wherein the section of the electrode layer is removed by laser ablation.

7. A resistor, comprising: a PTC ceramic plate; a first metallic electrode layer covering a first face of the ceramic plate; and a second metallic electrode layer covering a second face of the ceramic plate, said second face being opposite the first face, wherein the first and/or the second metallic electrode layer cover only a part of the corresponding face of the PTC ceramic plate.

8. The resistor according to claim 7, wherein at most 90% of the area of the first face and/or of the second face is covered by the respective electrode layer.

9. The resistor according to claim 7, wherein at most 80% of the area of the first face and/or of the second face is covered by the respective electrode layer.

10. The resistor according to claim 7, wherein 40% to 90% of the area of the first face and/or of the second face is covered by the respective electrode layer.

11. The resistor according to claim 7, wherein, at least 50% of the area of the first face and/or of the second face is covered by the respective electrode layer.

12. The resistor according claim 7, wherein the area of the larger electrode layer is at most 15% larger than the area of the smaller electrode layer.

13. The resistor according claim 7, wherein the area of the larger electrode layer is at most 10% larger than the area of the smaller electrode layer.

14. A heating device comprising several resistors that each comprise a PTC ceramic plate, a first metallic electrode layer covering a first face of the ceramic plate and a second metallic electrode layer covering a second face of the ceramic plate; wherein the areas of the first face of the various resistors agree within manufacturing tolerances; and wherein in at least some of the resistors the first and/or the second face is only covered in part by the respective electrode layer.

15. The heating device according to claim 14, wherein the area of the largest electrode layer of all resistors of the device is at least 10% larger than the area of the smallest electrode layer.

16. The heating device according to claim 14, wherein the area of the largest electrode layer of all resistors of the device is at least 15% larger than the smallest electrode layer.

17. The heating device according to claim 14, wherein the resistors are held by a frame made of electrically insulating material.

18. The heating device according to claim 14, wherein the resistors are arranged in at least one heating rod connected to at least one heat transfer fin.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above-mentioned aspects of exemplary embodiments will become more apparent and will be better understood by reference to the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0019] FIG. 1 shows schematically a cross-section of an example of a resistor;

[0020] FIG. 2 shows an example of a resistance-temperature characteristic of such a resistor;

[0021] FIG. 3 shows an example of the distribution of the minimum resistance R.sub.min of such resistors;

[0022] FIG. 4 shows a flow chart of a method for confectioning such resistors;

[0023] FIG. 5 shows schematically a cross-section of an example of a resistor after confectioning;

[0024] FIG. 6 shows schematically an example of the distribution of the minimum resistance R.sub.min of such resistors after confectioning and also the distribution of the minimum resistance R.sub.min of such resistors before confectioning as shown in FIG. 3;

[0025] FIG. 7 shows an embodiment of a heating device;

[0026] FIG. 8 shows a sub-assembly of the heating device of FIG. 7; and

[0027] FIG. 9 shows some components of the sub-assembly of FIG. 8.

DESCRIPTION

[0028] The embodiments described below are not intended to be exhaustive or to limit the invention to the precise forms disclosed in the following description. Rather, the embodiments are chosen and described so that others skilled in the art may appreciate and understand the principles and practices of this disclosure.

[0029] FIG. 1 shows schematically in a cross-section a resistor 1 that comprises a PTC ceramic plate 2 and metallic electrode layers 3, 4 covering opposite faces of the ceramic plate 2. The ceramic plate may, e.g., be of the basis of barium titanate, the electrode layers 3, 4, e.g., of aluminum.

[0030] FIG. 2 shows an example of the resistance-temperature characteristic of a resistor as shown in FIG. 1. The abscissa shows temperature T in degrees Celsius and the ordinate resistance R in Ohm. The resistance-temperature characteristic of PTC ceramics generally looks like the example shown in FIG. 2. An increase in temperature initially leads to a slow reduction in resistance R until a minimum resistance R.sub.min is reached, in the example shown at a temperature T.sub.Rmin of about 150°. Further increase in temperature leads to an increase in resistance that is at first rather slow and accelerates drastically as soon as critical temperature T.sub.ref is reached. In the example shown, the critical temperature is about 195° C.

