STRUCTURE, AGGLOMERATE, OPTOELECTRONIC DEVICE AND METHODS FOR PRODUCING A STRUCTURE AND AN AGGLOMERATE

20230163252 · 2023-05-25

    Inventors

    Cpc classification

    International classification

    Abstract

    A structure comprising a nanoparticle converting electromagnetic radiation of a first wavelength into electromagnetic radiation of a second wavelength range, an interlayer at least partially surrounding the nanoparticle, and an encapsulation at least partially surrounding the interlayer is specified, wherein the interlayer comprises a plurality of first amphiphilic ligands and a plurality of second amphiphilic ligands and the first ligands and the second ligands are intercalated.

    Furthermore, an agglomerate comprising a plurality of structures, an optoelectronic device as well as methods for producing a structure and an agglomerate are disclosed.

    Claims

    1. A structure comprising: a nanoparticle configured to convert electromagnetic radiation of a first wavelength range into electromagnetic radiation of a second wavelength range; an interlayer at least partially surrounding the nanoparticle; and an encapsulation at least partially surrounding the interlayer; wherein: the interlayer comprises a plurality of first amphiphilic ligands and a plurality of second amphiphilic ligands; and the first ligands and the second ligands are intercalated.

    2. The structure according to claim 1, wherein the encapsulation comprises a thickness ranging from 10 nanometers to 100 nanometers, both inclusive.

    3. The structure according to claim 1, wherein the encapsulation comprises a material selected from the group consisting of silica, alumina, titania, and combinations thereof.

    4. The structure according to claim 1, wherein the first ligands and the second ligands interact through a bonding selected from the group consisting of van der Waals forces, n-stacking, covalent bonding, and combinations thereof.

    5. The structure according to claim 1, wherein the first ligand and/or the second ligand comprises a polar head group and a non-polar side chain; the non-polar side chain comprises a spacer group, an aromatic group, and a terminal group; and the spacer group and the terminal group comprise an alkyl chain or an alkenyl chain.

    6. The structure according to claim 1, wherein: the second ligand is a polymer; the polymer comprises a polar backbone and a plurality of non-polar side chains; and the polar backbone comprises a plurality of polar head groups.

    7. The structure according to claim 1, wherein the interlayer comprises an additive selected from the group consisting of: ligands, quantum dots, growth reagents, reducing agents, lubricants, plasticizers, and combinations thereof.

    8. An agglomerate comprising a plurality of structures according to claim 1, said plurality of structures being agglomerated with each other by a bonding selected from the group consisting of covalent bonding, coordinative bonding, or both.

    9. The agglomerate according to claim 8, wherein the agglomerate comprises a diameter ranging from 0.5 micrometers to 10 micrometers, both inclusive.

    10. An optoelectronic device comprising: a semiconductor chip comprising an epitaxially grown semiconductor layer sequence configured to emit electromagnetic radiation of a first wavelength range; and a conversion layer comprising the structure according to claim 1, said conversion layer configured to convert the electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range.

    11. An optoelectronic device comprising: a semiconductor chip comprising an epitaxially grown semiconductor layer sequence configured to emit electromagnetic radiation of a first wavelength range; and a conversion layer comprising the agglomerate according to claim 8, said conversion layer configured to convert the electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range.

    12. A method for producing a structure, wherein the method comprises: providing a nanoparticle configured to convert electromagnetic radiation of a first wavelength range into electromagnetic radiation of a second wavelength range, said nanoparticle comprising a plurality of amphiphilic first ligands on a surface; forming an interlayer at least partially around the nanoparticle by adding a plurality of amphiphilic second ligands to the nanoparticle, wherein the interlayer comprises the first ligands and the second ligands and wherein the first ligands and the second ligands are intercalated; forming an encapsulation at least partially around the interlayer.

    13. The method according to claim 12, wherein the second ligand comprises a reactive head group comprising a SiR.sub.3 group; wherein each R is independently selected from the group comprising H, OMe, OEt, OiPr, Cl, Br.

