METHOD FOR ENHANCING CREEP AGE FORMING PROCESS OF A METALLIC COMPONENT
20230158564 · 2023-05-25
Assignee
Inventors
Cpc classification
B22D27/08
PERFORMING OPERATIONS; TRANSPORTING
B22D17/2069
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A method for accelerating the creep age forming of a metallic component is provided. The method includes the steps of applying static loading and ultrasound vibrations to the local regions on a metallic component during the creep age forming process. The transmission of ultrasound in the component enhances the mobility of dislocations and atoms and thus accelerates the creep deformation in the component.
Claims
1. A method for accelerating creep age forming process by enhanced local creep deformation of a metallic component, the method comprising the steps of: preparing at least one elongated sonotrode, the sonotrode comprising a first end and a second end, the first end connected to an ultrasound system and the second end comprising a tip; providing a least one former; preparing a loading device to each sonotrode; placing the metallic component on said at least one former; placing each sonotrode to each location where accelerated creep deformation is required, with the sonotrode at one side and the former at the opposite side of the component at that location; brining the component to predetermined temperatures; and applying loading to cause creep deformation in the component and applying ultrasonic vibrations through the sonotrode to the component at predetermined rates and times to accelerate local creep deformation until the component reaches its desired profile.
2. The method of claim 1, wherein the ultrasound system generates vibrations at the tip of the sonotrode at a frequency greater than 15,000 Hz.
3. The method of claim 1, wherein the sonotrode is made of a metallic alloy.
4. The method of claim 1, wherein the loading is high enough to cause creep in the component by a combined action of ultrasound, compressive load, and heat.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0018]
[0019]
[0020]
[0021]
DETAILED DESCRIPTION OF THE INVENTION
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety.
[0023] Shrinkage porosity occurs in the hot spots in a casting if the local liquid shrinkage cannot be fed [1]. In die casting or permanent mold casting industry, squeeze pins are used for eliminating or reducing porosity in hot spots [5-6].
[0024] The prior arts using a squeeze pin is illustrated in
[0025] The present invention teaches to use the combined effect of compression, ultrasound, heat, and feeding using extra material on the solidifying material not only to eliminate porosity but also to refine the solidification structure, heal cracks, break up oxide films, and enhance the mechanical properties of the materials in the hot spot of a casting. The invention is made based on the following phenomena:
[0026] Ultrasonic grain refining: Applying high-intensity ultrasonic vibration to a solidifying material is capable of significantly modifying the morphology and reducing the grain size of the primary solid phase precipitating from the liquid in ultra pure metals [7] and their alloys [8]. The morphology of the eutectic phases is also modified, and their grain sizes are reduced [9-10]. U.S. Pat. No. 7,216,690 to Han et al. discloses the use of high-intensity ultrasonic vibration in a metal mold for achieving globular grains (from dendritic grains) suitable for semi-solid processing of metallic alloys. Such results, especially the formation of globular grains in the slug 17 and in the hot spot in the casting 16, should be achievable if a sonotrode is used to replace the squeeze pin 10 shown in
[0027] Shear thinning of semi-solid materials: A slurry containing up to 0.6 fractions of non-dendritic or globular primary solid phase grains experiences shear thinning, i.e. the viscosity of such a material decreases under shearing [11]. Such a semisolid material is capable of flowing under shear without forming cracks. A mushy material containing fractions of dendritic solid higher than that corresponding to the dendritic coherence points cracks during shearing. Under a compressive load by upsetting a test piece containing high fractions of solid, in the range of 0.6 to 0.99, the maximum upsetting stress for samples with non-dendritic grains is significantly (30 to 60%) lower than that of samples with dendritic grains [12]. Non-dendritic or globular grains slip over one another, exhibiting low resistance to deformation and high resistance to cracking. Dendritic grains interlock with each other, exhibiting high resistance to deformation and brittleness at high fractions of solid under strains and stresses [13-18]. Thus using a sonotrode to replace the squeeze pin 10 shown in
[0028] Ultrasonic softening: Ultrasonic softening occurs in materials under combined static and cyclic loading. Ultrasound with a stress amplitude exceeding elastic strength brings about 40% or greater reduction in the static stress. Once the irradiation is ceased, the static stress returns to its original value [19]. Ultrasound is capable of driving dislocations to move, which is closely related to the plastic deformation of materials under loading. Furthermore, the materials under ultrasound irradiation are much higher in plasticity and resistance to cracking than that without subject to ultrasonic irradiation.
[0029] Ultrasonic welding: Ultrasound passing through the interface between two solid phases gives rise to certain phenomena at the interface and near it. In particular, the excitation of vibrations in one phase leads to its heating and plastic deformation. When an interface is subjected to a combined effect of ultrasound and some other factors such as static pressure, heating, and external forces, the interfacial phenomena are strongly intensified so that materials can be welded [20]. Thus, using the combined effect of compression, ultrasound, heat and feeding using extra material is capable of eliminating cracks and pores due to ultrasonic welding.
[0030]
[0031] The present invention can also be used for reducing defects in a solid article that contains internal defects such as cracks, porosity, and oxide films.
[0032] The present invention shown in
[0033]
[0034] While the invention has been described in connection with specific embodiments thereof, it will be understood that the inventive methodology is capable of further modifications. This patent application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains and as may be applied to the essential features herein before set forth and as follows in scope of the appended claims.
REFERENCES
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