[0031] Both the temperature T.sub.Rmin at which the resistance is minimal and the temperature T.sub.ref at which resistance starts to rise rapidly with increasing temperature are dependent on the composition of the PTC ceramic and can be changed by the addition of dopants to barium titanate, for example.

[0032] The resistance at a given temperature, e.g., 25° C., as well as the temperature T.sub.Rmin at which the resistance is minimal varies significantly from one production batch to another and even with production batches. FIG. 3 shows a typical distribution of the minimum resistance R.sub.min for such resistors. In FIG. 3 the resistance is given in Ohm on the abscissa and the probability density in percent on the ordinate. As can be seen resistances are spread over a large range such that some resistors have resistances that are more than twice as other resistances of other resistors. Such large differences in resistance are problematic for many applications. The resistors are therefore confectioned in order to make this distribution narrower. By confectioning, as described below, the resistivity of resistors that have a rather low resistance can be increased.

[0033] FIG. 4 shows a flow chart of a method for confectioning such resistors. In a first step a resistance of the resistor is measured, for example at a defined temperature like 25° C., or the minimum resistance Rmin. Based on these measurements resistors are then sorted into classes, for example resistors with a resistance below 600Ω are classed as A, resistors of 600Ω to 800Ω are classed as B, resistors of 800Ω to 1000Ω are classed as C, and resistors above 1000Ω as D.

[0034] Stones of class A and B are then confectioned in order to raise their resistance by removing sections of their metallic electrode surfaces 3 and/or 4. The larger the area of the metallic electrodes 3, 4 that is removed, the more the resistance is increased. By comparing the measured resistance to a target resistance, it is determined how much the surface area of the ceramic plate that is covered by metallic electrode layers 3, 4 is to be reduced. Then one or more sections of the metallic electrode layers 3, 4 are reduced, e.g., by laser ablation.

[0035] For example, strip-shaped sections adjacent to an edge of the ceramic plate may be reduced. FIG. 5 shows schematically a resistor 1 after confectioning by removing sections of the metallic electrode layers 3, 4. In FIG. 5, corresponding sections were removed from both metallic electrode layers 3, 4, but an increase in resistance can also be achieved if only part of one electrode layer is removed and the other electrode layer still completely covers a face of the ceramic plate 2. During confectioning the area of the electrode layer 3, 4 is reduced by at least 10%, often by 15% or more, e.g., by 20% or more or even 25% or more. Thus in most confectioned resistors at most 90% of the area of the first face and/or of the second face of the ceramic plate 2 is covered by the respective electrode layer 3, 4. After confectioning usually 40% to 90% of the area of the first face and/or of the second face of the ceramic plate 2 is covered by the respective electrode layer 3, 4. After confectioning, in most stones 50% to 70% of the area of the first face and/or of the second face of the ceramic plate 2 may be covered by the respective electrode layer 3, 4.

[0036] In FIG. 6 the distribution of the minimum resistance R.sub.min is shown schematically both before confectioning and after confectioning. The continuous line is the same as in FIG. 3 and shows the probability distribution of resistance. The dotted line shows schematically the probability distribution of resistance after confectioning. In the example shown, only resistors of classes A and B, i.e., resistors having a minimum resistance Rmin below 800Ω were confectioned in order to raise their minimum resistivity into the useful range of 800Ω to 1000Ω, e.g., by using a target minimum resistance of 900Ω.

[0037] As a comparison of the two curves in FIG. 6 shows, confectioning greatly increases the percentage of resistors that have a minimum resistance Rmin inside the range of 600Ω to 1000Ω, which is the usable range for a heating device as explained in connection with FIGS. 7 to 9 below. Thus confectioning resistors greatly reduces waste and lowers overall production costs. Of course, different applications might require resistors that have other resistances, but any application usually sets a range of usable resistance that is only met by a part of as-produced resistors without confectioning.