    14. The method according to claim 12, wherein: the encapsulation comprises silica, and forming the encapsulation at least partially around the interlayer comprises growing the silica using a reverse micelle method.

    15. The method according to claim 12, wherein: the encapsulation comprises silica, and forming the encapsulation at least partially around the interlayer comprises treating with an alkoxy silane.

    16. The method according to claim 12, further comprising after forming the interlayer, dispersing the nanoparticle at least partially surrounded by the interlayer in a polar solvent to form a first solution; and further comprising adding the first solution to a second solution comprising a non-polar solvent and a surfactant to form a third solution; and wherein forming an encapsulation at least partially around the interlayer comprises adding a reagent selected from the group consisting of a silica source, water, an acid, a base, and combinations thereof to the third solution.

    17. The method according to claim 12, wherein the nanoparticle with the plurality of first ligands is provided in a first solvent; and further comprising adding the plurality of second ligands to the nanoparticle with the plurality of first ligands in the first solvent.

    18. The method according to claim 17, further comprising: removing the first solvent after the addition of the plurality of second ligands; and transferring the nanoparticle to a second solvent after the first solvent is removed; wherein the first solvent is a less polar than the second solvent.

    19. The method according to claim 17, further comprising: transferring the nanoparticle to the second solvent by stirring of a biphasic system after the addition of the plurality of second ligands; wherein the first solvent is less polar than the second solvent.

    20. A method for producing an agglomerate, wherein the method comprises: providing a plurality of structures according to claim 1 in a solvent; and agglomerating the plurality of structures by at least one method selected from the group consisting of adding an anti-solvent, adding a salt, removing the solvent, and combinations thereof.

    Description

    BRIEF DESCRIPTION OF THE DRAWINGS

    [0104] Advantageous embodiments and developments of the structure, the agglomerate, the optoelectronic device, the method for producing a structure and the method for producing an agglomerate will become apparent from the exemplary embodiments described below in conjunction with the Figures.

    [0105] In the Figures:

    [0106] FIG. 1 shows a schematic cross section of a structure according to an exemplary embodiment.

    [0107] FIGS. 2 and 6 each show a schematic representation of a first ligand.

    [0108] FIGS. 3, 4, and 7 each show a schematic representation of a second ligand.

    [0109] FIG. 5 shows a schematic cross section of a structure according to an exemplary embodiment.

    [0110] FIG. 8 shows three schematic representations of a structure each according to an exemplary embodiment.

    [0111] FIGS. 9 and 10 each show a schematic cross section of an agglomerate according to an exemplary embodiment.

    [0112] FIGS. 11 and 12 each show a schematic cross section of an optoelectronic device according to an exemplary embodiment.

    [0113] FIG. 13 shows methods steps for producing a structure according to an exemplary embodiment by means of schematic cross sections.

    [0114] FIGS. 14, 15, 16, and 17 each show a schematic cross section of a nanoparticle with an interlayer.

    [0115] FIG. 18 shows a schematic cross section of a structure according to an exemplary embodiment.

    [0116] FIG. 19 shows methods steps for producing an agglomerate according to an exemplary embodiment by means of schematic cross sections.

    [0117] FIG. 20 shows a transmission electron microscopy image of structures according to an exemplary embodiment.

    [0118] In the exemplary embodiments and Figures, similar or similarly acting constituent parts are provided with the same reference symbols. The elements illustrated in the Figures and their size relationships among one another should not be regarded as true to scale. Rather, individual elements may be represented with an exaggerated size for the sake of better representability and/or for the sake of better understanding.

    DETAILED DESCRIPTION

    [0119] In FIG. 1 an exemplary embodiment of a structure 6 described herein is shown. The structure 6 comprises a nanoparticle 1 which is surrounded by an interlayer 4 and an encapsulation 5. In particular, the encapsulation 5 comprises or consists of silica, alumina, titania, and combinations thereof. In a further embodiment, the encapsulation 5 consists of silica. The nanoparticle 1 comprises or consists of at least one semiconductor material, for example CdS or CdSe. The nanoparticle 1 may comprise a core and at least one shell. In a further embodiment, the nanoparticle 1 is a core-shell-shell quantum dot comprising a core with CdSe, a first shell with CdS and a second shell with ZnS.

    [0120] The nanoparticle 1 may convert electromagnetic radiation of a first wavelength range into electromagnetic radiation of a second wavelength range. Thus, the structure 6 is configured to convert electromagnetic radiation of the first wavelength range into electromagnetic radiation of the second wavelength range. In other words, the structure 6 has wavelength converting properties. The second wavelength range is from 500 nanometers and 1000 nanometers, both inclusive. The first wavelength range is in the UV to blue region of the electromagnetic radiation.

    [0121] The encapsulation 5 is indirectly coupled to the nanoparticle 1 with the aid of the interlayer 4. The interlayer 4 is arranged between the nanoparticle 1 and the encapsulation 5. The interlayer comprises a plurality of first ligands 2 and a plurality of second ligands 3. The first ligands 2 are so-called native ligands which arise from the production process of the nanoparticle 1. The second ligands 3 are intercalated into the plurality of first ligands 2.

    [0122] A schematic structure of the first ligand 2 and the second ligand 3 is shown in FIGS. 2 and 3. The first ligand 2 comprises a head group 7 and a side chain 8. In a further embodiment, the head group 8 is a polar head group, in particular a phosphonate or a carboxylate. The second ligand 3 comprises a polar head group 9 and a non-polar side chain 10. The head group 7, 9 is covalently bound to the side chain 8, 10.

    [0123] Referring again to FIG. 1, a magnification shows the structure of the interlayer 4 in more detail. The first ligands 2 are covalently, coordinatively, or both covalently and coordinatively bound to a surface of the nanoparticle 1. In particular, the head group 7 of the first ligand 2 is at least coordinatively bound to the nanoparticle 1. The side chain 8 points away from of the nanoparticle 1 into the direction of the encapsulation 5. The second ligands 3 are arranged such that the side chain 10 points in the direction of the nanoparticle 1. The side chain 8 of the first ligand 2 and the side chain 10 of the second ligand 3 and thus also the first ligand 2 and the second ligand 3 interact through at least one of van der Waals forces, n-stacking, covalent bonding, and combinations thereof. In particular, if the side chains 8 and 9 comprise alkyl chains, the first ligand 2 and the second ligand 3 interact mainly through van der Waals forces. The head group 9 of the second ligand 3 is oriented away from the nanoparticle 1 and is adjacent to the encapsulation 5. In particular, the head group 9 is covalently, coordinatively, or both covalently and coordinatively bound to the encapsulation 5. Additionally or alternatively, the head group 9 is bound by an ionic bond to the encapsulation 5. In the case that the head group is covalently bound to the encapsulation and that the encapsulation comprises silica, the head group may contain at least one silicon atom.

    [0124] The interlayer 4 may comprise additives (not shown) like ligands, quantum dots, growth reagents, reducing agent, lubricants, plasticizers, and combinations thereof. These compounds may be arranged in between the non-polar side chains 10, 8 of the first ligands 2 and the second ligands 3.

    [0125] Alternatively, to the structure of the second ligand 3 shown in FIG. 3, the second ligand 3 may also have a structure as shown in FIG. 4. In this case, the second ligand 3 is a polymer. The polymeric second ligand comprises a polar backbone comprising a plurality of head groups 9. Furthermore, the polymeric second ligand 3 comprises a plurality of side chains 10 covalently bound to the backbone. In other words, the polymeric second ligand 3 comprises a plurality of subunits consisting of one polar head group 9 and one side chain 10 which are covalently linked together. An advantage of a polymeric second ligand 3 is that the polymeric second ligand 3 associates more strongly compared to its corresponding monomer.