[0038] FIG. 6 shows an example wherein the target resistance for the confectioning process was set well with the probability distribution such that only about two thirds of the resistors initially had a resistance below the target resistance. However, the target resistance might also be set higher so that a much larger percentage of all resistors initially have a resistance that is below the target resistance. It is even possible to set the target resistance so high that all or almost all resistors are subjected to the confectioning process wherein a section of their metallic electrode layer is removed.

[0039] FIG. 7 shows a heating device for heating the interior a passenger compartment of a car. In use, an air stream flows through the heating device and is thereby heated. The heating device comprises several sub-assemblies, namely heating rods 10 as shown in FIG. 8. FIG. 9 shows an exploded view of a heating rod 10.

[0040] The heating rod 10 comprises a tube 11 provided with a plurality of fins. The fins might be an integral part of the tube, for example the fins might be produced by skiving, or provided as separate parts, e.g., sheets fixed to the tube 11. Inside the tube 11 are resistors 1, e.g., seven resistors 1, that were confectioned as explained above. The resistors 1 are held by a frame 12 and electrically contacted by metallic sheets 13 arranged above and below the resistors 1 such that the sheets 13 contact the metallic electrode layers 3, 4 of the resistors 1 (see FIGS. 1 and 5).

[0041] As the resistors 1 have been through a confectioning process according to FIG. 4, some sections of the metallic electrode layers 3, 4 have been removed and the contact sheets 13 also touch some areas of the resistors 1 where the ceramic plate 2 is not covered by the metallic electrode layer 3, 4. Although the metallic sheets 13 touch the ceramic plate 2 directly in such places, only negligible electrical contact is created directly between the ceramic plate 2 and the metallic contact sheets. In use, almost all current that flows from one of the contact sheets 13 to the other contact sheet flows through the electrode layers 3, 4. Hence, it is usually not necessary to place electrical insulation on sections of the ceramic plate 2 where the electrode layer 3, 4 has been removed.

[0042] The contact sheets 13 are covered on the side facing away from the resistors 1 with electrically insulating ceramic strips 14, e.g., alumina. In addition, the package comprising the resistors 1, the frame 12, the contact sheets 13, and the insulating sheets 14 may be wrapped in an electrically insulating film 15. The ends of the tube 11 may be closed with plugs 16 stuck into the tube 11.

[0043] As the heating device explained above comprises resistors 1 that have confectioned by a process according to FIG. 4, these resistors 1 differ in the size of their electrode layers 3, 4. All resistors 1 have the same mechanical dimensions within manufacturing tolerances. That is the ceramic plates 2 of all resistors 1 have essentially the same size. In some of these resistors, the electrode layers 3, 4 might cover opposite faces of the ceramic plate 2 completely, but in some resistors parts of the electrode layers 3, 4 have been removed such that some sections of the sides that face the contact sheets 13 are free from electrode layers 3, 4.

[0044] Usually, the area of the largest electrode layer 3, 4 of such a heating device is at least 10% larger than the area of the smallest electrode layer 3, 4. In some embodiments. The area of the largest electrode layer may even be 120% or more of the area of the smallest electrode layer.

[0045] While exemplary embodiments have been disclosed hereinabove, the present invention is not limited to the disclosed embodiments. Instead, this application is intended to cover any variations, uses, or adaptations of this disclosure using its general principles. Further, this application is intended to cover such departures from the present disclosure as come within known or customary practice in the art to which this invention pertains and which fall within the limits of the appended claims.

LIST OF REFERENCE SIGNS

[0046] 1 resistor [0047] 2 PTC ceramic plate [0048] 3 electrode layer [0049] 4 electrode layer [0050] 10 heating device [0051] 11 tube [0052] 12 frame [0053] 13 electrode sheet [0054] 14 insulating strip [0055] 15 insulating film [0056] 16 plug