    [0126] In FIG. 5 an exemplary embodiment of a structure 6 is shown which comprises first ligands 2 and second ligands 3 having an aromatic group 12, 15. The present structure 6 comprises a nanoparticle 1, an interlayer 4 and an encapsulation 5. The interlayer 4 is arranged between the nanoparticle 1 and the encapsulation 5 and comprises the first ligands 2 and the second ligands 3. The detailed structure of the first ligand 2 and the second ligand 3 may be seen in the magnification of FIG. 5, which shows a section of the interlayer 4.

    [0127] The first ligand 2 comprises a head group 7 which is presently a carboxylate, a spacer group 11 which is presently an alkyl chain with five methylene units, an aromatic group 12 which is a substituted phenyl ring, and a terminal group 13 which is an alkyl chain with four carbon atoms. The aromatic group 12 comprises substituents R′, R″, R′″, R″″ which are independently selected from the following group: a hydrogen atom, a halogen atom, an alkane group, an alkene group, an alkyne group, a nitrile, a ketone, an aldehyde.

    [0128] The second ligand 3 comprises a head group 9, a spacer group 14 which is an alkyl chain having three methylene units, an aromatic group 15, and a terminal group 16 with an alkyl chain comprising six carbon atoms. The aromatic group 15 is a substituted phenyl ring. The head group 9 comprises a silicon atom which is covalently bound to the alkyl chain of the spacer group 14. Three oxygen atoms are further bound to the silicon atom of the head group 9. Through the oxygen atoms, the second ligand 3 is covalently bound to the encapsulation 5. In other words, the head group 9 of the second ligand 3 is integrated into a network of a material of the encapsulation 5. In this case, each R in the Si(OR).sub.3 group is (SiO.sub.2).sub.x.

    [0129] During production of the structure 6, Si(OR).sub.3 in the head group 9 of the second ligand 3 may have a different composition. In particular, the R groups may have been methyl (Me) or ethyl (Et).

    [0130] For representing the interaction between the first ligand 2 and the second ligand 3, two orbital lobes for each aromatic group 12, 15 are shown. The orbital lobes of the first ligand 2 and the orbital lobes of the second ligand 3 interact with each other. This phenomenon is also called n-stacking.

    [0131] FIG. 6 shows a schematic representation of a first ligand 2. The first ligand 2 comprises presently a head group 7 and a side chain 8. The head group 7 may be selected from the group comprising phosphonic acids, carboxylic acids, primary amines, thiols, and derivatives thereof.

    [0132] The side chain 8 is divided in three parts: a spacer group 11, an aromatic group 12, and a terminal group 13. The spacer group 11 may be an alkyl chain, an alkene chain, or an alkyne chain, which is covalently bound to the head group 7. In particular, the spacer group 11 is linear; however, it is also possible that the spacer group 11 is branched. The spacer group 11 may also be at least partially fluorinated.

    [0133] The aromatic group 12 is covalently bound to the spacer group 11 and the terminal group 13. The aromatic group 12 is presently a phenyl ring. In other words, the aromatic group 12 is a benzene derivative. Alternatively, it is also possible that the aromatic group 12 is a pyridine, an indene, a naphthalene, or an anthracene. The aromatic group 12 may be further substituted.

    [0134] The terminal group 13 may be an alkene chain, or an alkyne chain, which is covalently bound to the aromatic group 12. In particular, the terminal group 13 is linear; however, it is also possible that the terminal group 13 is branched. The terminal group 13 may also be at least partially fluorinated.

    [0135] FIG. 7 shows a schematic representation of a second ligand 3. The second ligand 3 comprises a head group 9 and a side chain 10. The head group 9 may be integrated into a network of an encapsulation 5. However, it is also possible that the head group 9 is selected from the group comprising phosphonic acids, carboxylic acids, primary amines, thiols, and derivatives thereof.

    [0136] The side chain 10 comprises presently a spacer group 14, and aromatic group 15, and a terminal group 16. The spacer group 14 is covalently bound to the head group 7. In particular, the spacer group 14 is an alkyl chain, an alkene chain, or an alkyne chain, which is covalently bound to the head group 7.

    [0137] In particular, the spacer group 14 is linear; however, it is also possible that the spacer group 14 is branched. The spacer group 14 may also be at least partially fluorinated.

    [0138] The aromatic group 15 is covalently bound to the spacer group 14 and the terminal group 16. The aromatic group 15 is presently shown as a phenyl ring. In other words, the aromatic group 15 is a benzene derivative. Alternatively, it is also possible that the aromatic group is a pyridine, an indene, a naphthalene, or an anthracene. The aromatic group 15 may be further substituted.

    [0139] The terminal group 16 may be an alkene chain, or an alkyne chain, which is covalently bound to the aromatic group 15. In particular, the terminal group 16 is linear; however, it is also possible that the terminal group 16 is branched. The terminal group 16 may also be at least partially fluorinated.

    [0140] FIG. 8 shows three structures 6 each according to an exemplary embodiment. Each structure 6 comprises a nanoparticle 1 surrounded by an interlayer 4 and an encapsulation 5. The interlayer 4 is arranged between the nanoparticle 1 and the encapsulation 5. Each of the shown structures 6 has an interlayer 4 with a different thickness. In FIG. 8, the thickness of the interlayer 4 increases from left to right. In other words, the structures 6 on the left has a thinner interlayer 4 compared to the structures 6 on the right.

    [0141] The thickness of the interlayer 4 maybe be tuned by the structure of a plurality of first ligands 2 and a plurality of second ligands in the interlayer 4. In particular, the thickness of the interlayer 4 is dependent on a length of the side chains 8, 10 of the first ligand and of the second ligand.

    [0142] FIG. 9 shows an agglomerate 17 according to an embodiment in a schematic sectional view. The agglomerate 17 comprises a plurality of structures 6, which are agglomerated with each other. The structures 6 each comprise a nanoparticle 1, an interlayer 4, and an encapsulation 5. In the agglomerate 17 at least two structures 6 are in direct contact with their encapsulations 5. At least two structures 6 are covalently bound to each other via their encapsulations 5. In other words, in the agglomerate 17 the plurality of nanoparticles 1 surrounded by a respective interlayer 4 has a common encapsulation 5. The agglomerate has a diameter ranging from at least 0.5 micrometers to at most 10 micrometers.

    [0143] In FIG. 10 another embodiment of an agglomerate 17 is shown. The agglomerate 17 comprises a plurality of structures 6, which are agglomerated with each other by covalent bonding. The structure 6 comprises a nanoparticle 1, an interlayer 4, and an encapsulation 5. Compared to the exemplary embodiment shown in FIG. 9, the present agglomerate comprises also a further encapsulation 18 surrounding the plurality of structures 6.

    [0144] FIG. 11 shows a schematic sectional cross section of an optoelectronic device 19 according to an embodiment. The optoelectronic device 19 comprises a semiconductor chip 20 and a conversion layer 21. The semiconductor chip 20 has an epitaxially grown semiconductor layer sequence with an active layer 22. The semiconductor chip 20 is configured to emit electromagnetic radiation of a first wavelength range. The electromagnetic radiation of the first wavelength range is generated in the active layer 22. In a further embodiment, the first wavelength range is in the UV to blue region of the electromagnetic radiation.

    [0145] The conversion layer 21 is arranged on a radiation exit surface of the semiconductor chip 20. The conversion layer 21 comprises presently a plurality of structures 6. The structures 6 have the structure and composition as described in combination with FIG. 1 or FIG. 5. The plurality of structures 6 is embedded in a matrix material, such as an epoxy or a silicone. Alternatively, the conversion layer 21 is free of the matrix material. In other words, the structures 6 are not embedded in matrix material.

    [0146] The conversion layer 21 is configured to convert electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range. The electromagnetic radiation of the first wavelength range is at least partially, or completely, different than the electromagnetic radiation of the second wavelength range. The second wavelength range is from 500 nanometers to 1000 nanometers, both inclusive.

    [0147] The optoelectronic device 19 according to an embodiment shown in FIG. 12 has a structure similar to the optoelectronic device 19 shown in FIG. 11. However, the optoelectronic device 19 of FIG. 12 comprises an agglomerate 17 instead of the structures 6 as shown in FIG. 11 in the conversion layer 21. Otherwise, the structure of the optoelectronic device 19 according to FIG. 12 is the same as described in combination with the optoelectronic device 19 according to FIG. 11.

    [0148] In FIG. 13 method steps for producing a structure 6 are shown. In a first step Sl, a nanoparticle 1 is provided. The nanoparticle is configured to convert electromagnetic radiation of a first wavelength range into electromagnetic radiation of a second wavelength range. The nanoparticle 1 is a quantum dot having a core-shell-shell structure and comprising at least one semiconductor material. The nanoparticle 1 comprises a plurality of amphiphilic first ligands 2 on a surface. In other words, the nanoparticle 1 is surrounded by the plurality of first ligands 2. The first ligand 2 comprises a head group 7 and a side chain 8. The first ligands 2 are coordinatively bound to the surface of the nanoparticle 1 via the head group 7.

    [0149] The nanoparticle 1 surrounded by the first ligands 2 is provided in a first solvent. The first solvent is a non-polar solvent, such as toluene, hexane, or chloroform.

    [0150] A plurality of amphiphilic second ligands 3 is added to the nanoparticle 1 with the first ligands 2, such that an interlayer 4 is formed. This is the second step S2. The interlayer 4 comprises the first ligands 2 and the second ligands 3. The first ligands 2 are intercalated with the second ligands 3.

    [0151] The nanoparticle 1 surrounded by the interlayer 4 is transferred to a second solvent. The second solvent is more polar than the first solvent. The second solvent may be methanol or ethanol. The nanoparticle 1 surrounded by the interlayer 4 may be transferred to a second solvent by first removing the first solvent through evaporation of the first solvent to give a film comprising the nanoparticle 1 surrounded by the interlayer 4 and then adding the second solvent. Alternatively, the nanoparticle 1 surrounded by the interlayer 4 is transferred to the second solvent by stirring of a biphasic system. The biphasic system comprises the first solvent with the nanoparticles 1 surrounded by the interlayer 4 and the second solvent.

    [0152] To ensure a complete intercalation, the second ligand 3 is added in excess. The excess of the second ligands 3 is removed by precipitation and resuspension cycles using a 3rd solvent which is an anti-solvent to the second solvent. The first solvent is a non-polar solvent, such as toluene or hexane.

    [0153] After the excess of the second ligands 3 is removed, the nanoparticle 1 surrounded by the interlayer 4 is dispersed in a solvent similar or identical to the second solvent such that a first solution is formed. A second solution comprising a non-polar solvent and a surfactant is added to this first solution. In that way, a third solution is formed. A silica source such as an alkoxy silane, for example tetraethyl orthosilicate (TEOS), water, and an acid or a base are added to the third solution. The silica source hydrolyzes such that an encapsulation 5 is formed around the interlayer 4. As a silica source is used to form the encapsulation 5, the encapsulation 5 comprises silica. The presently described method of forming the encapsulation 5 can also be described as a reverse micelle reaction. Forming the encapsulation 5 is the third step S3.

    [0154] The previously described process of forming the encapsulation 5 is repeated at least once. In this way, a uniformly shaped encapsulation 5 is produced.

    [0155] If the second ligands 3 comprises a reactive head group 9, such as Si(OMe).sub.3 or Si(OEt).sub.3, the head group 9 is integrated into the encapsulation 5. This is due to hydrolyzation of the silica source where the reactive head group 9 hydrolyzes and forms a covalent bond to the silicon and the encapsulation 5.

    [0156] After the encapsulation 5 is formed around the interlayer 4, the finished structure 6 is obtained.

    [0157] FIG. 14 shows a nanoparticle 1 surrounded by an interlayer 4 obtained as an intermediate during the method for producing a structure 6. The nanoparticle 1 at least partially surrounded by the interlayer 4 is obtained after a plurality of second ligands 3 is added to the nanoparticle 1 surrounded by a plurality of first ligands 2. Presently, the first ligands 2 comprise a head group 7 and a side chain 8. The second ligands 3 comprise a head group 9 and a side chain 10. The first ligands 2 and the second ligands 3 are intercalated in such a way that the side chains 8, 10 interact with each other by van der Waals forces. The first ligands 2 are arranged such that the head group 7 is in direct contact with a surface of the nanoparticle 1. In other words, the side chain 8 of the first ligand 2 faces away from the nanoparticle 1. The second ligands 3 are arranged such that the side chain 10 points into the direction of the nanoparticle 1. However, the side chain 10 is not in direct contact with the surface of the nanoparticle 1. The head group 9 of the second ligand 3 forms a surface of the interlayer 4.

    [0158] FIG. 15 also shows a nanoparticle 1 surrounded by an interlayer 4. Compared to the nanoparticle 1 surrounded by the interlayer 4 shown in FIG. 14, the presently shown nanoparticle 1 surrounded by an interlayer 4 comprises polymeric second ligands 3. Otherwise, the structure of the nanoparticle 1 surrounded by the interlayer 4 is the same as described in combination with FIG. 14. The polymeric second ligand 3 comprises a polar backbone with a plurality of polar head groups 9 and a plurality of non-polar side chains 10. The polymeric second ligand 3 is intercalated into the first ligands 2 such that the side chains 10 of the second ligand 3 interact with the side chains 8 of the first ligands 2.

    [0159] The nanoparticle 1 surrounded by an interlayer 4 shown in FIG. 16 comprises a plurality of second ligands 3 in the interlayer 4 which have a reactive head group 9 and a side chain 10. The second ligand 3 is trimethoxy(octyl)silane. The reactive head group 9 is Si (OMe).sub.3. The side chain 10 is presently an alkyl chain comprising eight carbon atoms. The side chains 8 of the first ligands 2 and the side chains 10 of the second ligands 3 interact by van der Waals forces.

    [0160] In FIG. 17 a nanoparticle 1 surrounded by an interlayer 4 is shown. The interlayer 4 comprises first ligands 2 and second ligands 3. Presently, the interlayer 4 comprises a plurality of three different first ligands 2. Each of the first ligands 2 comprises a carboxylate as head group 7. Each carboxylate is coordinatively bound to a surface of the nanoparticle 1. The first ligands 2 further comprise a spacer group 11, an aromatic group 12, and a terminal group 13.

    [0161] The spacer group 11 is an alkyl chain. The spacer groups 11 of the three different first ligands 2 have a different chain length. The chain length of the left first ligand 2 is three carbon atoms, the chain length of the first ligand 2 in the middle is six carbon atoms, and the chain length of the first ligand 2 on the right is twelve carbon atoms. The aromatic groups 12 of the different first ligands 2 are each a phenyl group. The terminal groups 13 are alkyl chains with a chain length of three or four carbon atoms.

    [0162] The interlayer 4 presently comprises a plurality of three different second ligands 3. Each of the second ligands 3 comprises a head group 9 which is presently a reactive head group comprising Si(OEt).sub.3. The second ligands 3 each further comprise a spacer group 14, an aromatic group 15, and a terminal group 16. The terminal groups 16 and the spacer groups 14 are presently alkyl chains.

    [0163] In the interlayer 4, the spacer groups 11 of the first ligands 2 interact through van der Waals forces with the terminal groups 16 of the second ligands 3. The aromatic groups 12 of the first ligands 2 interact through n-stacking with the aromatic group 15 of the second ligand 3. The terminal groups 13 of the first ligand 2 interact through van der Waals forces with the spacer group 14 of the second ligand 3.

    [0164] FIG. 18 shows a schematic cross sectional view of a structure 6 according to an exemplary embodiment. The structure 6 comprises a nanoparticle 1, an interlayer 4, and an encapsulation 5. The interlayer 4 is arranged between the nanoparticle 1 and the encapsulation 5. The interlayer 4 comprises first ligands 2 which are in direct contact with a surface of the nanoparticle 1. The first ligands 2 comprises a head group 7 and a side chain 8. The first ligands 2 may be bound to the surface of the nanoparticle 1 by at least a coordinative bond of a head group 7 to the nanoparticle 1.

    [0165] The interlayer 4 further comprises second ligands 3. The second ligands 3 comprise a head group 9 and a side chain 10. The head group 9 is presently integrated into the encapsulation 5. In other words, the head group 9 of the second ligands 3 has at least one covalent bond to a material of the encapsulation 5. At present, the head group 9 comprises a silicon atom, and the encapsulation 5 comprises silica. The silicon atom of the head group 9 is bound to oxygen atoms of the silica of the encapsulation 5.

    [0166] In combination with FIG. 19, a method for producing an agglomerate 17 is described. In a first step S4, a plurality of structures 6 are provided in a solvent. The structures 6 each comprise a nanoparticle 1 surrounded by an interlayer 4 and an encapsulation 5. The interlayer 4 is arranged between the nanoparticle 1 and the encapsulation 5. For example, the structures 6 comprise a structure as described in combination with FIG. 1, 5, or 18.

    [0167] In a second step S5, the plurality of structures 6 are agglomerated by adding an anti-solvent or a salt or removing the solvent. In this way an agglomerate 17 is formed. In the agglomerate 17, the encapsulations 5 of the structures 6 are in direct contact. The encapsulations 5 of two adjacent structures 6 are covalently bound to each other. In other words, in the agglomerate 17 a plurality of nanoparticles 1 shares a common encapsulation 5.

    [0168] In a third step S6, the agglomerate 17 is further encapsulated. This is achieved by forming a further encapsulation 18 around the agglomerate 17. Forming a further encapsulation 18 around the agglomerate 17 comprises treating the agglomerate with a silica source such as TEOS. Thus, the further encapsulation 18 comprises or consists of silica.

    [0169] FIG. 20 shows a transmission electron microscopy (TEM) image of structures 6 according to an exemplary embodiment. Each structure 6 comprises a nanoparticle 1, an interlayer 4, and an encapsulation 5. The nanoparticle 1 is configured to convert electromagnetic radiation of a first wavelength range into electromagnetic radiation of a second wavelength range. Presently, a plurality of structures 6 is agglomerated such that an agglomerate 17 is formed.

    [0170] The nanoparticle 1 is a quantum dot with a core-shell-shell structure, comprising a CdSe core, a CdS shell, and a ZnS shell. The interlayer 4 comprises a first ligand 2 and a second ligand 3. The encapsulation 5 consists of silica. The encapsulation 5 has an uneven surface.

    [0171] The features and exemplary embodiments described in connection with the figures may be combined with each other according to further exemplary embodiments, even if not all combinations are explicitly described. Furthermore, the exemplary embodiments described in connection with the figures may have alternative or additional features as described in the general part.

    [0172] The invention is not restricted to the exemplary embodiments by the description on the basis of said exemplary embodiments. Rather, the invention encompasses any new feature and also any combination of features, which in particular comprises any combination of features in the patent claims and any combination of features in the exemplary embodiments, even if this feature or this combination itself is not explicitly specified in the patent claims or exemplary embodiments.

    REFERENCES

    [0173] 1 nanoparticle

    [0174] 2 first ligand

    [0175] 3 second ligand

    [0176] 4 interlayer

    [0177] 5 encapsulation

    [0178] 6 structure

    [0179] 7, 9 head group

    [0180] 8, 10 side chain

    [0181] 11, 14 spacer group

    [0182] 12, 15 aromatic group

    [0183] 13, 16 terminal group

    [0184] 17 agglomerate

    [0185] 18 further encapsulation

    [0186] 19 optoelectronic device

    [0187] 20 semiconductor chip

    [0188] 21 conversion element

    [0189] 22 active layer

    [0190] S1, S4 first step

    [0191] S2, S5 second step

    [0192] S3, S6 third step